阅读说明：本技术 刚挠结合板压合结构和制作方法 (Rigid-flex printed circuit board pressing structure and manufacturing method ) 是由 孙启双 孙文兵 于 2019-09-26 设计创作，主要内容包括：本发明公开了一种刚挠结合板压合结构和制作方法,方法包括：通过不流胶PP片分隔非不流胶PP片与露出区；压合刚性板、挠性板、不流胶PP片和非不流胶PP片形成刚挠结合板。压合结构包括刚性板、挠性板、不流胶PP片和非不流胶PP片；挠性板包括露出区,不流胶PP片分隔非不流胶PP片与露出区；刚性板、挠性板、不流胶PP片和非不流胶PP片压合形成刚挠结合板。本发明实施例通过不流胶PP片分隔非不流胶PP片与露出区,能够防止胶流到露出区；压合刚性板与挠性板、不流胶PP片和非不流胶PP片,能够生成符合平整度要求的刚挠结合板。(the invention discloses a rigid-flex printed circuit board pressing structure and a manufacturing method thereof, wherein the method comprises the following steps: separating the non-flowing glue PP sheet from the exposed area by the non-flowing glue PP sheet; and pressing the rigid plate, the flexible plate, the no-flow glue PP sheet and the no-flow glue PP sheet to form the rigid-flex printed circuit board. The pressing structure comprises a rigid plate, a flexible plate, a no-flow adhesive PP sheet and a no-flow adhesive PP sheet; the flexible plate comprises an exposed area, and the non-flowing glue PP sheet is separated from the exposed area; and the rigid-flex combination board is formed by pressing the rigid board, the flexible board, the no-flow glue PP sheet and the no-flow glue PP sheet. According to the embodiment of the invention, the non-flowing glue PP sheet and the exposed area are separated by the non-flowing glue PP sheet, so that glue can be prevented from flowing to the exposed area; and the rigid plate, the flexible plate, the no-flow glue PP sheet and the no-flow glue PP sheet are pressed, so that the rigid-flex printed circuit board meeting the flatness requirement can be generated.)

1. The utility model provides a rigid-flex printed circuit board pressfitting structure which characterized in that includes:

The device comprises a rigid plate, a flexible plate, a no-flow glue PP sheet and a no-flow glue PP sheet;

the flexible plate comprises an exposed area, and the non-flowing glue PP sheet separates the non-flowing glue PP sheet from the exposed area;

And the rigid plate, the flexible plate, the no-flow glue PP sheet and the no-flow glue PP sheet are pressed to form the rigid-flex combined plate.

2. The press-fit structure for the rigid-flex printed circuit board according to claim 1, wherein the no-flow glue PP sheet is strip-shaped and is disposed at an edge of the exposed area.

3. the rigid-flex printed circuit board press-fit structure according to claim 1, wherein the non-flowing glue PP sheet is frame-shaped, and the non-flowing glue PP sheet is located in the frame.

4. The rigid-flex printed circuit board press-fit structure according to claim 2 or 3, further comprising a cover film disposed on the exposed region.

5. The rigid-flex printed board press-fit structure according to claim 4, wherein the glue flow of the non-glue PP sheet is 0.2-0.5mm, and the glue flow of the non-glue PP sheet is greater than 2.0 mm.

6. A manufacturing method of a rigid-flex printed circuit board lamination structure, which is suitable for the lamination structure of any one of claims 1 to 5, and is characterized by comprising the following steps:

Separating the non-flowing glue PP sheet and the exposed area by the non-flowing glue PP sheet;

And pressing the rigid plate, the flexible plate, the no-flow glue PP sheet and the non-no-flow glue PP sheet to form the rigid-flex printed circuit board.

7. The method for manufacturing a rigid-flex printed circuit board lamination structure according to claim 6, comprising:

And arranging a strip-shaped non-flowing glue PP sheet at the edge of the exposed area.

8. The method for manufacturing a rigid-flex printed circuit board lamination structure according to claim 6, comprising:

and arranging a frame-shaped no-flow PP sheet in the frame.

9. The method for manufacturing a press-fit structure of a rigid-flex printed circuit board according to claim 7 or 8, further comprising disposing a cover film on the exposed area.

10. the method for manufacturing a rigid-flex printed circuit board press-fit structure according to claim 9, wherein the flow amount of the non-flow PP sheet is 0.2-0.5mm, and the flow amount of the non-flow PP sheet is greater than 2.0 mm.

Technical Field

the invention relates to the technical field of PCB production, in particular to a rigid-flex printed circuit board laminating structure and a manufacturing method thereof.

Background

The rigid-flex printed circuit board is provided with a flexible area for bending, and the adhesive of the rigid area needs to be ensured not to overflow to the flexible area during pressing, so that the adhesive for pressing and combining the rigid board and the flexible board adopts a non-flowing PP sheet as the adhesive of the rigid-flex printed circuit board.

The no-flow PP sheet is also called no-flow-PP, namely, the glue flow is very low during the pressing. Because the glue flow amount is very low, the glue flow amount is small after the glue is directly filled between the circuit intervals or on the surface in the pressing process, and the surface of the rigid-flex printed circuit board is uneven after the rigid-flex printed circuit board is pressed.

With the higher-level development of the rigid-flex printed circuit board, the rigid-flex printed circuit board has a plurality of blind buried hole technical designs of the rigid printed circuit board, and the flat requirements of the designs on the board surface are very high. If the former method is adopted, the flatness of the rigid-flex printed circuit board pressed by the non-gumming PP sheets cannot meet the requirement of the current technical development.

Disclosure of Invention

embodiments of the present invention aim to address, at least to some extent, one of the technical problems in the related art. Therefore, an object of the embodiments of the present invention is to provide a rigid-flex printed circuit board press-fit structure.

therefore, the second purpose of the invention is to provide a manufacturing method of the rigid-flex board lamination structure.

The technical scheme adopted by the invention is as follows:

In a first aspect, an embodiment of the present invention provides a rigid-flex printed circuit board press-fit structure, including: the device comprises a rigid plate, a flexible plate, a no-flow glue PP sheet and a no-flow glue PP sheet; the flexible plate comprises an exposed area, and the non-flowing glue PP sheet is separated from the exposed area; and the rigid-flex combination board is formed by pressing the rigid board, the flexible board, the no-flow glue PP sheet and the no-flow glue PP sheet.

Preferably, the no-flow PP sheet is strip-shaped and is arranged at the edge of the exposed area.

Preferably, the no-flow PP sheet is frame-shaped, and the no-flow PP sheet is positioned in the frame.

Preferably, the rigid-flex printed circuit board press-fit structure further comprises a cover film arranged in the exposed area.

Preferably, the glue flowing amount of the non-glue-flowing PP sheet is 0.2-0.5mm, and the glue flowing amount of the non-glue-flowing PP sheet is more than 2.0 mm.

in a second aspect, an embodiment of the present invention provides a method for manufacturing a rigid-flex printed circuit board lamination structure, which is applicable to the above lamination structure, and includes: separating the non-flowing glue PP sheet from the exposed area by the non-flowing glue PP sheet; and pressing the rigid plate, the flexible plate, the no-flow glue PP sheet and the no-flow glue PP sheet to form the rigid-flex printed circuit board.

preferably, the manufacturing method comprises: and arranging a strip-shaped non-flowing glue PP sheet at the edge of the exposed area.

Preferably, the manufacturing method comprises: the frame type no-flow glue PP sheet is arranged, and the no-flow glue PP sheet is arranged in the frame.

Preferably, the manufacturing method further comprises disposing a cover film on the exposed region.

Preferably, the glue flowing amount of the non-glue-flowing PP sheet is 0.2-0.5mm, and the glue flowing amount of the non-glue-flowing PP sheet is more than 2.0 mm.

The embodiment of the invention has the beneficial effects that:

According to the embodiment of the invention, the non-flowing glue PP sheet and the exposed area are separated by the non-flowing glue PP sheet, so that glue can be prevented from flowing to the exposed area; and the rigid plate, the flexible plate, the no-flow glue PP sheet and the no-flow glue PP sheet are pressed, so that the rigid-flex printed circuit board meeting the flatness requirement can be generated.

drawings

FIG. 1 is a flow chart of one embodiment of a method of fabricating a rigid-flex printed circuit board lamination;

FIG. 2 is a flow chart of one embodiment of a method of fabricating a rigid-flex printed circuit board lamination structure;

FIG. 3 is a flow chart of one embodiment of a method of fabricating a rigid-flex printed circuit board lamination structure;

FIG. 4 is a flow chart of one embodiment of a method of fabricating a rigid-flex printed circuit board lamination structure;

FIG. 5 is a side view of one embodiment of a flex-rigid board press fit arrangement;

FIG. 6 is a top view of one embodiment of a flex-rigid board press fit structure.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

the related technical names are as follows:

the PP sheet is a Prepreg (Prepreg is the english abbreviation of Pre-pregant), and is a sheet-shaped bonding material synthesized by resin and a carrier. The resin is a thermosetting material of a high molecular polymer, and the currently commonly used resin is epoxy resin.

No-flow prepreg no-flow-PP: the low-flow-glue prepreg (low-flow-PP) is called, the low-flow-glue prepreg contains low-flow-glue high polymer materials in the PP sheet to reduce the fluidity of the PP sheet, but the performance of other glass fiber cloth cannot be influenced, and meanwhile, the high polymer materials have very good toughness, so that after the PP sheet is combined with a soft board, drilling is machined, the board routing effect is very good, the binding force and the heat resistance are very good, and abnormal pressing cannot occur. Therefore, the material is selected as a common adhesive for the production of the rigid-flexible combined board.