阅读说明：本技术 军工有铅无铅混装印制板组件通孔插装器件回流焊接方法 (Reflow soldering method for through hole plug-in device of military lead-free mixed printed board assembly ) 是由 谭磊 苟俊锋 张仲瑶 于 2021-09-06 设计创作，主要内容包括：本发明涉及一种军工有铅无铅混装印制板组件通孔插装器件回流焊接方法,属于印制板焊接领域。本发明使用有铅锡膏喷印工艺结合耐高温合成石防护固定工装,使军工有铅/无铅器件表贴器件、通孔插装器件一次性完成混合回流焊接生产；通过根据器件尺寸制作的防护工装实现不同种类通孔插装器件的的耐热防护与固定,通过喷印方法实现印制板各种焊盘的锡膏涂覆。具有生产效率高,一致性好,取代了多工序军工印制板组件的生产,提高了军工印制板组件的可靠性与生产效率。(The invention relates to a reflow soldering method for a through hole plug-in device of a lead-free mixed printed board assembly for military industry, and belongs to the field of printed board soldering. The invention uses the lead-tin paste spray printing process combined with the high-temperature resistant synthetic stone protection fixing tool to lead the military industry to complete the mixed reflow soldering production of the surface-mounted device and the through hole-mounted device of the lead/lead-free device at one time; the heat-resistant protection and fixation of different types of through hole plug-in devices are realized through the protection tool manufactured according to the sizes of the devices, and the solder paste coating of various pads of the printed board is realized through the spray printing method. The method has the advantages of high production efficiency and good consistency, replaces the production of multi-process military printed board assemblies, and improves the reliability and the production efficiency of the military printed board assemblies.)

1. A through hole plug-in device reflow soldering method for a military lead-free mixed printed board assembly is characterized by comprising the following steps:

s1, spraying and printing lead-tin paste on the surface-mounted bonding pad of the surface-mounted device on the printed board and the through hole bonding pad of the through hole plug-in device through printed board tin paste spraying and printing equipment;

s2, manufacturing a hollowed-out buckling device and a device high-temperature-resistant supporting and protecting fixed cover with the wall thickness of 1-2mm by adopting a synthetic stone base material according to the size of the through hole insertion device to protect the through hole insertion device with insufficient temperature resistance;

s3, manufacturing a hollowed-out buckling device and a device high-temperature-resistant supporting and protecting fixing cover with the wall thickness of 1-2mm by adopting a synthetic stone base material according to the size of the through hole insertion device, and fixing the through hole insertion device with few pins;

and S4, completing the mixed reflow soldering production at one time.

2. The reflow soldering method for through-hole inserted devices of military lead-free mixed printed board assemblies according to claim 1, wherein the solder paste is sprayed on the printed board surface bonding pads according to the manufacturer spray printing process parameters in the step S1.

3. The reflow soldering method for through-hole inserted devices of military lead-free mixed printed board assemblies according to claim 1, wherein the printed board through-hole pads in the step S1 are subjected to spray printing of solder paste by using surface-mount pad spray printing parameters according to the whole area of the through-hole pads containing the openings.

4. The reflow soldering method for through-hole inserted devices of military lead-free mixed printed board assemblies according to any one of claims 1 to 3, wherein the temperature resistance of the synthetic stone substrate in the step S2 is higher than 300 ℃.

5. The method for reflow soldering of through hole inserted devices of military lead-free mixed printed board assembly according to claim 4, wherein the step S2 is to set a 0.5mm gap between the fixing cover and the device.

6. The reflow soldering method for through-hole inserted devices of military lead-free mixed printed board assemblies according to any one of claims 1 to 3, wherein the synthetic stone substrate in the step S3 has a temperature resistance higher than 300 ℃.

7. The reflow soldering method for through hole inserted devices of military lead-free mixed printed board assemblies according to claim 6, wherein in the step S3, a gap of 0.5mm is provided between the fixing cover and the devices.

8. The method of reflow soldering of through-hole mount devices for a military lead-free and mixed-lead printed board assembly of claim 1, wherein the surface mount devices comprise lead and lead-free devices.

9. The reflow soldering method for through hole inserted devices of military lead-free mixed printed board assemblies according to claim 8, wherein the step S4 specifically comprises: and performing reflow soldering on the surface-mounted device and the through hole plug-in device by using a surface-mounted soldering program curve once to complete one-time soldering of the whole board device.

10. The method for reflow soldering of through-hole inserted devices of military lead-free mixed printed board assembly according to claim 9, wherein the surface-mount soldering procedure curve is a high-temperature curve of the lead-free lead-containing device.

Technical Field

The invention belongs to the field of printed board welding, and particularly relates to a reflow soldering method for a through hole plug-in device of a military lead-free mixed printed board assembly.

Background

The requirements of military products on the assembly production efficiency of printed board assemblies and the reliability of welding spots are higher and higher, through hole plug-in devices in the traditional printed board assemblies need to be welded manually after reflow soldering of surface-mounted devices, the production efficiency is low, and meanwhile, the consistency of manual welding quality is difficult to guarantee.

Disclosure of Invention

Technical problem to be solved

The invention aims to solve the technical problem of how to provide a through hole plug-in device reflow soldering method for a lead-free mixed printed board assembly for military industry, so as to solve the problems of low efficiency and incapability of ensuring quality caused by manual soldering after reflow soldering of surface-mounted devices of through hole plug-in devices in the traditional printed board assembly.

(II) technical scheme

In order to solve the technical problem, the invention provides a reflow soldering method for a through hole plug-in device of a military lead-free mixed printed board assembly, which comprises the following steps:

s1, spraying and printing lead-tin paste on the surface-mounted bonding pad of the surface-mounted device on the printed board and the through hole bonding pad of the through hole plug-in device through printed board tin paste spraying and printing equipment;

s2, manufacturing a hollowed-out buckling device and a device high-temperature-resistant supporting and protecting fixed cover with the wall thickness of 1-2mm by adopting a synthetic stone base material according to the size of the through hole insertion device to protect the through hole insertion device with insufficient temperature resistance;

s3, manufacturing a hollowed-out buckling device and a device high-temperature-resistant supporting and protecting fixing cover with the wall thickness of 1-2mm by adopting a synthetic stone base material according to the size of the through hole insertion device, and fixing the through hole insertion device with few pins;

and S4, completing the mixed reflow soldering production at one time.

Further, in the step S1, solder paste is sprayed on the printed board surface-mounted pad according to the manufacturer spray printing process parameters.

Further, in the step S1, the solder paste is jet printed on the through-hole pad of the printed board by using the surface-mount pad jet printing parameters according to the whole area of the through-hole pad including the opening.

Further, the temperature resistance of the synthetic stone base material in the step S2 is higher than 300 ℃.

Further, in the step S2, a 0.5mm gap is provided between the fixing cover and the device.

Further, the temperature resistance of the synthetic stone base material in the step S3 is higher than 300 ℃.

Further, in the step S3, a 0.5mm gap is provided between the fixing cover and the device.

Further, the surface-mounted device comprises a lead-containing device and a lead-free device.

Further, the step S4 specifically includes: and performing reflow soldering on the surface-mounted device and the through hole plug-in device by using a surface-mounted soldering program curve once to complete one-time soldering of the whole board device.

Further, the surface-mount welding program curve is a high-temperature curve of the lead-containing and lead-free device.

(III) advantageous effects

The invention provides a reflow soldering method for through hole inserted devices of military industry lead-free mixed printed board assemblies, which is characterized in that the through hole inserted devices of the military industry printed board assemblies and surface mounted devices (lead-free mixed mounted) are subjected to spray printing of solder paste by spray printing equipment, and then are subjected to reflow soldering with the through hole inserted devices in a reflow soldering mode, so that the through hole inserted devices and the surface mounted devices can be soldered by one-time reflow soldering, and the reflow soldering method has the characteristics of high efficiency and good quality consistency.

The method has the advantages that the lead-tin paste spray printing process is combined with the high-temperature resistant synthetic stone protection fixing tool, so that the lead/lead-free device surface-mounted device and the through hole plug-in device of the military industry can complete the mixed reflow soldering production at one time; the heat-resistant protection and fixation of different types of through hole plug-in devices are realized through the protection tool manufactured according to the sizes of the devices, and the solder paste coating of various pads of the printed board is realized through the spray printing method. The method has the advantages of high production efficiency and good consistency, replaces the production of multi-process military printed board assemblies, and improves the reliability and the production efficiency of the military printed board assemblies.

Detailed Description

In order to make the objects, contents and advantages of the present invention clearer, the following detailed description of the embodiments of the present invention will be given in conjunction with examples.

The method is used for realizing the process that the jet printing equipment of the solder pad paste is used for carrying out jet printing on the solder pad paste together with the surface-mounted device (lead-free and lead-free mixed loading) of the through hole plug-in device of the military printed board assembly, and then the through hole plug-in device and the surface-mounted device are subjected to reflow soldering together in a reflow soldering mode, so that the through hole plug-in device and the surface-mounted device can be soldered together by one-time reflow soldering, and the method has the characteristics of high efficiency and good quality consistency.

The method mainly adopts a specially designed shielding and fixing device of the through hole plug-in device, and sprays solder paste on the upper surface bonding pad and the through hole bonding pad of the printed board by the current advanced printed board assembly solder paste spraying equipment, so that one-time soldering of the whole board device is completed by carrying out reflow soldering at one time on surface-mounted devices (including lead-free devices) and through hole plug-in devices by using surface-mounted soldering program curves (including high-temperature curves of lead-free devices).

The invention aims to provide a process method which can lead military lead/lead-free mixed surface-mounted devices and through hole plug-in devices to be capable of carrying out solder paste spray printing once and completing the welding of the whole board device by adopting a reflow soldering process once.

The specific implementation method is as follows:

s1, spraying and printing lead-tin paste on the upper surface bonding pad and the through hole bonding pad of the printed board through the printed board tin paste spraying and printing equipment;

the solder paste spray printing equipment for the printed board is advanced and mature on the market at present, the upper surface of the printed board is printed with the solder pads, the through hole solder pads are all sprayed and printed with the lead solder paste (the military industry has the lead/lead-free device mixed reflow soldering requirement), the surface of the printed board is printed with the solder paste according to the spray printing process parameters of manufacturers, the through hole solder pads are sprayed with the surface mounting solder pads according to the spray printing process parameters of the whole area of the through hole solder pads containing openings, thus, the various solder pads of the whole board are all sprayed with the solder paste, and the use of the follow-up whole board soldering process is facilitated.

S2, manufacturing a hollowed-out buckling device and a device high-temperature-resistant supporting and protecting fixed cover with the wall thickness of 1-2mm by adopting a synthetic stone base material according to the size of the through hole insertion device to protect the through hole insertion device with insufficient temperature resistance;

the invention relates to a method for protecting a lead/lead-free component in military industry, which is characterized in that the highest temperature of mixed reflow soldering reflux of the lead/lead-free component in military industry is high, and part of conventional through hole inserted components is insufficient in temperature resistance, a synthetic stone base material (temperature resistance is higher than 300 ℃) is adopted to manufacture a hollow buckling component and a component high-temperature-resistant supporting and protecting fixed cover with the wall thickness of 1-2mm according to the size of the through hole inserted component to protect the component. Therefore, the high temperature of the hot air reflow soldering can not directly act on the device to play a role of thermal protection, and the reflow soldering of the whole board is ensured.

S3, manufacturing a hollowed-out buckling device and a device high-temperature-resistant supporting and protecting fixing cover with the wall thickness of 1-2mm by adopting a synthetic stone base material according to the size of the through hole insertion device, and fixing the through hole insertion device with few pins;

according to the invention, a synthetic stone base material (with the temperature resistance higher than 300 ℃) is adopted, and according to the size of the through hole insertion device, a device supporting and protecting fixing cover which is hollowed and covers the device and has the wall thickness of 1-2mm is manufactured to fix the position of the through hole insertion device, so that the guarantee is provided for the whole plate reflow soldering.

A0.5 mm gap is arranged between the fixed cover and the device, so that the device is protected and fixed better.

And S4, completing the mixed reflow soldering production at one time.

And reflow soldering is carried out on surface-mounted devices (including lead-free devices) and through hole-mounted devices at one time by using surface-mounted soldering program curves (including high-temperature curves of the lead-free devices), and one-time soldering of the whole board device is completed at high efficiency and high consistency.

The method has the advantages that the lead-tin paste spray printing process is combined with the high-temperature resistant synthetic stone protection fixing tool, so that the lead/lead-free device surface-mounted device and the through hole plug-in device of the military industry can complete the mixed reflow soldering production at one time; the heat-resistant protection and fixation of different types of through hole plug-in devices are realized through the protection tool manufactured according to the sizes of the devices, and the solder paste coating of various pads of the printed board is realized through the spray printing method. The method has the advantages of high production efficiency and good consistency, replaces the production of multi-process military printed board assemblies, and improves the reliability and the production efficiency of the military printed board assemblies.

The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.