阅读说明：本技术 电路板组装工艺和背光组装工艺 (Circuit board assembly process and backlight assembly process ) 是由 李庭 潘连兴 吴克成 于 2021-06-15 设计创作，主要内容包括：本发明公开一种电路板组装工艺和背光组装工艺,其中,所述电路板组装工艺包括以下步骤：锡膏印刷,将电路板通过夹具固定,钢网对电路板上的焊盘刷锡膏且刷锡膏角度为45°～60°；贴片,贴片机按照设定参数,将表面组装元器件安装到电路板的对应位置；回流焊,回流焊机按照设定参数将锡膏融化,使表面组装元器件与电路板牢固粘接在一起；冲切,冲切机按照预设规格对电路板进行冲切形成满足规格要求的分片；包装入库,将分片做好防尘、防静电包装入库。本发明技术方案可有效提升电路板组装工艺的良品率,降低生产成本。(The invention discloses a circuit board assembly process and a backlight assembly process, wherein the circuit board assembly process comprises the following steps: solder paste printing, wherein the circuit board is fixed through a clamp, and the solder paste is brushed on a bonding pad on the circuit board by a steel mesh at an angle of 45-60 degrees; mounting the surface assembly component on a corresponding position of the circuit board by a chip mounter according to set parameters; reflow soldering, wherein the reflow soldering machine melts the solder paste according to set parameters, so that the surface assembly component and the circuit board are firmly bonded together; punching, namely punching the circuit board by a punching machine according to a preset specification to form a fragment meeting the specification requirement; and packaging and warehousing, namely, packaging the fragments into a warehouse for dust prevention and static prevention. The technical scheme of the invention can effectively improve the yield of the circuit board assembly process and reduce the production cost.)

1. A circuit board assembly process is characterized by comprising the following steps:

solder paste printing, wherein the circuit board is fixed through a clamp, and the solder paste is brushed on a bonding pad on the circuit board by a steel mesh at an angle of 45-60 degrees;

mounting the surface assembly component on a corresponding position of the circuit board by a chip mounter according to set parameters;

reflow soldering, wherein the reflow soldering machine melts the solder paste according to set parameters, so that the surface assembly component and the circuit board are firmly bonded together;

punching, namely punching the circuit board by a punching machine according to a preset specification to form a fragment meeting the specification requirement;

and packaging and warehousing, namely, packaging the fragments into a warehouse for dust prevention and static prevention.

2. The circuit board assembly process of claim 1, wherein the solder paste printing, steel mesh aligning the pads of the circuit board, is preceded by the step of:

unfreezing the solder paste, and placing the refrigerated solder paste in a room-temperature environment for 2-4 hours;

stirring the solder paste, and stirring the unfrozen solder paste in the same direction for 2-6 minutes;

and positioning the circuit board, namely placing the circuit board on the clamp and positioning the position of the circuit board.

3. The circuit board assembly process of claim 1, wherein the step of mounting the surface mount component to the fixed position of the circuit board after the step of applying solder paste at an angle of 45 ° to 60 ° further comprises:

and inspecting the SPI solder paste, measuring the data of the solder paste through a solder paste inspection machine, and detecting the printing quality of the solder paste according to preset data.

4. The circuit board assembly process of claim 3, wherein the step of detecting the quality of the solder paste printing according to the predetermined data further comprises:

the engineer confirms that the engineer retests the data of the solder paste and determines that the data of the solder paste detector is accurate;

cleaning the circuit board with solder paste, and cleaning the printed circuit board with alcohol, Xinnau water or no-clean soldering flux;

and (3) IPQC confirmation, namely after the cleaned circuit board is confirmed by a process control engineer, returning qualified products to the solder paste printing process again, and returning unqualified products to the circuit board to clean the solder paste again.

5. The circuit board assembly process of claim 1, wherein the reflow soldering process melts the soldering paste to firmly adhere the surface assembly component and the circuit board together, and the die-cutting process further comprises the following steps before the die-cutting process is performed on the circuit board according to a preset specification to form the fragments meeting the specification requirements:

AOI inspection, namely acquiring images through AOI detection equipment, comparing welding spots of a test circuit board with preset parameters, and identifying defects;

and pasting the double-sided adhesive tape, confirming that the double-sided adhesive tape is the same as the circuit board in model, pasting the double-sided adhesive tape according to the indication direction, and checking the pasting condition of the double-sided adhesive tape.

6. The circuit board assembly process of claim 5, wherein the AOI inspection, after acquiring images through the AOI inspection equipment, comparing the solder joints of the test circuit board with preset parameters, and identifying defects, further comprises:

the technician adjusts and improves, according to the said label defect, the technician presumes the chip mounter parameter again; or

And maintaining, namely maintaining the circuit board according to the identification defects, and returning the maintained circuit board to AOI inspection again.

7. The assembly process of the circuit board according to claim 1, wherein the punching, the cutting machine performs punching on the circuit board according to a preset specification to form fragments meeting specification requirements, then the fragments are packaged and put in storage, and before the fragments are subjected to dustproof and antistatic packaging and put in storage, the assembly process further comprises the following steps:

the jig is electrified for inspection, the tester sets voltage and current parameters, conducts electricity on the slices for inspection, and checks whether the slice parameters are normal;

waste discharge, cutting off redundant rim charge of the punched circuit board;

covering a film, namely covering a dustproof film on the surface of the circuit board;

and packaging and warehousing, namely, packaging the fragments into a warehouse for dust prevention and static prevention.

8. The circuit board assembly process of claim 7, wherein the laminating, after the dustproof film is coated on the surface of the circuit board, is packaged and warehoused, and before the dustproof and anti-static packaging of the split pieces is warehoused, the method further comprises the following steps:

the appearance inspection is carried out, whether the type of the fragments is correct or not, whether the golden finger is adhered with tin or not, whether the electronic element is missing or not, the protective film is not completely covered and other defects are detected, and the fragments are returned to the film covering again when the defects exist in the appearance inspection;

and (4) OQC (inspection of quality of shipment), wherein an engineer checks and confirms the packaging state, product identification, accessories, product performance inspection reports, outer box labels and the like of the fragments, and the OQC returns to appearance inspection again when detecting that the fragments have problems.

9. The circuit board assembly process of claim 7, wherein the step of conducting inspection by the jig, setting voltage and current parameters by the tester, conducting inspection to the segment, and checking whether the segment parameters are normal further comprises:

and repairing, namely repairing the defects of the circuit board according to the detection of the jig power-on inspection, repairing the defects of the split piece such as missing welding, insufficient welding and the like, and returning the repaired split piece to the jig power-on inspection again.

10. A backlight assembly process, wherein the backlight assembly process is implemented by applying the circuit board assembly process according to any one of claims 1 to 9.

Technical Field

The invention relates to the field of circuit board processing, in particular to a circuit board assembling process and a backlight assembling process.

Background

With the development of science and technology, more and more electric devices tend to be miniaturized, ultra-thin and diversified, and the assembly of circuit boards also plays an increasingly important role.

With the smaller and smaller of the mounted electronic components, the yield of the original circuit board assembly process flow is gradually reduced, and in the prior art, the process flow of firstly cutting the circuit board and then assembling does not meet the requirements of the assembly process of the small circuit board.

Therefore, how to provide a circuit board assembly process and a backlight assembly process is a problem that needs to be solved by those skilled in the art.

Disclosure of Invention

The invention mainly aims to provide a circuit board assembling process and a backlight assembling process, and aims to achieve the purposes of improving the universality of the circuit board assembling process and reducing the production cost by optimizing the structure of the circuit board assembling process. In order to achieve the above object, the present invention provides a circuit board assembly process, which comprises the following steps:

solder paste printing, wherein the circuit board is fixed through a clamp, and the solder paste is brushed on a bonding pad on the circuit board by a steel mesh at an angle of 45-60 degrees;

mounting the surface assembly component on a corresponding position of the circuit board by a chip mounter according to set parameters;

reflow soldering, wherein the reflow soldering machine melts the solder paste according to set parameters, so that the surface assembly component and the circuit board are firmly bonded together;

punching, namely punching the circuit board by a punching machine according to a preset specification to form a fragment meeting the specification requirement;

and packaging and warehousing, namely, packaging the fragments into a warehouse for dust prevention and static prevention.

Optionally, the step of printing solder paste, the steel mesh aligning the solder pads of the circuit board, comprises:

unfreezing the solder paste, and placing the refrigerated solder paste in a room-temperature environment for 2-4 hours;

stirring the solder paste, and stirring the unfrozen solder paste in the same direction for 2-6 minutes;

and positioning the circuit board, namely placing the circuit board on the clamp and positioning the position of the circuit board.

Optionally, the step of mounting the surface mount component to the fixed position of the circuit board after the step of brushing the solder paste with the solder paste at an angle of 45 ° to 60 ° further includes:

inspecting the SPI solder paste, measuring the data of the solder paste through a solder paste inspection machine, and detecting the printing quality of the solder paste according to preset data;

optionally, the step of detecting the quality of the solder paste printing according to the preset data further includes:

the engineer confirms that the engineer retests the data of the solder paste and determines that the data of the solder paste detector is accurate;

cleaning the circuit board with solder paste, and cleaning the printed circuit board with alcohol, Xinnau water or no-clean soldering flux;

and (3) IPQC confirmation, namely after the cleaned circuit board is confirmed by a process control engineer, returning qualified products to the solder paste printing process again, and returning unqualified products to the circuit board to clean the solder paste again.

Optionally, reflow soldering melts the soldering paste, makes after surface mount components and parts and circuit board firmly bond together, die-cuts, still includes before die-cutting formation satisfies specification requirement's burst according to predetermineeing the specification to the circuit board:

AOI inspection, namely acquiring images through AOI detection equipment, comparing welding spots of a test circuit board with preset parameters, and identifying defects;

and pasting the double-sided adhesive tape, confirming that the double-sided adhesive tape is the same as the circuit board in model, pasting the double-sided adhesive tape according to the indication direction, and checking the pasting condition of the double-sided adhesive tape.

Optionally, the AOI inspection, which acquires an image through an AOI inspection device, compares a solder joint of the test circuit board with a preset parameter, and identifies a defect, further includes:

the technician adjusts and improves, according to the said label defect, the technician presumes the chip mounter parameter again; or

And maintaining, namely maintaining the circuit board according to the identification defects, and returning the maintained circuit board to AOI inspection again.

Optionally, after the circuit board is punched by the punching machine according to a preset specification to form fragments meeting specification requirements, the fragments are packaged and put in storage, and before the fragments are subjected to dustproof and anti-static packaging and put in storage, the method further comprises the following steps:

the jig is electrified for inspection, the tester sets voltage and current parameters, conducts electricity on the slices for inspection, and checks whether the slice parameters are normal;

waste discharge, cutting off redundant rim charge of the punched circuit board;

covering a film, namely covering a dustproof film on the surface of the circuit board;

and packaging and warehousing, namely, packaging the fragments into a warehouse for dust prevention and static prevention.

Optionally, the laminating, after the surface of the circuit board is covered with the dustproof film, is packaged and warehoused, and before the slicing is dustproof and anti-static packaged and warehoused, the laminating method further includes:

the appearance inspection is carried out, whether the type of the fragments is correct or not, whether the golden finger is adhered with tin or not, whether the electronic element is missing or not, the protective film is not completely covered and other defects are detected, and the fragments are returned to the film covering again when the defects exist in the appearance inspection;

and (4) OQC (inspection of quality of shipment), wherein an engineer checks and confirms the packaging state, product identification, accessories, product performance inspection reports, outer box labels and the like of the fragments, and the OQC returns to appearance inspection again when detecting that the fragments have problems.

Optionally, the power-on inspection of the jig, the setting of voltage and current parameters by the tester, the power-on inspection of the segment, and the inspection of whether the segment parameters are normal further include:

and repairing, namely repairing the defects of the circuit board according to the detection of the jig power-on inspection, repairing the defects of the split piece such as missing welding, insufficient welding and the like, and returning the repaired split piece to the jig power-on inspection again.

The invention also provides a backlight assembly process, which is realized by applying the circuit board assembly process.

According to the technical scheme, the solder paste is printed, the steel mesh is aligned to the bonding pad of the circuit board fixed by the fixture, and the solder paste is brushed with the angle of 45-60 degrees, so that the solder paste can be printed on the corresponding position of the circuit board more uniformly and firmly; mounting the surface assembly component on a fixed position of the circuit board by a chip mounter according to set parameters; reflow soldering, wherein the reflow soldering machine melts the soldering paste according to set parameters, so that the surface assembly component and the circuit board are firmly bonded together; punching, namely punching the circuit board by a punching machine according to a preset specification to form a fragment meeting the specification requirement; and packaging and warehousing, namely, packaging the fragments into a warehouse for dust prevention and static prevention. According to the technical scheme, the yield of the small circuit board assembly process is effectively improved and the production cost is reduced through the process flow of firstly mounting and then cutting.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic flow chart of the circuit board assembly process of the present invention

FIG. 2 is a schematic flow chart of an embodiment of a circuit board assembly process according to the present invention;

FIG. 3 is a schematic flow chart of a circuit board assembly process according to another embodiment of the present invention;

FIG. 4 is a schematic flow chart of a circuit board assembly process according to another embodiment of the present invention;

FIG. 5 is a schematic flow chart illustrating a circuit board assembly process according to another embodiment of the present invention;

FIG. 6 is a schematic flow chart of a circuit board assembly process according to yet another embodiment of the present invention;

fig. 7 is a flow chart of a circuit board assembly process according to another embodiment of the invention.

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The invention provides a circuit board assembly process.

In this embodiment, referring to fig. 1, the circuit board assembly process includes the following steps:

solder paste printing, wherein the circuit board is fixed through a clamp, and the solder paste is brushed on a bonding pad on the circuit board by a steel mesh at an angle of 45-60 degrees;

in detail, the circuit board is fixed on a clamp, a steel mesh corresponding to the circuit board is laid above the circuit board, the through holes formed in the steel mesh correspond to bonding pads of the circuit board, then solder paste is brushed, and the inclination angle of the brushing plate is 45-60 degrees, so that the solder paste in the through holes is more full, cavities are reduced, and cold solder joint or even explosion is caused.

Mounting the surface assembly component on a corresponding position of the circuit board by a chip mounter according to set parameters;

in detail, whether the specification of the component is consistent with the preset specification or not is checked, and whether continuous tin or tin point deviation exists between the component and the circuit board or not is needed after the chip mounting is completed.

Reflow soldering, wherein the reflow soldering machine melts the solder paste according to set parameters, so that the surface assembly component and the circuit board are firmly bonded together;

in detail, the time and the temperature of reflow soldering are detected, the damage of high temperature to the circuit board is avoided, whether the temperature curves of the heating area, the preheating area, the reflow soldering area and the cooling area of the reflow soldering furnace are judged within a preset range, the condition of a welding spot is checked after reflow soldering, the welding spot is timely fed back and adjusted, and the rejection rate is reduced.

Punching, namely punching the circuit board by a punching machine according to a preset specification to form a fragment meeting the specification requirement;

and packaging and warehousing, namely, packaging the fragments into a warehouse for dust prevention and static prevention.

It should be noted that the temperatures of the respective regions of the reflow oven are set in advance, and when the temperature rises and stabilizes at a preset value, the reflow process can be started, and in this embodiment, the parameters of the reflow are set as: temperature rise slope: 0-3 ℃/s; maximum temperature drop slope: -4.5 to-1 ℃/s; the temperature of the constant temperature area is 120-217 ℃, and the time is as follows: 90-150 s; refluxing time: 220 ℃ for 50-90 s; maximum temperature: 235 ℃ and 255 ℃; actually measured mean temperature: 245 +/-5 ℃; the conveyor speed was 70 cm/min.

In this embodiment, the circuit board is the FPC board, need use the attached high temperature of tray to glue at the reflow soldering in-process and put into the reflow soldering after fixed, avoid bending with the FPC of taking and cause components and parts off normal or the aversion badly, and because this application is die-cut behind the earlier paster, the FPC circuit board of this application does not need be convenient for artifical burst through the preliminary treatment promptly, but direct die-cut behind the integrative board paster, the FPC board is more whole, in the course of working, structural strength is better, the error in the transportation process has been reduced, the yield of product has been promoted.

In one embodiment, the step of printing solder paste and aligning a steel mesh to the pads of the circuit board further comprises:

unfreezing the solder paste, and placing the refrigerated solder paste in a room-temperature environment for 2-4 hours;

in detail, the solder paste contains volatile substances, and is usually refrigerated by a refrigerator, wherein the refrigerating temperature is 5-10 ℃, and the validity period can be effectively prolonged.

Stirring the solder paste, and stirring the unfrozen solder paste in the same direction for 2-6 minutes;

in detail, the same direction stirring functions to reduce collision and friction between solder balls, resulting in deformation of the solder balls. While reducing heat generation resulting in thermal movement within the rosin resulting in localized failure. In addition, bubble generation is reduced.

And positioning the circuit board, namely placing the circuit board on the clamp and positioning the position of the circuit board.

It should be noted that the bottle cap must not be opened during the process of solder paste thawing, and when the solder paste is taken out from the cold box, the temperature is much lower than the room temperature, and if the bottle cap is not "rewarming", the water vapor in the air is easily condensed and attached to the solder paste when the bottle cap is opened. When the solder passes through the reflow furnace, the temperature is generally over 200 ℃, and moisture is rapidly vaporized due to strong heat, so that the phenomenon of tin explosion is caused, tin balls are generated, and even components are damaged.

Referring to fig. 2, in an embodiment, the step of aligning the steel mesh to the pads of the circuit board, and applying solder paste at an angle of 45 ° to 60 ° before the step of mounting the surface mount component to the fixed position of the circuit board further includes:

and inspecting the SPI solder paste, measuring the data of the solder paste through a solder paste inspection machine, and detecting the printing quality of the solder paste according to preset data.

It should be noted that the solder paste inspection machine can only inspect the surface image of the circuit board, and if the area covered by the object is not detectable, the solder paste printer can measure: the printing quantity of the solder paste, the printing height of the solder paste, the printing area of the solder paste and the printing flatness of the solder paste are measured; the solder paste printer may detect: whether the solder paste printing is deviated or not, whether the solder paste printing is highly deviated or not, whether the solder paste printing is bridged or not, and whether the solder paste printing is defectively damaged or not.

Further, the SPI solder paste inspection, which measures the solder paste data by a solder paste inspection machine and detects the solder paste printing quality according to preset data, further includes:

the engineer confirms that the engineer retests the data of the solder paste and determines that the data of the solder paste detector is accurate;

cleaning the circuit board with solder paste, and cleaning the printed circuit board with alcohol, Xinnau water or no-clean soldering flux;

and (3) IPQC confirmation, namely after the cleaned circuit board is confirmed by a process control engineer, returning qualified products to the solder paste printing process again, and returning unqualified products to the circuit board to clean the solder paste again.

It should be noted that, because the SPI solder paste inspection machine can only perform surface image inspection, the area covered by an object cannot be inspected, and generally, a circuit board is taken for visual inspection before the SPI solder paste inspection machine takes a picture as a standard sample, and the judgment is performed based on the standard sample, so that many misjudgments are necessarily caused, parameters of the SPI solder paste inspection machine need to be continuously inspected and modified, and the misjudgment rate is reduced. Therefore, this application has increased the engineer and has confirmed to collect the parameter and revise the parameter of SPI solder paste inspection machine to the circuit board of erroneous judgement, the circuit board that the solder paste printing goes wrong, then wash the solder paste, retrieve and recycle, thereby reduce because of the prior art mistake, carry recyclable's product to the subsequent handling, cause irreversible loss, discover the problem as early as possible, and in time solve, and recycle, reduced the cost of product, utilize industrial production.

In an embodiment, reflow soldering melts the soldering paste, makes after surface assembly components and parts and circuit board firmly bond together, die-cuts, still includes before die-cutting the burst that forms to satisfy the specification requirement according to predetermineeing the specification to the circuit board:

AOI inspection, namely acquiring images through AOI detection equipment, comparing welding spots of a test circuit board with preset parameters, and identifying defects;

in detail, the machine automatically scans the circuit board through the camera, acquires images, compares the tested welding points with qualified parameters in the database, inspects defects on the circuit board through image processing, and marks the defects through a display or an automatic mark for repair personnel to repair.

And pasting the double-sided adhesive tape, confirming that the double-sided adhesive tape is the same as the circuit board in model, pasting the double-sided adhesive tape according to the indication direction, and checking the pasting condition of the double-sided adhesive tape.

It should be noted that AOI inspection finds and eliminates errors early in the assembly process to achieve good process control. Early detection of defects and avoidance of sending a damaged board to a subsequent assembly stage leading to non-maintainability, AOI will reduce maintenance costs and avoid scrapping non-repairable circuit boards.

Referring to fig. 3 and 4, further, the AOI inspection, after acquiring an image through an AOI inspection apparatus, comparing a solder joint of a test circuit board with a preset parameter, and identifying a defect, further includes:

the technician adjusts and improves, according to the said label defect, the technician presumes the chip mounter parameter again; or

And maintaining, namely maintaining the circuit board according to the identification defects, and returning the maintained circuit board to AOI inspection again.

It should be noted that the AOI automatically detects different mounting errors and welding defects through a vision processing technology, provides an on-line detection scheme to improve production efficiency and welding quality, finds and eliminates errors at an early stage of an assembly process to achieve good process control, finds defects at an early stage to avoid sending NG boards to a subsequent assembly stage, and reduces repair costs to avoid scrapping unrepairable circuit boards. The technician can adjust the parameters of the surface mount device and the reflow soldering stage in time through the surface mount error and the welding defect detected by AOI so as to reduce the loss, and can accurately repair the NG board through the detection scheme of AOI so as to reduce the loss and be beneficial to industrial production.

In an embodiment, after the die cutting, the die cutting machine performs die cutting on the circuit board according to a preset specification to form fragments meeting specification requirements, the fragments are packaged and put in storage, and before the fragments are subjected to dustproof and anti-static packaging and put in storage, the method further includes:

the jig is electrified for inspection, the tester sets voltage and current parameters, conducts electricity on the slices for inspection, and checks whether the slice parameters are normal;

waste discharge, cutting off redundant rim charge of the punched circuit board;

covering a film, namely covering a dustproof film on the surface of the circuit board;

and packaging and warehousing, namely, packaging the fragments into a warehouse for dust prevention and static prevention.

It should be noted that, in this embodiment, the surface mounted device is an LED lamp, and when the jig is powered on for detection, it is not only necessary to detect whether the current and the voltage meet the predetermined values,

referring to fig. 6 and 7, further, after the surface of the circuit board is covered with the dustproof film, the film is packaged and stored in a warehouse, and before the dustproof and antistatic packaging of the split pieces is finished and stored in a warehouse, the method further includes:

the appearance inspection is carried out, whether the type of the fragments is correct or not, whether the golden finger is adhered with tin or not, whether the electronic element is missing or not, the protective film is not completely covered and other defects are detected, and the fragments are returned to the film covering again when the defects exist in the appearance inspection;

and OQC inspection, wherein an shipment quality inspection engineer inspects and confirms the packaging state, product identification, accessories, product performance inspection reports, outer box labels and the like of the fragments, and the OQC returns to appearance inspection again when detecting that the fragments have problems, so that the consistence of the receiving time and the appointed content of a client is ensured.

Referring to fig. 5, further, after the jig is subjected to power-on inspection, the tester sets voltage and current parameters, performs power-on test on the segment, and checks whether the segment parameters are normal, the method further includes:

and repairing, namely repairing the defects of the circuit board according to the detection of the jig power-on inspection, repairing the defects of the split piece such as missing welding, insufficient welding and the like, and returning the repaired split piece to the jig power-on inspection again.

The invention also provides a backlight assembly process, which is implemented by applying the circuit board assembly process.

It should be noted that, because the backlight assembly process of the present invention includes all embodiments of the circuit board assembly process, the backlight assembly process of the present invention has all the advantages of the circuit board assembly process described above, and details are not described herein.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.