阅读说明：本技术 导电线路修补方法 (Method for repairing conductive circuit ) 是由 郭冉 胡军辉 于 2019-03-25 设计创作，主要内容包括：本发明提供了一种导电线路修补方法及其设备,包括以下步骤：将具有线路缺陷的待修补板放置于修补设备中,并将线路缺陷移动至缺陷摄像头处；缺陷摄像头采集缺陷照片,并根据缺陷照片得出待修补线路的起点坐标和终点坐标、以及待修补线路的宽度和路径；根据待修补线路的起点坐标、终点坐标、宽度和路径,修补设备的激光器自起点坐标沿路径至终点坐标扫描,得出待修补线路的高度变化数据,生成挤胶头的运动参数和挤胶参数；将挤胶头移动至起点坐标,根据挤胶头的运动参数和挤胶参数移动挤胶头并向待修补线路挤出导电浆料并固化导电浆料。本发明提供的导电线路修补方法,可对待修补线路的修补,降低报废率,降低生产成本。(The invention provides a method and equipment for repairing a conducting circuit, which comprises the following steps: placing a board to be repaired with the line defects in repair equipment, and moving the line defects to the position of a defect camera; the defect camera acquires a defect picture, and obtains a start point coordinate and an end point coordinate of the line to be repaired, and the width and the path of the line to be repaired according to the defect picture; scanning a laser of the repairing device from the starting point coordinate to the end point coordinate along the path according to the starting point coordinate, the end point coordinate, the width and the path of the line to be repaired to obtain height change data of the line to be repaired, and generating a motion parameter and a glue extruding parameter of a glue extruding head; and moving the glue extruding head to the coordinates of the starting point, moving the glue extruding head according to the motion parameters and the glue extruding parameters of the glue extruding head, extruding the conductive paste to the line to be repaired and curing the conductive paste. The conductive circuit repairing method provided by the invention can repair the circuit to be repaired, reduce the rejection rate and reduce the production cost.)

1. The method for repairing the conducting circuit is characterized by comprising the following steps:

placing a board to be repaired with the line defects in repair equipment, and moving the line defects to the position of a defect camera;

the defect camera collects a defect picture, and obtains a start point coordinate and an end point coordinate of the line to be repaired, and the width and the path of the line to be repaired according to the defect picture;

scanning a laser of the repairing device from the starting point coordinate along the path to the end point coordinate according to the starting point coordinate, the end point coordinate, the width and the path of the line to be repaired to obtain height change data of the line to be repaired, and generating a motion parameter and a glue extruding parameter of a glue extruding head;

and moving the glue extruding head to a starting point coordinate, moving the glue extruding head according to the motion parameter and the glue extruding parameter of the glue extruding head, extruding the conductive paste to the line to be repaired and curing the conductive paste.

2. The conductive line repairing method according to claim 1, wherein before the step of placing the board to be repaired having the line defect in the repairing apparatus and moving the line defect to the defective camera, the board to be repaired is scanned by an automatic optical inspection apparatus to obtain position data of the line to be repaired.

3. The conductive line repairing method according to claim 2, wherein before moving the line to be repaired to the defective camera:

importing the position data and the standard design data of the line to be repaired, which are obtained by using automatic optical detection equipment, into the repairing equipment;

the board to be repaired is provided with a plurality of mark points, the defect camera captures each mark point in sequence according to standard design data to generate mark point coordinate parameters, and the line defects are positioned according to the mark point coordinate parameters.

4. A conductive line repairing method according to claim 3, wherein: the repairing equipment comprises a limiting plate used for positioning one corner of the plate to be repaired, and the other three corners of the plate to be repaired are provided with the mark points.

5. The conductive line repairing method according to claim 1, wherein: the motion parameters of the glue squeezing head comprise a motion track and a motion speed of the glue squeezing head, and the glue squeezing parameters of the glue squeezing head comprise the glue squeezing amount in unit time.

6. The conductive line repairing method according to claim 1, wherein after the steps of moving the paste ejection head to the start point coordinates, moving the paste ejection head according to the motion parameters and paste ejection parameters of the paste ejection head, and ejecting the conductive paste to the line to be repaired and curing the conductive paste, the laser engraving head removes the excess conductive paste according to the start point coordinates and end point coordinates of the line to be repaired, and the width and path of the line to be repaired.

7. The conductive line repairing method according to claim 1, wherein in the step of moving the paste extruding head to the start point coordinates, moving the paste extruding head according to the motion parameter and the paste extruding parameter of the paste extruding head, extruding the conductive paste to the line to be repaired, and curing the conductive paste, the conductive paste is cured by using a hot air heating head or an infrared radiation heating head.

8. A circuit repairing apparatus for use in the conductive line repairing method as claimed in any one of claims 1 to 7, characterized in that: including the casing, be used for placing workstation, defect camera, crowded head of gluing, laser instrument, first removal module and the second that treats the repair plate and remove the module, the defect camera reaches the laser instrument all is fixed in the casing, the workstation is fixed in on the first removal module, crowded head of gluing is fixed in on the second removal module.

9. The line patching device of claim 8, wherein: and the second mobile module is also fixedly provided with a monitoring camera for monitoring the surface of the board to be repaired.

10. The line patching device of claim 8, wherein: and a heating head for solidifying the conductive paste is also fixed on the shell.

Technical Field

The invention belongs to the technical field of printed circuit boards, and particularly relates to a method for repairing a conducting circuit.

Background

A printed circuit board is a circuit substrate having printed wiring for mounting and connecting circuit components. In the manufacturing process of the printed circuit board, due to the fact that the resolution ratio of the conducting circuit is high, the process difficulty is high, various manufacturing defects can occur in the conducting circuit manufacturing process, the defects of the conducting circuit are mostly circuit breakage, pits, air holes and the like, the production yield of the printed circuit board is low, and the production cost is indirectly increased.

Disclosure of Invention

The invention aims to provide a method for repairing a conductive circuit, which aims to solve the technical problem that the production yield of a circuit board is low due to the fact that the circuit board has various circuits to be repaired in the prior art.

In order to achieve the purpose, the invention adopts the technical scheme that: a method for repairing a conductive circuit is provided, which comprises the following steps:

placing a board to be repaired with the line defects in repair equipment, and moving the line defects to the position of a defect camera;

the defect camera collects a defect picture, and obtains a start point coordinate and an end point coordinate of the line to be repaired, and the width and the path of the line to be repaired according to the defect picture;

scanning a laser of the repairing device from the starting point coordinate to the end point coordinate along the path according to the starting point coordinate, the end point coordinate and the path of the line to be repaired to obtain height change data of the line to be repaired, and generating a motion parameter and a glue extruding parameter of a glue extruding head;

and moving the glue extruding head to a starting point coordinate, moving the glue extruding head according to the motion parameter and the glue extruding parameter of the glue extruding head, extruding the conductive paste to the line to be repaired, and curing the conductive paste.

Further, before the step of placing the board to be repaired with the line defect in the repairing device and moving the line defect to the defect camera, scanning the board to be repaired by using an automatic optical detection device to obtain the position data of the line to be repaired.

Further, before moving the line to be repaired to the defective camera:

importing the position data and the standard design data of the line to be repaired, which are obtained by using automatic optical detection equipment, into the repairing equipment;

the board to be repaired is provided with a plurality of mark points, the defect camera captures each mark point in sequence according to standard design data to generate mark point coordinate parameters, and the line defects are positioned according to the mark point coordinate parameters.

Furthermore, the repairing device comprises a limiting plate for positioning one corner of the plate to be repaired, and the other three corners of the plate to be repaired are provided with the marking points.

Furthermore, the motion parameters of the glue squeezing head comprise a motion track and a motion speed of the glue squeezing head, and the glue squeezing parameters of the glue squeezing head comprise the glue squeezing amount in unit time.

Further, after the step of moving the glue extruding head to the starting point coordinate, moving the glue extruding head according to the motion parameter and the glue extruding parameter of the glue extruding head, extruding the conductive paste to the line to be repaired, and curing the conductive paste, the laser engraving head removes the redundant conductive paste according to the starting point coordinate and the end point coordinate of the line to be repaired, and the width and the path of the line to be repaired.

Further, in the step of moving the glue extruding head to the starting point coordinate, moving the glue extruding head according to the motion parameter and the glue extruding parameter of the glue extruding head, extruding the conductive paste to the line to be repaired and curing the conductive paste, the conductive paste is cured by adopting a hot air heating head or an infrared radiation heating head.

The invention also provides a line repairing device which is used in the conductive line repairing method and comprises a machine shell, a workbench for placing a board to be repaired, a defect camera, a glue extruding head, a laser, a first moving module and a second moving module, wherein the defect camera and the laser are fixed on the machine shell, the workbench is fixed on the first moving module, and the glue extruding head is fixed on the second moving module.

Furthermore, a monitoring camera for monitoring the surface of the board to be repaired is fixed on the second mobile module.

Furthermore, a heating head for solidifying the conductive paste is fixed on the machine shell.

The conductive circuit repairing method and the conductive circuit repairing equipment have the beneficial effects that: compared with the prior art, the method for repairing the conductive circuit comprises the steps of firstly collecting a defect picture by using a defect camera, obtaining a starting point coordinate and an end point coordinate of the circuit to be repaired and a width and a path of the circuit to be repaired according to the defect picture, then scanning the circuit to be repaired by using a laser to obtain height change data of the circuit to be repaired, so as to obtain a motion parameter and an extrusion glue parameter of an extrusion glue head, and extruding glue on the circuit to be repaired according to the motion parameter and the extrusion glue parameter of the extrusion glue head, so that the circuit to be repaired is repaired, the rejection rate is reduced, and the production cost is reduced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

FIG. 1 is a flowchart illustrating a method for repairing a conductive trace according to an embodiment of the present invention;

fig. 2 is a structural diagram of a line repairing apparatus according to an embodiment of the present invention.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be construed as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

Referring to fig. 1 and fig. 2 together, the method for repairing the conductive circuit according to the present invention will now be described. In one embodiment, the method for repairing the conductive circuit comprises the following steps:

s10: placing a board to be repaired 010 with a line to be repaired 011 into the repairing equipment, and moving the line to be repaired 011 to a defect camera 024;

s20: the defect camera 024 acquires a defect picture, and obtains a start point coordinate and an end point coordinate of the line to be repaired 011 and a width and a path of the line to be repaired 011 according to the defect picture;

s30: according to the starting point coordinate, the end point coordinate and the path of the line 011 to be repaired, scanning a laser 026 of the repairing device from the starting point coordinate along the path to the end point coordinate to obtain height change data of the line 011 to be repaired, and generating a motion parameter and a glue squeezing parameter of a glue squeezing head 028;

s40: and moving the glue squeezing head 028 to the coordinates of the starting point, moving the glue squeezing head 028 according to the motion parameters and the glue squeezing parameters of the glue squeezing head 028, squeezing out the conductive paste from the line to be repaired 011 and solidifying the conductive paste.

The line to be repaired 011 comprises the defects of line breakage, pits, air holes and the like which lack conductive paste. Steps S10 to S30 are preparation work before repairing the circuit, and determine the motion parameter and the glue squeezing parameter of the glue squeezing head 028, so as to facilitate glue squeezing and circuit repairing in S40. S20 obtains parameters of the line to be repaired 011 in the horizontal direction, that is, the start point coordinate and the end point coordinate of the line to be repaired 011, the width and the path of the line to be repaired 011, and the like, by photographing with the defect camera 024. S30 scans the line to be repaired 011 by the laser 026, and obtains parameters of the line to be repaired 011 in the height direction, that is, height variation data of the line to be repaired 011. Alternatively, the table on which the board to be repaired 010 is placed may be moved in three directions of XYZ.

Compared with the prior art, the conductive circuit repairing method provided by the invention has the advantages that firstly, a defect camera 024 is adopted to collect a defect picture, the starting point coordinate and the end point coordinate of the line 011 to be repaired and the width and the path of the line 011 to be repaired are obtained according to the defect picture, then a laser 026 is used to scan the line 011 to be repaired to obtain the height change data of the line 011 to be repaired, so that the motion parameter and the glue squeezing parameter of the glue squeezing head 028 are obtained, and glue squeezing is carried out on the line 011 to be repaired according to the motion parameter and the glue squeezing parameter of the glue squeezing head 028, so that the repairing of the line 011 to be repaired is realized, the rejection rate is reduced, and the production cost is reduced.

As one embodiment of the method for repairing the conductive circuit provided by the present invention, before step S10, the board to be repaired 010 is scanned by an automatic optical detection device, so as to obtain position data of the circuit to be repaired 011. An automatic optical inspection apparatus (AOI apparatus) is an apparatus for inspecting a common defect based on an optical principle, and is widely used in the field of defect inspection, which is the prior art. Specifically, when detection is performed, the AOI device scans the circuit board through the defect camera 024, compares the tested welding points with qualified parameters in the database, inspects defects on the circuit through image processing, displays or marks the defects through a display or an automatic mark, and obtains coordinates of the circuit to be repaired 011 for repair by a maintenance worker. The position coordinates of the line 011 to be repaired can be obtained through detection of AOI equipment, but the specific graph of the line 011 to be repaired cannot be obtained, and the specific shape of the defect needs to be further determined through the repairing equipment.

As one embodiment of the conductive circuit repairing method provided by the present invention, in step S10, before moving the circuit to be repaired 011 to the defective camera 024:

leading the position data and the standard design data of the line to be repaired 011, which are obtained by using automatic optical detection equipment, into the repairing equipment;

the board 010 to be repaired is provided with a plurality of marking points 012, and the defect camera 024 captures each marking point 012 in sequence according to standard design data, generates marking point coordinate parameters, and locates line defects according to the marking point coordinate parameters.

Specifically, the position data of the line to be repaired 011 includes coordinates of the line to be repaired 011, which can mark the substantial position of the line to be repaired 011. The standard design data is the initial design data of the circuit board, and because the circuit board generates errors in the manufacturing process, the manufactured circuit has position deviation, length and width deviation and the like compared with the standard design data. The standard design data includes the relative position of the circuit and the plate, the width of the circuit, the routing path of the circuit and the like.

The repairing equipment is internally provided with a database system, and the position data and the standard design data of the line 011 to be repaired can be imported into the database system to prepare for positioning the line 011 to be repaired.

Alternatively, the number of the marking points 012 is at least three, and they are not on the same straight line, so that they can be used for marking and positioning. The mark point coordinate parameters include coordinates and shape information of the plurality of mark points 012. The standard design data also includes position and shape information of the standard marking points 012. The mark points 012 on the board to be repaired 010 are captured according to the mark point information in the standard design data to obtain mark point coordinate parameters, and then the mark point coordinate parameters are matched with the mark point information in the standard design data, so that the circuit of the board to be repaired 010 is matched with the standard design circuit, and thus the circuit coordinates on the board to be repaired 010 can be positioned and the circuit coordinate information can be uploaded to a database of the repairing equipment. At this time, the database has the line coordinate information and the defect position data, and the position of the line to be repaired 011 can be positioned by combining the line coordinate information and the defect position data, and the line to be repaired 011 is moved to the position of the defect camera 024. In addition, the manufacturing accuracy of the circuit on the board to be repaired 010 can be determined by matching the coordinate parameters of the mark points with the information of the mark points in the standard design data, and if errors such as amplification, reduction and the like exist, differential compensation can be performed on the position coordinates of the circuit on the board to be repaired 010. For example, if the size of the mark point on the board to be repaired 010 is 1.01 times of the size of the standard design mark point, the line to be repaired has an amplification error, and the line position information on the board to be repaired 010 needs to be reduced by 1.01 times as a whole, thereby improving the repair accuracy.

As one embodiment of the method for repairing the conductive circuit provided by the present invention, the repairing apparatus includes a position limiting plate 021 for positioning one corner of the board to be repaired 010, and other three corners of the board to be repaired 010 are provided with mark points 012. The arrangement of the corner limiting plate 021 is convenient for limiting the plate to be repaired 010. The corner limiting plate 021 may be L-shaped, and has a limiting effect on both sides of the board to be repaired 010. The mark points 012 of the other three corners are far away from the corner limiting plate 021, so that the four corners can be positioned, and the positioning accuracy is improved.

In step S30, the motion parameters of the paste ejection head 028 include a motion trajectory and a motion speed of the paste ejection head 028, and the paste ejection parameters of the paste ejection head 028 include a paste ejection amount per unit time. More specifically, a line graph to be repaired can be obtained according to the starting point coordinate, the end point coordinate and the routing path of the line 011 to be repaired, and then the moving path of the glue squeezing head 028 is selected by calling parameters in the database; according to the width and height change data of the line 011 to be repaired, the movement speed of the glue squeezing head 028 and the glue squeezing amount in unit time are selected by combining parameters in a database, and the thickness and the width of the repaired line are controlled. The glue extruding amount can be controlled by a glue valve. And (4) extruding the glue to obtain the conductive paste. The glue dispensing head 028 can move in X, Y, Z three directions.

As one embodiment of the method for repairing a conductive circuit according to the present invention, after the paste is extruded or during the paste extrusion process, the conductive paste is cured by using the heating head 025. Optionally, the conductive paste is cured by a hot air heating head or an infrared radiation heating head, the hot air heating head or the infrared radiation heating head is fixedly connected with the glue squeezing head 028, glue squeezing and curing are performed simultaneously, and the fixing mode can reduce the flowability of the conductive paste and prevent the paste from flowing to a non-circuit area. Optionally, after the glue extruding is finished, the conductive paste is cured by using a hot air heating head or an infrared radiation heating head, and the heating path is the same as the glue extruding path. Optionally, the circuit board after glue filling is placed into a heating furnace for heating and curing. The curing temperature is between 100 ℃ and 100 ℃.

As one embodiment of the conductive line repairing method provided by the present invention, after step S40, the laser engraving head 027 removes the excess conductive paste according to the start point coordinates and the end point coordinates of the line to be repaired 011, and the width and path of the line to be repaired 011. For example, the line to be repaired 011 is a strip with a length of 3mm and a width of 20 μm, and the engraved areas of the finishing engraving head are two strips with a length of 3mm and a width of 2 μm, which are distributed on both sides of the strip with a width of 20 μm. Optionally, after the removal of the excess slurry is completed, the circuit board is cleaned and dried to prevent the engraved slurry from adhering to the circuit board.

Referring to fig. 2, the present invention further provides a circuit repairing apparatus, which is used in the conductive circuit repairing method in any of the above embodiments, the circuit repairing apparatus further includes a housing 022, a worktable for placing a board to be repaired, a defect camera 024, a glue extrusion head 028, a laser 026, a first moving module 020, and a second moving module 023, wherein the defect camera 024 and the laser 026 are both fixed to the housing 022, the worktable is fixed to the first moving module 020, and the glue extrusion head 028 is fixed to the second moving module 023. The workstation can be moved by the drive of first removal module 020, can drive and treat that the benefit circuit 011 removes to defect camera 024, still can drive and treat that the benefit circuit 011 removes to crowded head 028 of gluing, and the second removes the module 023 and can drive crowded head 028 of gluing and remove in the small distance, makes crowded head 028 of gluing and the relative position of treating the benefit circuit 011 more accurate. Optionally, the corner limiting plate 021 is fixed on the workbench, and is used for positioning the board 010 to be repaired. The defect camera 024 is used for shooting a picture of the line 011 to be repaired, and the field range is more than 10mm x 10 mm. The laser 026 is used to detect changes in the height of the line to be repaired 011. First removal module 020 and second remove module 023 are the triaxial and remove the module, and the precision that the second removed the module 023 is higher, realizes the mobility control of the below 10 mu m precision.

The circuit repairing equipment provided by the invention is used in the conductive circuit repairing method, can position and repair the circuit 011 to be repaired, reduces the rejection rate of the circuit board and reduces the production cost.

As a specific implementation manner of the line repairing apparatus provided by the present invention, the second moving module 023 is further fixed with a monitoring camera 029 for monitoring the surface of the board 010 to be repaired. The shooting precision of the monitoring camera 029 is higher, and the field range of the monitoring camera is more than 1mm x 1 mm. The monitoring camera 029 can move along with the squeezing glue head 028, so that the change of the slurry on the surface of the plate can be monitored in real time.

As an embodiment of the line repairing apparatus provided by the present invention, a heating head 025 for curing conductive paste is further fixed to the housing 022, and the conductive paste can be cured after the paste is extruded. Heating tip 025 can be a hot air heating tip or an infrared radiation heating tip. In another embodiment, the second moving module 023 is further fixed with a heating head 025 for curing the conductive paste, which can be primarily cured during the paste extruding process.

Optionally, a laser engraving head 027 is further fixed to the second movable module 023 for removing the excess conductive paste.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.