阅读说明：本技术 一种图形电镀陪镀板可重复利用的图形电镀方法 (Pattern electroplating method capable of repeatedly utilizing plating accompanying plate ) 是由 徐文中 胡志杨 李江 涂波 于 2019-09-24 设计创作，主要内容包括：本发明涉及印制电路板技术领域,具体为一种图形电镀陪镀板可重复利用的图形电镀方法。本发明在使用VCP对生产板进行图形电镀处理时,使用制作了陪镀图形并在陪镀图形上电镀有镍金层作为蚀刻保护层的图形电镀陪镀板陪镀,在每一线次的生产板完成电镀处理时均使图形电镀陪镀板过一次碱性蚀刻线,通过蚀刻处理除去图形电镀处理过程中在图形电镀陪镀板表面形成的铜层,使图形电镀陪镀板恢复使用前的状态,从而可重新投入图形电镀处理中使用,实现图形电镀陪镀板的重复利用,完全避免了现有图形电镀陪镀板随使用次数增加导致外观变差及其变重变厚而导致图形电镀过程中图形电镀陪镀板掉落、夹具损坏、铜缸污染等问题,可降低生产成本及提高生产效率。(The invention relates to the technical field of printed circuit boards, in particular to a pattern electroplating method capable of repeatedly utilizing a pattern electroplating accompanying plate. When the VCP is used for carrying out the graph electroplating treatment on the production board, the graph electroplating accompany-plating board which is manufactured with accompany-plating graphs and is electroplated with the nickel layer as the etching protection layer on the accompany-plating graphs is used for accompany-plating, when the production plate of each line finishes the electroplating treatment, the pattern electroplating accompany plate passes through an alkaline etching line, removing the copper layer formed on the surface of the pattern plating accompanying plate in the pattern plating process through etching treatment to restore the state of the pattern plating accompanying plate before use, therefore, the electroplating plate can be used in the graph electroplating treatment again, the reuse of the graph electroplating plate is realized, the problems that the appearance of the existing graph electroplating plate is poor along with the increase of the using times, the appearance of the existing graph electroplating plate is changed to be heavy and the thickness of the existing graph electroplating plate is changed to be thick, the graph electroplating plate falls off in the graph electroplating process, a clamp is damaged, a copper cylinder is polluted and the like are completely avoided, the production cost can be reduced, and the production efficiency can be improved.)

1. A pattern electroplating method capable of reusing a pattern electroplating accompanying plate is characterized by comprising the following steps:

s1, cutting the double-sided copper-clad plate according to the size of the production plate to obtain a substrate;

sequentially carrying out film coating/film pasting, exposure, development and etching treatment on a substrate, and etching a plating accompanying pattern on the substrate, wherein the plating accompanying pattern is in an L shape, a square shape, a Chinese character 'ri' shape or a field shape and is formed by a copper layer;

s2, sequentially carrying out chemical nickel deposition, chemical gold deposition and electrogilding treatment on the substrate, and sequentially forming a nickel deposition layer, a gold deposition layer and an electrogilding layer on the plating accompanying graph of the substrate to obtain a graph plating accompanying board;

s3, carrying out pattern electroplating treatment on the production plates by using vertical continuous electroplating equipment, and respectively adding one pattern electroplating accompanying plate before the first production plate and one pattern electroplating accompanying plate after the last production plate;

the production board is a production board on which an electroplating pattern is manufactured after film pasting, exposure and development;

s4, making the pattern electroplating plate used in the pattern electroplating treatment of the previous step pass through an alkaline etching line, and performing etching treatment to remove a copper layer formed on the pattern electroplating plate in the pattern electroplating treatment process;

s5, using the pattern electroplating plate after the previous etching treatment to carry out the pattern electroplating treatment in the step S3;

s6, repeating the steps S4 and S5.

2. The pattern plating process of claim 1, wherein a nickel-plating layer having a thickness of 3 to 5 μm is deposited on the substrate by electroless nickel plating in step S2.

3. The pattern plating method for recycling a plating accompanying plate according to claim 2, wherein the electroless nickel plating treatment is carried out for a nickel plating time of 20-30min in step S2.

4. The pattern plating process of claim 2, wherein a gold immersion layer having a thickness of 0.05 to 0.07 μm is deposited on the nickel immersion layer of the substrate by a chemical gold immersion process in step S2.

5. The pattern plating method for recycling a plating accompanying plate according to claim 4, wherein in the step S2, the immersion gold time of the chemical immersion gold treatment is 10-15 min.

6. The pattern plating method for recycling of plating accompanied plate according to claim 4, wherein in step S2, a plating gold layer with a thickness of 0.20-0.30 μm is plated on the gold immersion layer of the substrate by the plating gold process.

7. The pattern plating method which can reuse the pattern plating accompany plate as claimed in claim 6, characterized in that in step S2, the current density of the plating gold treatment is 0.5ASD, and the plating time is 180S.

8. The pattern plating method for plating a plating-accompanying plate which can be reused according to claim 1, wherein in step S1, the copper layer thickness of the double-sided copper clad laminate is H OZ.

Technical Field

The invention relates to the technical field of printed circuit boards, in particular to a pattern electroplating method capable of repeatedly utilizing a pattern electroplating accompanying plate.

Background

In the production of circuit boards, electroplating is an almost indispensable process, and at present, electroplating is generally performed using a gantry plating line or a vertical continuous plating apparatus (VCP), and due to the safety and economy of the vertical continuous plating apparatus, it has been a necessary trend to replace the gantry plating line.

When electroplating is carried out by applying vertical continuous electroplating equipment, in order to ensure that the first plate and the last plate in the production plates of each line cannot burn due to overlarge current in the electroplating processing process of the production plates, the plating accompanying plates are respectively added in front of the first plate and behind the last plate, and particularly, when the production plates are subjected to pattern electroplating, effective and stable plating accompanying plates are required to be placed to ensure the pattern electroplating effect. The pattern electroplating accompanying plate for VCP electroplating at present is generally formed by directly cutting a double-sided copper-clad plate used as a base material in circuit board production, or certain accompanying plating patterns are etched on the copper-clad plate obtained by cutting according to the circuit condition on the production plate so as to improve the accompanying plating effect of the pattern electroplating accompanying plate, the height of the pattern electroplating accompanying plate is generally equivalent to that of the production plate, and the height difference is within the range of +/-3 cm. The copper surface on the board is accompanied and plated in the figure electroplating is used for electrically conducting and sharing the electric current, avoids in the production board first board and last board to appear burning the board.

However, with the increase of the number of times of using the pattern electroplating accompanying plate, the copper amount on the pattern electroplating accompanying plate can be obviously increased, the pattern electroplating accompanying plate becomes thick and heavy, the appearance of the pattern electroplating accompanying plate becomes poor, the problems of falling of the pattern electroplating accompanying plate, damage of a clamp, pollution of a copper cylinder and the like in the electroplating process are easily caused, the pattern electroplating accompanying plate cannot be reused for a long time, and the pattern electroplating accompanying plate needs to be frequently replaced, so that the production cost is increased, and the production efficiency is influenced.

Disclosure of Invention

The invention provides a pattern electroplating method which can repeatedly utilize a pattern electroplating accompanied plate so as to improve the electroplating production efficiency and reduce the production cost, aiming at the problems that the electroplating accompanied plate used in the existing VCP electroplating can not be repeatedly used for a long time, so that the electroplating cost is increased and the production efficiency is influenced.

In order to achieve the purpose, the invention adopts the following technical scheme.

A pattern electroplating method capable of reusing a pattern electroplating accompanying plate comprises the following steps:

s1, cutting the double-sided copper-clad plate according to the size of the production plate to obtain a substrate;

sequentially carrying out film coating/film pasting, exposure, development and etching treatment on a substrate, and etching a plating accompanying pattern on the substrate, wherein the plating accompanying pattern is in an L shape, a square shape, a Chinese character 'ri' shape or a field shape and is formed by a copper layer;

s2, sequentially carrying out chemical nickel deposition, chemical gold deposition and electrogilding treatment on the substrate, and sequentially forming a nickel deposition layer, a gold deposition layer and an electrogilding layer on the plating accompanying graph of the substrate to obtain a graph plating accompanying board;

s3, carrying out pattern electroplating treatment on the production plates by using vertical continuous electroplating equipment, and respectively adding one pattern electroplating accompanying plate before the first production plate and one pattern electroplating accompanying plate after the last production plate;

the production board is a production board on which an electroplating pattern is manufactured after film pasting, exposure and development;

s4, making the pattern electroplating plate used in the pattern electroplating treatment of the previous step pass through an alkaline etching line, and performing etching treatment to remove a copper layer formed on the pattern electroplating plate in the pattern electroplating treatment process;

s5, using the pattern electroplating plate after the previous etching treatment to carry out the pattern electroplating treatment in the step S3;

s6, repeating the steps S4 and S5.

Preferably, in step S2, a nickel-deposited layer with a thickness of 3-5 μm is deposited on the substrate by electroless nickel deposition.

More preferably, the nickel precipitation time of the chemical nickel precipitation treatment is 20-30 min.

Preferably, in step S2, a gold-depositing layer with a thickness of 0.05-0.07 μm is deposited on the nickel-depositing layer of the substrate by a chemical gold-depositing process.

More preferably, in step S2, the electroless gold plating treatment is performed for a gold plating time of 10-15 min.

Preferably, in step S2, an electro-gold layer with a thickness of 0.20-0.30 μm is electroplated on the gold immersion layer of the substrate by an electro-gold plating process.

More preferably, in step S2, the current density of the gold electroplating treatment is 0.5ASD and the electroplating time is 180S.

Preferably, in step S1, the thickness of the copper layer of the double-sided copper-clad plate is H OZ.

Compared with the prior art, the invention has the beneficial effects that:

the invention uses the graph electroplating accompanying plate which is manufactured with an accompanying plating graph and is electroplated with a nickel layer as an etching protective layer on the accompanying plating graph for accompanying plating when the VCP is used for carrying out graph electroplating processing on a production plate, the graph electroplating accompanying plate passes through an alkaline etching line once when the electroplating processing is finished on the production plate of each line, a copper layer formed on the surface of the graph electroplating accompanying plate in the graph electroplating processing process is removed through the etching processing, the graph electroplating accompanying plate is recovered to be used before use, thereby being capable of being used in the graph electroplating processing again, realizing the reutilization of the graph electroplating accompanying plate, completely avoiding the problems of the graph electroplating accompanying plate falling, fixture damage, copper cylinder pollution and the like in the graph electroplating processing process caused by the appearance deterioration and the weight change of the graph electroplating accompanying plate along with the increase of the use times, reducing the production cost and improving the production efficiency, the production capacity of 10 ten thousand square meters can save about 2 ten thousand yuan of the manufacturing cost of the pattern electroplating accompanying plate. In addition, the pattern electroplating accompanying plates are etched after the electroplating treatment of each line is finished, so that the states of the pattern electroplating accompanying plates used in the pattern electroplating treatment at each time can be ensured to be the same, the electroplating environments of the production plates of each line can be kept as consistent as possible, and the electroplating quality is improved.

Drawings

FIG. 1 is a schematic diagram of a substrate with a plating-accompanying pattern formed in an embodiment.

Detailed Description

In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to the following specific embodiments.