阅读说明：本技术 具有用于电子构件的安装位置的电路载体、电子电路和制造方法 (Circuit carrier with mounting locations for electronic components, electronic circuit and method of manufacture ) 是由 M.海曼 C.谢伦伯格 R.厄本 K.威尔克 于 2019-08-20 设计创作，主要内容包括：本发明涉及一种电路载体(12)或一种具有这种电路载体(12)的电子组件(11)以及用于制造电路载体(12)和电子组件(11)的方法。电路载体(12)和电子组件(11)具有用于电子构件(13)的安装位置(14),电子构件(13)通过连接部(16)、尤其烧结连接部被连接。按照本发明规定,设有凹空(22)和突出部(23),在对构件(13)和电路载体(12)之间的间隙(18)进行底部填充时,凹空(22)和突出部(23)导引底部填充材料(16)并且因此防止底部填充材料过早地合流。过早地合流即导致在底部填充材料中产生气泡,所述气泡降低底部填充的质量。这可以有利地被防止。(The invention relates to a circuit carrier (12) or an electronic component (11) having such a circuit carrier (12) and to a method for producing a circuit carrier (12) and an electronic component (11). The circuit carrier (12) and the electronic component (11) have mounting locations (14) for electronic components (13), the electronic components (13) being connected by a connection (16), in particular a sintered connection. According to the invention, recesses (22) and projections (23) are provided, which recesses (22) and projections (23) guide the underfill material (16) during the underfilling of the gap (18) between the component (13) and the circuit carrier (12) and thus prevent premature interflow of the underfill material. Premature confluence can result in the generation of bubbles in the underfill material that reduce the quality of the underfill. This can advantageously be prevented.)

1. A circuit carrier (12) having mounting locations (14) for electronic components (13),

it is characterized in that the preparation method is characterized in that,

the mounting location (14) has at least one recess (22) at its edge, which constitutes a depression in a surface (27) of the circuit carrier (12), and

a deposit (16) of a connection aid material is applied to the mounting location (14), wherein the deposit (16) consists of a sintered material and projections (23) are provided at the edges of the deposit (16).

2. Circuit carrier (12) according to claim 1, characterized in that the recess (22) is formed by a slit which extends perpendicularly to the edge of the mounting location (14).

3. Circuit carrier (12) according to one of the preceding claims, characterized in that the recess is provided in an insulating layer (15) constituting a surface (27) of the circuit carrier (12) and/or in a metallization (26) provided on the circuit carrier (12).

4. The circuit carrier (12) of claim 1, wherein the protrusion (23) has the shape of a wedge protruding from an edge of the deposit (16).

5. The circuit carrier (12) of claim 4 wherein the width of the wedge is exactly equal to the height of the deposit (16).

6. An electronic circuit (11) with a circuit carrier (12) according to one of claims 1 to 5 and an electronic component (13),

it is characterized in that the preparation method is characterized in that,

the electronic component (13) is fixed on the deposit of the connection assisting material.

7. Electronic circuit (11) according to claim 6, characterized in that the gap between the circuit carrier (12) and the component (13) is filled with an underfill material (19).

8. A method for producing a circuit carrier (12), wherein mounting locations (14) for electronic components (13) are produced,

it is characterized in that the preparation method is characterized in that,

at least one recess (22) is produced at the edge of the mounting location (14), wherein the recess is designed as a depression in the surface (27) of the circuit carrier (12) or a surface structuring is produced.

9. Method according to claim 8, characterized in that the recess (22) is manufactured by a cutting method.

10. Method according to claim 8, characterized in that the recesses (22) or the surface structuring are produced by structuring of a layer on the circuit carrier (12).

11. Method according to any one of claims 8 to 10, characterized in that a deposit (16) of a connection aid material is applied or applied on the mounting location (14).

12. A method for manufacturing an electronic assembly,

-manufacturing a circuit carrier (12) according to the method of claim 11;

-fixing an electronic component (13) on the deposit (16);

-filling the gap (18) between the circuit carrier (12) and the component (13) with an underfill material (19).

13. Method according to claim 12, characterized in that the underfill material (19) is introduced into the gap (18) in a region outside the at least one recess (22), preferably just in the middle between two recesses (22).