阅读说明：本技术 图案形成方法 (Pattern forming method ) 是由 牛久正幸 大屋秀信 星野秀樹 山内正好 小俣猛宪 新妻直人 青山亮 浦山一步 于 2018-02-22 设计创作，主要内容包括：本发明的课题在于,提供能够将图案的电阻保持得低并且将图案中的不连续部简便地去除的图案形成方法,该课题通过如下图案形成方法解决,图案形成方法至少包含：在基材(1)上印刷包含导电性材料的图案中间体的印刷工序、以及对图案中间体进行电解电镀处理的电镀工序,在印刷工序中印刷的图案中间体具有：在电镀工序中被通电的被电镀部、以及相对于该被电镀部不连续地设置且在电镀工序中不被通电的不连续部,在电镀工序中,使用至少含有金属种类相互不同的2种以上的金属盐和络合剂的电镀液来进行电场电镀处理,从而将图案中间体的不连续部去除,形成由被电镀被膜包覆的被电镀部构成的图案。(The present invention addresses the problem of providing a pattern forming method capable of keeping the resistance of a pattern low and easily removing discontinuities in the pattern, the pattern forming method including at least: a printing step of printing a pattern intermediate containing a conductive material on a base material (1), and a plating step of subjecting the pattern intermediate to electrolytic plating, wherein the pattern intermediate printed in the printing step has: in the plating step, an electric field plating treatment is performed using a plating solution containing at least 2 or more metal salts of different metal types and a complexing agent, thereby removing the discontinuous portion of the pattern intermediate and forming a pattern of the plated portion covered with a plating film.)

1. A method of forming a pattern, comprising: a printing step of printing a pattern intermediate containing a conductive material on a base material; and an electroplating step of performing electrolytic plating treatment on the pattern intermediate,

the pattern intermediate printed in the printing process has: a plating target portion that is energized in the plating step; and a discontinuous portion which is provided discontinuously with respect to the portion to be plated and is not energized in the plating step,

in the plating step, the discontinuous portion of the pattern intermediate is removed by performing an electric field plating treatment using a plating solution containing at least 2 or more metal salts of different metal species and a complexing agent, thereby forming a pattern of the plating target portion covered with a plating film.

2. The pattern forming method as claimed in claim 1,

the 2 or more metal salts at least comprise: a metal salt containing copper or nickel as a main metal, and a metal salt containing a metal having a standard electrode potential within 1V of the main metal.

3. The pattern forming method as claimed in claim 2,

the 2 or more metal salts comprise: a metal salt containing copper as a main metal, and a metal salt containing nickel as a metal having a standard electrode potential within 1V of the main metal.

4. The pattern forming method as claimed in claim 2,

the 2 or more metal salts comprise: a metal salt containing nickel as a main metal, and a metal salt containing any of iron, tin, chromium, or copper as a metal having a standard electrode potential within a difference of 1V from the main metal.

5. The pattern forming method as claimed in claim 4,

further containing a metal salt containing zinc as the 2 or more metal salts.

6. The pattern forming method as claimed in any one of claims 1 to 5,

in the printing step, a closed geometric pattern is formed on the base material by a linear liquid containing the conductive material, and then the linear liquid is dried to deposit the functional material along the edge of the linear liquid, thereby forming the conductive pattern intermediate having the discontinuous portion formed by the inner thin lines and the plating target portion formed by the outer thin lines.

7. The pattern forming method according to any one of claims 1 to 6,

in the printing step, the conductive material is provided on the base material by an ink jet method.

Technical Field

The present invention relates to a pattern forming method, and more particularly, to a pattern forming method capable of keeping the resistance of a pattern low and easily removing a discontinuous portion in the pattern.

Background

As a method for forming a pattern including a conductive material, a photolithography technique has been widely used. However, the photolithography technique consumes a lot of material and has a complicated process. Therefore, a method with less material consumption and simple process is studied. For example, the following method is used: droplets containing a conductive material are given to a base material by an ink jet method, and a fine line pattern is formed. However, in the ink jet method, mist-like droplets are sometimes scattered in addition to the main droplets when ink is ejected. The splashed mist ink forms discontinuous portions (portions made of a conductive material that is provided in isolation at positions different from a desired pattern) on the base material, and this becomes a significant cause of deterioration in transparency.

In addition, the present applicant has previously disclosed the following technologies: a pattern intermediate body composed of an inner thin line and an outer thin line including a conductive material is formed on a base material by forming a closed geometric pattern with a linear liquid including the conductive material, drying the linear liquid to deposit the conductive material along an edge portion, and a pattern is formed by removing the inner thin line from the pattern intermediate body to form a pattern with a thin line remaining without being removed (patent document 1).

Prior art documents

Patent document

Patent document 1: japanese patent laid-open publication No. 2017-39109

Disclosure of Invention

Problems to be solved by the invention

In the method of forming a pattern including a conductive material, when a discontinuous portion formed by a mist or a discontinuous portion formed by a drawing method (for example, an inner thin line of patent document 1) is not useful in a product, it is required to remove the discontinuous portion. However, a technique of keeping the resistance of the pattern low and easily removing the discontinuity has not been sufficiently established.

Accordingly, an object of the present invention is to provide a pattern forming method capable of keeping the resistance of a pattern low and easily removing a discontinuous portion in the pattern.

Other problems of the present invention will be apparent from the following description.

Means for solving the problems

The above problems are solved by the following inventions.

1. A method for forming a pattern on a substrate,

at least comprises the following components: a printing step of printing a pattern intermediate containing a conductive material on a base material; and an electroplating step of performing electrolytic plating treatment on the pattern intermediate,

the pattern intermediate printed in the printing process has: a plating target portion that is energized in the plating step; and a discontinuous portion which is provided discontinuously with respect to the portion to be plated and is not energized in the plating step,

in the plating step, the discontinuous portion of the pattern intermediate is removed by performing an electric field plating treatment using a plating solution containing at least 2 or more metal salts of different metal species and a complexing agent, thereby forming a pattern of the plating target portion covered with a plating film.

2. The method for forming a pattern described in the above item 1,

the 2 or more metal salts at least comprise: a metal salt containing copper or nickel as a main metal, and a metal salt containing a metal having a standard electrode potential within 1V of the main metal.

3. The method for forming a pattern described in the above 2,

the 2 or more metal salts comprise: a metal salt containing copper as a main metal, and a metal salt containing nickel as a metal having a standard electrode potential within 1V of the main metal.

4. The method for forming a pattern described in the above 2,

the 2 or more metal salts comprise: a metal salt containing nickel as a main metal, and a metal salt containing any of iron, tin, chromium, or copper as a metal having a standard electrode potential within a difference of 1V from the main metal.

5. The method for forming a pattern according to item 4 above,

further containing a metal salt containing zinc as the 2 or more metal salts.

6. The method of forming a pattern according to any one of 1 to 5,

in the printing step, a closed geometric pattern is formed on the base material by a linear liquid containing the conductive material, and then the linear liquid is dried to deposit the functional material along the edge of the linear liquid, thereby forming the conductive pattern intermediate having the discontinuous portion formed by the inner thin lines and the plating target portion formed by the outer thin lines.

7. The method of forming a pattern according to any one of 1 to 6 above,

in the printing step, the conductive material is provided on the base material by an ink jet method.

Effects of the invention

According to the present invention, it is possible to provide a pattern forming method capable of keeping the resistance of a pattern low and easily removing a discontinuous portion in the pattern.

Drawings

Fig. 1 is a diagram illustrating an example of a printing process.

Fig. 2 is a diagram illustrating an example of a pattern after the plating step.

Detailed Description

The following describes the embodiments of the present invention in detail.

1. Pattern forming method

The pattern forming method according to the present embodiment includes at least: a printing step of printing a pattern intermediate containing a conductive material on a base material; and a plating step of performing electrolytic plating treatment on the pattern intermediate, the pattern intermediate printed in the printing step having: a plating target portion that is energized in the plating step; and a discontinuous portion which is provided discontinuously with respect to the plating target portion and is not energized in the plating step, wherein the discontinuous portion of the pattern intermediate is removed by performing an electric field plating treatment using a plating solution containing at least 2 or more metal salts and complexing agents of different metal species, thereby forming a pattern of the plating target portion covered with a plating film.

According to this pattern forming method, the discontinuous portion can be easily removed while keeping the resistance of the pattern low. As the discontinuous portion, there may be mentioned a discontinuous portion formed by the fog as described above, a discontinuous portion formed by a drawing method (for example, an inner thin line of patent document 1), and the like. In particular, when a transparent conductive film or the like is formed by a pattern, the discontinuous portion is removed, whereby the low visibility of the pattern can be improved (the visibility of the pattern can be reduced), and the transparency can be improved.

Hereinafter, the printing step and the plating step of the pattern forming method will be described in more detail.

(1) Printing process

In the printing step, a pattern intermediate containing a conductive material is printed on a base material. In the present embodiment, in the printing step, a pattern intermediate is printed, the pattern intermediate having: the plating apparatus includes a portion to be plated, which is energized in a subsequent plating step, and a discontinuous portion, which is provided discontinuously with respect to the portion to be plated and is not energized in the plating step.

[ Pattern intermediate ]

The pattern intermediate body contains a conductive material and has a portion to be plated and a discontinuous portion. The plating target portion is a portion to which an electrode (a power feeding electrode, usually a cathode) for electrolytic plating is energized in a subsequent plating step. On the other hand, the discontinuous portion is provided discontinuously with respect to the portion to be plated, and is not energized by the electrode for electrolytic plating.

That is, in the pattern intermediate, the plating target portion and the discontinuous portion are discontinuously provided so as to be insulated from each other. Among the mutually insulated portions constituting the pattern intermediate, the portions to be energized in the subsequent plating step are the portions to be plated, and the portions not to be energized are the discontinuous portions. Any of the mutually insulated portions constituting the pattern intermediate can be selected as the plating target portion and any of the mutually insulated portions constituting the pattern intermediate can be selected as the plating target portion, and can be determined according to the purpose, application, and the like.

The shape of the pattern intermediate is not particularly limited, and may be any shape such as a linear shape or a flat shape, and may be formed on the base material in a desired shape. The pattern intermediate is preferably constituted by 1 or more conductive thin lines (conductive material provided in a linear shape).

[ printing method ]

In the printing step, a printing method can be used to provide the conductive material on the base material. The printing method is not particularly limited, and examples thereof include a screen printing method, a relief printing method, a gravure printing method, a lithographic printing method, a flexographic printing method, an ink jet method, and the like, and among them, an ink jet method is preferable. The liquid droplet discharge method of the ink jet head in the ink jet method is not particularly limited, and examples thereof include a piezoelectric method and a thermal method.

[ coffee stain phenomenon ]

In the printing method, the coffee stain phenomenon can be utilized when the ink (liquid containing a conductive material) applied to the base material is dried. When a liquid containing a conductive material is dried by utilizing the coffee stain phenomenon, the conductive material can be selectively deposited along the edge of the liquid, thereby forming a conductive thin line.

In a preferred example of the printing method using the coffee stain phenomenon, a conductive pattern intermediate body composed of an inner thin line and an outer thin line can be formed by first forming a closed geometric pattern on a base material with a linear liquid containing a conductive material, and then drying the linear liquid to deposit a functional material along the edge of the linear liquid. An example of such a printing method will be described with reference to fig. 1.

First, as shown in fig. 1(a), a plurality of linear liquids 2 each having a rectangular shape as a closed geometric figure are formed at predetermined intervals in the longitudinal direction (vertical direction in the figure) and the width direction (horizontal direction in the figure) of a substrate 1.

Next, as shown in fig. 1(b), when the linear liquid 2 is dried, the functional material is deposited along the edge of the linear liquid 2 by utilizing the coffee stain phenomenon. In this case, since the closed geometric figure has the inner and outer peripheries as the edges, the thin wire unit 5 is formed of the inner thin wire 3 and the outer thin wire 4, the inner thin wire 3 is formed of the conductive material deposited on the inner periphery, and the outer thin wire 4 is formed of the conductive material deposited on the outer periphery.

In the thin wire unit 5, the outer thin wire 4 includes the inner thin wire 3 on the inner peripheral side. In the illustrated example, the inner thin wire 3 and the outer thin wire 4 are formed concentrically. The inner thin lines 3 and the outer thin lines 4 are rectangular in shape corresponding to the shapes of the inner and outer peripheral edges of the linear liquid 2.

Next, as shown in fig. 1(c), a plurality of linear liquids 2 each having a square shape as a closed geometric figure are formed at predetermined intervals in the longitudinal direction (vertical direction in the figure) and the width direction (horizontal direction in the figure) of the substrate 1. Here, a plurality of linear liquids 2 each having a rectangular shape are formed at positions sandwiched between the thin wire units 5 formed in advance. Here, the linear liquid 2 exhibiting a quadrilateral shape is configured such that: and the outer thin wire 4 among the thin wire units 5 adjacent thereto is in contact with but not in contact with the inner thin wire 3.

Next, as shown in fig. 1(d), when the linear liquid 2 is dried, the thin thread unit 5 composed of the inner thin thread 3 and the outer thin thread 4 is further formed from each linear liquid 2 by utilizing the coffee stain phenomenon, and this can be used as a pattern intermediate.

In the resulting pattern intermediate, the outer thin lines 4 are connected to the adjacent outer thin lines 4. On the other hand, the inner thin wire 3 is not connected to the other inner thin wires 3 and the outer thin wires 4. That is, the inner thin lines 3 are formed discontinuously with respect to the outer thin lines 4, and are isolated in the pattern intermediate.

In the plating step described later, for example, the outer thin wire 4 is selected as a portion to be plated, and the inner thin wire 3 is removed as a discontinuous portion, whereby a pattern shown in fig. 2 can be formed.

In the example of fig. 2, the inner thin line 3 is removed, and a pattern is formed by the outer thin line (which may be simply referred to as a thin line because the inner thin line is removed) 4. In this pattern, a plurality of outer thin lines 4 are two-dimensionally arranged in parallel in the direction of 2 diagonal lines of a quadrangle represented by the outer thin lines 4, and the mutually adjacent outer thin lines 4 intersect each other at two intersection points by intersecting both sides across a vertex.

In the example of fig. 1 and 2, the linear liquid 2, the inner thin wire 3, and the outer thin wire 4 are formed in a square shape, but the present invention is not limited thereto, and a closed geometric figure formed by a polygon such as a triangle, a hexagon, or an octagon may be formed. The closed geometric figure may include a curved line element such as a circle or an ellipse.

In the above description, the case where the pattern intermediate body composed of the closed geometric figure is formed by the coffee stain phenomenon has been mainly shown, but the present invention is not limited thereto, and various pattern intermediate bodies can be formed. For example, a linear liquid in a linear, curved or zigzag shape may be applied to the base material, and the conductive material may be deposited on both edges of the linear liquid in the longitudinal direction, thereby forming 2 parallel lines of 1 group from 1 linear liquid. In addition, the printing method may not necessarily utilize the coffee stain phenomenon. Although the pattern intermediate having a shape different from the shape of the ink applied to the base material can be formed by the coffee stain phenomenon, the pattern intermediate having the same shape as the shape of the ink applied to the base material may be formed without using the coffee stain phenomenon.

[ substrate ]

As the substrate, a transparent substrate is preferably used. The degree of transparency of the transparent substrate is not particularly limited, and the light transmittance thereof may be any value of several% to several tens%, and the spectral transmittance thereof may be any value. The light transmittance and the spectral transmittance can be determined appropriately according to the application and the purpose.

The material of the substrate is not particularly limited, and examples thereof include polyethylene terephthalate (PET) resin, polyethylene naphthalate (PEN) resin, polybutylene terephthalate resin, cellulose-based resin (polyacetyl cellulose, cellulose diacetate, cellulose triacetate, and the like), polyethylene resin, polypropylene-based resin, methacrylic resin, cyclic polyolefin-based resin, polystyrene-based resin, acrylonitrile- (poly) styrene copolymer (AS resin), acrylonitrile-butadiene-styrene copolymer (ABS resin), polyvinyl chloride-based resin, poly (meta) acrylic resin, polycarbonate-based resin, polyester-based resin, polyimide-based resin, polyamide-imide-based resin, cycloolefin polymer (COP) resin, and the like. When these materials are used, good transparency can be imparted to the substrate 1. In addition, by using a synthetic resin material in particular, good bendability can be imparted to the base material 1. The substrate 1 made of a synthetic resin material may be in the form of a film, which may or may not be stretched.

The shape of the substrate is not particularly limited, and may be, for example, a plate shape (plate material). When the transparent conductive film is a plate material, the thickness, size (area), and shape are not particularly limited, and can be appropriately determined according to the application and purpose of the transparent conductive film. The thickness of the plate material is not particularly limited, and may be, for example, about 1 μm to 10cm, and further about 20 μm to 300 μm.

Further, the substrate may be subjected to a surface treatment for changing the surface energy. Further, a hard coat layer, an antireflection layer, or the like may be provided on the substrate.

[ ink ]

Next, a printing method, particularly, ink suitable for use in the above-described coffee stain phenomenon will be described in detail.

The conductive material to be contained in the ink is not particularly limited, and examples thereof include conductive fine particles, conductive polymers, and the like.

Examples of the conductive fine particles include metal fine particles and carbon fine particles.

Examples of the metal constituting the metal fine particles include Au, Pt, Ag, Cu, Ni, Cr, Rh, Pd, Zn, Co, Mo, Ru, W, Os, Ir, Fe, Mn, Ge, Sn, Ga, and In. Among them, Au, Ag, and Cu are preferable, and Ag is particularly preferable. The metal fine particles can have an average particle diameter of, for example, 1 to 100nm, and further 3 to 50 nm. The average particle diameter is a volume average particle diameter and can be measured by "Zetasizer 1000 HS" manufactured by malvern corporation.

Examples of the carbon fine particles include graphite fine particles, carbon nanotubes, and fullerenes.

The conductive polymer is not particularly limited, but preferably a pi-conjugated conductive polymer can be used. Examples of the pi-conjugated conductive polymer include polythiophenes and polyanilines. The pi-conjugated conductive polymer can be used together with a polyanion such as polystyrene sulfonic acid, for example.

The concentration of the conductive material in the ink can be set to, for example, 5 wt% or less, and further 0.01 wt% or more and 1.0 wt% or less. This promotes the coffee stain phenomenon, and provides an effect of making the conductive thin wire finer.

The solvent used in the ink is not particularly limited, and may include one or more selected from water and an organic solvent. Examples of the organic solvent include alcohols such as 1, 2-hexanediol, 2-methyl-2, 4-pentanediol, 1, 3-butanediol, 1, 4-butanediol, and propylene glycol, and ethers such as diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, triethylene glycol monomethyl ether, dipropylene glycol monomethyl ether, and dipropylene glycol monoethyl ether.

In addition, other components such as a surfactant may be contained in the ink. The surfactant is not particularly limited, and examples thereof include a silicon surfactant. The concentration of the surfactant in the ink can be set to, for example, 1 wt% or less.

[ drying of ink ]

The ink (linear liquid) applied to the substrate may be dried naturally or forcibly. The drying method used for forced drying is not particularly limited, and for example, a method of heating the surface of the substrate to a predetermined temperature, a method of forming a gas flow on the surface of the substrate, or the like can be used alone or in combination. The air flow can be formed by blowing or sucking air using a fan or the like, for example.

[ sintering treatment ]

The sintering process can be performed on the pattern intermediate formed on the base material. The sintering treatment can be performed as a pretreatment of the plating step, for example. Examples of the sintering treatment include light irradiation treatment and heat treatment. In the light irradiation treatment, for example, gamma rays, X rays, ultraviolet rays, visible light, Infrared Rays (IR), microwaves, radio waves, or the like can be used. In the heat treatment, for example, hot air, a heating table, heating press, or the like can be used.

(2) Electroplating step

In the plating step, the pattern intermediate printed in the printing step is subjected to electrolytic plating treatment. As described above, the pattern intermediate has: the plating apparatus includes a plating target portion to which current is applied in a plating step, and a discontinuous portion which is provided discontinuously with respect to the plating target portion and is not applied with current in the plating step.

In the plating step, the discontinuous portions of the pattern intermediate can be removed by performing the electric field plating treatment using a plating solution containing at least 2 or more metal salts and complexing agents of different metal species from each other, thereby forming a pattern of a plating target portion covered with a plating film.

For example, in a state where the pattern intermediate on the base material is immersed in a plating solution, the plating solution is brought into contact with the anode, and the plating target portion can be coated with a plating film by electrically connecting the cathode and the plating target portion. In this case, the discontinuous portions that are not energized can be removed by the plating liquid.

The reason why the plating liquid exerts the above-described action can be considered as follows. First, when 1 of 2 or more metal salts contained in the plating solution mainly contributes to the formation of a plating film, the other metal salts mainly act as an oxidizing agent. The conductive material constituting the discontinuous portion of the intermediate pattern is oxidized by the oxidizing agent and further the dissolution is promoted by the complexing agent contained in the plating liquid, and as a result, the conductive material is removed by the etching function. In electrolytic plating, a complexing agent is generally used to promote dissolution of the anode electrode, but the present inventors have found through studies that: the present inventors have made the present invention based on the finding that a complexing agent effectively functions to remove discontinuities as another effect in a plating solution according to the present invention. In the normal etching, the discontinuous portion is removed together with the plating target portion, and it is difficult to selectively remove the discontinuous portion, but the plating film can be preferentially formed on the plating target portion by the plating solution of the present embodiment, and the discontinuous portion can be selectively removed.

[ electroplating solution ]

The plating liquid preferably contains at least 2 or more metal salts different in metal species from each other: a metal salt containing a main metal, and a metal salt containing a metal having a standard electrode potential within 1V of the main metal. In this case, the main metal is particularly preferably copper or nickel. The principal metal refers to the metal with the highest molar concentration among the metals in the plating solution. When a plurality of metal salts containing the same main metal are present, the molar concentration of the main metal is the total molar concentration of the main metals constituting the metal salts. The "main metal" and the "metal having a standard electrode potential within 1V from the main metal" may have a relatively high standard electrode potential as long as the difference between the standard electrode potentials is within 1V.

The molar concentration of the main metal in the plating solution is not particularly limited, but is preferably in the range of 0.05(mol/L) to 0.5 (mol/L).

The metal having a difference in standard electrode potential of 1V or less is preferably a trace amount of the metal relative to the main metal, and for example, the molar concentration ratio of "the main metal" to "the metal having a difference in standard electrode potential of 1V or less relative to the main metal" is preferably in the range of 1: 0.001 to 1: 0.05. A particularly preferable range is 1: 0.003 to 1: 0.02.

More preferably, the 2 or more metal salts contained in the plating solution include: a metal salt containing copper as a main metal, and a metal salt containing nickel as a metal having a standard electrode potential within 1V of the main metal.

In addition, the 2 or more kinds of metal salts contained in the plating liquid more preferably include: a metal salt containing nickel as a main metal, and a metal salt containing any of iron, tin, chromium, or copper as a metal having a standard electrode potential within a difference of 1V from the main metal.

Further, the 2 or more kinds of metal salts contained in the plating liquid include: when a metal salt containing nickel as a main metal and a metal salt containing any of iron, tin, chromium, and copper as a metal whose standard electrode potential is within 1V from the main metal are contained, it is particularly preferable that a metal salt containing zinc is further contained as 2 or more kinds of metal salts. Thereby, nickel as a main metal forms a nickel-zinc alloy plating film on the plating target portion together with zinc. As a result, the removal of the discontinuous portion and the blackening (antireflection effect) by the nickel-zinc alloy plating work in cooperation, and an effect particularly excellent in transparency and low visibility can be obtained.

In the case where a metal salt containing zinc is used in combination as described above, the concentration (wt%) of zinc in the plating solution may be lower than that of the main metal, and is preferably higher than "a metal having a standard electrode potential within 1V with respect to the main metal" which is contained in the plating solution. In particular, it is preferable to use a plating solution containing a metal salt containing nickel in combination with a metal salt containing zinc because the surface of the plating (the surface of the plating film) can be blackened and this blackened surface can synergistically reduce visibility in the present invention. From the viewpoint of sufficiently exerting such effects, the molar concentration ratio of the metal salt containing nickel to the metal salt containing zinc is preferably in the range of 1: 0.3 to 1: 0.6.

In the above description, the metal salt containing copper is not particularly limited, and examples thereof include copper sulfate pentahydrate and the like. The metal salt containing nickel is not particularly limited, and examples thereof include nickel sulfate hexahydrate, nickel ammonium sulfate hexahydrate, nickel chloride and the like. The metal salt containing iron is not particularly limited, and examples thereof include iron trichloride hexahydrate and the like. The metal salt containing tin is not particularly limited, and examples thereof include tin dichloride and the like. The metal salt containing chromium is not particularly limited, and examples thereof include chromium trichloride. The metal salt containing zinc is not particularly limited, and examples thereof include zinc sulfate.

The complexing agent contained in the plating liquid is not particularly limited, and a substance that promotes the dissolution of the conductive material can be preferably used, and for example, 1 or more selected from boric acid, citric acid, sodium thiocyanate, pyrophosphoric acid, ethylenediaminetetraacetic acid, and the like can be used. The concentration of the complexing agent in the plating liquid is not particularly limited, but is preferably in the range of 0.03mol/L to 1 mol/L.

The solvent of the plating solution can preferably use water. In addition, other components than the above-described components may be suitably contained in the plating liquid within a range not impairing the effects of the present invention. Examples of the other components contained in the plating liquid include hydrochloric acid, a gloss imparting agent, a surfactant, and a pH buffer.

In the plating step using the plating liquid described above, for example, when the intermediate pattern shown in fig. 1(d) is subjected to electrolytic plating in the plating liquid, the outer thin wire 4 as the plating target portion is electrically connected to an electrode (a power feeding electrode, usually a cathode) for electrolytic plating, and a plating layer can be formed on the outer thin wire 4 by supplying power to the outer thin wire 4. At this time, the inner thin wire 3 as the discontinuous portion is provided discontinuously with respect to the outer thin wire 4 as the plated portion, and therefore, is not energized except from the energizing path. The pattern shown in fig. 2 can be formed by removing the inner thin lines 3 by the action of the plating liquid. The pattern shown in fig. 2 is composed of the outer threads 4, with the inner threads 3 removed.

As described above, by removing the discontinuous portion (here, the inner thin wire 3) which is a part of the pattern intermediate, and forming a pattern from the plating target portion (here, the outer thin wire 4) covered with the plating film, an arbitrary lattice interval (arrangement interval of thin wires) can be given to the pattern.

In addition, when 1 transparent conductive film is formed from a plurality of conductive thin lines arranged in parallel, the isolated discontinuous portions in the pattern intermediate not only hardly contribute to the conductivity of the transparent conductive film, but also cause a decrease in transmittance and transparency. By removing the discontinuous portion, the transmittance and transparency of the transparent conductive film can be improved.

Further, since the plating film is laminated on the plating target portion in the plating step, the resistance of the obtained pattern is reduced, and an effect of excellent conductivity can be obtained.

The discontinuous portion is not limited to the inner thin line described above, and may have various shapes. The discontinuity is preferably a portion which is intentionally or unintentionally formed in the printing process, and is a portion which is not useful in the final product. The discontinuous portion may be a portion formed by, for example, mist of ink or the like unintentionally adhering to the base material in a printing process for printing the plating target portion. Such discontinuous portions can be appropriately removed in the plating step described above, and the quality of the final product can be improved. Further, it is also possible to remove a plurality of types of discontinuous portions at the same time, and for example, a discontinuous portion formed of the inner thin line described above and a discontinuous portion due to fog may be removed at the same time.

[ multiple metal layers ]

In the plating step, a plurality of plating treatments may be performed on the pattern intermediate body, the plating treatments being different in plating solution. In this case, the plating metals may be different in each plating solution. By the plating treatment a plurality of times, a plurality of metal layers (plating films) can be stacked on the plating target portion. When the plating treatment is performed a plurality of times, it is preferable to perform the electric field plating treatment using a plating liquid containing at least 2 or more metal salts and complexing agents different in metal species from each other to remove the discontinuous portions in at least 1 plating treatment, preferably at least the first 1 plating treatment.

(3) Others

The pattern formed by the printing step and the plating step described above, or the application of the patterned substrate having the pattern on the substrate is not particularly limited, and various applications can be used.

It is preferable to use a pattern composed of a plurality of conductive thin lines arranged in parallel as 1 transparent conductive film. The transparent conductive film is used as a transparent electrode for various devices provided in various electronic devices, for example, and specifically, can be used as a transparent electrode for displays of various types such as liquid crystal, plasma, organic electroluminescence, and field emission.

The transparent electrode can be used as a transparent electrode for a touch panel, a mobile phone, electronic paper, various solar cells, various electroluminescence light control elements, and the like. In particular, the transparent electrode can be used for a touch panel sensor of an electronic device such as a smartphone, a tablet terminal, or the like, for example. When used as a touch panel sensor, the transparent electrodes can be used as the position detection electrodes (X electrodes and Y electrodes).

Here, "transparent" does not mean that the conductive thin line itself constituting the transparent conductive film is transparent, and the transparent conductive film as a whole can transmit light (for example, through a region where the conductive thin line is not provided).

Further, it is also preferable that a pattern composed of 1 or a plurality of conductive thin lines is used as an electric wiring or the like constituting an electric circuit.