阅读说明：本技术 一种铆合焊盘印刷电路板的制备方法 (Preparation method of riveted bonding pad printed circuit board ) 是由 程飞 胡河彬 林直宏 袁征 于 2019-09-27 设计创作，主要内容包括：一种铆合焊盘印刷电路板的制备方法,步骤：在基板上钻出所需的铆孔,并进行表面光化处理；依据产品技术要求,制作专用网板,将目标电路直接印刷至基板上,并进行固化、印刷阻焊剂等后续操作,得到目标电路永久固化在电路板上的半成品；选择长度合适的带有铆接头的焊盘,将铆接头插入铆孔中并顶住焊盘；铆合：将焊盘露出的铆接头铆合在电路板背面,使其固定在电路板上。本发明具有工艺简单易控、生产效率高、成本低、人工需求少、自动化程度高的特点,有效解决了直印电路板上焊盘无法良好固定的问题,同时应用广泛,可用在不同材质的基板上,可用于单面板、双面板或多层板的加工制作,且非直印电路板也可用铆合的方法安置焊盘。(A preparation method of a riveting pad printed circuit board comprises the following steps: drilling a needed riveting hole on the substrate, and carrying out surface photochemical treatment; according to the technical requirements of products, manufacturing a special screen plate, directly printing a target circuit on a substrate, and performing subsequent operations such as curing, solder resist printing and the like to obtain a semi-finished product of the target circuit which is permanently cured on a circuit board; selecting a welding disc with a riveting head with proper length, inserting the riveting head into the riveting hole and propping against the welding disc; riveting: and riveting the exposed riveting head of the welding plate on the back surface of the circuit board to fix the circuit board. The invention has the characteristics of simple and easily-controlled process, high production efficiency, low cost, less manual demand and high automation degree, effectively solves the problem that the bonding pad on the direct printing circuit board cannot be well fixed, has wide application, can be used on substrates of different materials, can be used for processing and manufacturing single-sided boards, double-sided boards or multilayer boards, and can also be used for arranging the bonding pad on the non-direct printing circuit board by a riveting method.)

1. A preparation method of a riveting welding plate printed circuit board is characterized by comprising the following steps:

1) drilling: drilling a needed riveting hole (10) on a substrate (1) and carrying out surface photochemical treatment;

2) printing and curing: manufacturing a special screen plate according to the technical requirements of products, directly printing a target circuit (2) on the substrate (1) processed in the step 1), and performing subsequent operations of curing and printing a solder resist to obtain a semi-finished product of the target circuit (2) which is permanently cured on a circuit board;

3) selecting a pad (3) with a rivet joint (31) with proper length, inserting the rivet joint (31) into the rivet hole (10) and propping against the pad (3);

4) riveting: the rivet joint (31) exposed from the pad (3) is riveted on the back surface of the circuit board so as to be fixed on the circuit board.

2. The method of claim 1, wherein: the substrate (1) in the step 1) is a single-sided board, a double-sided board or a multilayer board, and the substrate (1) includes but is not limited to a rigid substrate and a flexible substrate.

3. The method of claim 2, wherein: the rigid substrate includes, but is not limited to, a rigid copper clad substrate, a composite substrate, and a special substrate, and the flexible substrate includes, but is not limited to, a polyester film substrate, a polyimide film substrate, and an ethylene fluoride propylene film substrate.

4. The production method according to claim 3, characterized in that: the rigid copper clad laminate includes, but is not limited to, a paper substrate and a glass cloth substrate; the composite substrate includes, but is not limited to, CEM-1 and CEM-3 substrates; the special substrate includes, but is not limited to, a metal-based substrate, a ceramic-based substrate, and a thermoplastic substrate.

5. The method of claim 4, wherein: the paper substrate includes but is not limited to flame retardant type substrate and non-flame retardant type board; glass cloth substrates include, but are not limited to, G10, FR-4, G11, and FR-5 substrates.

6. The method of claim 1, wherein: the drilling of the step 1) includes, but is not limited to, automatic drilling and manual drilling, and the surface smoothing treatment of the circuit board after drilling includes, but is not limited to, polishing, grinding and deburring.

7. The method of claim 6, wherein: the automatic drilling includes, but is not limited to, drilling; the manual drilling includes but is not limited to electric drill drilling and tap drilling.

8. The method of claim 1, wherein: the printing of the step 2) is specifically as follows: fixing a special screen plate on a printer, coating conductive slurry for printing on the special screen plate, and directly printing on a substrate, wherein the curing is to transfer the printed circuit board to a drier for baking, so that a conductive medium is permanently cured on the circuit board, and printing a solder resist on the circuit board by the same method.

9. The method of claim 8, wherein: the conductive slurry is prepared by mixing a conductive medium serving as a main material with an organic solvent, water, an auxiliary material or other chemical components, uniformly mixing and modulating to obtain mixed medium slurry with a certain viscosity, wherein the conductive slurry comprises but is not limited to carbon slurry, copper slurry and silver slurry; transfer of circuit boards during printing includes, but is not limited to, manual, robotic, automated transport systems; the printing process includes, but is not limited to, printing circuits, printing solder resists.

10. The method of claim 1, wherein: and in the riveting step 4), the exposed part of the riveting head of the welding pad is tightly and coarsely riveted on the back surface of the circuit board, the riveting mode includes but is not limited to punching riveting and spin riveting, and the specification of the riveting component includes but is not limited to opening self-plugging rivets and closed self-plugging rivets.

Technical Field

The invention relates to the technical field of printed circuit board manufacturing, in particular to a preparation method of a riveting pad printed circuit board.

Background

With the rapid development of the electronic industry, the printed circuit board has become the mainstream of the market, and the development of various industries of national economy is promoted. Therefore, optimizing the production process flow of the printed circuit board, improving the production efficiency and quality, reducing the pollution generated in the production process, and ensuring the health and personal safety of workers in the production process becomes the main research direction in the field.

The production of the traditional printed circuit board adopts a chemical etching process (subtractive method) after photo-induced imaging on a copper foil substrate, and the basic process comprises the following steps: pretreatment, film pressing, exposure, development, etching, film removing, pressing plate pressing, hole drilling, film pressing, exposure, development, copper and tin plating, film removing, tin stripping by etching, green paint coating, silk printing, gold dipping, cutting, tin spraying, copper protection, inspection, packaging and other processes. The production process is complex, the production cost is high, the efficiency is low, a large amount of manpower and material resources are consumed, the material utilization rate is low, the energy consumption is high, and the pollution is large. Meanwhile, a large amount of chemical reagents used in production can cause harm to physical and psychological health of workers.

In recent years, a method of printing a wiring pattern directly on an insulating substrate (direct printed circuit board) has been developed, which is a method of replacing subtractive wiring with printing on an insulating substrate. For example, chinese patent No. 201210101514.7, "a printed circuit board and a method for manufacturing the same", includes: preparing a substrate; placing the screen on the substrate using a screen or steel screen printing process; uniformly spreading metal paste on the silk screen by using a paste spreading process, so that the metal paste is printed on the substrate through the hollow points or hollow lines; carrying out pre-drying treatment on the substrate subjected to the slurry-spreading process; and firing the substrate subjected to the pre-drying treatment to reduce the metal slurry into a metal pattern layer. The manufacturing method adopts a paste-spreading process to uniformly spread metal paste on a screen printing substrate, and the method does not need a corrosion step, thereby reducing the environmental pollution, greatly simplifying the process flow of the printed circuit board, improving the production efficiency, reducing the use of a large amount of chemical reagents, improving the working environment of workers, reducing the cost and reducing the environmental pollution.

However, this method has fatal disadvantages: soldering cannot be performed satisfactorily on a printed wiring. After the printed circuit board is manufactured, the electronic devices need to be assembled. The fixation of many components is realized by welding electrode leads on the welding pads, and the electrical connection between the components is realized by printed wires. The welding spots on the direct-printed circuit board are difficult to fix and easy to fall off, so that the components cannot be stably assembled, namely the circuit board has no practical application value.

Disclosure of Invention

The invention aims to provide a preparation method of a riveting pad printed circuit board, which has the advantages of simple process, high production efficiency and low cost.

The technical scheme adopted by the invention for solving the technical problems is as follows: a preparation method of a riveting welding plate printed circuit board is characterized by comprising the following steps:

1) drilling: drilling a needed riveting hole on the substrate, and carrying out surface photochemical treatment;

2) printing and curing: manufacturing a special screen plate according to the technical requirements of products, directly printing a target circuit on the substrate processed in the step 1), and performing subsequent operations of curing and printing a solder resist to obtain a semi-finished product of the target circuit which is permanently cured on a circuit board;

3) selecting a welding disc with a riveting head with proper length, inserting the riveting head into the riveting hole and propping against the welding disc;

4) riveting: and riveting the exposed riveting head of the welding plate on the back surface of the circuit board to fix the circuit board.

Preferably, the substrate of step 1) is a single-sided board, a double-sided board or a multi-layered board, and the substrate includes, but is not limited to, a rigid substrate and a flexible substrate.

Still preferably, the rigid substrate includes, but is not limited to, a rigid copper clad substrate, a composite substrate, and a special substrate, and the flexible substrate includes, but is not limited to, a polyester film substrate, a polyimide film substrate, and a fluorinated ethylene propylene film substrate.

Further, the rigid copper clad laminate includes, but is not limited to, a paper substrate and a glass cloth substrate; the composite substrate includes, but is not limited to, CEM-1 and CEM-3 substrates; the special substrate includes, but is not limited to, a metal-based substrate, a ceramic-based substrate, and a thermoplastic substrate.

Still further, the paper substrate includes but is not limited to flame retardant type substrates and non-flame retardant type substrates thereof; glass cloth substrates include, but are not limited to, G10, FR-4, G11, and FR-5 substrates.

As a modification, the drilling of the step 1) comprises but is not limited to automatic drilling and manual drilling, and the surface photochemical treatment of the circuit board after drilling comprises but is not limited to polishing, grinding and deburring.

Further, the automatic drilling includes, but is not limited to, drilling by a drill press; the manual drilling includes but is not limited to electric drill drilling and tap drilling.

Further improved, the printing of the step 2) is specifically as follows: fixing a special screen plate on a printer, coating conductive slurry for printing on the special screen plate, and directly printing on a substrate, wherein the curing is to transfer the printed circuit board to a drier for baking, so that a conductive medium is permanently cured on the circuit board, and printing a solder resist on the circuit board by the same method.

Further, the conductive paste is prepared by mixing a conductive medium serving as a main material with an organic solvent, water, an auxiliary material or other chemical components, and uniformly mixing to obtain a mixed medium paste with a certain viscosity, wherein the conductive paste includes but is not limited to carbon paste, copper paste and silver paste; transfer of circuit boards during printing includes, but is not limited to, manual, robotic, automated transport systems; the printing process includes, but is not limited to, printing circuits, printing solder resists.

And finally, riveting in the step 4) is to tightly and thickly rivet the exposed part of the pad riveting head on the back of the circuit board, the riveting mode includes but is not limited to impact riveting and spin riveting, and the specifications of the riveting component include but are not limited to opening self-plugging rivets and closed self-plugging rivets.

Compared with the prior art, the invention has the advantages that: through drilling riveting hole, printed circuit on the base plate after, fix the pad riveting on the circuit board, effectively solved the unable good fixed problem of pad on the direct printing circuit board, the pad is good with the circuit contact moreover, and is difficult to drop, and components and parts can pass through electrode lead welding on the pad for direct printing circuit board has tangible production using value. The method has the characteristics of simple and easily-controlled process, high production efficiency, low cost, less manual demand and high automation degree, can be widely applied, can be used for processing and manufacturing single-panel, double-panel or multi-layer boards on substrates made of different materials, and can also be used for arranging the bonding pad on a non-direct-printed circuit board by using a riveting method.

Drawings

Fig. 1 is a schematic structural view of a substrate according to embodiment 1 of the present invention;

FIG. 2 is a schematic view of the substrate of FIG. 1 after drilling;

FIG. 3 is a schematic diagram of the substrate of FIG. 2 after drilling and printing of the circuit;

FIG. 4 is a schematic structural diagram of a pad with a rivet joint inserted into a rivet hole and laminated on a circuit;

FIG. 5 is a schematic structural diagram of a finished single-sided printed circuit board after riveting;

fig. 6 is a schematic structural view of a double-sided printed circuit board finished product according to embodiment 2 of the present invention;

FIG. 7 is a flow chart of a manufacturing process of example 2 of the present invention.

Detailed Description

The invention is described in further detail below with reference to the accompanying examples.

Example 1

As shown in fig. 1 to 5, a method for manufacturing a riveted pad printed circuit board includes the following steps:

1) drilling: drilling a needed riveting hole 10 on the substrate 1 and carrying out surface photochemical treatment;

2) printing and curing: manufacturing a special screen plate according to the technical requirements of products, directly printing a target circuit 2 on the substrate 1 processed in the step 1), and performing subsequent operations such as curing, solder resist printing and the like to obtain a semi-finished product of the target circuit 2 which is permanently cured on a circuit board;

3) selecting a pad 2 with a rivet joint 31 with a proper length, inserting the rivet joint 31 into the rivet hole 10 and propping against the pad 3;

4) riveting: the rivet 31 exposed from the land 3 is riveted to the back surface of the circuit board to be fixed to the circuit board.

The present embodiment is a single-sided circuit board, the target circuit 2 is printed on one side of the substrate 1, and the substrate 1 includes but is not limited to a rigid substrate and a flexible substrate; the rigid substrate includes, but is not limited to, rigid copper clad substrates, composite substrates, and special substrates, and the flexible substrates include, but are not limited to, polyester film substrates, polyimide film substrates, and fluorinated ethylene propylene film substrates; the rigid copper clad laminate includes, but is not limited to, a paper substrate and a glass cloth substrate; the composite substrate includes, but is not limited to, CEM-1 and CEM-3 substrates; the special substrate includes but is not limited to a metal-based substrate, a ceramic-based substrate, and a thermoplastic substrate; the paper substrate includes but is not limited to flame retardant type substrate and non-flame retardant type board; glass cloth substrates include, but are not limited to, G10, FR-4, G11, and FR-5 substrates.

The drilling of the step 1) comprises but is not limited to automatic drilling and manual drilling, and the surface photochemical treatment of the circuit board after drilling comprises but is not limited to polishing, grinding and deburring.

The automatic drilling includes, but is not limited to, drilling; the manual drilling includes but is not limited to electric drill drilling and tap drilling.

The printing of the step 2) is specifically as follows: fixing a special screen plate on a printer, coating conductive slurry for printing on the special screen plate, and directly printing on a substrate, wherein the curing is to transfer the printed circuit board to a drier for baking, so that a conductive medium is permanently cured on the circuit board, and printing a solder resist on the circuit board by the same method.

The conductive slurry is prepared by mixing a conductive medium serving as a main material with an organic solvent, water, an auxiliary material or other chemical components, uniformly mixing and modulating to obtain mixed medium slurry with a certain viscosity, wherein the conductive slurry comprises but is not limited to carbon slurry, copper slurry and silver slurry; transfer of circuit boards during printing includes, but is not limited to, manual, robotic, automated transport systems; the printing process includes, but is not limited to, printing circuits, printing solder resists.

The riveting in the step 4) is to tightly and thickly rivet the exposed part of the riveting head 31 of the bonding pad 3 on the back of the circuit board, the riveting mode includes but is not limited to impact riveting and spin riveting, the specification of the riveting component includes but is not limited to opening blind rivet and closed blind rivet, and the ground material of the riveting component includes but is not limited to copper, iron, aluminum, gold, silver and other materials.

Example 2

As shown in fig. 6 to 7, a method for manufacturing a riveted pad printed circuit board is different from that of embodiment 1 in that the embodiment is a double-sided circuit board, a target circuit 2 is printed on both sides of a substrate 1 by a special mesh, and the rest of the processes are the same as those of embodiment 1.

And (4) conclusion: according to the invention, after the substrate is drilled and the circuit is printed, the bonding pad is riveted on the circuit board, so that the preparation method is simple and easy to operate, the bonding pad is in good contact with the circuit and is difficult to fall off, and the component can be welded on the bonding pad through the electrode lead, thereby effectively solving the problem that the bonding pad on the direct printing circuit board cannot be well fixed; meanwhile, the production efficiency is high, the cost is low, the labor requirement is low, the automation degree is high, the application is wide, the method can be used for processing and manufacturing single-panel, double-sided boards or multi-layer boards on substrates made of different materials, and a bonding pad can be arranged on a non-direct-printed circuit board by using a riveting method.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the technical principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.