阅读说明：本技术 一种充电桩用pcb板的制作方法 (Manufacturing method of PCB for charging pile ) 是由 陈涛 何艳球 张亚锋 蒋华 叶锦群 张永谋 张宏 于 2019-09-19 设计创作，主要内容包括：一种充电桩用PCB板的制作方法,包括以下步骤：S1：前期处理；S2：沉铜；S3：贴蓝胶：在PCB板上预设镀金区域和非镀金区域,预设的镀金区域上设有要进行镀金的待镀金焊盘,在非镀金区域上贴上蓝胶,镀金区域裸露出铜层；S4：微蚀(一)、撕蓝胶：将镀金区域的铜层微蚀掉,撕掉非镀金区域上的蓝胶；S5：印刷油墨：将预设的镀金区域用油墨覆盖,然后进行烘烤；曝光和显影后露出待镀金焊盘；S6：选干化膜、镀金：将干膜覆盖PCB板的双面,并曝光显影出待镀金焊盘,对待镀金焊盘进行镀镍后进行镀金；S7：退膜、退墨；S8：微蚀(二)；S9：后期处理。本方法不会出现渗金、线路渗蚀的情况,确保产品的品质,同时提高了生产效率,制备得到的PCB板能够承受较大电流。(A manufacturing method of a PCB for a charging pile comprises the following steps: s1: performing pretreatment; s2: copper deposition; s3: pasting blue glue: presetting a gold-plating area and a non-gold-plating area on a PCB, wherein the preset gold-plating area is provided with a pad to be plated with gold to be plated, the non-gold-plating area is pasted with blue glue, and the gold-plating area exposes a copper layer; s4: microetching and tearing blue glue: slightly etching the copper layer of the gold-plated area, and tearing off blue glue on the non-gold-plated area; s5: printing ink: covering a preset gold-plating area with ink, and then baking; exposing the bonding pad to be plated with gold after exposure and development; s6: selecting a drying film and gold plating: covering the dry film on the two sides of the PCB, exposing and developing to obtain a pad to be plated with gold, and plating the pad to be plated with gold after nickel plating; s7: removing the film and ink; s8: microetching; s9: and (5) post-processing. The method has the advantages that the conditions of gold infiltration and circuit infiltration corrosion are avoided, the quality of products is ensured, the production efficiency is improved, and the prepared PCB can bear larger current.)

1. A manufacturing method of a PCB for a charging pile is characterized by comprising the following steps: the method comprises the following steps:

s1: pre-treatment: preparing a PCB with outer layer circuit patterns on two sides;

s2: copper deposition: depositing copper on the whole PCB, and forming a copper layer on the surface of the PCB;

s3: pasting blue glue: presetting a gold-plating area and a non-gold-plating area on a PCB, wherein the preset gold-plating area is provided with a pad to be plated with gold to be plated, the non-gold-plating area is pasted with blue gel, the blue gel is tightly pasted with the non-gold-plating area, and a copper layer is exposed in the gold-plating area;

s4: microetching and tearing blue glue: slightly etching off the copper layer in the gold-plated area, reserving the copper layer in the non-gold-plated area due to the protection of blue gel, and tearing off the blue gel on the non-gold-plated area;

s5: printing ink: covering a preset gold-plating area with ink, and then baking; exposing the bonding pad to be plated with gold after exposure and development;

s6: selecting a drying film and gold plating: covering the two sides of the PCB with the dry film for electroplating resistance, exposing and developing to obtain a pad to be plated with gold, plating the pad to be plated with gold after nickel plating, and forming a gold-plated pad;

s7: removing the film and ink: removing the film and ink after gold plating;

s8: microetching, namely microetching the preset non-gold-plated area by adopting etching solution;

s9: and (5) post-processing.

2. The manufacturing method of the PCB for the charging pile according to claim 1, wherein the manufacturing method comprises the following steps: the pretreatment sequentially comprises the following steps: cutting, drilling, electroplating, and manufacturing an outer layer circuit pattern and AOI.

3. The manufacturing method of the PCB for the charging pile according to claim 1, wherein the manufacturing method comprises the following steps: the post-processing comprises the following steps in sequence: solder mask, text, form, test, FQC and packaging.

4. The method for manufacturing the PCB for the charging pile according to claim 1, wherein the copper deposition controls the thickness of copper to be 0.4 um ~ 1 um.

5. The method for manufacturing the PCB for the charging post according to claim 1, wherein the baking temperature in the step S5 is 70 ~ 85 ℃ and the baking time is 10 ~ 20 minutes.

6. The manufacturing method of the PCB for the charging pile according to claim 1, wherein the manufacturing method comprises the following steps: in the step S6, the thickness of nickel plating is more than 100u 'and the thickness of gold plating is more than 10 u'.

7. The manufacturing method of the PCB for the charging pile according to claim 1, wherein the manufacturing method comprises the following steps: in the step S8, ammonia water is used for microetching.

Technical Field

The invention relates to the field of PCBs (printed circuit boards), in particular to a manufacturing method of a PCB for a charging pile.

Background

Under the background of vigorous popularization and application of new energy vehicles in China, China has become a huge market for explosive growth of new energy vehicles all over the world, and due to promotion of new technologies such as big data, the Internet of things and the like, a charging pile or a charging station is not only a basic configuration of the new energy vehicles, but also becomes an important intelligent connection and contact of people, vehicles and services. Therefore, use intelligent charging stake as the tongs, based on big data and thing networking, the facility construction that charges has obtained the rapid development, and the stake demand of charging continuously increases.

The charging pile mainly comprises a pile body, a functional unit, a charging control unit, a charging controller, a metering module, a charging interface and a human-computer interaction interface. Charging piles are mainly divided into alternating current charging piles and direct current charging piles, the alternating current charging piles generally have power of about several kilowatts and are suitable for slow charging, RS485 or RS232 interfaces are generally arranged, charging data are uploaded to a cloud terminal through a DTU, and a charging mode is calculated through cloud terminal application; the power of the direct current charging pile is generally tens of kilowatts, the quick charging service is provided, and the direct current charging pile is mainly applied to quick charging occasions such as various charging stations and highways.

Consequently, fill the PCB requirement in the electric pile and bear the high current to the contact wearability is good, generally adopts thick copper and the technology of local pad gilt, but because of the copper is thick, conventional pull-in lead wire method, the dry film can't laminate with the face completely, and the dry film can't fill the space of copper face and substrate completely during dry film press mold, has following problem: (1) during gold plating, the liquid medicine can permeate into the gaps, so that gold is permeated; (2) when the lead is etched, the etching solution can infiltrate into the joint of the circuit and the bonding pad, so that the circuit is corroded.

Disclosure of Invention

In order to overcome the technical problems, the invention provides a manufacturing method of a PCB for a charging pile, which does not need to draw a lead in and can avoid the problems of gold infiltration and corrosion.

A manufacturing method of a PCB for a charging pile comprises the following steps:

s1: pre-treatment: preparing a PCB with outer layer circuit patterns on two sides;

s2: copper deposition: depositing copper on the whole PCB, and forming a copper layer on the surface of the PCB;

s3: pasting blue glue: presetting a gold-plating area and a non-gold-plating area on a PCB, wherein the preset gold-plating area is provided with a pad to be plated with gold to be plated, the non-gold-plating area is pasted with blue gel, the blue gel is tightly pasted with the non-gold-plating area, and a copper layer is exposed in the gold-plating area;

s4: microetching and tearing blue glue: slightly etching off the copper layer in the gold-plated area, reserving the copper layer in the non-gold-plated area due to the protection of blue gel, and tearing off the blue gel on the non-gold-plated area;

s5: printing ink: covering a preset gold-plating area with ink, and then baking; exposing the bonding pad to be plated with gold after exposure and development;

s6: selecting a drying film and gold plating: covering the two sides of the PCB with the dry film for electroplating resistance, exposing and developing to obtain a pad to be plated with gold, plating the pad to be plated with gold after nickel plating, and forming a gold-plated pad;

s7: removing the film and ink: removing the film and ink after gold plating;

s8: and (II) microetching, namely microetching the preset non-gold-plated area by using etching solution.

S9: and (5) post-processing.

Further, the pretreatment sequentially comprises the following steps: cutting, drilling, electroplating, and manufacturing an outer layer circuit pattern and AOI.

Further, the post-processing sequentially comprises the following steps: solder mask, text, form, test, FQC and packaging.

Further, the copper deposition controls the copper thickness to be 0.4 um ~ 1 um.

Further, the baking temperature in the step S5 is 70 ~ 85 degrees celsius, and the baking time is 10 ~ 20 minutes.

Further, in the step S6, the nickel plating thickness is 100u ″ or more, and the gold plating thickness is 10 u' or more.

Further, in the step S8, ammonia water is used for microetching.

The manufacturing method of the PCB for the charging pile provided by the invention has the advantages that the situations of metal infiltration and circuit infiltration corrosion can be avoided, the quality of a product is ensured, the conventional processes of etching a lead and etching a dry film of the lead are saved, and the production efficiency is improved; the prepared PCB has thick copper with the thickness of at least 6OZ, the gold-plating thickness of the bonding pad is normal, and the PCB can bear larger current; the PCB board manufactured by the method can be produced in batch.

Detailed Description

The technical solution of the present invention will be further described in detail with reference to the following examples.

A manufacturing method of a PCB for a charging pile comprises the following steps:

s1: pre-treatment: preparing a PCB with outer layer circuit patterns on two sides; the pretreatment sequentially comprises the following steps:

s11: cutting; in the embodiment, a substrate with a thickness of at least 6OZ copper is adopted for cutting;

s12: drilling and electroplating, wherein the PTH hole is formed by drilling;

s13: manufacturing an outer layer circuit pattern and AOI, and manufacturing a PCB with the outer layer circuit pattern on both sides through exposure and development;

s2, copper deposition, namely, copper deposition is carried out on the whole board, a copper layer is formed on the surface of the PCB, the copper deposition controls the copper thickness to be 0.4 um ~ 1 um, if the copper thickness is too thick, the subsequent micro-etching is difficult, if the copper thickness is too thin, the PCB is easy to scratch, the conductivity is influenced, and therefore, the copper thickness needs to be controlled;

s3: pasting blue glue: the method comprises the steps that a gold-plating area and a non-gold-plating area are preset on a PCB, a pad to be plated with gold is arranged on the preset gold-plating area, blue gel is pasted on the preset non-gold-plating area, the blue gel is tightly attached to the non-gold-plating area, and a copper layer is exposed out of the preset gold-plating area;

s4: microetching and tearing blue glue: slightly etching a copper layer formed by copper deposition on the gold-plated area, reserving the copper layer in the non-gold-plated area due to the protection of blue gel, and electrically conducting the gold-plated area with the copper layer formed by copper deposition through a PTH hole during subsequent gold plating to obtain current gold plating; tearing off the blue glue on the non-gold-plated area;

s5, printing ink, namely selecting the ink as anti-gold-plating ink, covering a gold-plating area with the ink, baking at the baking temperature of 70 ~ 85 ℃ for 10 ~ 20 minutes, and printing the ink by adopting dot blocking screen printing, exposing and developing after baking to expose a pad to be plated with gold, wherein the ink covering area is ensured to be more than 5mm larger than one side of the pad to be plated with gold, and the window at the exposure pad is more than 3mil larger than one side of the pad to be plated with gold;

s6: selecting a drying film and gold plating: covering the two sides of the PCB with the electroplating-resistant selective dry film, exposing and developing to obtain a pad to be plated with gold and a gold-plated conductive clamping plate position, plating nickel on the pad to be plated with gold, and then plating gold to form a gold-plated pad; wherein the thickness of nickel plating is more than 100u ', the thickness of gold plating is more than 10 u', the width of the position of the clamping plate is more than 8mm, and the gold plating is carried out within 12 hours of the selection of the dry film so as to avoid the quality change of the dry film.

S7: removing the film and ink: removing the film and ink after gold plating to avoid incomplete ink removal, and finishing the film removal and the ink removal within 6 hours after gold plating;

s8: and (II) microetching, namely microetching the preset non-gold-plated area by adopting ammonia water, and etching away the copper formed by copper deposition.

S9: post-processing; the post-processing comprises the following steps in sequence: solder mask, text, form, test, FQC and packaging.

The invention discloses a manufacturing method of a PCB (printed circuit board) for a charging pile, which comprises the steps of firstly manufacturing a circuit pattern, then realizing copper deposition of a non-gold-plated area by pasting blue glue, enabling all patterns of the non-gold-plated area to form a conductor, conducting PTH (plated through hole) holes on the gold-plated area with the non-gold-plated area, and obtaining current to realize gold plating; meanwhile, the mode of printing ink and covering a dry film before gold plating is adopted, so that gold leakage during gold plating can be prevented, dry film sealing can be realized, and the via hole of a non-gold-plated area can be prevented from being plated with gold. The invention can not cause the situations of gold infiltration and circuit infiltration corrosion, ensures the quality of products, saves the conventional processes of etching the lead and etching the dry film of the lead and improves the production efficiency; the prepared PCB can have thick copper with the thickness of at least 6OZ, the gold-plating thickness of the bonding pad is normal, and the PCB can bear larger current; the PCB board manufactured by the method can be produced in batch.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.