阅读说明：本技术 一种天线振子制备方法及天线振子 (Antenna oscillator preparation method and antenna oscillator ) 是由 刘仕明 刘飞华 宋喆 虞成城 于 2020-06-22 设计创作，主要内容包括：本发明公开了一种天线振子制备方法,包括如下步骤,S1、获得天线振子的基材；S2、通过物理气相沉积(PVD)工艺在基材的表面形成金属层,金属层可分为由内向外排布的镍层/铜层或镍层/铜层/镍层；S3、利用UV激光器在金属层上加工功能线路；S4、通过电镀将功能线路的铜层加厚；S5、利用化学溶剂退去功能线路外的金属层；S6、通过电在铜层上形成锡层。采用物理气相沉积(PVD)工艺将基材的表面金属化,以替代现有工艺中的喷砂及化镍工艺,提升了天线振子信号传输的稳定性,同时避免了喷砂产生的小颗粒粉尘和噪音对生产人员、环境及设备造成的伤害,减少化镍工艺产生的废水,使天线振子的生产过程更加环保,利于减少资源浪费、降低生产成本。(The invention discloses a preparation method of an antenna oscillator, which comprises the following steps of S1, obtaining a base material of the antenna oscillator; s2, forming a metal layer on the surface of the base material through a Physical Vapor Deposition (PVD) process, wherein the metal layer can be a nickel layer/copper layer or a nickel layer/copper layer/nickel layer which are arranged from inside to outside; s3, processing a functional circuit on the metal layer by using a UV laser; s4, thickening the copper layer of the functional circuit by electroplating; s5, removing the metal layer outside the functional circuit by using a chemical solvent; and S6, forming a tin layer on the copper layer through electricity. The surface of the base material is metallized by adopting a Physical Vapor Deposition (PVD) process to replace a sand blasting and nickel melting process in the prior art, so that the stability of signal transmission of the antenna oscillator is improved, meanwhile, the harm of small-particle dust and noise generated by sand blasting to production personnel, environment and equipment is avoided, the waste water generated by the nickel melting process is reduced, the production process of the antenna oscillator is more environment-friendly, the resource waste is reduced, and the production cost is lowered.)

1. A preparation method of an antenna oscillator is characterized by comprising the following steps: comprises the following steps of (a) carrying out,

s1, obtaining a base material of the antenna oscillator;

s2, forming a metal layer on the surface of the base material through a Physical Vapor Deposition (PVD) process, wherein the metal layer can be a nickel layer/copper layer or a nickel layer/copper layer/nickel layer which are arranged from inside to outside;

S3, processing a functional circuit on the metal layer by using an infrared or Ultraviolet (UV) laser;

s4, thickening the copper layer of the functional circuit through electroplating;

s5, removing the nickel layer outside the functional circuit by using a chemical solvent;

and S6, forming a tin layer on the copper layer through electroplating.

2. The method of manufacturing an antenna element according to claim 1, wherein: in step S1, the base material is one or more of Syndiotactic Polystyrene (SPS), Liquid Crystal Polymer (LCP), syndiotactic polystyrene/glass fiber (SPS/GF) composite material, liquid crystal polymer/glass fiber (LCP/GF) composite material, syndiotactic polystyrene/polyethylene terephthalate/glass fiber (SPS/PET/GF) composite material, syndiotactic polystyrene/poly 2,6 dimethyl-1, 4-phenylene oxide/glass fiber (SPS/PPO/GF) composite material, syndiotactic polystyrene/polyphenylene sulfide/glass fiber (SPS/PPS/GF) composite material, and syndiotactic polystyrene/liquid crystal polymer/glass fiber (SPS/LCP/GF) composite material.

3. The method of manufacturing an antenna element according to claim 1, wherein: in step S2, the thickness of the nickel layer is 30-100nm, and the thickness of the copper layer is 50-200 nm.

4. The method of manufacturing an antenna element according to claim 1, wherein: step S21 is further included after step S2, testing the one hundred lattice bonding force of the metal layer formed by a Physical Vapor Deposition (PVD) process.

5. The method of manufacturing an antenna element according to claim 1, wherein: in step S3, the power of the infrared or Ultraviolet (UV) laser is 2-30W, the frequency of the laser is 20-60KHz, and the speed of the laser is 500-.

6. The method of manufacturing an antenna element according to claim 1, wherein: in step S4, the thickness of the thickened copper layer is 8-25 μm.

7. The method of manufacturing an antenna element according to claim 1, wherein: in step S5, the chemical solvent is a compound solvent including sulfuric acid, sodium persulfate, and hydrogen peroxide.

8. The method of manufacturing an antenna element according to claim 1, wherein: in step S6, the tin layer has a thickness of 8-25 μm.

9. The method of manufacturing an antenna element according to claim 1, wherein: and step S7 is further included after the step S6, the hundred-grid bonding force of the metal layer after tin electroplating is tested, and the metal layer after tin electroplating is subjected to high-temperature environment test.

10. An antenna element, characterized by: the antenna element is obtained by the antenna element preparation method according to any one of claims 1-9.

Technical Field

The invention relates to the technical field of antennas, in particular to an antenna oscillator and a preparation method thereof.

Background

The antenna oscillator is an important component in an antenna, has the functions of guiding and amplifying electromagnetic waves, is used for enhancing electromagnetic signals received by the antenna, and is widely used in various antennas.

At present, the antenna oscillator generally adopts glass fiber reinforced PPS as a base material, and the density of the glass fiber reinforced PPS base material is higher and the dielectric loss under high frequency is higher. The existing forming process of the antenna oscillator generally comprises the steps of injection molding, sand blasting, nickel melting, laser etching, copper electroplating, nickel removing, tin electroplating and the like, and the forming process is complex and is not environment-friendly. Especially, a lot of fine dust is generated in the sand blasting process, and along with great noise, serious potential harm is caused to production personnel, environment and equipment, the roughness of the surface of the antenna oscillator is increased by sand blasting, the signal stability of the antenna oscillator is reduced, a large amount of waste water is generated in the nickel melting process, environment pollution and water resource waste are caused, and the processes need large equipment investment and raw material cost.

Therefore, an antenna oscillator preparation method is needed to optimize the existing antenna oscillator metallization process, reduce environmental pollution and save production cost.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: the antenna oscillator and the preparation method thereof are capable of reducing environmental pollution, reducing process cost and improving product performance.

In order to solve the technical problems, the invention adopts the technical scheme that: a preparation method of an antenna oscillator comprises the following steps of S1, obtaining a base material of the antenna oscillator; s2, forming a metal layer on the surface of the base material through a Physical Vapor Deposition (PVD) process, wherein the metal layer can be a nickel layer/copper layer or a nickel layer/copper layer/nickel layer which are arranged from inside to outside; s3, processing a functional circuit on the metal layer by using an infrared or Ultraviolet (UV) laser; s4, thickening the copper layer of the functional circuit through electroplating; s5, removing the nickel layer outside the functional circuit by using a chemical solvent; and S6, forming a tin layer on the copper layer through electroplating.

In order to solve the technical problems, the invention also adopts the following technical scheme: an antenna oscillator is obtained by the antenna oscillator preparation method.

The invention has the beneficial effects that: the surface of the substrate is metallized by adopting a Physical Vapor Deposition (PVD) process to replace a sand blasting and nickel melting process in the prior art, the increase of the surface roughness of the substrate caused by sand blasting is avoided, the stability of signal transmission of the antenna oscillator is improved, meanwhile, the damage of small-particle dust and noise generated by sand blasting to production personnel, environment and equipment is avoided, the waste water generated by the nickel melting process is reduced, the production process of the antenna oscillator is more environment-friendly, the waste of resources is reduced, and the production cost is reduced.

Detailed Description

In order to explain the technical content, the objects and the effects of the present invention in detail, the following description will be given with reference to the embodiments.

The most key concept of the invention is as follows: the Physical Vapor Deposition (PVD) process is adopted to replace the sand blasting and nickel melting process in the prior art.

A preparation method of an antenna oscillator comprises the following steps of S1, obtaining a base material of the antenna oscillator; s2, forming a metal layer on the surface of the base material through a Physical Vapor Deposition (PVD) process, wherein the metal layer can be a nickel layer/copper layer or a nickel layer/copper layer/nickel layer which are arranged from inside to outside; s3, processing a functional circuit on the metal layer by using an infrared or Ultraviolet (UV) laser; s4, thickening the copper layer of the functional circuit through electroplating; s5, removing the nickel layer outside the functional circuit by using a chemical solvent; and S6, forming a tin layer on the copper layer through electroplating.

The principle of the invention is briefly described as follows: a Physical Vapor Deposition (PVD) process replaces the processes of sand blasting and nickel melting in the traditional process flow, a metal layer is formed on the surface of the base material, and then a functional circuit is processed on the metal layer, and the antenna oscillator function is realized through the processes of copper electroplating, nickel stripping, tin electroplating and the like.

From the above description, the beneficial effects of the present invention are: the harm of small-particle dust and noise generated by sand blasting to production personnel, environment and equipment is avoided, the waste water generated by the nickel melting process is reduced, the production process of the antenna oscillator is more environment-friendly, and the reduction of resource waste and the reduction of production cost are facilitated.

Further, in step S1, the base material is one or more of Syndiotactic Polystyrene (SPS), Liquid Crystal Polymer (LCP), syndiotactic polystyrene/glass fiber (SPS/GF) composite material, liquid crystal polymer/glass fiber (LCP/GF) composite material, syndiotactic polystyrene/polyethylene terephthalate/glass fiber (SPS/PET/GF) composite material, syndiotactic polystyrene/poly 2,6 dimethyl-1, 4-phenylene ether/glass fiber (SPS/PPO/GF) composite material, syndiotactic polystyrene/polyphenylene sulfide/glass fiber (SPS/PPS/GF) composite material, and syndiotactic polystyrene/liquid crystal polymer/glass fiber (SPS/LCP/GF) composite material.

As can be seen from the above description, the base material of the present technical solution can be selected from Syndiotactic Polystyrene (SPS), Liquid Crystal Polymer (LCP), syndiotactic polystyrene/glass fiber (SPS/GF) composite material, liquid crystal polymer/glass fiber (LCP/GF) composite material, syndiotactic polystyrene/polyethylene terephthalate/glass fiber (SPS/PET/GF) composite material, syndiotactic polystyrene/poly 2,6 dimethyl-1, 4-phenylene ether/glass fiber (SPS/PPO/GF) composite material, syndiotactic polystyrene/polyphenylene sulfide/glass fiber (SPS/PPS/GF) composite material or syndiotactic polystyrene/liquid crystal polymer/glass fiber (SPS/LCP/GF) composite material with smaller density, etc, The material with better dielectric property under high frequency enables the quality of the antenna oscillator to be lighter, improves the performance of the antenna oscillator and is beneficial to the light weight of the base station.

Further, in step S2, the thickness of the nickel layer is 30-100nm, and the thickness of the copper layer is 50-200 nm.

Further, step S2 is followed by step S21 of testing the bonding strength of the metal layer formed by a Physical Vapor Deposition (PVD) process.

From the above description, it can be known that whether the adhesion force of the metal layer formed on the base material by the Physical Vapor Deposition (PVD) process to the base material meets the standard or not is judged through the one-hundred-grid test, so as to ensure that the metal layer is stably adhered to the base material and the stable operation of the antenna oscillator is ensured.

Further, in step S3, the power of the infrared or Ultraviolet (UV) laser is 2-30W, the frequency of the laser is 20-60kHz, and the speed of the laser is 500-5000 mm/S.

From the above description, the functional circuit of the antenna oscillator is formed by laser-etching the metal layer on the surface of the substrate by the infrared or Ultraviolet (UV) laser, and the parameters of the infrared or Ultraviolet (UV) laser are set in a proper range, so that the functional circuit processed by the infrared or Ultraviolet (UV) laser is complete and clear.

Further, in step S4, the thickness of the copper layer after thickening is 8-25 μm.

As can be seen from the above description, the conductive performance of the metal layer of the antenna element is enhanced by increasing the thickness of the copper layer by electroplating copper.

Further, in step S5, the chemical solvent is a compound solvent including sulfuric acid, sodium persulfate, and hydrogen peroxide.

As can be seen from the above description, the compound solvent is configured to etch the nickel layer except for the functional circuit, and the excess nickel layer is removed from the substrate to ensure the normal use of the functional circuit.

Further, in step S6, the tin layer has a thickness of 8 to 25 μm.

According to the description, the tin layer is electroplated on the surface of the thickened copper layer, so that the copper layer is prevented from being oxidized, the deformation or color change of the functional circuit during welding is avoided, the function of protecting the functional circuit is achieved, and the external interference resistance of the antenna oscillator is enhanced.

Further, step S7 is included after step S6, the hundred-grid bonding force of the metal layer after tin electroplating is tested, and the metal layer after tin electroplating is subjected to a high temperature environment test.

According to the description, after the substrate is subjected to electrotinning, a hundred-grid test is required again, whether the metal layer foams or is layered or not is tested in a high-temperature environment, the metal layer after the electrotinning is tightly connected with the substrate, and the quality of the finished product of the antenna oscillator is ensured.

An antenna oscillator is obtained by the antenna oscillator preparation method.

As can be seen from the above description, the beneficial effects of the present invention are: the antenna oscillator obtained by the antenna oscillator preparation method avoids increase of surface roughness of the base material caused by sand blasting, improves stability of signal transmission of the antenna oscillator, and meanwhile, adopts the base material with lower density and better dielectric property, improves performance of the antenna oscillator, so that the finished antenna oscillator is lighter in weight and beneficial to light weight of a base station.