阅读说明：本技术 背板、使用其的溅射靶材及其使用方法 (Backing plate, sputtering target material using backing plate and using method of sputtering target material ) 是由 杨清河 吴智稳 翁基祥 苏梦鹏 于 2019-03-12 设计创作，主要内容包括：背板、使用其的溅射靶材及其使用方法。背板包括第一板体、第二板体与固定件。固定件可拆地连接第一板体及第二板体。本发明第一板体、第二板体与流体管路的组装方法简单、快速。相较于采用焊接工艺(bonding)的组装方式,本发明使用锁固方法可降低组装时间及制造成本,提升生产效率。(A backing plate, a sputtering target using the same and a using method thereof. The back plate comprises a first plate body, a second plate body and a fixing piece. The fixing piece is detachably connected with the first plate body and the second plate body. The method for assembling the first plate body, the second plate body and the fluid pipeline is simple and rapid. Compared with the assembly mode adopting a welding process (bonding), the locking method can reduce the assembly time and the manufacturing cost and improve the production efficiency.)

1. A backing sheet, comprising:

a first plate body;

a second plate body; and

and the fixing pieces are used for detachably connecting the first plate body and the second plate body.

2. The backboard according to claim 1, wherein the first board and the second board together define a receiving space, and a fluid pipeline is disposed in the receiving space, wherein the first board and the second board satisfy at least one structural characteristic selected from the following (1) to (6):

(1) at least one of the first plate body and the second plate body is provided with a groove, and the accommodating space is defined by the groove;

(2) the height of the first plate body accounts for 75% -87.5% of the height of the back plate;

(3) the height of the second plate body accounts for 12.5% -25% of the height of the back plate;

(4) the first plate body is provided with at least one pipeline through hole which is communicated with the accommodating space;

(5) the first plate body and the second plate body both comprise an inner plate wall and an outer plate wall which are opposite, and the fixing piece is arranged between the outer plate wall and the inner plate wall of the first plate body and between the outer plate wall and the inner plate wall of the second plate body which are correspondingly overlapped with the fixing piece respectively;

(6) the first plate body and the second plate body form a thread side face with a corresponding screw, and the fixing piece is respectively connected with the thread side faces of the first plate body and the second plate body so as to lock and fix the first plate body and the second plate body.

3. The backing sheet of claim 1 wherein the fixing member satisfies at least one structural feature selected from the following (1) to (7):

(1) the torsion value of the fixing piece on the first plate body and the second plate body is 25 KgF-cm-35 KgF-cm;

(2) the total number of the fixing pieces is between 3 and 150;

(3) the unit density of the fixing parts distributed on the first plate body or the second plate body is 0.000526-0.026/cm²；

(4) The total surface area of the fixing pieces respectively accounts for 1% -50% of the area of a first plate body surface or a second plate body surface of the back plate, and the first plate body surface and the second plate body surface are opposite to each other;

(5) the distance between the plurality of fixing pieces is 2-10 cm;

(6) the fixing member includes a screw, a plug, or an adhesive;

(7) the fixing piece does not overlap an accommodating space defined by the first plate body and the second plate body together.

4. A sputtering target, comprising:

a backsheet as set forth in any one of claims 1 to 3; and

a sputtering plate disposed on the back plate.

5. The sputtering target according to claim 4, wherein the backing plate or the sputtering plate satisfies at least one structural feature selected from the following (1) to (6):

(1) the material of the sputtering plate is metal or oxide;

(2) the back plate is made of metal;

(3) the fixing piece is arranged below the sputtering plate;

(4) the outermost periphery of the back plate comprises at least one cavity fixing hole;

(5) the sputtering plate is arranged on the first plate body or the second plate body;

(6) the back plate further comprises a magnetic substance arranged in the accommodating space defined by the first plate body and the second plate body.

6. The sputtering target according to claim 5, wherein the first plate body and the second plate body are made of a metal such as aluminum, titanium or copper; or the material of the sputtering plate is aluminum, titanium, copper or indium tin oxide.

7. A method of using a sputtering target, the method comprising:

providing a backing sheet according to any one of claims 1 to 3;

the first plate body and the second plate body are connected through the fixing piece; and

a sputtering plate is disposed on the backing plate.

8. The method of using a sputter target according to claim 7, wherein providing the backing plate of claim 2, the method of using the fixture to connect the first plate body and the second plate body comprises: a plurality of fixing pieces are correspondingly locked into the outer plate wall of the second plate body from the surface of a first plate body of the back plate through the outer plate wall of the first plate body and correspondingly locked into the inner plate wall of the second plate body from the surface of the first plate body through the inner plate wall of the first plate body; or a plurality of fixing pieces penetrate through the outer plate wall of the second plate body from the surface of a second plate body of the back plate opposite to the surface of the first plate body and are correspondingly locked into the outer plate wall of the first plate body, penetrate through the inner plate wall of the second plate body from the surface of the second plate body and are correspondingly locked into the inner plate wall of the first plate body, and the fixing pieces are respectively connected with the thread side surfaces of the first plate body and the second plate body so as to lock and fix the first plate body and the second plate body.

9. The method of claim 7, further comprising disposing the fluid conduit or a magnetic material in the receiving space, or disposing the sputtering plate on a first plate surface or a second plate surface of the backing plate, the first plate surface and the second plate surface being opposite to each other.

10. The method of claim 9, further comprising detaching the securing member of the backing plate to separate the first plate body and the second plate body from each other and removing the fluid line from the receiving space.

Technical Field

The invention relates to a back plate, a sputtering target using the same and a using method thereof.

Background

Currently, sputtering is one of the main deposition methods. The sputtering technique generally forms plasma in a sputtering chamber, the plasma (plasma) performs ion bombardment (ion bombardment) on a metal target to collide metal atoms of the target, so as to form gas molecules which are emitted onto a substrate to be deposited, and the gas molecules are subjected to sputtering actions such as adhesion, adsorption, surface migration, nucleation and the like, so as to finally form a metal film with the metal atoms on the substrate. Sputtering technology is widely used in the fields of industrial production and scientific research. However, sputtering targets typically use a soldering process (bonding), and therefore are time consuming to assemble, expensive, and less flexible to use.

Disclosure of Invention

The invention relates to a back plate, a sputtering target using the same and a using method thereof.

According to an aspect of the present invention, a back plate is provided, which includes a first plate, a second plate and a fixing member. The fixing piece is used for detachably connecting the first plate body and the second plate body.

In one embodiment, the first board and the second board together define a receiving space, and a fluid pipeline is disposed in the receiving space, wherein the first board and the second board satisfy at least one structural characteristic selected from the following (1) to (6):

(1) at least one of the first plate body and the second plate body is provided with a groove, and the accommodating space is defined by the groove;

(2) the height of the first plate body accounts for 75% -87.5% of the height of the back plate;

(3) the height of the second plate body accounts for 12.5% -25% of the height of the back plate;

(4) the first plate body is provided with at least one pipeline through hole which is communicated with the accommodating space;

(5) the first plate body and the second plate body both comprise an inner plate wall and an outer plate wall which are opposite, and the fixing piece is arranged between the outer plate wall and the inner plate wall of the first plate body and between the outer plate wall and the inner plate wall of the second plate body which are correspondingly overlapped with the fixing piece respectively;

(6) the first plate body and the second plate body form a thread side face with a corresponding screw, and the fixing piece is respectively connected with the thread side faces of the first plate body and the second plate body so as to lock and fix the first plate body and the second plate body.

In one embodiment, the fixing member satisfies at least one structural feature selected from the following (1) to (7):

(1) the torsion value of the fixing piece on the first plate body and the second plate body is 25 KgF-cm-35 KgF-cm;

(2) the total number of the fixing pieces is between 3 and 150;

(3) the unit density of the fixing parts distributed on the first plate body or the second plate body is 0.000526-0.026/cm²；

(4) The total surface area of the fixing pieces respectively accounts for 1% -50% of the area of a first plate body surface or a second plate body surface of the back plate, and the first plate body surface and the second plate body surface are opposite to each other;

(5) the distance between the plurality of fixing pieces is 2-10 cm;

(6) the fixing member includes a screw, a plug, or an adhesive;

(7) the fixing piece does not overlap an accommodating space defined by the first plate body and the second plate body together.

According to an aspect of the present invention, a sputtering target is provided, which includes the backing plate and the sputtering plate as described above, wherein the sputtering plate is disposed on the backing plate.

In one embodiment, the backing plate or the sputtering plate satisfies at least one structural feature selected from the following (1) to (6):

(1) the material of the sputtering plate is metal or oxide;

(2) the back plate is made of metal;

(3) the fixing piece is arranged below the sputtering plate;

(4) the outermost periphery of the back plate comprises at least one cavity fixing hole;

(5) the sputtering plate is arranged on the first plate body or the second plate body;

(6) the back plate further comprises a magnetic substance arranged in the accommodating space defined by the first plate body and the second plate body.

In one embodiment, the first board and the second board are made of aluminum, titanium or copper; or the material of the sputtering plate is aluminum, titanium, copper or indium tin oxide.

According to another aspect of the present invention, there is provided a method of using a sputtering target, comprising: a backing sheet as described above is provided. The first plate body and the second plate body are connected through the fixing piece. A sputtering plate is disposed on the backing plate.

In an embodiment, a method for using the fixing member to connect the first board and the second board includes: a plurality of fixing pieces are correspondingly locked into the outer plate wall of the second plate body from the surface of a first plate body of the back plate through the outer plate wall of the first plate body and correspondingly locked into the inner plate wall of the second plate body from the surface of the first plate body through the inner plate wall of the first plate body; or a plurality of fixing pieces penetrate through the outer plate wall of the second plate body from the surface of a second plate body of the back plate opposite to the surface of the first plate body and are correspondingly locked into the outer plate wall of the first plate body, penetrate through the inner plate wall of the second plate body from the surface of the second plate body and are correspondingly locked into the inner plate wall of the first plate body, and the fixing pieces are respectively connected with the thread side surfaces of the first plate body and the second plate body so as to lock and fix the first plate body and the second plate body.

In an embodiment, the backing plate is provided, and the using method further includes disposing the fluid pipeline or a magnetic substance in the accommodating space, or disposing the sputtering plate on a first plate surface or a second plate surface of the backing plate, where the first plate surface and the second plate surface are opposite to each other.

In an embodiment, the method further includes detaching the fixing member of the back plate to separate the first plate and the second plate from each other, and moving the fluid pipeline out of the accommodating space.

The invention has the beneficial effects that:

the method for assembling the first plate body, the second plate body and the fluid pipeline is simple and rapid. Compared with the assembly mode adopting a welding process (bonding), the locking method can reduce the assembly time and the manufacturing cost and improve the production efficiency.

Drawings

Fig. 1A to 1E illustrate a method of using a sputtering target according to the concept of the first embodiment.

Fig. 2A to 2D illustrate a method of using a sputtering target according to a second embodiment of the concept.

Fig. 3 illustrates a sputtering target according to the concept of the third embodiment.

Wherein, the reference numbers:

102. 202, 302: first plate body

102A, 202A, 106A, 206A: groove

102B: board base

102W1, 106W1, 302W1, 306W 1: outer panel wall

102W2, 106W2, 302W2, 306W 2: inner panel wall

103: pipeline through hole

104: fluid pipeline

106. 206, 306: second plate body

108. 208, 308: back plate

108A: chamber fixed hole

110. 310: surface of the first plate body

112. 312: surface of the second plate body

114. 214: containing space

116: fixing piece

118: sputtering plate

118S: sputtering surface

120. 220, 320: sputtering target material

102C, 106C, 302C, 306C: fixing hole

H. H1, H2: height

L, L1: length of

W: width of

Detailed Description

Some examples are described below. It should be noted that the present invention is not intended to show all possible embodiments, and other embodiments not suggested by the present invention may also be applicable. Moreover, the dimensional ratios in the drawings are not to scale with actual products. Accordingly, the description and drawings are only for the purpose of illustrating embodiments and are not to be construed as limiting the scope of the invention. Moreover, the descriptions of embodiments, such as specific structures, process steps, and material applications, are provided for illustrative purposes only and are not intended to limit the scope of the present disclosure. The steps and structural details of the embodiments may be changed and modified according to actual application process requirements without departing from the spirit and scope of the present invention. The following description will be given with the same/similar reference numerals as used for the same/similar elements.

Fig. 1A to 1E illustrate a method of using a sputtering target according to the concept of the first embodiment.

Referring to fig. 1A, a first board 102 is provided. The first plate body 102 includes a plate base 102B, an outer plate wall 102W1, and an inner plate wall 102W 2. The outer panel wall 102W1 is a closed frame-shaped wall portion that protrudes from four side edges of the panel base 102B. The inner panel wall 102W2 is a strip-shaped wall portion that protrudes from the panel base 102B and connects from the inner surface of the outer panel wall 102W 1. The first plate 102 has a channel 102A defined by a plate base 102B, an outer plate wall 102W1, and an inner plate wall 102W 2. In this embodiment, the outer panel wall 102W1 and the inner panel wall 102W2 are provided with a plurality of fastening holes 102C. The plate base 102B is provided with a line through hole 103. The line through holes 103 communicate the trenches 102A with the external environment, respectively.

Referring to fig. 1B, the fluid line 104 is disposed in the groove 102A of the first plate 102. Two opposite ends of the fluid pipeline 104 respectively pass through the two pipeline through holes 103 and extend to the outside, that is, the two pipeline through holes 103 on the plate substrate 102B can be respectively used as a liquid outlet and a liquid inlet of the fluid pipeline 104.

Referring to fig. 1C, a second board 106 is provided. The second plate body 106 has a groove 106A. The fluid line 104 is sandwiched between the first plate 102 and the second plate 106, and the fluid line 104 is disposed in the groove 102A and the groove 106A, thereby forming the back plate 108.

In one embodiment, the length L of the back plate 108 is about 2500-; the width W of the back plate 108 is about 100 mm to 300mm, such as 190 mm. The height H1 of the first panel 102 may be approximately 75% to 87.5%, such as 80%, of the height H of the back panel 108. The height H2 of the second panel 106 is approximately 12.5% to 25%, for example 20%, of the height H of the back panel 108. In one embodiment, the height H of the back plate 108 is about 16mm, the height H2 of the second plate 106 is about 2mm to about 4mm, such as about 3.2mm, and the height H1 of the first plate 102 is about 12 mm to about 14mm, such as about 12.8 mm. The back plate 108 has a first plate surface 110 and a second plate surface 112 opposite to each other, and the first plate surface 110 and the second plate surface 112 are respectively located on opposite sides of the back plate 108.

The groove 102A of the first board 102 and the groove 106A of the second board 106 define a receiving space 114 of the back plate 108. In this embodiment, the profiles are serpentine and are arranged in 2 rows. The shape, contour and size of the receiving space 114 formed by the groove 102A of the first plate 102 and the groove 106A of the second plate 106 can be matched with the fluid pipeline 104, and the receiving space 114 has a U-shaped contour, so that the fluid pipeline 104 can be clamped in the receiving space 114.

In one embodiment, a magnetic material (not shown) may be selectively disposed in the back plate 108, and the magnetic material is disposed in the accommodating space 114 to control a magnetic line type of the sputtering plate 118 (shown in fig. 1D) disposed later.

Referring to fig. 1C to 1D, a plurality of fasteners 116 may be used to detachably fix the first board 102 and the second board 106. The second plate 106 also has an outer plate wall 106W1 and an inner plate wall 106W2 corresponding to the outer plate wall 102W1 and the inner plate wall 102W2 of the first plate 102, respectively, the outer plate wall 106W1 and the inner plate wall 106W2 of the second plate 106 have a plurality of fixing holes 106C corresponding to the plurality of fixing holes 102C of the first plate 102, and the plurality of fixing holes 106C penetrate the outer plate wall 106W1 and the inner plate wall 106W2 of the second plate 106, respectively. The fasteners 116 are respectively disposed in the fastening holes 102C, 106C of the first board 102 and the second board 106, and are locked in the portion of the back plate 108 not overlapping the receiving space 114, for example, between the outer panel wall 102W1 and the inner panel wall 102W2 of the first board 102, and the outer panel wall 106W1 and the inner panel wall 106W2 of the second board 106 overlapping with the outer panel wall and the inner panel wall 102W2, respectively. In this embodiment, the fasteners 116 penetrate from the second panel surface 112 through the outer panel wall 106W1 and the inner panel wall 106W2 of the second panel 106 and into the outer panel wall 102W1 and the inner panel wall 102W2 of the first panel 102, respectively, that is, some of the fasteners 116 penetrate from the outer panel wall 106W1 of the second panel 106 into the outer panel wall 102W1 of the first panel 102, other fasteners 116 penetrate from the inner panel wall 106W2 of the second panel 106 into the inner panel wall 102W2 of the first panel 102, and the fasteners 116 are locked from the fastening holes 106C of the second panel 106 into the fastening holes 102C of the first panel 102, respectively. The fixing member 116 may include a screw, a plug, or an adhesive, such as a metal adhesive, a soft solder, etc., wherein the material of the screw or the plug may be stainless steel or iron.

In one embodiment, the screw-threaded side surfaces of the screws are formed in the plurality of fixing holes 102C, 106C of the first plate 102 and the second plate 106 by drilling, and the screws can be screwed into the screw holes by using a screwdriver, i.e., the fixing member 116 is correspondingly locked into the fixing holes 106C of the second plate 106 and the fixing holes 102C of the first plate 102 from the second plate surface 112 by using a screw mechanism, so that the fixing member 116 is connected to the screw-threaded side surfaces of the second plate 106 and the first plate 102, respectively, to detachably fix the second plate 106 and the first plate 102. The back plate 108 is formed by the above-mentioned locking method, and the plurality of fasteners 116 generate a torque of about 25KgF-cm to 35KgF-cm, for example, 29.4KgF-cm, to the first plate 102 and the second plate 106. The fasteners 116 are disposed to avoid the fluid pipeline 104, for example, the fasteners 116 are disposed between the outer panel wall 106W1 and the inner panel wall 106W2 of the second panel 106 and the outer panel wall 102W1 and the inner panel wall 102W2 of the first panel 102 to connect the second panel 106 and the first panel 102, and the fastening holes 102C and 106C are disposed at positions where the fasteners 116 are located at the outer side of the receiving space 114 of the back panel 108, so that the fasteners 116 do not overlap the receiving space 114, thereby preventing the heat dissipation of the back panel 108 from being affected and achieving a uniform cooling effect of the fluid pipeline 104.

In one embodiment, the total number of the fixing members 116 is about 3 to 150, for example, 30. In one embodiment, the unit density of the plurality of fasteners 116 distributed on the first plate 102 or the second plate 106 is about 0.000526-0.026 fasteners/cm²E.g. 0.01 pieces/cm². In one embodiment, the total surface area of the plurality of fastening elements 116 is about 1% to about 50%, such as about 30%, of the area of the first board surface 110 or the second board surface 112. In one embodiment, the distance between the plurality of fixing elements 116 is about 2-10 cm, for example, 5 cm. First plate body102. The assembly method of the second plate 106 and the fluid line 104 is simple and fast. Compared with the assembly method adopting the welding process (bonding) in the prior art, the locking method can reduce the assembly time and the manufacturing cost and improve the production efficiency.

Referring to FIG. 1D, FIG. 1D is a cross-sectional view taken along an orientation similar to line AB of FIG. 1C. As shown in FIG. 1D, the sputtering plate 118 is disposed on the second plate surface 112 of the back plate 108, and the length L1 of the sputtering plate 118 is about 2150-3150mm, such as 2650mm, where the second plate surface 112 can be regarded as the upper surface of the back plate 108. In one embodiment, a plurality of fasteners 116 may be disposed below the sputtering plate 118. In one embodiment, the sputtering plate 118 is disposed on the first plate body surface 110 of the backing plate 108, and the first plate body surface 110 may be regarded as the upper surface of the backing plate 108.

In one embodiment, sputtering target 120 is assembled by securing sputtering plate 118 to second plate body surface 112 of backing plate 108 using fasteners (not shown). The interface (not shown) between the sputtering plate 118 and the backing plate 108 can include screws, plugs, or adhesives, such as metal adhesives, soft solders, and the like. The sputtering surface 118S of the sputtering plate 118 is the surface of the sputtering target 120 that faces the substrate to be deposited with a thin film when placed in the sputtering chamber. In one embodiment, the fluid line 104 may be filled with a liquid to provide cooling and heat dissipation to the sputtering target 120.

Referring to FIG. 1E, in one embodiment, the outermost periphery of the backing plate 108 may further include at least one chamber fastening hole 108A for subsequent fastening to a sputtering chamber (not shown).