阅读说明：本技术 一种柔性电路板垂直喷锡铅的辅助设备 (Flexible circuit board perpendicular direct tin-lead injection auxiliary equipment ) 是由 黄丽兰 于 2019-09-11 设计创作，主要内容包括：本发明公开了一种柔性电路板垂直喷锡铅的辅助设备,其结构包括底板、连接柱、限位架、电路板放置结构、固定块,连接柱竖直安装于底板上端并且采用机械连接,限位架垂直安装于底板上端边缘,电路板放置结构设于限位架内侧,固定块安装于底板上方并且采用螺栓连接；电路板放置结构包括集屑结构、喷锡铅辅助结构、管道、热风发散结构,集屑结构水平安装于喷锡铅辅助结构下端,本发明在热风发散结构下方设置了喷锡铅辅助结构,使其可对热风进行分散,电路板表面受热与受风将更加均匀,焊料附着更加均匀,防止部分位置未处理完毕或者过度处理,并且阻挡了焊料的流出,防止形成锡垂,而导致元器件从封装口松动,提高了柔性电路板整体的质量。(The invention discloses auxiliary equipment for vertically spraying tin and lead on a flexible circuit board, which structurally comprises a bottom plate, a connecting column, a limiting frame, a circuit board placing structure and a fixing block, wherein the connecting column is vertically arranged at the upper end of the bottom plate and is in mechanical connection; the circuit board placing structure comprises a scrap collecting structure, a tin-spraying lead auxiliary structure, a pipeline and a hot air dispersing structure, wherein the scrap collecting structure is horizontally arranged at the lower end of the tin-spraying lead auxiliary structure.)

1. The auxiliary device for vertically spraying tin and lead on the flexible circuit board structurally comprises a bottom plate (1), a connecting column (2), a limiting frame (3), a circuit board placing structure (4) and a fixing block (5), wherein the connecting column (2) is vertically installed at the upper end of the bottom plate (1), the limiting frame (3) is vertically installed at the edge of the upper end of the bottom plate (1), the circuit board placing structure (4) is arranged on the inner side of the limiting frame (3), and the fixing block (5) is installed above the bottom plate (1); the method is characterized in that:

the circuit board placing structure (4) comprises a scrap collecting structure (41), a tin-spraying lead auxiliary structure (42), a pipeline (43) and a hot air dispersing structure (44), wherein the scrap collecting structure (41) is horizontally arranged at the lower end of the tin-spraying lead auxiliary structure (42), the pipeline (43) is vertically arranged at the upper end of the tin-spraying lead auxiliary structure (42), and the lower end of the hot air dispersing structure (44) is connected to the upper end of the pipeline (43).

2. The auxiliary device for the direct injection of tin-lead into the flexible circuit board according to claim 1, wherein: collection bits structure (41) are including collection bits case (411), intercommunication mouth (412), block frame (413), inlet scoop (414), collection bits case (411) upper end is located in intercommunication mouth (412), it installs in collection bits case (411) inboard to block frame (413), inlet scoop (414) are located and are kept off frame (413) inboard and run through in collection bits case (411) below.

3. The auxiliary device for the direct injection of tin-lead into the flexible circuit board according to claim 2, wherein: stop frame (413) including curb plate (3a), baffler board (3b), upper plate (3c), curb plate (3a) are installed in baffler board (3b) below outside, upper plate (3c) are connected between baffler board (3b), baffler board (3b) run through there is the through-hole and be horizontal distribution.

4. The auxiliary device for the direct injection of tin-lead into the flexible circuit board according to claim 1, wherein: tin-sprayed lead auxiliary structure (42) includes frame (421), leeward board (422), places case (423), windward board (424), slide rail (425), leeward board (422) horizontal installation is in frame (421) inboard lower extreme, it locates leeward board (422) top to place case (423) level, windward board (424) horizontal installation in frame (421) inboard upper end and locate and place case (423) top, slide rail (425) embedding is installed in frame (421) inboardly.

5. The auxiliary device of the flexible circuit board direct injection of tin-lead according to claim 4, wherein: the lower wind plate (422) and the upper wind plate (424) are provided with a plurality of holes and are distributed in a staggered manner.

6. The auxiliary device for the direct injection of tin-lead into the flexible circuit board according to claim 1, wherein: the hot air dispersing structure (44) comprises an air inlet (441), a shell (442), an air outlet (443) and a dispersing structure (444), wherein the air inlet (441) penetrates through the upper end of the shell (442), the air outlet (443) is arranged on the inner side of the shell (442), and the dispersing structure (444) is vertically installed on the top of the inner side of the shell (442) and is located on the same central line with the air inlet (441).

7. The auxiliary device of the flexible circuit board direct injection of tin-lead according to claim 6, wherein: a plurality of air deflectors (20) are arranged on the inner side of the shell (442) and are distributed at equal intervals.

8. The auxiliary device of the flexible circuit board direct injection of tin-lead according to claim 6, wherein: the dispersing structure (444) comprises a frame body (4a), an air guide opening (4b) and an air collecting chamber (4c), the air guide opening (4b) penetrates through the inner side of the frame body (4a) and forms an included angle of 20 degrees with the horizontal plane, and the air collecting chamber (4c) is arranged on the inner side of the frame body (4a) and communicated with the air inlet (441).

Technical Field

The invention belongs to the field of flexible circuit board processing, and particularly relates to auxiliary equipment for vertically spraying tin and lead on a flexible circuit board.

Background

The flexible circuit board is the flexible folding circuit board of light, the thin flexible of thickness, accomplishes at the circuit board and makes the back, needs to weld the upper element and parts and come further processing, then need clear away circuit board and downthehole unnecessary solder, so need use perpendicular tin-spraying lead to handle, utilize hot-blast to blow on the circuit board surface, make the even attached to of unnecessary solder on the encapsulation point to this fastness of strengthening the connection of components and parts on the circuit board, but prior art exists following not enoughly:

because the vertical tin-lead injection treatment adopts a vertical blowing method to work, the surface of the flexible circuit board is heated and is not uniformly blown, so that the solder on the surface of the flexible circuit board is not uniformly adhered, the solder of part of packaging points is not treated completely, the solder close to an air port is excessively dissolved due to long time of receiving hot air, tin sag is formed when the flexible circuit board is taken out, components are loosened from a packaging port, and the integral quality of the flexible circuit board is further influenced.

Therefore, the application provides the auxiliary equipment for the flexible circuit board to vertically inject tin and lead, and the defects are improved.

Disclosure of Invention

Aiming at the defects in the prior art, the invention aims to provide auxiliary equipment for vertically spraying tin and lead on a flexible circuit board, so as to solve the problems that in the prior art, because the vertical tin and lead spraying treatment adopts a vertical blowing method to work, the surface of the flexible circuit board is heated unevenly and is subjected to wind unevenly, solder on the surface of the flexible circuit board is adhered unevenly, the solder on partial packaging points is not treated completely, the solder close to a wind port is excessively dissolved due to long time of receiving hot wind, and tin sag is formed when the flexible circuit board is taken out, so that components are loosened from a packaging port, and the overall quality of the flexible circuit board is influenced.

In order to achieve the purpose, the invention is realized by the following technical scheme: the auxiliary device for the vertical direct injection of tin and lead on the flexible circuit board structurally comprises a bottom plate, a connecting column, a limiting frame, a circuit board placing structure and a fixing block, wherein the connecting column is vertically installed at the upper end of the bottom plate and is in mechanical connection with the connecting column; the circuit board placing structure comprises a scrap collecting structure, a tin spraying lead auxiliary structure, a pipeline and a hot air dispersing structure, wherein the scrap collecting structure is horizontally arranged at the lower end of the tin spraying lead auxiliary structure and is mechanically connected with the tin spraying lead auxiliary structure, the pipeline is vertically arranged at the upper end of the tin spraying lead auxiliary structure and is mutually communicated, and the lower end of the hot air dispersing structure is connected to the upper end of the pipeline and is positioned on the same central line.

The scrap collecting structure is further improved, the scrap collecting structure comprises a scrap collecting box, a communication port, a blocking frame and an air suction port, the communication port is formed in the upper end of the scrap collecting box and is of an integrated structure, the blocking frame is installed on the inner side of the scrap collecting box and is located on the same central line, and the air suction port is formed in the inner side of the blocking frame and penetrates through the lower portion of the scrap collecting box.

The invention is further improved, the blocking frame comprises side plates, blocking plates and an upper plate, the side plates are arranged on the outer side below the blocking plates, the upper plate is connected between the blocking plates, and the blocking plates are provided with through holes in a penetrating mode and are distributed horizontally.

The tin-lead spraying auxiliary structure is further improved, and comprises a frame, a lower wind plate, a placing box, an upper wind plate and a slide rail, wherein the lower wind plate is horizontally arranged at the lower end of the inner side of the frame, the placing box is horizontally arranged above the lower wind plate, the upper wind plate is horizontally arranged at the upper end of the inner side of the frame and is arranged above the placing box, and the slide rail is embedded in the inner side of the frame and is movably connected with the placing box.

In a further improvement of the invention, the lower wind plate and the upper wind plate are provided with a plurality of holes and are distributed in a staggered manner.

The invention is further improved, the hot air dispersing structure comprises an air inlet, a shell, an air outlet and a dispersing structure, the air inlet penetrates through the upper end of the shell, the air outlet is arranged on the inner side of the shell, and the dispersing structure is vertically arranged on the top of the inner side of the shell and is positioned on the same central line with the air inlet.

In a further improvement of the invention, a plurality of air deflectors are arranged on the inner side of the shell and are distributed at equal intervals.

The invention is further improved, the dispersing structure comprises a frame body, an air guide opening and an air collecting chamber, the air guide opening penetrates through the inner side of the frame body and forms an included angle of 20 degrees with the horizontal plane, and the air collecting chamber is arranged on the inner side of the frame body and is communicated with an air inlet.

According to the technical scheme, the auxiliary device for the direct injection of the tin and the lead on the flexible circuit board has the following beneficial effects:

the invention arranges the tin-lead spraying auxiliary structure below the hot air dispersing structure, hot air enters the dispersing structure along the air inlet and cannot directly blow downwards due to the blocking of the frame body, the hot air changes the wind direction along the air guide opening and is sent out of the air outlet, the wind direction is led out downwards through the air guide plate and enters the inner side of the tin-lead spraying auxiliary structure along the pipeline, at the moment, the hot air passes through the upper air plate and enters the placing box for spraying tin-lead on the flexible circuit board, redundant solder is blown off, the solder on the inner side of the packaging opening cannot flow out due to the blocking of the lower air plate at the lower end, and the packaging opening corresponding to the hole of the lower air plate is subjected to air draft of the lower communicating opening, so that the cooling is carried out to prevent the outflow, the hot air can be dispersed, the surface heating and the wind receiving of the circuit board are more uniform, the solder is more uniform in adhesion, and, and the flowing of the solder is blocked, the formation of tin sag is prevented, the looseness of the component from the packaging opening is caused, and the integral quality of the flexible circuit board is improved.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

FIG. 1 is a schematic structural diagram of an auxiliary device for direct injection of tin and lead on a flexible circuit board according to the present invention;

FIG. 2 is a schematic structural diagram of a circuit board placement structure according to the present invention;

FIG. 3 is a schematic structural view of a chip collecting structure according to the present invention;

FIG. 4 is a schematic view of a barrier frame according to the present invention;

FIG. 5 is a schematic structural diagram of a tin-lead-sprayed auxiliary structure according to the present invention;

FIG. 6 is a schematic view of a partial structure of the down wind plate and the up wind plate of the present invention;

FIG. 7 is a schematic view of the structure of the lower wind plate and the upper wind plate of the present invention;

FIG. 8 is a schematic structural view of a hot air dispersing structure according to the present invention;

FIG. 9 is a schematic structural view of the housing of the present invention;

fig. 10 is a schematic structural view of a dispersion structure according to the present invention.

In the figure: the device comprises a bottom plate-1, a connecting column-2, a limiting frame-3, a circuit board placing structure-4, a fixing block-5, a scrap collecting structure-41, a tin-lead spraying auxiliary structure-42, a pipeline-43, a hot air dispersing structure-44, a scrap collecting box-411, a communicating port-412, a blocking frame-413, an air suction port-414, a side plate-3 a, a blocking plate-3 b, an upper plate-3 c, a frame-421, a lower air plate-422, a placing box-423, an upper air plate-424, a sliding rail-425, an air inlet-441, a shell-442, an air outlet-443, a dispersing structure-444, an air deflector-20, a frame body-4 a, an air guide port-4 b and an air collecting chamber-4 c.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.

Referring to fig. 1-10, the embodiments of the present invention are as follows:

the structure of the device comprises a bottom plate 1, a connecting column 2, a limiting frame 3, a circuit board placing structure 4 and a fixing block 5, wherein the connecting column 2 is vertically arranged at the upper end of the bottom plate 1 and is in mechanical connection, the limiting frame 3 is vertically arranged at the edge of the upper end of the bottom plate 1, the circuit board placing structure 4 is arranged at the inner side of the limiting frame 3 and is horizontally arranged above the bottom plate 1, and the fixing block 5 is arranged above the bottom plate 1 and is in bolt connection; the circuit board placing structure 4 comprises a scrap collecting structure 41, a tin-spraying lead auxiliary structure 42, a pipeline 43 and a hot air dispersing structure 44, wherein the scrap collecting structure 41 is horizontally arranged at the lower end of the tin-spraying lead auxiliary structure 42 and is in mechanical connection, the pipeline 43 is vertically arranged at the upper end of the tin-spraying lead auxiliary structure 42 and is communicated with the upper end of the tin-spraying lead auxiliary structure 42, and the lower end of the hot air dispersing structure 44 is connected to the upper end of the pipeline 43 and is positioned on the same central line.

Referring to fig. 3, the scrap collecting structure 41 includes a scrap collecting box 411, a communication port 412, a blocking frame 413 and an air suction port 414, the communication port 412 is disposed at the upper end of the scrap collecting box 411 and is an integrated structure, the blocking frame 413 is mounted inside the scrap collecting box 411 and is located on the same central line, the air suction port 414 is disposed inside the blocking frame 413 and penetrates below the scrap collecting box 411, and the air suction port 414 is connected to a fan.

Referring to fig. 4, the blocking frame 413 includes a side plate 3a, a blocking plate 3b, and an upper plate 3c, the side plate 3a is installed at the outer side below the blocking plate 3b, the upper plate 3c is connected between the blocking plates 3b, the blocking plate 3b has a through hole penetrating therethrough and is horizontally distributed, the dropped solder is cooled due to the cooling of wind during air draft, and the dropped solder does not directly enter the air suction opening 414 due to the angle of the through hole of the blocking plate 3 b.

Referring to fig. 5, the tin-lead spraying auxiliary structure 42 includes a frame 421, a lower wind plate 422, a placing box 423, an upper wind plate 424, and a sliding rail 425, wherein the lower wind plate 422 is horizontally installed at the lower end of the inner side of the frame 421, the placing box 423 is horizontally disposed above the lower wind plate 422, the upper wind plate 424 is horizontally installed at the upper end of the inner side of the frame 421 and is disposed above the placing box 423, and the sliding rail 425 is embedded in the inner side of the frame 421 and is movably connected with the placing box 423, so as to assist in placing the flexible circuit board.

Referring to fig. 6-7, the lower wind plate 422 and the upper wind plate 424 are provided with a plurality of holes and are distributed in a staggered manner, so that solder does not directly drip from the parts where hot wind is directly blown, and solder does not drip from the corresponding holes of the lower wind plate 422 when the solder is dissolved in the direction of the downward wind.

Referring to fig. 8, the hot wind discharging structure 44 includes an air inlet 441, a housing 442, an air outlet 443, and a dispersing structure 444, wherein the air inlet 441 penetrates through the upper end of the housing 442, the air outlet 443 is disposed inside the housing 442, and the dispersing structure 444 is vertically installed at the top of the inside of the housing 442 and is located on the same center line as the air inlet 441.

Referring to fig. 9, a plurality of wind deflectors 20 are disposed inside the housing 442 and are equidistantly distributed, and when hot wind enters the housing 442, the wind direction of the hot wind is changed by the wind deflectors 20.

Referring to fig. 10, the dispersing structure 444 includes a frame body 4a, an air guiding opening 4b and an air collecting chamber 4c, the air guiding opening 4b penetrates through the inner side of the frame body 4a and forms an included angle of 20 degrees with the horizontal plane, the air collecting chamber 4c is arranged on the inner side of the frame body 4a and is communicated with the air inlet 441, the blowing direction of hot air is changed according to the angle of the air guiding opening 4b, and the hot air is prevented from being blown out in a concentrated manner, so that the hot air is blown out more uniformly.

Based on the above embodiment, the specific working principle is as follows:

the device is arranged below a vertical tin-lead spraying device, the device can be used by connecting an upper spray head with a fan, a placing box 423 is opened, a flexible circuit board needing tin-lead spraying is placed inside the placing box 423 and closed, hot air enters a dispersing structure 444 from a spray head along an air inlet 441 at the moment, the hot air is concentrated inside an air collecting chamber 4c and cannot directly blow downwards due to the blocking of a frame body 4a, the hot air changes the air direction along an air guide opening 4b and is sent into an air outlet 443, the hot air is blown to the inner side of a shell 442 and is led out downwards through an air guide plate 20 and enters the inner side of a tin-lead spraying auxiliary structure 42 along a pipeline 43, the hot air passes through an upper air plate 424 to enter the inner side of the placing box 423 to spray the tin-lead on the flexible circuit board at the moment, redundant solder is blown off, the solder on the inner side of a packaging opening cannot flow out due to the blocking of a lower air plate 422 at the lower end, and the corresponding packaging opening on the lower air plate 422, will cool off, prevent to flow out, the wind that has unnecessary solder at this moment will enter into collection bits case 411 inboardly to receive the separation of blocking frame 413, and wind will be discharged from inlet scoop 414, after accomplishing tin-lead spraying, take out the flexible circuit board, put into the flexible circuit board that will handle again, so cycle work.

The invention solves the problems that in the prior art, because the vertical tin-lead spraying treatment adopts a vertical blowing method to work, the surface of the flexible circuit board is heated and windingly unevenly, so that the solder on the surface of the flexible circuit board is unevenly adhered, the solder on partial packaging points is not treated, the solder close to an air port is excessively dissolved due to long time of receiving hot air, tin sag is formed when the flexible circuit board is taken out, so that components are loosened from a packaging opening, and the integral quality of the flexible circuit board is further influenced, the invention arranges a tin-lead spraying auxiliary structure below a hot air dispersing structure through the mutual combination of the components, the hot air enters a dispersing structure along an air inlet and cannot directly impact downwards due to the blocking of a frame body, the wind direction of the hot air changes along an air guide opening and is sent out to an air outlet, the wind direction is guided out downwards through an air guide plate, and the hot air enters the inner side of the tin-lead spraying auxiliary structure, at this moment, hot air passes through the upper wind plate to enter the placing box to spray tin and lead on the flexible circuit board, redundant solder is blown off, the solder on the inner side of the packaging opening cannot flow out due to the obstruction of the lower wind plate at the lower end, the packaging opening corresponding to the lower wind plate hole is subjected to air draft of the communicating opening at the lower part, cooling is carried out to prevent the outflow, the solder can be dispersed to hot air, the surface of the circuit board is heated and is more uniform with the wind, the solder is more uniformly attached, the part of the position is prevented from being unprocessed or excessively processed, the outflow of the solder is blocked, the formation of tin sag is prevented, components are enabled to be loosened from the packaging opening, and the integral quality of the flexible circuit board is improved.

While there have been shown and described what are at present considered the fundamental principles and essential features of the invention and its advantages, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.