阅读说明：本技术 一种pcb电路板的外形整平装置 (Appearance leveling device of PCB circuit board ) 是由 彭海军 于 2021-10-29 设计创作，主要内容包括：本发明公开了一种PCB电路板的外形整平装置,包括锡池、夹具、风刀组件和吸风组件,锡池用于盛放金属锡融液,并在上端设有开口,夹具设于开口的上方并作竖直方向的往复运动,吸风组件设有吸风口,吸风口内转动设有叶片,叶片转动后抽取热风并吸取锡铜熔渣与挥发的助焊剂,吸风口内还装设有冷凝件,冷凝件吸附助焊剂并分离出锡铜熔渣。本发明设置有吸风组件,在散热的同时,通过强劲的风力收集风刀吹落的锡铜熔渣,避免锡铜熔渣掉落至锡池中,有效避免金属铜对锡池的影响；同时热风经过冷凝件后,助焊剂能够快速冷却析出,避免助焊剂附着在装置的各个零部件后腐蚀重要零部件。(The invention discloses an appearance leveling device of a PCB (printed circuit board), which comprises a tin pool, a clamp, an air knife assembly and an air suction assembly, wherein the tin pool is used for containing molten tin metal, the upper end of the tin pool is provided with an opening, the clamp is arranged above the opening and reciprocates in the vertical direction, the air suction assembly is provided with an air suction opening, a blade is rotationally arranged in the air suction opening, the blade extracts hot air and sucks tin-copper slag and volatilized soldering flux after rotating, a condensing piece is also arranged in the air suction opening, and the condensing piece adsorbs the soldering flux and separates the tin-copper slag. The tin-copper slag collecting device is provided with the air suction assembly, tin-copper slag blown off by the air knife is collected through strong wind power while heat is dissipated, the tin-copper slag is prevented from falling into a tin pool, and the influence of metal copper on the tin pool is effectively avoided; meanwhile, after the hot air passes through the condensing part, the soldering flux can be rapidly cooled and separated out, and the soldering flux is prevented from being attached to each part of the device and corroding important parts.)

1. The utility model provides a PCB circuit board's appearance leveling device which characterized in that: including tin pond (1), anchor clamps (2), air knife subassembly (3) and the subassembly (4) that induced drafts, tin pond (1) is used for holding metallic tin melt liquid to be equipped with the opening in the upper end, anchor clamps (2) are used for the centre gripping the PCB circuit board, anchor clamps (2) are located the open-ended top is and is made the reciprocating motion of vertical direction, air knife subassembly (3) are including the air knife, the wind gap orientation of air knife the PCB circuit board, it is equipped with the inlet scoop to induced draft subassembly (4), the inlet scoop internal rotation is equipped with blade (420), blade (420) rotate the back and extract hot-blast and absorb tin copper slag and volatile scaling powder, condensation piece (5) have still been installed in the inlet scoop, condensation piece (5) adsorb the scaling powder separates the tin copper slag.

2. The apparatus of claim 1, wherein: the tin bath cover is characterized by further comprising a cover assembly (6), the cover assembly (6) comprises a sliding rail (610), a rack (620), a first gear (630), a second gear (640) and a cover plate (650), the sliding rail (610) is vertically arranged, the clamp (2) is slidably arranged on the sliding rail (610), the rack (620) is vertically arranged on the lower end face of the clamp (2), the first gear (630) is rotatably arranged on the side wall of the sliding rail (610) and meshed with the rack (620), the second gear (640) and the first gear (630) are coaxially arranged, the cover plate (650) is slidably arranged above an opening of the tin bath (1) and is provided with a tooth surface matched with the second gear (640), and the cover plate (650) is configured with a closed state covering the opening and an open state exposing the opening;

after the clamp (2) moves downwards, the rack (620) moves downwards and drives the first gear (630) and the second gear (640) to rotate, and the second gear (640) pushes the cover plate (650) to be switched from a closed state to an open state.

3. The apparatus of claim 2, wherein: the two sides of the rack (620) are both provided with tooth surfaces, the first gear (630), the second gear (640) and the cover plates (650) are symmetrically arranged on the two sides of the rack (620), the two cover plates (650) are obliquely arranged at the opening of the tin bath (1) and are arranged in a door structure which is opened in opposite directions, and symmetrical slope surfaces are formed after the cover plates (650) are closed.

4. The apparatus of claim 1, wherein: the air suction assembly (4) further comprises a vertically arranged pipeline (410), openings are formed in two ends of the pipeline (410), an air suction opening is formed in the upper end of the pipeline (410) and is arranged towards an air opening of the air knife, the lower end of the pipeline (410) is communicated with the outside, the blade (420) is rotatably installed in the pipeline (410), a driving motor (430) is coaxially installed above the blade (420), a planetary speed reducer (440) is installed below the blade (420), and the condensing part (5) is detachably connected with the output end of the planetary speed reducer (440);

the blades (420) extract hot air after rotating and convey the hot air to the inside of the pipeline (410), and the soldering flux is liquefied and separated out after passing through the condensing part (5).

5. The apparatus of claim 4, wherein: the upper end of the pipeline (410) is flared.

6. The apparatus of claim 4, wherein: a filter screen (450) is arranged in the pipeline (410), and the filter screen (450) is arranged above the blades (420).

7. The apparatus of claim 1, wherein: condensing member (5) are including member (510) and at least a set of condensation piece (520), the vertical setting of member (510), inside is equipped with interior passageway (511), a plurality of through-holes (512) and intercommunication have been seted up on the lateral wall of member (510) interior passageway (511), condensation piece (520) cover is located on the periphery wall of member (510) to establish to the middle part sunken, the circular disk shape of edge perk, the scaling powder process that condensation piece (520) outer was appeared in through-hole (512) flow in interior passageway (511).

8. The apparatus of claim 7, wherein: the condensation sheet (520) is made of stainless steel material with good heat conductivity and corrosion resistance.

9. The apparatus for flattening the outer shape of a PCB as claimed in claim 7, wherein: the lower end of the rod piece (510) is communicated with a cold air pipe (7), and cold air output by the cold air pipe (7) enters the inner channel (511) and is diffused by the through hole (512).

Technical Field

The invention relates to the technical field of PCB processing, in particular to an appearance leveling device of a PCB.

Background

A printed Circuit board (pcb), which is called a printed Circuit board (pcb) and is also called a printed Circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical interconnection of electronic components.

The printed circuit board consists of an insulating bottom plate, a connecting lead and a welding disc for assembling and welding electronic elements, and has double functions of a conductive circuit and the insulating bottom plate. The circuit can replace complex wiring to realize electrical connection among elements in the circuit, thereby simplifying the assembly and welding work of electronic products, reducing the wiring workload in the traditional mode and greatly lightening the labor intensity of workers; and the volume of the whole machine is reduced, the product cost is reduced, and the quality and the reliability of the electronic equipment are improved.

In the manufacture of the printed circuit board, hot air leveling is an indispensable procedure, the working principle of the hot air leveling is to remove redundant solder on the surface and in holes of the printed circuit board by utilizing hot air, and the residual solder is uniformly covered on a bonding pad, a non-resistance solder line and a surface packaging point, so that the hot air leveling is one of the surface treatment modes of the printed circuit board.

The specific operation process is that firstly, the soldering flux is coated on the printed circuit board, then the soldering flux is dipped in the molten solder, then the soldering flux passes through between two air knives, the redundant solder on the printed circuit board is blown off by hot compressed air in the air knives, and meanwhile, the redundant solder in the metal holes is removed, so that a flat and uniform solder coating is obtained.

Firstly, after a printed circuit board containing copper foil is soaked in tin, partial copper and tin are dissolved, and when the content exceeds a certain proportion, the fluidity of tin is deteriorated, so that tin-copper slag blown off by an air knife can influence a tin pool; secondly, the volatile scaling powder gathers in the device and can't discharge, forms yellow liquid and corrodes equipment, brings the potential safety hazard.

Disclosure of Invention

The invention aims to provide a PCB (printed circuit board) appearance leveling device, which aims to solve the technical problem that tin-copper slag falls into a tin pool and cannot be discharged with soldering flux in the prior art.

In order to solve the technical problems, the invention specifically provides the following technical scheme:

the utility model provides a PCB circuit board's appearance leveling device, includes tin pond, anchor clamps, air knife subassembly and the subassembly that induced drafts, the tin pond is used for holding metallic tin and melts liquid to be equipped with the opening in the upper end, anchor clamps are used for the centre gripping PCB circuit board, anchor clamps are located the open-ended top is made the reciprocating motion of vertical direction, air knife subassembly includes the air knife, the wind gap orientation of air knife PCB circuit board, the subassembly that induced drafts is equipped with the inlet scoop, the inlet scoop internal rotation is equipped with the blade, the blade rotates the back extraction hot-blast and absorb tin copper slag and volatile scaling powder, still installed the condensation piece in the inlet scoop, the condensation piece adsorbs scaling powder separates tin copper slag.

As a preferred scheme of the invention, the tin bath sealing device further comprises a covering component, wherein the covering component comprises a sliding rail, a rack, a first gear, a second gear and a cover plate, the sliding rail is vertically arranged, the clamp is slidably arranged on the sliding rail, the rack is vertically arranged on the lower end face of the clamp, the first gear is rotatably arranged on the side wall of the sliding rail and is meshed with the rack, the second gear is coaxially arranged with the first gear, the cover plate is slidably arranged above an opening of the tin bath and is provided with a tooth surface matched with the second gear, and the cover plate is configured with a closed state covering the opening and an open state exposing the opening;

after the clamp moves downwards, the rack moves downwards and drives the first gear and the second gear to rotate, and the second gear pushes the cover plate to be switched from a closed state to an open state.

As a preferable scheme of the invention, both sides of the rack are provided with tooth surfaces, the first gear, the second gear and the cover plates are symmetrically arranged on both sides of the rack, the two cover plates are obliquely arranged at the opening of the tin bath and are in a split door structure, and the cover plates form symmetrical slopes after being closed.

As a preferred scheme of the invention, the air suction assembly further comprises a vertically arranged pipeline, openings are arranged at two ends of the pipeline, an air suction opening is arranged at the upper end of the pipeline and faces towards an air opening of the air knife, the lower end of the pipeline is communicated with the outside, the blades are rotatably arranged in the pipeline, a driving motor is coaxially arranged above the blades, a planetary reducer is arranged below the blades, and the condensing part is detachably connected with the output end of the planetary reducer;

the blades extract hot air after rotating and convey the hot air to the interior of the pipeline, and the soldering flux is liquefied and separated out after passing through the condensing part.

In a preferred embodiment of the present invention, the upper end of the duct is formed in a trumpet shape.

As a preferable scheme of the invention, a filter screen is arranged in the pipeline and is arranged above the blades.

As a preferable scheme of the present invention, the condensing member includes a rod member and at least one set of condensing sheet, the rod member is vertically disposed, an inner channel is disposed inside the rod member, a plurality of through holes are formed in a side wall of the rod member and communicated with the inner channel, the condensing sheet is sleeved on an outer peripheral wall of the rod member, the condensing sheet is recessed at a middle portion and has a round disc shape with a raised edge, and the flux precipitated on an outer layer of the condensing sheet flows into the inner channel through the through holes.

In a preferred embodiment of the present invention, the condensation sheet is made of a stainless steel material having good thermal conductivity and corrosion resistance.

As a preferable scheme of the present invention, the lower end of the rod is communicated with a cold air pipe, and cold air output by the cold air pipe enters the inner channel and is emitted from the through hole.

Compared with the prior art, the invention has the following beneficial effects:

the tin-copper slag collecting device is provided with the air suction assembly, tin-copper slag blown off by the air knife is collected through strong wind power while heat is dissipated, the tin-copper slag is prevented from falling into a tin pool, and the influence of metal copper on the tin pool is effectively avoided; meanwhile, after the hot air passes through the condensing part, the soldering flux can be rapidly cooled and separated out, so that the soldering flux is prevented from being attached to each part of the device and corroding important parts;

after the blades rotate, hot air in the device is extracted and can be quickly conveyed to the condensing part, so that the soldering flux can be quickly collected;

the condensing piece is provided with a rod piece and a condensing sheet, so that the soldering flux in the hot air can be quickly separated out, and can be discharged through an inner channel of the rod piece to protect other parts in the device;

the cover assembly is arranged, and when the printed circuit board dipped and coated with molten tin passes through the air knife, the blown tin-copper slag can be blocked by the cover plate and prevented from falling into a tin pool.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.

FIG. 1 is a schematic structural diagram of a contour flattening apparatus for a PCB according to an embodiment of the present invention;

FIG. 2 is a sectional view taken along the line A-A in FIG. 1;

FIG. 3 is an enlarged view of a portion of FIG. 1 at B;

FIG. 4 is a schematic diagram illustrating an overall structure of a condensation member of a contour flattening apparatus for a PCB according to an embodiment of the present invention;

FIG. 5 is a top view of a condensing element of a contour flattening apparatus for a PCB circuit board according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of an alternative embodiment of the present invention.

The reference numerals in the drawings denote the following, respectively:

1-a tin bath; 2-clamping; 3-a wind knife assembly; 4-a suction assembly; 410-a pipeline; 420-a blade; 430-a drive motor; 440-planetary reducer; 450-a filter screen; 5-a condensing member; 510-a rod member; 511-inner channel; 512-through holes; 520-a condensation sheet; 6-covering the assembly; 610-a slide rail; 620-rack; 630-a first gear; 640-a second gear; 650-cover plate; 7-cold air pipe.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1 to 6, the present invention provides an appearance leveling device for a PCB, including a tin bath 1, a fixture 2, an air knife assembly 3 and an air suction assembly 4, wherein the tin bath 1 is used for containing molten tin, and has an opening at an upper end, the fixture 2 is used for clamping the PCB, the fixture 2 is disposed above the opening and reciprocates in a vertical direction, the air knife assembly 3 includes an air knife, an air port of the air knife faces the PCB, the air suction assembly 4 is provided with an air suction port, a blade 420 is rotatably disposed in the air suction port, the blade 420 rotates to draw hot air and suck tin-copper slag and volatilized flux, a condensing member 5 is further disposed in the air suction port, and the condensing member 5 adsorbs the flux and separates the tin-copper slag.

In the specific working process, the clamp 2 clamps the printed circuit board coated with the soldering flux, firstly, the clamp 2 is driven by a driving device to drive the printed circuit board to descend until the part of the printed circuit board, which needs to be dipped with the solder, is completely immersed in the tin pool 1, and the printed circuit board stays in the tin pool 1 for several seconds, so that the solder tin is ensured to completely infiltrate the printed circuit board; then the driving device rises to drive the printed circuit board to pass through the air knife, uniform and continuous hot compressed air can be provided at the air port, and the hot compressed air blows the solder coating to blow off the solder of the coating and the redundant solder in the metal hole; the tin-copper slag that blows off is caught and is inhaled by the subassembly 4 that induced drafts, and blade 420 rotates, inhales the hot-air that contains a large amount of scaling powders in the device, and hot-blast process condensing part 5, scaling powder behind condensing part 5, and quick cooling is appeared.

In brief, the air suction assembly 4 collects tin-copper slag blown off by the air knife through strong wind power while dissipating heat, so that the tin-copper slag is prevented from falling into the tin pool 1, and the influence of metal copper on the tin pool 1 is effectively avoided; meanwhile, after the hot air passes through the condensing part 5, the soldering flux can be rapidly cooled and separated out, and the soldering flux is prevented from being attached to each part of the device and corroding important parts.

The above-mentioned outline flattening device of a PCB circuit board further comprises a covering assembly 6, the covering assembly 6 comprises a slide rail 6, a rack 620, a first gear 630, a second gear 640 and a cover plate 650;

the slide rail 6 is vertically arranged in the device and fixedly connected with the device, the clamp 2 is slidably arranged on the slide rail 6, and the drive device drives the clamp 2 to do reciprocating motion in the vertical direction, so that the procedures of dip-coating solder and leveling hot air of the printed circuit board are realized;

the rack 620 is vertically arranged on the lower end face of the clamp 2, the first gear 630 is rotatably arranged on the side wall of the sliding rail 6 and meshed with the rack 620, the second gear 640 and the first gear 630 are coaxially arranged, the cover plate 650 is slidably arranged above the opening of the tin bath 1 and is provided with a tooth surface matched with the second gear 640, and the cover plate 650 is configured with a closed state covering the opening and an open state exposing the opening;

after the clamp 2 moves downwards, the rack 620 moves downwards and drives the first gear 630 and the second gear 640 to rotate, and the second gear 640 pushes the cover plate 650 to switch from the closed state to the open state.

The first gear 630 and the second gear 640 are arranged for controlling the transmission ratio, so as to ensure that the cover plate 650 is completely closed after the printed circuit board is completely separated from the tin bath 1; at the same time, it is ensured that the printed circuit board can be completely immersed in the tin bath 1 when the cover 650 is in the open extreme position.

Both sides of the rack 620 are provided with tooth surfaces, the first gear 630, the second gear 640 and the cover plates 650 are symmetrically arranged on both sides of the rack 620, the two cover plates 650 are obliquely arranged at the opening of the tin bath 1 and are arranged in a door structure which is opened in opposite directions, and the cover plates 650 form symmetrical slope surfaces after being closed.

The cover plate 650 is arranged to prevent a part of tin-copper slag from falling into the tin bath 1 when the tin-copper slag falls onto the cover plate 650, and the cover plate 650 can prevent impurities from entering the tin bath 1; the apron 650 slope sets up, has domatic, and the tin copper slag can be followed domatic and rolled off, is changeed and is caught by the subassembly 4 that induced drafts.

In a preferred scheme, the air suction assembly 4 further comprises a vertically arranged pipeline 410, openings are arranged at two ends of the pipeline 410, an air suction opening is arranged at the upper end of the pipeline 410 and faces the air opening of the air knife, the lower end of the pipeline 410 is communicated with the outside,

a grating for mounting each part is also arranged in the pipeline 410 and is fixedly connected on the inner wall of the pipeline 410; a driving motor 430 is fixedly installed above the grating, an output shaft of the driving motor 430 extends downwards, the blades 420 are sleeved on the output shaft of the driving motor 430, and the driving motor 430 drives the blades 420 to rotate; the blade 420 is preferably a worm wheel blade, has stronger suction force, and can more effectively capture the blown tin-copper slag.

Still fixed mounting has planetary reducer on the grid, and planetary reducer's input links to each other with driving motor 430, and detachably is connected with condensing part 5 on the output.

Wherein, the blade 420 extracts hot air after rotating and conveys the hot air to the inside of the pipeline 410, and the soldering flux is liquefied and separated out after passing through the condensing part 5.

The air suction assembly 4 is structurally arranged, and after all hot air in the device is sucked by the blades 420, all the hot air passes through the condensing part 5, so that the maximum condensation and precipitation of the soldering flux can be ensured; the condensation member 5 obtains a certain rotation speed with the aim of:

firstly, the contact with hot air is more uniform, and the soldering flux is ensured to be uniformly separated out on the surface layer of the condensing part 5;

secondly, if the tin-copper slag falls on the condensing part 5, the tin-copper slag can continuously separate from the surface layer of the condensing part 5 due to centrifugal force, so that the tin-copper slag and the soldering flux are effectively separated.

The upper end of the duct 410 is flared. More tin-copper slag can be captured.

The filter screen 450 is arranged in the pipeline 410, the filter screen 450 is arranged above the blades 420, and the tin-copper slag falls on the filter screen 450, so that the tin-copper slag can be prevented from falling on the condensing part 5, and the slag can be collected more easily, and is convenient for recycling.

In an optional embodiment, the condensing member 5 includes a rod 510 and at least one set of condensing fins 520, the rod 510 is vertically disposed, an inner channel 511 is disposed inside the rod 510, a plurality of through holes 512 are disposed on a side wall of the rod 510 and are communicated with the inner channel 511, the at least one set of condensing fins 520 is sleeved on an outer circumferential wall of the rod 510 and is configured to be a circular disk shape with a concave middle portion and a raised edge, and the soldering flux separated out from an outer layer of the condensing fins 520 flows into the inner channel 511 through the through holes 512.

The condensing sheet 520 is made of a stainless steel material having good thermal conductivity and corrosion resistance.

Specifically, the condensation sheet 520 has a larger surface area to increase the adsorption area of the flux, and the larger surface area is beneficial to heat dissipation and cooling; the device is arranged in a round disc shape, so that the liquefied soldering flux is prevented from being separated from the condensing sheet 520 due to the centripetal force generated by rotation, and meanwhile, the liquefied soldering flux is gathered to the middle part; the rod member 510 is provided with a through hole 512 and an inner channel 511, which is convenient for collecting the liquefied flux on each set of condensing sheets 520, and finally, the collected flux flows into the inner channel 511 through the through hole 512 and is discharged, thereby effectively preventing the flux from attaching and corroding important parts.

In an alternative embodiment, the lower end of the rod 510 is connected to the cold air pipe 7, and the cold air output from the cold air pipe 7 enters the inner channel 511 and is emitted from the through hole 512, and the hot air passes through the condensation sheet 520 for a long time, which causes poor cooling effect, so that the cold air pipe 7 is introduced to help the condensation sheet 520 dissipate heat, which is beneficial to increasing the flux precipitation rate.

The above embodiments are only exemplary embodiments of the present application, and are not intended to limit the present application, and the protection scope of the present application is defined by the claims. Various modifications and equivalents may be made by those skilled in the art within the spirit and scope of the present application and such modifications and equivalents should also be considered to be within the scope of the present application.