阅读说明：本技术 成膜装置和成膜方法 (Film forming apparatus and film forming method ) 是由 户岛宏至 岩下浩之 平泽达郎 于 2019-07-22 设计创作，主要内容包括：本发明的课题在于提供一种扩大了加工余量而且难以在放电空间发生与反应气体的反应的使用了反应性溅射的成膜装置和成膜方法。其解决手段一种成膜装置,其包括：处理腔室、释放溅射颗粒的溅射机构、屏蔽释放溅射颗粒的放电空间的溅射颗粒屏蔽部件、设置在处理腔室内的反应室、在反应室内支承基片的基片支承部、使基片移动的移动机构、设置于溅射颗粒屏蔽部件的具有小于基片的面积且使溅射颗粒朝向基片而通过的溅射颗粒通过孔、和向反应室内导入反应气体的反应气体导入部,该成膜装置一边使基片移动,一边使通过了溅射颗粒通过孔的溅射颗粒与导入到反应室的反应气体进行反应,在基片上形成反应性溅射膜。(The invention provides a film forming apparatus and a film forming method using reactive sputtering, which have a large machining allowance and are difficult to react with a reaction gas in a discharge space. The solution is a film forming apparatus comprising: the film forming apparatus includes a processing chamber, a sputtering mechanism for discharging sputtering particles, a sputtering particle shielding member for shielding a discharge space for discharging the sputtering particles, a reaction chamber provided in the processing chamber, a substrate supporting portion for supporting a substrate in the reaction chamber, a moving mechanism for moving the substrate, a sputtering particle passage hole provided in the sputtering particle shielding member and having an area smaller than that of the substrate and through which the sputtering particles pass toward the substrate, and a reaction gas introducing portion for introducing a reaction gas into the reaction chamber.)

1. A film deposition apparatus for depositing a film by reactive sputtering, comprising:

a processing chamber in which a film forming process is performed on a substrate;

a sputtering mechanism that releases sputtered particles from the target within the processing chamber;

a sputtering particle shielding member that shields a discharge space to which the sputtering particles released by the sputtering mechanism can be released;

a reaction chamber provided independently of the discharge space in the process chamber;

a substrate support supporting a substrate within the reaction chamber;

a moving mechanism that moves the substrate supported by the substrate support;

a sputtering particle passage hole, which is provided in the sputtering particle shielding member, has an area smaller than that of the substrate, and passes the sputtering particle toward the substrate of the reaction chamber; and

a reaction gas introduction part which introduces a reaction gas into the reaction chamber,

the film forming apparatus is configured to react sputtering particles released from the sputtering mechanism into the discharge space and ejected into the reaction chamber through the sputtering particle passage holes, with a reaction gas introduced into the reaction chamber, while moving the substrate by the substrate moving mechanism, and form a reactive sputtering film generated by the reaction on the substrate.

2. The film forming apparatus according to claim 1, wherein:

the area of the sputtering particle passing hole is 90% or less of the area of the substrate.

3. The film forming apparatus according to claim 2, wherein:

the area of the sputtering particle through hole is 10-50% of the area of the substrate.

4. The film forming apparatus according to any one of claims 1 to 3, wherein:

the substrate is horizontally arranged on the substrate supporting part,

the substrate moving mechanism moves the substrate in a horizontal plane,

the sputtering particle shielding member is arranged right above the substrate and has a sputtering particle shielding plate in which the sputtering particle passage holes are formed,

the sputtering particles react with the reaction gas in a reaction space between the sputtering particle shielding plate and the substrate.

5. The film forming apparatus according to claim 4, wherein:

the distance between the sputtering particle shielding plate and the substrate is more than 2 mm.

6. The film forming apparatus according to claim 4 or 5, wherein:

the sputtering particle shielding plate functions as a rectifying plate for rectifying the reaction gas.

7. The film forming apparatus according to any one of claims 1 to 6, wherein:

the sputtering mechanism includes:

a target holding portion that holds a target for releasing the sputtering particles;

a sputtering gas introduction unit that introduces a sputtering gas into the discharge space; and

a power supply for applying a voltage to the target holding portion,

the sputtering gas is dissociated around the target by applying a voltage to the target holding portion, and ions of the dissociated sputtering gas collide with the target to release sputtered particles.

8. The film forming apparatus according to claim 7, wherein:

the target holder holds the target in an inclined manner with respect to the substrate, and the sputtered particles released from the target are irradiated in an inclined manner with respect to the substrate.

9. The film forming apparatus according to any one of claims 1 to 8, wherein:

the substrate moving mechanism moves the substrate in a straight line.

10. The film forming apparatus according to any one of claims 1 to 8, wherein:

the substrate moving mechanism rotates the substrate.

11. A film forming method for forming a film by reactive sputtering using a film forming apparatus, comprising:

the film forming apparatus includes:

a processing chamber in which a film forming process is performed on a substrate;

a sputtering mechanism that releases sputtered particles from the target within the processing chamber;

a sputtering particle shielding member that shields a discharge space to which the sputtering particles released by the sputtering mechanism can be released;

a reaction chamber provided independently of the discharge space in the process chamber;

a substrate support supporting a substrate within the reaction chamber;

a moving mechanism that moves the substrate supported by the substrate support;

a sputtering particle passage hole, which is provided in the sputtering particle shielding member, has an area smaller than that of the substrate, and passes the sputtering particle toward the substrate of the reaction chamber; and

a reaction gas introduction part which introduces a reaction gas into the reaction chamber,

the film forming method includes:

a step of moving the substrate by the substrate moving mechanism;

a step of discharging the sputtering particles in the discharge space by the sputtering mechanism while moving the substrate, and ejecting the sputtering particles to the reaction chamber through the sputtering particle passage holes;

reacting the sputtering particles ejected into the reaction chamber with a reaction gas introduced into the reaction chamber; and

a step of forming a reactive sputtered film generated by the step of reacting on the substrate.

Technical Field

The present invention relates to a film deposition apparatus and a film deposition method.

Background

In the manufacture of electronic devices such as semiconductor devices, a film formation process is performed to form a film on a substrate.

As a film formation process, reactive sputtering is known in which sputtered particles released from a target are reacted with a reactive gas such as oxygen or nitrogen to form a compound thin film such as an oxide film or a nitride film on a substrate (for example, patent documents 1 and 2).

Disclosure of Invention

Technical problem to be solved by the invention

The invention provides a film forming apparatus and a film forming method using reactive sputtering, which have a large machining allowance and are difficult to react with a reaction gas in a discharge space.

Technical solution for solving technical problem

A film deposition apparatus according to an embodiment of the present invention is a film deposition apparatus for forming a film by reactive sputtering, including:

a processing chamber in which a film forming process is performed on a substrate;

a sputtering mechanism configured to release sputtered particles from the target in the processing chamber;

a sputtering particle shielding member that shields a discharge space to which the sputtering particles released by the sputtering mechanism can be released;

a reaction chamber provided independently of the discharge space in the processing chamber;

a substrate support part for supporting the substrate in the reaction chamber;

a moving mechanism for moving the substrate supported by the substrate support;

a sputtering particle passage hole provided in the sputtering particle shielding member, having an area smaller than that of the substrate, and allowing the sputtering particle to pass through the substrate in the reaction chamber; and

a reaction gas introduction part for introducing a reaction gas into the reaction chamber,

the film forming apparatus is configured to cause the reaction gas introduced into the reaction chamber to react with the sputtering particles discharged into the discharge space by the sputtering mechanism and ejected into the reaction chamber through the sputtering particle passage holes while moving the substrate by the substrate moving mechanism, thereby forming a reactive sputtered film formed by the reaction on the substrate.

Effects of the invention

According to the present invention, it is possible to provide a film deposition apparatus and a film deposition method using reactive sputtering in which a machining allowance is increased and a reaction with a reactive gas is difficult to occur in a discharge space.

Drawings

Fig. 1 is a vertical sectional view showing a film deposition apparatus according to a first embodiment.

FIG. 2 is a view showing a relationship between sputtering particles passing holes and a substrate in the film forming apparatus of FIG. 1.

Fig. 3 is a schematic view for explaining a manner of forming a film by the first embodiment.

Fig. 4 is a vertical sectional view showing a film deposition apparatus according to a second embodiment.

FIG. 5 is a view showing the relationship between the sputtering particle passage hole and the substrate in the film forming apparatus of FIG. 4.

Description of the symbols

1: film forming apparatus

10: processing chamber

10 a: chamber body

10 b: cover body

12: substrate support

14,14': substrate moving mechanism

16: target material support

18: power supply

20: sputtering particle shielding member

22: sputtering gas introduction part

24: reaction gas introduction part

26: exhaust mechanism

28: target material

36: sputtering particle shielding plate

37: sputtering particles through the holes

38: shielding component

S1: discharge space

S2: reaction chamber

S3: reaction space

W: substrate

Detailed Description

The embodiments are specifically described below with reference to the drawings.

< first embodiment >

First, a first embodiment will be explained.

Fig. 1 is a vertical sectional view showing a film deposition apparatus according to a first embodiment.

The film deposition apparatus 1 of the present embodiment is an apparatus for forming a film on a substrate W by reactive sputtering. The film forming apparatus 1 includes a process chamber 10, a substrate support 12, a substrate moving mechanism 14, a target holder 16, a power supply 18, a sputtering particle shielding member 20, a sputtering gas introduction portion 22, a reaction gas introduction portion 24, and an exhaust device 26. Examples of the substrate W include, but are not limited to, a semiconductor wafer.

The processing chamber 10 includes a chamber body 10a having an opening at an upper portion thereof and a lid body 10b provided to cover the upper opening of the chamber body 10 a. The cross-sectional shape of the lid 10b is trapezoidal.

An exhaust port 25 is formed in the bottom of the processing chamber 10, and the exhaust device 26 is connected to the exhaust port 25. The exhaust unit 26 includes a pressure control valve and a vacuum pump, and the inside of the processing chamber 10 can be evacuated to a predetermined degree of vacuum by the exhaust unit 26.

A transfer port 29 for transferring the substrate W into and out of an adjacent transfer chamber (not shown) is formed in a side wall of the processing chamber 10. The carrying in/out port 29 is opened and closed by a gate valve 30.

The substrate support 12 is disposed in the chamber body 10a of the process chamber 10 to horizontally support the substrate W. The substrate support 12 can be linearly moved in the horizontal direction by the substrate moving mechanism 14. Therefore, the substrate W supported by the substrate support 12 can be linearly moved in the horizontal plane by the substrate moving mechanism 14. The substrate moving mechanism 14 includes an articulated arm portion 31 and a driving portion 32, and the articulated arm portion 31 is driven by the driving portion 32 to move the substrate support portion 12 in the horizontal direction.

The sputtering gas introduction part 22 is provided at the top of the process chamber 10. An inert gas such as Ar gas or Kr gas is introduced into the processing chamber 10 from the sputtering gas introduction unit 22 as a sputtering gas.

The target holder 16 is a member for holding the target 28, is formed of a conductive material, and is attached to the inclined surface of the lid body 10b of the processing chamber 10 so as to be inclined with respect to the substrate W via an insulating member. The target 28 is made of a material containing a constituent element of a film to be formed. For example, when the film to be formed is a TiN film, it is made of Ti.

The target holder 16 is electrically connected to a power supply 18. Where the target 28 is a conductive material, the power supply 18 may be a direct current power supply, and where the target 28 is a dielectric material, the power supply 18 may be a high frequency power supply. When the power supply 18 is a high-frequency power supply, the power supply 18 is connected to the target holder 16 via a matching unit. By applying a voltage to the target holder 16, the inert gas, which is the sputtering gas introduced from the sputtering gas introduction portion 22, is dissociated around the target 28. Thereafter, the ions in the dissociated gas collide with the target 28, and are released obliquely downward from the sputtered particles of the particles of which the target 28 is a constituent material.

The target holder 16, the power supply 18, and the sputtering gas introduction section 22 constitute a sputtering mechanism for discharging sputtered particles from the target 28.

The reaction gas introduction part 24 is provided at the bottom of the process chamber 10. The reaction gas introduction part 24 introduces, for example, O ₂Gas, N ₂A reaction gas such as gas is introduced into the processing chamber 10. Reaction gas and gas released from the target 28The sputtered particles react to form a predetermined compound film on the surface of the substrate W on the substrate support 12. For example, the target 38 is Ti and the reaction gas is N ₂When gas is generated, a TiN film is formed.

The sputtering particle shielding member 20 is provided in the processing chamber 10, and has a function of shielding the sputtering particles released from the target 28, and the sputtering particle shielding member 20 has a sputtering particle shielding plate 36, a shielding member 38, and sputtering particle passing holes 37.

The sputtering particle shielding plate 36 has a substantially plate shape, is horizontally provided right above the substrate support 12, and has sputtering particle passage holes 37 formed therein. The sputtering particle passage holes 37 penetrate the sputtering particle shielding plate 36 in the plate thickness direction. The shielding member 38 is disposed above the sputtering particle shielding plate 36. Then, the sputtering particle shielding plate 36 and the shielding member 38 form a shielded space, and this space becomes a discharge space S1 where the sputtering particles are discharged from the target 28. A gap of about 1 to 2mm is formed between the sputtering particle shielding plate 36 and the shielding member 38, and a labyrinth structure is formed.

The region in the process chamber 10 where the substrate W is disposed and the reaction gas reacts with the sputtered particles is a reaction chamber S2 different from the discharge space S1. Further, the sputtered particles pass through the holes 37 to pass the sputtered particles of the discharge space S1 toward the substrate W of the reaction chamber S2. The discharge space S1 and the reaction chamber S2 can be independently controlled in pressure by adjusting the flow rates of an inert gas and a reactive gas, which are sputtering gases.

The sputtering gas introduction unit 22 supplies a sputtering gas to the discharge space S1, and the reaction gas introduction unit 24 supplies a reaction gas to the reaction chamber S2.

In the shielded discharge space S1, the sputtered particles are discharged obliquely downward from the target 28, and pass through the sputtered particle passage holes 37 to be obliquely irradiated onto the substrate W in the reaction chamber S2.

The sputtered particles have a smaller area than the substrate W through the holes 37, and it is difficult for the reaction gas to bypass the discharge space S1. The area of the sputtering particle passage holes 37 is preferably 90% or less, more preferably 10 to 90%, and still more preferably 10 to 50% of the area of the substrate W. When the substrate W is linearly moved forward as in this example, the shape of the sputter particle passage holes 37 can be a rectangle having a length equal to or longer than the diameter (width) of the substrate W as shown in FIG. 2.

On the other hand, in the reaction chamber S2, the reaction gas is supplied while the sputtering particles are dropped from the discharge space S1 between the sputtering particle passage holes 37 and the substrate W, and the reaction space S3 in which the sputtering particles react with the reaction gas is formed. A compound to be formed is generated by the reaction in the reaction space S3, and a reactive sputtering film containing the compound is formed on the substrate W.

In this case, the distance between the sputtering particle shielding plate 36 and the substrate W may be set to a distance that allows the reaction gas to be supplied to the reaction space S3 with sufficiently large conductance. This makes it possible to improve the reactivity between the sputtered particles and the reaction gas in the reaction space S3. From such a viewpoint, the distance between the sputtering particle shielding plate 36 and the substrate W is preferably 2mm or more, and more preferably 4mm or more.

Further, the portions of the sputtering particle shielding plate 36 other than the sputtering particle passage holes 37 function as a rectifying plate for rectifying the reaction gas, so that the reaction gas can be stably supplied onto the substrate W in a laminar flow state.

The film forming apparatus 1 further includes a control unit 40. The control unit 40 includes a computer, and has a main control unit including a CPU that controls each component of the film formation apparatus 1, for example, the power supply 18, the introduction of the sputtering gas, the introduction of the reaction gas, the exhaust device 26, the drive mechanism 32, and the like. In addition, other devices include input devices such as a keyboard and a mouse, output devices, display devices, and storage devices. The main controller of the controller 40 mounts a storage medium storing a process menu in the storage device, and causes the film deposition apparatus 1 to perform a predetermined operation based on the process menu read from the storage medium.

Next, a film forming operation of the film forming apparatus configured as described above will be described.

First, the gate valve 30 is opened, and the substrate W is carried into the reaction chamber S2 in the processing chamber 10 by a carrying device (not shown) from a carrying chamber (not shown) adjacent to the processing chamber 10, and placed on the substrate support 12.

Next, an inert gas such as Ar gas or Kr gas is introduced as a sputtering gas from the sputtering gas introduction unit 22 into the discharge space S1 in the processing chamber 10, and the pressure in the processing chamber 10 is adjusted to a predetermined pressure.

Subsequently, while the substrate W placed on the substrate support 12 is linearly moved in the horizontal plane by the substrate moving mechanism 14, a voltage is applied from the power supply 18 to the target holder 16, and a reaction gas is introduced from the reaction gas introduction portion 24 into the reaction chamber S2 in the processing chamber 10.

At this time, the sputtering gas introduced from the sputtering gas introduction portion 22 is dissociated by an electromagnetic field formed by applying a voltage to the target holder 16. Thereafter, ions in the dissociated gas collide with the target 28, and sputtered particles of the constituent material of the target 28 are released obliquely downward from the target 28. As shown in fig. 3, the sputtered particles P released from the target 28 are ejected into the reaction chamber S2 through the sputtered particles passage holes 37 and irradiated toward the substrate W. On the other hand, when the reaction gas G introduced into the process chamber 10 from the reaction gas introduction portion 24 diffuses in the process chamber 10 and reaches the reaction space S3 where the sputtering particles P fall down from the sputtering particle passage holes 37 toward the substrate 10, the reaction gas G reacts with the sputtering particles P to generate a compound to be deposited, and a reactive sputtering film F made of the compound is formed on the substrate W.

In a conventional reactive sputtering apparatus, a reactive gas is often supplied into a discharge space where sputtered particles are released. In this case, the discharge space is generally covered with a shield, and a slit for introducing the reaction gas is formed in the shield. However, in order to suppress the leakage of the sputtering particles, when the gap is reduced, the reaction gas is hard to enter the discharge space and difficult to control, and thus the machining allowance tends to be reduced. On the other hand, if the reaction gas is sufficiently introduced, the reaction gas is excessively supplied, and there is a problem that the reaction occurs even on the target surface, the film formation rate is lowered, or waste (particles) is generated (Poisson model).

In addition, in the conventional reactive sputtering apparatus, a reactive sputtering film is deposited also on a shielding portion (inside of the sputtering particle shielding member 20, etc.) around the substrate. Generally, a reactive sputtering film has a large film stress and is easily peeled off, and when the reactive sputtering film is deposited also on a shielding portion around a substrate, there is a problem that waste (particles) or the like is generated, and a maintenance cycle is shortened.

In the techniques of patent documents 1 and 2, the entrance of the reactive gas into the discharge space is suppressed by the pressure difference plate and the partition plate, and the reactive gas becomes difficult to reach the target. However, the sputtering particle passage holes formed in the pressure difference plate and the partition plate are formed wider than the substrate, and the intrusion of the reaction gas into the discharge space cannot necessarily be effectively suppressed.

In contrast, in the present embodiment, while the substrate W is linearly moved, the reaction gas is reacted with the reaction gas in the reaction space S3 outside the discharge space S1 by passing the sputter particles from the discharge space S1 through the sputter particle passage holes 37 having a smaller area than the substrate W.

Accordingly, the reaction gas can be supplied to the substrate W with a sufficiently large conductance without supplying the reaction gas to the discharge space with a small conductance, and thus, the processing margin can be increased. Further, since the sputtering particles pass through the holes 37 and the substrate W is moved so as to have a smaller area than the substrate, the reaction gas is less likely to flow into the discharge space, and the reaction between the target and the reaction gas can be suppressed. In this case, the area of the sputtering particle passage holes 37 is preferably 90% or less, more preferably 10 to 90%, and still more preferably 10 to 50% of the area of the substrate W. Further, since the reactive gas is supplied to the sputter particles falling down from the discharge space S1 to the reaction space S3 through the sputter particle passage holes 37, the reactive gas can be made more difficult to intrude into the discharge space, and the reaction between the target and the reactive gas can be more reliably prevented.

By separating the discharge space from the reaction space in this way, it is possible to prevent the sputtering particles from reacting with the reaction gas at the shielding portion (the sputtering particle shielding member 20 and the like) around the substrate to deposit a reactive sputtering film. Therefore, generation of waste (particles) at the shielding portion around the substrate is suppressed, and a problem of shortening of the maintenance period is not caused.

Further, when the discharge space S1 shielded by the sputtering particle shielding member 20 is separately defined in the processing chamber 10 as in the present embodiment, the following effect can be obtained by changing the volume of the discharge space S1. That is, when the discharge space S1 is not defined, since the shape and the volume of the processing chamber 10 are fixed, the sputtered particles may not be released under optimum conditions according to the conditions such as the type of film and the film thickness. In this case, it is difficult to change the shape and volume of the processing chamber 10. In contrast, by changing the volume of the discharge space S1 in the process chamber 10, the target ambient pressure, the gas concentration of the sputtering gas, and the like can be easily changed. Therefore, the sputtering particles can be easily released under optimum conditions without changing the shape of the processing chamber.

Further, by setting the distance between the sputtering particle shielding plate 36 and the substrate W to a distance that allows the reaction gas to be supplied to the reaction space S3 with sufficiently large conductance, the reactivity between the sputtering particles and the reaction gas can be improved in the reaction space S3. From such a viewpoint, the distance between the sputtering particle shielding plate 36 and the substrate W is preferably 2mm or more, and more preferably 4mm or more.

Further, since the portions of the sputtering particle shielding plate 36 other than the sputtering particle passage holes 37 function as a flow regulating plate for guiding the reaction gas to the reaction space S3, the reaction gas can be stably supplied onto the substrate W in a laminar flow state.

In the present embodiment, the shape of the sputtering particle passage hole 37 is a rectangle having a length equal to or greater than the diameter (width) of the substrate W, and sputtering particles are obliquely irradiated from the target 28 toward the substrate W while moving the substrate W linearly, and are caused to react with the reaction gas. Therefore, by making the angle of the sputtered particles substantially constant, it is possible to perform oblique film formation with high directivity.

< second embodiment >

Next, a second embodiment will be described.

Fig. 4 is a vertical sectional view showing a film deposition apparatus according to a second embodiment.

The film deposition apparatus 1 'of the present embodiment is configured in the same manner as the film deposition apparatus 1 shown in fig. 1 except that a substrate transfer mechanism 14' is provided instead of the substrate transfer mechanism 14.

The substrate moving mechanism 14' has a rotation driving part 41 and a rotation shaft 42, and the rotation shaft 42 is fixed to the center of the substrate supporting part 12. Therefore, the substrate support portion 12 is rotated by the rotation driving portion 41 via the rotation shaft 42, and the substrate W thereon rotates in a horizontal plane in accordance therewith.

In the present embodiment, reactive sputtering is performed in the same manner as in the first embodiment while the substrate W is rotated and moved by the substrate moving mechanism 14'.

In the present embodiment, the shape of the sputtering particle passage holes 37 formed in the sputtering particle shielding plate 36 is preferably a shape that is wide at the outer peripheral portion of the substrate W and narrow at the central portion, as shown in fig. 5. This makes it possible to supply the sputtered particles more uniformly to the outer peripheral portion and the central portion of the substrate.

In the present embodiment, as in the first embodiment, the machining allowance can be increased, and the reaction gas is less likely to react in the discharge space. In addition, other effects of the first embodiment can be similarly exhibited.

< other applications >

The embodiments have been described above, but the embodiments disclosed herein are merely illustrative in all aspects and should not be considered as restrictive. In the above-described embodiment, various omissions, substitutions, and changes may be made without departing from the scope and spirit of the claims that follow.

For example, the method of releasing the sputtering particles in the above embodiment is merely an example, and the sputtering particles may be released by another method. In the above embodiment, an example in which the target is disposed obliquely to perform oblique film formation is described, but the present invention is not limited thereto, and the target may be disposed at the center. In the above-described embodiment, the movement in the horizontal plane of the base is described by taking the linear forward movement and the rotation as examples, but other movements such as swing may be used.