阅读说明：本技术 一种均匀镀膜的装置以及方法 (Device and method for uniformly coating film ) 是由 王正安 于 2019-04-30 设计创作，主要内容包括：本发明公开了一种均匀镀膜的装置以及方法,该装置包括：点蒸发源阵列、加热组件、膜层监控机构和加热控制机构；点蒸发源阵列包括多个均匀排布的点蒸发源,在每个点蒸发源的外部设置加热组件；膜层监控机构包括：厚度测量器,用于监测基板的膜层厚度,成分分析器,用于监测基板的膜层成分,以及与厚度测量器和成分分析器连接的控制器,用于根据膜层厚度和膜层成分得到各个点蒸发源的蒸发量；加热控制机构与控制器和加热组件连接,用于根据蒸发量,控制加热组件对每个点蒸发源的加热输出功率。本发明通过设置多个均匀排布的点蒸发源,能够实现大面积的均匀镀膜,并通过实时监测数据,精确控制蒸发材料的蒸发量,提高了蒸发材料的有效利用率。(The invention discloses a device and a method for uniformly coating a film, wherein the device comprises: the device comprises a point evaporation source array, a heating assembly, a film monitoring mechanism and a heating control mechanism; the point evaporation source array comprises a plurality of point evaporation sources which are uniformly distributed, and a heating assembly is arranged outside each point evaporation source; the film monitoring mechanism includes: the evaporation system comprises a thickness measurer, a composition analyzer and a controller, wherein the thickness measurer is used for monitoring the film thickness of a substrate, the composition analyzer is used for monitoring the film composition of the substrate, and the controller is connected with the thickness measurer and the composition analyzer and is used for obtaining the evaporation amount of each point evaporation source according to the film thickness and the film composition; the heating control mechanism is connected with the controller and the heating assembly and is used for controlling the heating output power of the heating assembly to each point evaporation source according to the evaporation amount. According to the invention, the plurality of point evaporation sources which are uniformly distributed are arranged, so that large-area uniform coating can be realized, the evaporation capacity of the evaporation material is accurately controlled through real-time monitoring data, and the effective utilization rate of the evaporation material is improved.)

1. The utility model provides a device of even coating film, locates evaporation coating film intracavity and is located the below of base plate conveyer belt, its characterized in that, the device includes: the device comprises a point evaporation source array, a heating assembly, a film monitoring mechanism and a heating control mechanism;

the point evaporation source array comprises a plurality of point evaporation sources which are uniformly distributed, and the heating assembly is arranged outside each point evaporation source;

the film monitor mechanism includes: the evaporation source comprises a thickness measurer, a composition analyzer and a controller, wherein the thickness measurer is used for monitoring the film thickness of a substrate, the composition analyzer is used for monitoring the film composition of the substrate, and the controller is connected with the thickness measurer and the composition analyzer and is used for obtaining the evaporation amount of each point evaporation source according to the film thickness and the film composition;

The heating control mechanism is connected with the controller and the heating assembly and is used for controlling the heating output power of the heating assembly to each point evaporation source according to the evaporation amount.

2. The apparatus for uniform coating according to claim 1, further comprising: the evaporation plane is parallel to the plane of the substrate conveyor belt, a plurality of communication holes are formed in the evaporation plane and are positioned above the point evaporation sources;

the point evaporation source array and the heating assembly are arranged in the chamber;

the component analyzer is disposed on the evaporation plane.

3. The apparatus for uniform coating according to claim 2, wherein the point evaporation source array comprises: the point evaporation sources are arranged in a row along the direction vertical to the moving direction of the substrate, and the point evaporation sources are arranged in a row along the moving direction of the substrate;

the same evaporation material is placed in the point evaporation sources arranged in the same column;

different evaporation materials are sequentially placed in the point evaporation sources arranged in the same row in a preset sequence.

4. The apparatus for uniform coating according to claim 3, wherein the point evaporation source comprises: the device comprises a crucible, a spray pipe and a nozzle, wherein one end of the spray pipe is communicated with the crucible, and the other end of the spray pipe is connected with the nozzle;

The crucible is used for evaporating evaporation materials;

the nozzles correspond to the communication holes one by one and are used for spraying the evaporation material evaporated in the crucible to the substrate.

5. The apparatus for uniform coating according to claim 4, further comprising: and a partition plate is arranged between the point evaporation sources arranged in rows and is arranged on the evaporation plane and used for separating evaporation materials sprayed by the nozzles in different rows.

6. The apparatus for uniform coating according to claim 4, wherein the heating assembly is wrapped outside each crucible for heating the crucible according to the heating output power set by the heating control mechanism.

7. The apparatus for uniform coating according to claim 6, wherein the heating control mechanism comprises:

the initial heating submodule is used for setting corresponding initial heating output power for the heating assembly arranged outside the point evaporation source;

and the real-time heating submodule is used for adjusting the heating output power of each heating assembly according to the evaporation capacity of each point evaporation source obtained in the controller.

8. A method of uniformly coating a film using the apparatus of any one of claims 1 to 7, the method comprising:

Conveying the substrate into an evaporation coating cavity;

the heating control mechanism controls the heating assembly to heat each point evaporation source with initial heating output power;

the thickness measurer collects film thickness data of the substrate and transmits the film thickness data to the controller, and the composition analyzer collects film composition data of the substrate and transmits the film composition data to the controller;

the controller obtains evaporation capacity data of each point evaporation source according to the film thickness data and the film component data and transmits the evaporation capacity data to the heating control mechanism;

the heating control mechanism adjusts the heating output power of the heating assembly of each point evaporation source according to the evaporation amount data;

and the heating assembly heats each point evaporation source according to the heating output power adjusted by the heating control mechanism.

Technical Field

The invention relates to the technical field of evaporation coating, in particular to a device and a method for uniform coating.

Background

The evaporation coating is often called vacuum coating. A vacuum coating equipment is used for heating a target material of a metal or nonmetal material under the condition of high vacuum, so that the target material is evaporated in the form of atomic groups or ions and is condensed into a thin film on the surface of a coated piece.

The existing thin-film solar cell is mainly prepared by vacuum coating equipment. In the preparation process of the thin-film solar cell, if the thickness difference of the target material vapor deposited on the surface of the plated part is large, the product quality is uneven, and the yield of the thin-film solar cell produced in the whole batch is determined by the uniformity of the film thickness.

In actual production, the evaporation source in the vacuum coating apparatus is usually set as a point evaporation source or a linear evaporation source to prepare the thin-film solar cell. However, the setpoint evaporation source is used for carrying out evaporation coating on the solar cell substrate, and the target material steam cannot be uniformly sprayed to the surface of a coating piece to be evaporated; and the linear evaporation source is difficult to realize mechanical adjustment, and the position of the linear evaporation source after mechanical processing is difficult to adjust according to the real-time performance parameters of the film layer in the film coating process.

Disclosure of Invention

In view of the above-mentioned defects or shortcomings in the prior art, it is desirable to provide a device and a method for uniform coating, which can perform uniformity adjustment on the thickness of a vacuum coating film, thereby improving the working efficiency and the product yield.

In order to achieve the purpose, the invention adopts the technical scheme that:

in one aspect of the invention, an apparatus for uniformly coating a film is provided.

The invention provides a device for uniformly coating, which is arranged in an evaporation coating cavity and below a substrate conveyor belt, and is characterized by comprising: the device comprises a point evaporation source array, a heating assembly, a film monitoring mechanism and a heating control mechanism;

the point evaporation source array comprises a plurality of point evaporation sources which are uniformly distributed, and the heating assembly is arranged outside each point evaporation source;

the film monitor mechanism includes: the evaporation source comprises a thickness measurer, a composition analyzer and a controller, wherein the thickness measurer is used for monitoring the film thickness of a substrate, the composition analyzer is used for monitoring the film composition of the substrate, and the controller is connected with the thickness measurer and the composition analyzer and is used for obtaining the evaporation amount of each point evaporation source according to the film thickness and the film composition;

the heating control mechanism is connected with the controller and the heating assembly and is used for controlling the heating output power of the heating assembly to each point evaporation source according to the evaporation amount.

In another aspect of the invention, a method for uniformly coating a film is also provided.

The invention provides a method for uniformly coating a film, which comprises the following steps:

Conveying the substrate into an evaporation coating cavity;

the heating control mechanism controls the heating assembly to heat each point evaporation source with initial heating output power;

the thickness measurer collects film thickness data of the substrate and transmits the film thickness data to the controller, and the composition analyzer collects film composition data of the substrate and transmits the film composition data to the controller;

the controller obtains evaporation capacity data of each point evaporation source according to the film thickness data and the film component data and transmits the evaporation capacity data to the heating control mechanism;

the heating control mechanism adjusts the heating output power of the heating assembly of each point evaporation source according to the evaporation amount data;

and the heating assembly heats each point evaporation source according to the heating output power adjusted by the heating control mechanism.

Compared with the prior art, the invention has the beneficial effects that:

according to the invention, the plurality of uniformly distributed point evaporation sources are arranged, and the evaporation capacity corresponding to each point evaporation source is adjusted and controlled according to the condition of the plated film layer measured on the substrate in real time, so that large-area uniform film coating can be realized, and the defect of insufficient film coating uniformity caused by the point evaporation sources is overcome.

The invention monitors the real-time film thickness data and the film component data of the substrate by arranging the thickness measurer and the component analyzer, thereby adaptively adjusting the real-time evaporation capacity of each point evaporation source in the point evaporation source array by utilizing the controller according to the corresponding relation between the film thickness data and the film component data.

The invention can rapidly and accurately control the evaporation capacity of the evaporation material according to the monitored real-time data, thereby realizing the accurate control of the performance of the film coated on the substrate, solving the defect that the linear evaporation source can not independently carry out local coating parameter adjustment, and improving the effective utilization rate of the evaporation material.

Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

fig. 1 is a schematic structural diagram of an apparatus for uniformly coating a film according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a point evaporation source mechanism of a uniform coating apparatus according to an embodiment of the present invention;

fig. 3 is a schematic view of a point evaporation source of a uniform coating apparatus according to a first embodiment of the present invention;

fig. 4 is a schematic view of a point evaporation source of a uniform coating apparatus according to a first embodiment of the present invention;

FIG. 5 is a schematic view of a nozzle arrangement of an apparatus for uniform coating according to an embodiment of the present invention;

FIG. 6 is a schematic view of a spacer plate of an apparatus for uniformly coating a film according to an embodiment of the present invention;

FIG. 7 is a flowchart illustrating a method for uniformly coating a film according to a second embodiment of the present invention;

in the figure:

11-point evaporation source mechanism, 2-film layer monitoring mechanism and 3-heating control mechanism;

11-chamber, 111-evaporation plane, 12-point evaporation source array, 121-crucible, 122-spray pipe, 123-nozzle, 13-heating component, 14-isolation plate;

21-thickness measurer, 22-composition analyzer, 23-controller;

4-evaporating a coating cavity;

5-a substrate conveyor;

6-substrate.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.