阅读说明：本技术 一种晶片镀膜设备 (Wafer coating equipment ) 是由 庄仕伟 于 2019-10-30 设计创作，主要内容包括：本发明涉及半导体加工领域,具体涉及一种晶片镀膜设备,包括盘体,所述盘体上具有若干个放置晶片的开口,所述开口内缘设置有磁性环,所述承载盘还具有磁性承载架,所述磁性承载架承载晶片,磁性承载架一端与磁性环的上表面接触,磁性承载架上设有通孔,所述通孔内设有弹片,弹片设置为弧形,磁性环上设有卡柱,卡柱在通孔内滑动并与弹片抵接,磁性承载架另一端与晶片的磁吸附性区接触,本发明通过磁性吸附晶片将其固定于承载盘上,并同时通过磁性吸附使翘曲晶片变平,防止镀源蒸镀到晶片的正面。(The invention relates to the field of semiconductor processing, in particular to a wafer coating device which comprises a disc body, wherein a plurality of openings for placing wafers are arranged on the disc body, magnetic rings are arranged at the inner edges of the openings, the disc body is also provided with a magnetic bearing frame, the magnetic bearing frame bears the wafers, one end of the magnetic bearing frame is in contact with the upper surface of the magnetic rings, through holes are formed in the magnetic bearing frame, elastic sheets are arranged in the through holes and are arc-shaped, clamping columns are arranged on the magnetic rings, the clamping columns slide in the through holes and are abutted against the elastic sheets, and the other end of the magnetic bearing frame is in contact with a magnetic adsorption area of the wafers.)

1. The utility model provides a wafer coating equipment, its characterized in that, includes disk body (10), opening (11) that the wafer was placed to a plurality of have on disk body (10), opening (11) inner edge is provided with magnetism ring (20), it still has magnetism and bears frame (30) to bear the weight of the dish, magnetism bears the weight of the wafer in frame (30), and magnetism bears the upper surface contact of frame (30) one end and magnetism ring (20), is equipped with through-hole (31) on magnetism bearing frame (30), be equipped with shell fragment (32) in through-hole (31), shell fragment (32) set up to the arc, are equipped with on magnetism ring (20) and block post (22), and block post (22) slide in through-hole (31) and with shell fragment (32) butt, magnetism bears the magnetism and bears the magnetism of the other end and wafer and adsorbs the district contact.

2. Wafer coating installation according to claim 1, characterized in that the magnetic carrier (30) is Z-shaped in cross-section.

3. Wafer coating installation according to claim 1, characterized in that the magnetic ring (20) is of a one-piece annular configuration or of an annular configuration surrounded by a plurality of magnetic blocks (21), the clamping columns (22) being arranged on the magnetic blocks (21).

4. Wafer coating installation according to claim 1, characterized in that the magnetic carrier (30) is of a unitary ring-shaped construction or a ring-shaped construction surrounded by a plurality of sub-magnetic carriers (30).

5. The wafer coating apparatus of claim 1, wherein the magnetic adsorption area of the wafer is an integrated annular area or an annular area surrounded by a plurality of sub-magnetic adsorption areas.

6. The wafer coating device according to claim 3, characterized in that the magnetic block (21) is integrated with the tray body (10) or is a detachable structure.

7. The wafer coating equipment according to claim 6, characterized in that the magnetic block (21) is fixed with the inner side wall of the opening (11) through a clamping groove.

8. The wafer coating device according to claim 6, wherein the elastic pieces (32) are provided in plurality and uniformly distributed in the through holes (31).

Technical Field

The invention relates to the field of semiconductor processing, in particular to a wafer coating device.

Background

Light emitting diodes are referred to as LEDs for short. Is made of a compound containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N), etc. When electrons and holes are recombined, visible light is radiated, so that the light-emitting diode can be manufactured.

In order to further improve the brightness of the LED chip, a Distributed Bragg Reflector (DBR) is usually coated on the back surface of the thinned wafer by vacuum coating, so as to reflect the light emitted to the back surface of the wafer back to the front surface, thereby improving the light emitting efficiency of the LED. When the distributed Bragg reflector is plated, the thinned wafer needs to be placed into a plating ring, and the thinned wafer has certain warping due to the stress problem, so that the thinned warped chip needs to be flattened by using a accompanying sheet or a pressing cover, and then the thinned chip is placed into a DBR plating pot to plate the DBR. The purpose of flattening the thinned warped wafer by using the accompanying sheet or the gland is to avoid the wafer edge and the plating ring from having a gap due to warping, so that the front face is plated abnormally in the film plating process. The used gland/accompanying sheet has more defects. If the accompanied sheet or the gland is used, the person can have electrode scratch/artificially crush the sheet with excessive force when placing the accompanied sheet (the scrapped sheet/the glass sheet), and the like, thereby causing yield loss.

Disclosure of Invention

The invention aims to provide a wafer coating device, which fixes a wafer on a bearing disc through magnetic attraction and flattens a warped wafer through the magnetic attraction so as to prevent a coating source from being evaporated on the front surface of the wafer.

In order to achieve the purpose, the invention adopts the following technical scheme:

the utility model provides a wafer coating equipment, includes the disk body, the opening that the wafer was placed to a plurality of has on the disk body, the opening inner edge is provided with the magnetism ring, bear the dish and still have the magnetism and bear the frame, the magnetism bears the frame and bears the wafer, and the magnetism bears the upper surface contact that frame one end and magnetism ring, and the magnetism bears and is equipped with the through-hole, be equipped with the shell fragment in the through-hole, the shell fragment sets up to the arc, is equipped with the card post on the magnetism ring, and the card post slides in the through-hole and with the shell fragment butt, the magnetism.

As a preferable scheme of the wafer coating equipment, the cross section of the magnetic bearing frame is Z-shaped.

As a preferable scheme of the wafer coating equipment, the magnetic ring is an integral annular structure or an annular structure formed by surrounding a plurality of magnetic blocks, and the clamping columns are arranged on the magnetic blocks.

As a preferable scheme of the wafer coating equipment, the magnetic bearing frame is of an integral annular structure or an annular structure formed by surrounding a plurality of sub-magnetic bearing frames.

As a preferable scheme of the wafer coating equipment, the magnetic adsorption area of the wafer is an integral annular area or an annular area formed by surrounding a plurality of sub-magnetic adsorption areas.

As a preferable scheme of the wafer coating equipment, the magnetic block and the disc body are integrally formed or are in a detachable structure.

As a preferable scheme of the wafer coating equipment, the magnetic block is fixed with the inner side wall of the opening through a clamping groove.

As a preferable scheme of the wafer coating equipment, the elastic sheets are arranged in a plurality and are uniformly distributed in the through holes.

The invention has the beneficial effects that: the wafer is placed on the Z-shaped magnetic support frame, the magnetic attraction phenomenon is generated at the contact position of the support frame and the wafer magnetic attraction area, the wafer is fixed on the bearing disc through the magnetic attraction, and the warping wafer is flattened through the magnetic attraction at the same time, so that the plating source is prevented from being evaporated to the front surface of the wafer.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described below. It is obvious that the drawings described below are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.

FIG. 1 is a top view of a wafer coating apparatus according to the present invention

FIG. 2 is a schematic view of a partial interface structure between a carrier plate and a wafer of a wafer coating apparatus according to the present invention;

FIG. 3 is a schematic top view of a magnetic ring and a magnetic carrier in the wafer coating apparatus according to the present invention;

FIG. 4 is a schematic view of the magnetic ring and the magnetic carrier of the wafer coating apparatus according to the present invention.

In the figure: 10-a tray body; 11-opening; 20-a magnetic ring; 21-a magnetic block; 22-clamp column; 30. a magnetic carrier; 31-a through hole; 32-spring plate; 4-wafer.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.

As an embodiment of the present invention, the present invention provides a wafer coating apparatus, including a tray body, the tray body having a plurality of openings for placing wafers, the inner edge of the openings being provided with a magnetic ring, the tray further having a magnetic carrier, the magnetic carrier carrying the wafers, one end of the magnetic carrier contacting the upper surface of the magnetic ring, the magnetic carrier having a through hole, the through hole being provided with an elastic piece, the elastic piece being arc-shaped, the magnetic ring having a clamping post, the clamping post sliding in the through hole and abutting against the elastic piece, the other end of the magnetic carrier contacting a magnetic adsorption region of the wafers.

Through the design of the coating equipment, the magnetic adsorption substance is coated on the specific area of the edge of the wafer to form a magnetic adsorption area, the magnetic block is arranged on the inner edge of the opening of the coating bearing disc for placing the wafer, the Z-shaped magnetic support frame is arranged at the corresponding position of the magnetic block, the wafer is placed on the Z-shaped magnetic support frame, the magnetic adsorption phenomenon is generated at the contact position of the support frame and the magnetic adsorption area of the wafer, the wafer is fixed on the bearing disc through the magnetic adsorption, the warped wafer is flattened through the magnetic adsorption, and the coating source is prevented from being evaporated to the front surface of the wafer.

The coating apparatus will be described with reference to preferred embodiments of the present invention.

Referring to fig. 1 to 3, the coating apparatus is used for placing a wafer 4 having a magnetic adsorption area, and includes a tray 10, the tray 10 has a plurality of openings 11 for placing the wafer 4, a magnetic ring 20 is disposed at an inner edge of the opening 11, the tray further has a magnetic bearing frame 30, the magnetic bearing frame 30 bears the wafer 4, one end of the magnetic bearing frame 30 contacts with an upper surface of the magnetic ring 20, a through hole 31 is disposed on the magnetic bearing frame 30, an elastic sheet 32 is disposed in the through hole 31, the elastic sheet 32 is configured to be arc-shaped, a clamping column 22 is disposed on the magnetic ring 20, the clamping column 22 slides in the through hole 31 and abuts against the elastic sheet 32, the clamping column 22 abuts against the elastic sheet 32, and the radial direction of the clamping column 22 is fixed and limited, so that the connection between the magnetic bearing. The other end of the magnetic carrier 30 is in contact with the magnetically-attracted region of the wafer, and the contact region is magnetically attracted. The magnetic carrier 30 has a Z-shaped cross section, and a horizontal portion at an upper end thereof is mounted on the upper surface of the magnetic ring 20, or may extend to the surface of the tray 10, and a horizontal portion at a lower end thereof carries the wafer 4. The magnetic ring 20 and the tray body 10 may be integrally formed or may be of a detachable structure, and when the detachable structure is adopted, the magnetic ring 20 and the inner side wall of the opening 11 may be fixed by a clamping groove. The wafer 4 may be a flat wafer or a wafer with warp, which is more advantageous for the wafer 4 with warp.

The magnetic ring 20 is an integrated ring structure or a ring structure surrounded by a plurality of magnetic blocks 21, and the clamp posts 22 are disposed on the magnetic blocks 21. The magnet carrier 30 is a unitary ring structure or a ring structure surrounded by a plurality of sub-magnet carriers. The magnetic-adsorption area of the wafer 4 is an integrated annular area or an annular area surrounded by a plurality of sub-magnetic-adsorption areas. When the magnetic adsorption area of the wafer 4 is large, the effective use area of the wafer is reduced, and the number of the dies is reduced, so that the smaller the magnetic adsorption area on the wafer 4 is, the better, as long as it can contact with the magnetic bearing frame 30 and pass through the magnetic adsorption, and the embodiment preferably arranges a plurality of sub magnetic adsorption areas on the edge of the wafer 4. In this embodiment, the magnetic ring 20 and the magnetic carrier 30 are each a unitary ring-shaped structure. The contact area between the two is large, so that the magnetic adsorption can be increased, and the magnetic support frame 30 or the wafer 4 is prevented from falling off in the film coating process.

In this embodiment, the magnetic ring 20 is surrounded by a plurality of magnetic blocks 21, and the magnetic carrier 30 is surrounded by a plurality of sub-magnetic carriers, which are equal in number and number to the sub-magnetic adsorption regions on the wafer 4. The end of the sub-magnetic carrier that contacts the wafer S.

The invention has the beneficial effects that: the magnetic adsorption area S1 is formed by plating magnetic adsorption material on the edge of the wafer, and a magnetic ring is arranged on the inner edge of the opening of the coating bearing disc for placing the wafer, and a Z-shaped magnetic bearing frame is arranged at the corresponding position of the magnetic ring, the wafer is placed on a Z-shaped magnetic supporting frame, and the contact position of the wafer and the magnetic adsorption area generates magnetic adsorption phenomenon, the wafer is fixed on the bearing disc by the magnetic adsorption, and the warped wafer is flattened by the magnetic adsorption at the same time, and the plating source is prevented from being evaporated to the front surface of the wafer.

The drawings are for illustrative purposes only and are presented in the form of illustrations only, not illustrations as physical or logical, and should not be construed as limiting the present patent; to better illustrate the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.

The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. are used for indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not indicated or implied that the referred device or element must have a specific orientation, be constructed in a specific orientation and be operated, and therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and are not to be construed as limitations of the present patent, and the specific meanings of the terms may be understood by those skilled in the art according to specific situations.

In the description of the present invention, unless otherwise explicitly specified or limited, the term "connected" or the like, if appearing to indicate a connection relationship between the components, is to be understood broadly, for example, as being fixed or detachable or integral; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through one or more other components or may be in an interactive relationship with one another. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

It should be understood that the above-described embodiments are merely preferred embodiments of the invention and the technical principles applied thereto. It will be understood by those skilled in the art that various modifications, equivalents, changes, and the like can be made to the present invention. However, such variations are within the scope of the invention as long as they do not depart from the spirit of the invention. In addition, certain terms used in the specification and claims of the present application are not limiting, but are used merely for convenience of description.