阅读说明：本技术 一种芯片生产用自动点胶焊接一体式设备 (Automatic dispensing and welding integrated equipment for chip production ) 是由 吴超 于 2021-08-03 设计创作，主要内容包括：本发明属于芯片生产技术领域,尤其是一种芯片生产用自动点胶焊接一体式设备,针对背景技术提出的问题,现提出以下方案,包括内部设有夹持机构的机箱和设置有点胶焊接一体机构的连接板,所述机箱的侧壁焊接有具备吸尘机构的除尘箱,且机箱的顶部外壁焊接有具备高精度移动机构的L型板,所述L型板的侧壁焊接有具备送风机构的送风罩。本发明通过高精度移动机构和点胶焊接一体机构的配合使用,利用高精度移动机构带动点胶焊接一体机构进行高精度的移动来实现芯片精准的点胶焊接在PCB基板上,提高整个设备的精准度,同时利用点胶焊接一体机构能够实现在一个设备上完成点胶和焊接两个操作,点胶更加均匀,这样提高了芯片生产的效率和质量。(The invention belongs to the technical field of chip production, in particular to an automatic glue dispensing and welding integrated device for chip production, and provides a scheme aiming at the problems in the background art. According to the invention, the high-precision moving mechanism and the dispensing and welding integrated mechanism are used in a matched manner, the dispensing and welding integrated mechanism is driven by the high-precision moving mechanism to perform high-precision movement so as to realize accurate dispensing and welding of chips on the PCB substrate, the precision of the whole equipment is improved, and meanwhile, the dispensing and welding integrated mechanism can be used for completing dispensing and welding operations on one equipment, so that dispensing is more uniform, and the efficiency and quality of chip production are improved.)

1. An automatic glue-dispensing and welding integrated device for chip production comprises a case (1) with a clamping mechanism arranged inside and a connecting plate (4) with a glue-dispensing and welding integrated mechanism, and is characterized in that a dust-removing box (2) with a dust-absorbing mechanism is welded on the side wall of the case (1), an L-shaped plate (3) with a high-precision moving mechanism is welded on the outer wall of the top of the case (1), an air supply cover (5) with an air supply mechanism is welded on the side wall of the L-shaped plate (3), a PCB (printed circuit board) substrate (6) is placed on the top of the case (1), a chip storage box (7) is placed on the inner wall of the bottom of the case (1), and a PLC (8) is fixed on the side wall of the case (1);

the clamping mechanism comprises a first servo motor (101), a bidirectional screw (102), two T-shaped sliding blocks (103), two clamping strips (104), two rubber pads (105) and a slide way (106);

the dust collection mechanism comprises a mounting plate (201), a suction pump (202), a mounting frame (203), a filter screen (204) and a dust collection block (205);

the high-precision moving mechanism comprises a second servo motor (301), a gear (302), a rack (303), a sliding rail (304), a CCD high-definition camera (305), an infrared sensor (306) and a support rod (307);

the integrated dispensing and welding mechanism comprises a first push rod motor (401), a transmission case (402), a stepping motor (403), dispensing instruments (404) which are distributed equidistantly, a plurality of chain wheels (405), a chain (406), a second push rod motor (407), a lifting plate (408) and electric welding devices (409) which are distributed equidistantly;

the air supply mechanism comprises a fan (501), electric heating wires (502) distributed at equal intervals and vent holes (503) distributed at equal intervals.

2. The automatic dispensing and welding integrated equipment for chip production according to claim 1, wherein the first servo motor (101) is fixed on the side wall of the case (1), the bidirectional screw (102) is coaxially connected with the output shaft of the first servo motor (101) through a coupler, the bidirectional screw (102) is respectively connected with the inner walls of two sides of the case (1) through two bearings, and the two T-shaped sliders (103) are respectively screwed at two opposite threaded ends of the bidirectional screw (102).

3. The automatic dispensing and welding integrated equipment for chip production according to claim 1, wherein the two clamping strips (104) are respectively welded on the outer walls of the two T-shaped sliding blocks (103) at the sides close to each other, the two rubber pads (105) are respectively adhered on the outer walls of the two clamping strips (104) at the sides close to each other, the slide (106) is arranged on the inner wall of the top of the case (1), and the outer walls of the two T-shaped sliding blocks (103) are both in sliding connection with the inner wall of the slide (106).

4. The automatic spot-gluing and welding integrated equipment for chip production according to claim 1, wherein the mounting plate (201) is welded on the side wall of the dust removal box (2), the air suction pump (202) is fixed on the outer wall of the top of the mounting plate (201), the mounting frame (203) is inserted into the inner wall of the middle of the dust removal box (2), and the filter screen (204) is fixed on the inner wall of the periphery of the mounting frame (203).

5. The automatic dispensing and welding integrated equipment for chip production according to claim 1, wherein the dust suction block (205) is welded on the outer wall of the top of the case (1), the dust suction block (205) is of a hollow structure, dust suction holes are formed in the inner wall of the front face of the dust suction block (205) and are distributed at equal intervals, and the dust suction block (205) is connected with the inner wall of the top of the dust removal box (2) through an exhaust pipe.

6. The automatic dispensing and welding integrated equipment for chip production is characterized in that the second servo motor (301) is fixed on the outer wall of the top of the L-shaped plate (3), the gear (302) is coaxially sleeved on an output shaft of the second servo motor (301), the rack (303) is meshed with the gear (302), and the sliding rail (304) is arranged on the inner wall of the top of the L-shaped plate (3).

7. The automatic spot-gluing and welding integrated equipment for chip production is characterized in that the CCD high-definition camera (305) and the infrared sensor (306) are fixed on the outer wall of the bottom of the L-shaped plate (3), the support rod (307) is welded on the outer wall of the center of the bottom of the rack (303), the outer wall of the support rod (307) is connected with the inner wall of the sliding rail (304) in a sliding mode, and the connecting plate (4) is welded on the outer wall of the bottom end of the support rod (307).

8. The automatic dispensing and welding integrated equipment for chip production is characterized in that the first push rod motor (401) and the second push rod motor (407) are both fixed on the outer wall of the bottom of the connecting plate (4), the transmission case (402) is welded on the outer wall of the output end of the first push rod motor (401), the stepping motors (403) are fixed on the inner wall of the top of the transmission case (402), and the dispensing instruments (404) distributed equidistantly are both connected with the inner wall of the bottom of the transmission case (402) through bearings.

9. The automatic dispensing and welding integrated equipment for chip production is characterized in that a plurality of chain wheels (405) are respectively sleeved on dispensing instruments (404) which are distributed equidistantly, a chain (406) is meshed on the chain wheels (405), an output shaft of a stepping motor (403) is coaxially connected with one dispensing instrument (404) through a coupler, a lifting plate (408) is welded on the outer wall of the output end of a second push rod motor (407), and electric welding devices (409) which are distributed equidistantly are fixed on the outer wall of the bottom of the lifting plate (408).

10. The automatic dispensing and welding integrated equipment for chip production as claimed in claim 1, wherein the fan (501) is fixedly communicated with the side wall of the air supply hood (5), the heating wires (502) distributed at equal intervals are welded on the inner wall of the air supply hood (5), and the plurality of vent holes (503) are formed in the inner wall of one side of the L-shaped plate (3).

Technical Field

The invention relates to the technical field of chip production, in particular to automatic dispensing and welding integrated equipment for chip production.

Background

In the production process of chips, generally, dispensing and pasting operations are required, that is, after a substrate is coated with glue, a corresponding chip is picked up and placed to be pasted on the substrate coated with the glue, and then the chip is welded.

But among the prior art the chip separately operates on two equipment respectively when carrying out point and welding, so not only work efficiency is low, influences the quality of whole chip processing easily at the in-process that shifts moreover to there is inhomogeneous problem of point in current point gluing technique usually, and because the inconvenient fixed PCB base plate that leads to of PCB base plate easily takes place to rock and offset in welding process in addition during the welding, and then influences the quality of chip production.

Disclosure of Invention

The invention aims to solve the defects in the prior art and provides an automatic dispensing and welding integrated device for chip production.

In order to achieve the purpose, the invention adopts the following technical scheme:

an automatic dispensing and welding integrated device for chip production comprises a case with a clamping mechanism inside and a connecting plate with a dispensing and welding integrated mechanism, wherein a dust removing box with a dust collecting mechanism is welded on the side wall of the case, an L-shaped plate with a high-precision moving mechanism is welded on the outer wall of the top of the case, an air supply cover with an air supply mechanism is welded on the side wall of the L-shaped plate, a PCB substrate is placed on the top of the case, a chip storage box is placed on the inner wall of the bottom of the case, and a PLC is fixed on the side wall of the case;

the clamping mechanism comprises a first servo motor, a bidirectional screw, two T-shaped sliding blocks, two clamping strips, two rubber pads and a slide way;

the dust absorption mechanism comprises a mounting plate, an air suction pump, a mounting frame, a filter screen and a dust absorption block;

the high-precision moving mechanism comprises a second servo motor, a gear, a rack, a slide rail, a CCD high-definition camera, an infrared sensor and a support rod;

the glue dispensing and welding integrated mechanism comprises a first push rod motor, a transmission box, a stepping motor, glue dispensing instruments distributed at equal intervals, a plurality of chain wheels, a chain, a second push rod motor, a lifting plate and electric welding devices distributed at equal intervals;

the air supply mechanism comprises a fan, electric heating wires distributed at equal intervals and vent holes distributed at equal intervals.

Preferably, the first servo motor is fixed on the side wall of the case, the bidirectional screw is coaxially connected with an output shaft of the first servo motor through a coupler, the bidirectional screw is respectively connected with the inner walls of two sides of the case through two bearings, and the two T-shaped sliders are respectively screwed at two opposite threaded ends of the bidirectional screw.

Preferably, two the centre gripping strip welds respectively in the one side outer wall that two T type sliders are close to each other, and two rubber pads bond respectively at the one side outer wall that two centre gripping strips are close to each other, the top inner wall at quick-witted case is seted up to the slide, and the outer wall of two T type sliders all with the inner wall sliding connection of slide.

Preferably, the mounting panel welding is at the lateral wall of dust removal case, and the aspiration pump is fixed at the top outer wall of mounting panel, the mounting frame is pegged graft at the middle part inner wall of dust removal case, and the filter screen is fixed at the mounting frame inner wall all around.

Preferably, the dust absorption block is welded on the outer wall of the top of the case, the dust absorption block is of a hollow structure, dust absorption holes distributed at equal intervals are formed in the inner wall of the front face of the dust absorption block, and the dust absorption block is connected with the inner wall of the top of the dust removal case through an exhaust pipe.

Preferably, the second servo motor is fixed on the outer wall of the top of the L-shaped plate, the gear is coaxially sleeved on an output shaft of the second servo motor, the rack is meshed with the gear, and the sliding rail is arranged on the inner wall of the top of the L-shaped plate.

Preferably, CCD high definition camera and infrared ray sensor all fix the bottom outer wall at the L template, and the vaulting pole welding is at the central outer wall in bottom of rack, the outer wall of vaulting pole and the inner wall sliding connection of slide rail, and the connecting plate welding is at the bottom outer wall of vaulting pole.

Preferably, first push rod motor and second push rod motor are all fixed at the bottom outer wall of connecting plate, and the transmission case welding is at the output outer wall of first push rod motor, step motor fixes the top inner wall at the transmission case, and the equidistance point that distributes is glued the appearance and is all connected through the bottom inner wall of bearing with the transmission case.

Preferably, a plurality of the sprocket cup joints respectively on the appearance is glued to the point that the equidistance distributes, and the chain meshing is on a plurality of sprockets, step motor's output shaft passes through the shaft coupling and one of them point appearance coaxial coupling that glues, and the lifter plate welds the output outer wall at second push rod motor, and the electric welding ware that the equidistance distributes all fixes the bottom outer wall at the lifter plate.

Preferably, the fan is fixedly communicated with the side wall of the air supply cover, the electric heating wires distributed at equal intervals are welded on the inner wall of the air supply cover, and the plurality of vent holes are formed in the inner wall of one side of the L-shaped plate.

The invention has the beneficial effects that:

1. the clamping mechanism is arranged, so that PCB substrates of different models can be clamped and fixed before dispensing welding, the PCB substrates are not easy to shake and shift in position in the subsequent processing process, and the quality and the precision of the dispensing welding of chips can be improved;

2. the dust collection mechanism is arranged, so that dust on the surface of the PCB substrate can be removed before dispensing and welding, the surface cleanliness of the PCB substrate in the subsequent processing process can be guaranteed, the adverse effect of the dust on the dispensing and welding work of the chip can be reduced, and the processing quality and effect are further improved;

3. according to the invention, the high-precision moving mechanism and the dispensing and welding integrated mechanism are mutually matched for use, and the dispensing and welding integrated mechanism is driven by the high-precision moving mechanism to perform high-precision movement so as to realize accurate dispensing and welding of chips on a PCB substrate, so that the precision of the whole equipment can be improved, and meanwhile, the dispensing and welding integrated mechanism can be used for completing dispensing and welding operations on one equipment, and dispensing is more uniform, so that the efficiency and quality of chip production are improved;

4. the air supply mechanism is arranged, the air supply mechanism can continuously supply hot air to enable the chip to be quickly attached to the PCB substrate in the dispensing process, so that the dispensing efficiency is improved, the air supply mechanism can continuously supply cold air in the welding process, the cooling rate of a welding position can be accelerated, and the welding efficiency is improved.

Drawings

Fig. 1 is a schematic view of an overall three-dimensional structure of an automatic dispensing and welding integrated device for chip production according to the present invention;

fig. 2 is a schematic perspective view of a clamping mechanism and a dust removing mechanism in the automatic dispensing and welding integrated device for chip production according to the present invention;

fig. 3 is a schematic perspective view of a clamping mechanism in the automatic dispensing and welding integrated device for chip production according to the present invention;

FIG. 4 is a schematic perspective view of a dust suction mechanism in the integrated automatic dispensing and welding apparatus for chip production according to the present invention;

fig. 5 is a schematic perspective view of a high-precision moving mechanism in the automatic dispensing and welding integrated device for chip production according to the present invention;

fig. 6 is a schematic perspective view of a dispensing and welding integrated mechanism in an automatic dispensing and welding integrated device for chip production according to the present invention;

FIG. 7 is a schematic view of an internal three-dimensional structure of a transmission case in the automatic dispensing and welding integrated device for chip production according to the present invention;

fig. 8 is a schematic perspective view of a plurality of sprockets in transmission connection with a chain in the automatic dispensing and welding integrated device for chip production according to the present invention;

fig. 9 is a schematic perspective view of an air supply mechanism in the automatic dispensing and welding integrated device for chip production according to the present invention;

fig. 10 is a schematic perspective view of two parts of an air pump and a fan in the automatic dispensing and welding integrated device for chip production according to the present invention.

In the figure: 1 case, 2 dust removal boxes, 3L-shaped plates, 4 connecting plates, 5 air supply hoods, 6PCB substrates, 7 chip storage boxes, 8PLC controllers, 101 first servo motors, 102 two-way screws, 103T-shaped sliding blocks, 104 clamping strips, 105 rubber pads, 106 slideways, 201 mounting plates, 202 air pumps, 203 mounting frames, 204 filter screens, 205 dust suction blocks, 301 second servo motors, 302 gears, 303 racks, 304 sliding rails, 305CCD high-definition cameras, 306 infrared sensors, 307 supporting rods, 401 first push rod motors, 402 transmission boxes, 403 stepping motors, 404 glue dispensing instruments, 405 sprockets, 406 chains, 407 second push rod motors, 408 lifting plates, 409 electric welding machines, 501 fans, 502 electric heating wires and 503 ventilation holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Referring to fig. 1-2, an automatic dispensing and welding integrated device for chip production comprises a case 1 with a clamping mechanism inside and a connecting plate 4 with a dispensing and welding integrated mechanism, wherein a dust removing case 2 with a dust collecting mechanism is welded on the side wall of the case 1, an L-shaped plate 3 with a high-precision moving mechanism is welded on the outer wall of the top of the case 1, an air supply cover 5 with an air supply mechanism is welded on the side wall of the L-shaped plate 3, a PCB (printed circuit board) substrate 6 is placed on the top of the case 1, a chip storage box 7 is placed on the inner wall of the bottom of the case 1, a PLC (programmable logic controller) 8 is fixed on the side wall of the case 1, a double-open type case door is hinged on the front of the case 1, and a sealing case door is hinged on the front of the dust removing case 2;

embodiment 1 is a preparation work before dispensing and welding, and referring to fig. 2-4, a clamping mechanism is composed of a first servo motor 101 fixed on the side wall of a case 1, a bidirectional screw 102 coaxially connected with an output shaft of the first servo motor 101 through a coupler, two T-shaped sliders 103 sequentially screwed on two opposite thread ends of the bidirectional screw 102, two clamping strips 104 sequentially welded on the outer walls of the two T-shaped sliders 103 close to one side, two rubber pads 105 sequentially adhered on the outer walls of the two clamping strips 104 close to one side, and a slideway 106 arranged on the inner wall of the top of the case 1, wherein the bidirectional screw 102 is respectively connected with the inner walls of the two sides of the case 1 through two bearings, the outer walls of the two T-shaped sliders 103 are both slidably connected with the inner wall of the slideway 106, the first servo motor 101 is connected with a forward/backward switch through a wire, and the forward/backward switch is connected with a power line;

the dust collection mechanism is composed of a mounting plate 201 welded on the side wall of the dust removal box 2, an air suction pump 202 fixed on the outer wall of the top of the mounting plate 201, a mounting frame 203 inserted in the inner wall of the middle of the dust removal box 2, a filter screen 204 fixed on the inner wall of the periphery of the mounting frame 203 and a hollow dust collection block 205 welded on the outer wall of the top of the case 1, dust collection holes distributed at equal intervals are formed in the inner wall of the front face of the dust collection block 205, and the dust collection block 205 is connected with the inner wall of the top of the dust removal box 2 through an air suction pipe;

the clamping mechanism and the dust suction mechanism are combined, the bidirectional screw 102 is driven to rotate by the first servo motor 101 before dispensing welding, under the limit of the slide 106, the two T-shaped sliders 103 screwed at two opposite thread ends of the bidirectional screw 102 drive the two clamping strips 104 to approach each other to clamp and fix the PCB substrate 6, so that the PCB substrate 6 is not easy to shake and shift in position in the subsequent processing process, the quality and the precision of dispensing welding of chips can be improved, the suction pump 202 is required to utilize the air negative pressure principle to enable the dust suction hole on the dust suction block 205 to generate strong suction force to suck dust on the PCB substrate 6 into the dust removal box 2, the sucked dust is intercepted by the filter screen 204 and collected in the dust removal box 2, the cleanliness of the surface of the PCB substrate 6 in the subsequent processing process can be ensured, and the adverse effect of the dust on the chip dispensing welding work can be reduced, the processing quality and effect are further improved;

embodiment 2 is that spot welding starts to work, and referring to fig. 5-9, the high-precision moving mechanism is composed of a second servo motor 301 fixed on the outer wall of the top of the L-shaped plate 3, a gear 302 coaxially sleeved on the output shaft of the second servo motor 301, a rack 303 meshed with the gear 302, a slide rail 304 arranged on the inner wall of the top of the L-shaped plate 3, a CCD high-definition camera 305 and an infrared sensor 306 sequentially fixed on the outer wall of the bottom of the L-shaped plate 3, and a stay bar 307 welded on the outer wall of the center of the bottom of the rack 303, the outer wall of the stay bar 307 is slidably connected with the inner wall of the slide rail 304, the connecting plate 4 is welded on the outer wall of the bottom of the stay bar 307, the second servo motor 301 is connected with a forward-backward switch through a wire, and the forward-backward switch is connected with a power line;

the integrated mechanism for glue dispensing and welding comprises a first push rod motor 401 and a second push rod motor 407 which are sequentially fixed on the outer wall of the bottom of the connecting plate 4, a transmission case 402 welded on the outer wall of the output end of the first push rod motor 401, a stepping motor 403 fixed on the inner wall of the top of the transmission case 402, glue dispensing instruments 404 which are connected with the inner wall of the bottom of the transmission case 402 through bearings and distributed equidistantly, a plurality of chain wheels 405 respectively sleeved on the glue dispensing instruments 404 distributed equidistantly, the same chain 406 meshed on the plurality of chain wheels 405, a lifting plate 408 welded on the outer wall of the output end of the second push rod motor 407 and electric welding devices 409 which are fixed on the outer wall of the bottom of the lifting plate 408 and distributed equidistantly, wherein an output shaft of the stepping motor 403 is coaxially connected with one of the glue dispensing instruments 404 through a coupler;

the air supply mechanism is composed of a fan 501 fixedly communicated with the side wall of the air supply cover 5, electric heating wires 502 which are welded on the inner wall of the air supply cover 5 and distributed at equal intervals, and vent holes 503 which are arranged on the inner wall of one side of the L-shaped plate 3 and distributed at equal intervals;

in combination with the high-precision moving mechanism, the integral dispensing and welding mechanism and the air supply mechanism, when the dispensing welding is performed, the gear 302 is driven to rotate by the second servo motor 301, the gear 302 rotates to drive the rack 303 to move, the rack 303 moves to drive the stay bar 307 to slide in the slide rail 304, the integral dispensing and welding mechanism on the connecting plate 4 is driven to accurately move by the CCD high-definition camera 305 and the infrared sensor 306, a plurality of dispensing instruments 404 arranged on the transmission case 402 are driven to move downwards by the first push rod motor 401 during dispensing, meanwhile, the stepping motor 403 is started to be matched with the transmission of a plurality of chain wheels 405 and a chain 406, finally, the plurality of dispensing instruments 404 perform rotary dispensing, after dispensing, the plurality of electric welding instruments 409 fixed at the bottom of the lifting plate 408 are driven to move downwards by the second push rod motor 407 to perform welding operation, so that the integral dispensing and welding mechanism can complete two operations of dispensing and welding on one device, and the point is glued more evenly, has improved the efficiency and the quality of chip production like this to utilize air supply mechanism, the in-process air supply mechanism that glues can be continuous carry hot-blast make the chip can be quick paste and cover on PCB base plate 6, thereby improved the efficiency of point, can be continuous carry cold wind at the welded in-process air supply mechanism, and then can accelerate the cooling rate of splice, thereby improved welded efficiency.

The working process of the invention is as follows: firstly, a bidirectional screw 102 is driven to rotate by a first servo motor 101, and two T-shaped sliders 103 screwed at two opposite thread ends of the bidirectional screw 102 drive two clamping strips 104 to approach each other to clamp and fix a PCB substrate 6 under the limit of a slideway 106; secondly, the suction pump 202 utilizes the air negative pressure principle to enable the dust suction holes on the dust suction block 205 to generate strong suction to suck the dust on the PCB substrate 6 into the dust removal box 2, and the sucked dust is intercepted by the filter screen 204 and collected in the dust removal box 2; thirdly, the gear 302 is driven to rotate through the second servo motor 301, the gear 302 rotates to drive the rack 303 to move, the rack 303 moves to drive the support rod 307 to slide in the slide rail 304, and the connecting plate 4 is enabled to accurately move by utilizing the CCD high-definition camera 305 and the infrared sensor 306; fourthly, the plurality of dispensing instruments 404 arranged on the transmission case 402 are driven to move downwards by the first push rod motor 401, meanwhile, the plurality of dispensing instruments 404 are driven to move downwards by the cooperation of the start of the stepping motor 403 with the transmission of the plurality of chain wheels 405 and the chain 406, and finally, the plurality of dispensing instruments 404 can move downwards, move horizontally and conveniently and rotate, so that uniform dispensing is realized, chips in the chip storage box 7 are sequentially placed on the PCB substrate 6 after dispensing is finished, and pasting work is finished, and meanwhile, the fan 501 is driven to continuously convey hot air to the PCB substrate 6 by the aid of the start of the electric heating wire 502; fourthly, the second push rod motor 407 is utilized to drive a plurality of electric welding devices 409 fixed at the bottom of the lifting plate 408 to move downwards for welding, and meanwhile, the fan 501 is started to enable the air supply hood 5 to continuously convey cold air to the PCB substrate 6.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.