阅读说明：本技术 主板维修治具及方法 (Mainboard maintenance jig and method ) 是由 陈伟杰 杜军红 葛振纲 于 2021-08-02 设计创作，主要内容包括：本申请公开了主板维修治具及方法,该治具包括治具本体、半导体以及液冷循环系统,所述半导体的一端与所述治具本体接触设置,所述半导体的另一端与部分所述液冷循环系统接触设置。该方法,包括：采用单面点胶非维修面有点胶芯片场景时和采用双面点胶方式维修场景时对所述主板进行维修处理。本申请通过利用半导体的帕尔贴效应的原理,即,一端吸热一端散热,并配合上述的液冷循环系统,从而有效地对主板进行降温处理。本申请采用半导体帕尔贴效应降温的方式在维修主板时给主板非维修面降温,从而防止非维修面点胶芯片爆胶导致需要二次维修造成主板报废的风险。(The application discloses mainboard maintenance tool and method, this tool includes tool body, semiconductor and liquid cooling circulation system, the one end of semiconductor with tool body contact sets up, the other end and the part of semiconductor liquid cooling circulation system contact sets up. The method comprises the following steps: and maintaining the mainboard when a single-side dispensing non-maintenance face dispensing chip scene and a double-side dispensing mode are adopted for maintaining the scene. This application is through the principle that utilizes the Peltier effect of semiconductor, namely, the heat dissipation of one end heat absorption one end to the foretell liquid cooling circulation system of cooperation, thereby cool down the processing to the mainboard effectively. This application adopts the mode of semiconductor peltier effect cooling to give the cooling of mainboard non-maintenance face when the maintenance mainboard to prevent that non-maintenance face from gluing the chip and exploding to glue and lead to needing secondary maintenance to cause the condemned risk of mainboard.)

1. The main board maintenance jig is characterized by comprising a jig body, a semiconductor and a liquid cooling circulating system, wherein one end of the semiconductor is in contact with the jig body, and the other end of the semiconductor is in contact with part of the liquid cooling circulating system.

2. The main board maintenance jig according to claim 1, wherein a thermistor sensor is further mounted on the jig body.

3. The main board maintenance jig according to claim 1, wherein the jig body is further provided with a mounting groove for mounting the main board to be maintained.

4. The motherboard maintenance jig of claim 3, wherein the non-maintenance side of the motherboard is disposed toward the semiconductor.

5. The motherboard maintenance jig of any one of claims 1 to 4, wherein an area of the semiconductor is equal to or larger than an area of the motherboard.

6. The motherboard maintenance jig of claim 1, wherein the liquid cooling circulation system comprises: the liquid tank and the conduit are arranged in a communicating manner, wherein part of the conduit is arranged in contact with the other end of the semiconductor.

7. The main board maintenance jig of claim 6, wherein a submersible pump with adjustable speed is further installed in the liquid tank.

8. The main board maintenance jig according to claim 6, wherein a portion of the guide pipe disposed in contact with the other end of the semiconductor is disposed in a ring-shaped or U-shaped configuration.

9. The motherboard maintenance jig of claim 7 or 8, wherein the liquid cooling circulation system further comprises: the control module group with be used for showing liquid temperature's in the liquid tank temperature display module group, the control module group still with temperature display module group the immersible pump electricity is connected.

10. The method for repairing a motherboard according to any one of claims 1 to 9, comprising: and maintaining the mainboard when a single-side dispensing non-maintenance face dispensing chip scene and a double-side dispensing mode are adopted for maintaining the scene.

Technical Field

The application belongs to the technical field of mainboard maintenance, and particularly relates to a mainboard maintenance jig and a mainboard maintenance method.

Background

Under the severe requirement of reliability quality control, the problem of damage to the main board device caused by stress generated by reliability cannot be avoided, and under the condition that the structure is optimized to the utmost extent but cannot be solved, the problem needs to be solved by dispensing the Underfil glue (underfill glue). Currently, single-side dispensing is generally adopted in the industry, when a single-side dispensing scene is adopted, if a non-maintenance side has a dispensing chip, more than 50% of risks of glue explosion can be caused, if double-side dispensing maintenance is adopted, 100% of risks of glue explosion and even mainboard scrap can be caused, however, under the condition that product design is more and more aggressive, the possibility of double-side dispensing can not be avoided, and the problems of glue explosion or mainboard scrap can be solved through related means under the environment that double-side dispensing needs to be pre-researched in advance.

Disclosure of Invention

To overcome the above drawbacks and deficiencies of the prior art, the present application provides a motherboard repairing apparatus and a motherboard repairing method.

In order to solve the technical problem, the application is realized by the following technical scheme:

this application has provided mainboard maintenance tool on the one hand, including tool body, semiconductor and liquid cooling circulation system, the one end of semiconductor with tool body contact sets up, the other end and the part of semiconductor liquid cooling circulation system contact sets up.

Optionally, in the main board maintenance jig, a thermistor sensor is further mounted on the jig body.

Optionally, in the main board maintenance jig, the jig body is further provided with a mounting groove for mounting the main board to be maintained.

Optionally, in the motherboard maintenance jig, a non-maintenance side of the motherboard is disposed toward the semiconductor.

Optionally, in the main board maintenance jig, an area of the semiconductor is greater than or equal to an area of the main board.

Optionally, above-mentioned mainboard maintenance tool, wherein, liquid cooling circulation system includes: the liquid tank and the conduit are arranged in a communicating manner, wherein part of the conduit is arranged in contact with the other end of the semiconductor.

Optionally, in the main board maintenance jig, a submersible pump with adjustable speed is further installed in the liquid tank.

Optionally, in the main board maintenance jig, a portion of the conduit disposed in contact with the other end of the semiconductor is disposed in an annular or U-shaped structure.

Optionally, above-mentioned mainboard maintenance tool, wherein, liquid cooling circulation system still includes: the control module group with be used for showing liquid temperature's in the liquid tank temperature display module group, the control module group still with temperature display module group the immersible pump electricity is connected.

This application another aspect has also provided the method of mainboard maintenance tool, includes: and maintaining the mainboard when a single-side dispensing non-maintenance face dispensing chip scene and a double-side dispensing mode are adopted for maintaining the scene.

Compared with the prior art, the method has the following technical effects:

this application is through the principle that utilizes semiconductor's peltier effect, promptly, one end heat absorption one end heat dissipation, and the cooperation liquid cooling circulation system to the mainboard is cooled down effectively and is handled.

The method adopts a semiconductor Peltier effect cooling mode to cool the non-maintenance surface of the mainboard when the mainboard is maintained, so that the risk that the mainboard is scrapped due to the fact that glue is exploded on a glue dispensing chip of the non-maintenance surface and secondary maintenance is needed is prevented;

the application continuously verifies that 20 double-sided dispensing main boards pass through the test and the passing rate is close to 100%; the temperature peak values of the front and the back of the main board are at least different by 80 degrees when the temperature measuring instrument is used for testing heating, and the temperature is effectively reduced.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

FIG. 1: the structure schematic diagram of the main board maintenance jig according to an embodiment of the application;

FIG. 2: the main board maintenance jig comprises a partial cross-sectional view;

FIG. 3: the method includes the steps that a detection data result graph of a mainboard to be maintained is obtained;

FIG. 4: the detection data result chart of the mainboard to be maintained in the prior art.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

As shown in fig. 1 and 2, in one embodiment of the present application, a motherboard maintenance fixture includes a fixture body 10, a semiconductor 40, and a liquid cooling circulation system 20, wherein one end (preferably, a heat absorbing end) of the semiconductor 40 is disposed in contact with the fixture body 10, and the other end (preferably, a heat dissipating end) of the semiconductor 40 is disposed in contact with the liquid cooling circulation system 20.

In the embodiment, the principle of peltier effect of the semiconductor 40 is utilized (the dc power supply provides energy required by the electron current, and after the power supply is turned on, the electron cathode (-starting, firstly passes through the P-type semiconductor 40, where heat is absorbed, and then passes through the N-type semiconductor 40, and then emits heat, and every time passing through one NP module, the heat is sent from one end to the other end to cause temperature difference, so as to form a cold end and a hot end), that is, one end absorbs heat and the other end dissipates heat, and the liquid cooling circulation system 20 is used in cooperation, so that the temperature of the motherboard 30 is effectively reduced.

Further, in this embodiment, a thermistor sensor is further installed on the jig body 10, and the effect of temperature reduction visualization can be achieved through the arrangement of the thermistor sensor.

The jig body 10 is further provided with a mounting groove for mounting the main board 30 to be maintained, wherein the shape of the mounting groove is not limited, and the mounting groove can be designed to be matched according to the actual shape of the main board 30.

In order to further improve the cooling effect on the semiconductor 40, in this embodiment, it is preferable that the area of the semiconductor 40 is greater than or equal to the area of the main board 30, so as to maximally transfer heat generated during the maintenance of the main board 30.

In this embodiment, the non-maintenance side of the main board 30 faces the semiconductor 40, and the non-maintenance surface of the main board 30 is cooled through the above setting, so that the risk that the main board 30 is scrapped due to the fact that the non-maintenance surface glue dispensing chip is exploded to cause secondary maintenance is prevented.

Optionally, the liquid cooling circulation system 20 includes: a liquid tank 21 and a conduit 22, the liquid tank 21 and the conduit 22 are arranged in communication, wherein a part of the conduit 22 is arranged in contact with the other end of the semiconductor 40. The heat absorbed by the semiconductor 40 is transferred by the liquid circulating in the conduit 22, thereby cooling the motherboard 30.

Further, in this embodiment, a submersible pump with adjustable speed is also installed in the liquid tank 21. The speed of the liquid can be adjusted through the submersible pump, so that a better cooling effect is obtained.

In order to further improve the cooling effect on the main board 30, in this embodiment, the contact area between the conduit 22 and the semiconductor 40 may also be increased, for example, a portion of the conduit 22 disposed in contact with the other end of the semiconductor 40 is disposed in an annular or U-shaped structure, so as to increase the contact area between the conduit 22 and the semiconductor 40 as much as possible, how to enhance the heat exchange, and achieve the purpose of cooling the main board 30.

Wherein, in the present embodiment, the liquid is preferably water.

Further, the liquid cooling circulation system 20 further includes: the temperature display module is used for displaying the temperature of liquid in the liquid tank 21, and the temperature display module is used for displaying the temperature of liquid in the current liquid tank 21, so that whether cold water needs to be additionally supplemented or not is judged by a worker conveniently, and the higher cooling effect of the mainboard 30 is kept.

Further, the liquid cooling circulation system 20 further includes: the control module group, the control module group still with the temperature display module the immersible pump electricity is connected, through the setting of control module group improves the intelligent control process of this embodiment to can be based on the temperature condition of the thermistor sensor that sets up on the tool body 10, control liquid cooling circulation system 20 intelligently, in order to reach the coordinated control of two parts.

In another aspect of the present embodiment, a method for maintaining a fixture of a motherboard 30 is further provided, including: the main board 30 is maintained in a single-sided dispensing non-maintenance scene with dispensing chips and in a double-sided dispensing maintenance scene.

In the method, a semiconductor 40 Peltier effect cooling mode is adopted to cool the non-maintenance surface of the mainboard 30 when the mainboard 30 is maintained, so that the risk that the mainboard 30 is scrapped due to the fact that secondary maintenance is needed as a result of glue explosion of glue chips of the non-maintenance surface is avoided.

As shown in fig. 3 and fig. 4, the comparison between the present embodiment and the prior art is combined with experimental data to illustrate that the present embodiment has an excellent cooling effect on the motherboard 30.

Wherein, the TC4 lead is used for measuring the upper surface of the mainboard 30; the TC2 lead is used for measuring the lower surface of the mainboard 30; the TC3 lead is used for measuring the contact surface between the main board 30 and the jig body 10.

The test method comprises the following steps: the furnace temperature tester is adopted for measurement, and the setting temperature of the thermometer is 320 ℃ and the fixed-point heating is carried out for more than 5 min.

Temperature difference comparison: comparing the temperature difference of different surfaces of the main board 30; and comparing the temperature difference change of the present embodiment with the conventional maintenance jig.

As can be seen from the graph shown in FIG. 3, the temperature difference between the three curves is large, and the cooling effect is ideal; wherein, TC2 wire is compared with TC4 wire: the peak temperature difference between the front and back sides of the main board 30 is 80 degrees; TC3 conductor vs. TC4 conductor: the chip is in direct contact with the jig body 10 with the best effect, and the temperature difference is 167 degrees.

As shown in fig. 4, a common maintenance jig is adopted in the prior art: the temperature difference of the three curves is not obvious or has no obvious difference.

Therefore, in the embodiment, the temperature peak values of the front side and the back side of the main board 30 are at least different by 80 degrees when the temperature measuring instrument is used for testing heating, and the temperature reduction is effective.

The experimental repair data for this example is shown in the following table:

the present embodiment passes the verification process described above for different motherboards 30: dismantling the shielding frame, retesting the mainboard 30 function, dismantling the power management chip, glue removing time, reassembling a new power management chip, retesting the mainboard 30 function, reassembling the box and retesting the mainboard 30 function, finally can know, through the above-mentioned flow of verifying, the retesting mainboard 30 function of foretell all passes, and its retesting percent of pass is almost 100%.

This application is through the principle that utilizes the Peltier effect of semiconductor, namely, the heat dissipation of one end heat absorption one end to the foretell liquid cooling circulation system of cooperation, thereby cool down the processing to the mainboard effectively. The method adopts a semiconductor Peltier effect cooling mode to cool the non-maintenance surface of the mainboard when the mainboard is maintained, so that the risk that the mainboard is scrapped due to the fact that glue is exploded on a glue dispensing chip of the non-maintenance surface and secondary maintenance is needed is prevented; the application continuously verifies that 20 double-sided dispensing main boards pass through the test and the passing rate is close to 100%; the temperature peak values of the front and the back of the main board are at least different by 80 degrees when the temperature measuring instrument is used for testing heating, and the temperature is effectively reduced.

In the description of the present application, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are used based on the orientations and positional relationships shown in the drawings only for convenience of description and simplification of operation, and do not indicate or imply that the referred device or element must have a specific orientation, be configured and operated in a specific orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

The above embodiments are merely to illustrate the technical solutions of the present application and are not limitative, and the present application is described in detail with reference to preferred embodiments. It will be understood by those skilled in the art that various modifications and equivalent arrangements may be made in the present invention without departing from the spirit and scope of the present invention and shall be covered by the appended claims.