Alignment apparatus and method, film forming apparatus and method, and method for manufacturing electronic device
阅读说明:本技术 对准装置和方法、成膜装置和方法及电子器件的制造方法 (Alignment apparatus and method, film forming apparatus and method, and method for manufacturing electronic device ) 是由 小林康信 于 2019-12-17 设计创作,主要内容包括:本发明提供对准装置和方法、成膜装置和方法及电子器件的制造方法,在成膜装置中,提高使用对准载置台对基板与掩模进行对准时的对准精度。使用进行基板与掩模的位置对合的对准装置,其中,该对准装置具有:基板支承部件;对准载置台,使支承于基板支承部件的基板平移或旋转;控制部,驱动对准载置台;以及位置获取部件,对基板对准标记进行检测而获取位置信息,控制部一边使对准载置台以载置台中心位置为中心旋转,一边通过位置获取部件多次获取基板对准标记的位置信息,基于多个位置信息,获取载置台中心位置的信息,使基板相对于基板支承部件相对地移动,以使作为基板的中心的基板中心位置来到通过载置台中心位置的对准载置台的旋转轴上。(The invention provides an alignment apparatus and method, a film forming apparatus and method, and a method for manufacturing an electronic device. An alignment apparatus for aligning a substrate and a mask is used, wherein the alignment apparatus comprises: a substrate supporting member; an alignment stage for translating or rotating the substrate supported by the substrate support member; a control unit for driving and aligning the loading table; and a position acquisition unit configured to detect the substrate alignment mark and acquire position information, wherein the control unit acquires the position information of the substrate alignment mark a plurality of times by the position acquisition unit while rotating the alignment stage about the stage center position, acquires the information of the stage center position based on the plurality of position information, and moves the substrate relative to the substrate support unit such that the substrate center position, which is the center of the substrate, comes on the rotation axis of the alignment stage passing the stage center position.)
1. An alignment apparatus for aligning a substrate and a mask, comprising a substrate, a mask, a first substrate, a second substrate,
the alignment device has:
a substrate support member supporting the substrate;
an alignment stage connected to the substrate support member to translate or rotate the substrate supported by the substrate support member;
a control unit that drives the alignment stage; and
a position acquisition unit that detects a substrate alignment mark provided on the substrate to acquire position information,
the control part
The position acquisition means acquires position information of the substrate alignment mark a plurality of times while rotating the alignment stage about a stage center position that is a center of the alignment stage,
acquiring information on a center position of the table based on the plurality of acquired position information,
and relatively moving the substrate or a 2 nd substrate different from the substrate with respect to the substrate supporting member so that a substrate center position as a center of the substrate or the 2 nd substrate comes on a rotation axis of the alignment stage passing through the stage center position.
2. The alignment device of claim 1,
The controller drives the alignment stage to align the substrate and the mask in a state where the substrate or the 2 nd substrate is brought onto the rotation shaft.
3. The alignment device of claim 1,
the alignment apparatus further includes a mask support member connected to the alignment stage to support the mask,
the control unit moves the mask so that a center position of the mask, which is a center of the mask, comes on the rotation axis.
4. The alignment device of claim 1,
the aligning device further comprises a storage part for storing information of the center position of the carrying table,
the control unit determines a positional relationship when the substrate supporting member supports the 2 nd substrate, based on the information on the center position of the mounting table stored in the storage unit.
5. The alignment device of claim 1,
the control unit transmits a control signal to an actuator provided in the alignment stage, thereby controlling the movement of the substrate by the alignment stage.
6. The alignment device according to any one of claims 1 to 5,
The position acquisition unit includes a camera that optically captures the substrate alignment mark.
7. The alignment device of claim 6,
the control section acquires information of the center position of the substrate based on the position information of the substrate alignment mark acquired by the position acquisition means.
8. A film forming apparatus includes: a chamber in which a substrate and a mask are arranged; an evaporation source that evaporates an evaporation material onto the substrate through the mask; and an alignment device, characterized in that,
the alignment device is as claimed in any one of claims 1 to 7.
9. An alignment apparatus for aligning a substrate and a mask, comprising a substrate, a mask, a first substrate, a second substrate,
the alignment device has:
a mask supporting member supporting the mask;
an alignment stage connected to the mask support member to translate or rotate the mask supported by the mask support member;
a control unit that drives the alignment stage; and
a position acquisition unit that detects a mask alignment mark provided on the mask to acquire position information,
the control part
The position acquisition means acquires position information of the mask alignment mark a plurality of times while rotating the alignment stage about a stage center position that is a center of the alignment stage,
Acquiring information on a center position of the table based on the plurality of acquired position information,
the mask is relatively moved with respect to the mask support member so that a mask center position, which is a center of the mask, comes on a rotation axis of the alignment stage passing through the stage center position.
10. The alignment device of claim 9,
the control unit drives the alignment stage to align the substrate and the mask with each other in a state where the mask is on the rotation axis.
11. The alignment device of claim 9,
the alignment apparatus further includes a substrate support member connected to the alignment stage to support the substrate,
the control unit moves the substrate so that a center position of the substrate, which is a center of the substrate, comes on the rotation axis together with the center position of the mask.
12. The alignment device of claim 9,
the aligning device further comprises a storage part for storing information of the center position of the carrying table,
the control unit determines a positional relationship between the mask support member and a different mask when the mask support member supports the different mask from the mask used for acquiring the center position of the stage, based on the information on the center position of the stage stored in the storage unit.
13. The alignment device of claim 9,
the control unit controls movement of the mask by the alignment stage by transmitting a control signal to an actuator provided in the alignment stage.
14. The alignment device according to any one of claims 9 to 13,
the position acquisition unit includes a camera that optically captures the mask alignment mark.
15. The alignment device of claim 14,
the control section acquires information of the mask center position based on the position information of the mask alignment mark acquired by the position acquisition means.
16. A film forming apparatus includes: a chamber in which a substrate and a mask are arranged; an evaporation source that evaporates an evaporation material onto the substrate through the mask; and an alignment device, characterized in that,
the alignment device is as claimed in any one of claims 9 to 15.
17. An alignment method for aligning a substrate and a mask in an alignment apparatus, the alignment apparatus comprising: a substrate support member supporting the substrate; aligning the stage to translate or rotate the substrate supported by the substrate support member; a control unit that drives the alignment stage; and a position acquisition unit that detects a substrate alignment mark provided on the substrate to acquire position information,
The alignment method has the following steps:
a step in which the position acquisition means acquires position information of the substrate alignment mark a plurality of times while the control unit rotates the alignment stage about a stage center position that is a center of the alignment stage;
a step in which the control unit acquires information on the center position of the mounting table based on a plurality of pieces of the position information; and
and a step in which the control unit relatively moves the substrate or a 2 nd substrate different from the substrate with respect to the substrate support member so that a substrate center position, which is a center of the substrate or the 2 nd substrate, comes on a rotation axis of the alignment stage passing through the stage center position.
18. A film forming method using a film forming apparatus, the film forming apparatus comprising: a chamber in which a substrate and a mask are arranged; an evaporation source that evaporates an evaporation material onto the substrate through the mask; and an alignment device, characterized in that,
the aligning apparatus is aligned by the aligning method of claim 17,
the film forming method further includes a step of performing evaporation of the evaporation material by the evaporation source.
19. A method for manufacturing an electronic device having a vapor deposition material formed on a substrate,
the method for manufacturing an electronic device uses an apparatus for manufacturing an electronic device, the apparatus comprising: a chamber in which a substrate and a mask are arranged; an evaporation source that evaporates an evaporation material onto the substrate through the mask; and an alignment means for aligning the alignment means,
the aligning apparatus is aligned by the aligning method of claim 17,
the method for manufacturing an electronic device further includes a step of performing vapor deposition of the vapor deposition material by the evaporation source.
20. An alignment method for aligning a substrate and a mask in an alignment apparatus, the alignment apparatus comprising: a mask supporting member supporting the mask; aligning the stage to translate or rotate the mask supported by the mask supporting member; a control unit that drives the alignment stage; and a position acquisition unit that detects a mask alignment mark provided on the mask to acquire position information,
the alignment method has the following steps:
a step in which the position acquisition means acquires position information of the mask alignment mark a plurality of times while the control unit rotates the alignment stage about a stage center position that is a center of the alignment stage;
A step in which the control unit acquires information on the center position of the mounting table based on a plurality of pieces of the position information; and
and a step in which the control unit relatively moves the mask with respect to the mask support member so that a mask center position, which is a center of the mask, comes on a rotation axis of the alignment stage passing through the stage center position.
21. A film forming method using a film forming apparatus, the film forming apparatus comprising: a chamber in which a substrate and a mask are arranged; an evaporation source that evaporates an evaporation material onto the substrate through the mask; and an alignment device, characterized in that,
the aligning apparatus is aligned by the aligning method of claim 20,
the film forming method further includes a step of performing evaporation of the evaporation material by the evaporation source.
22. A method for manufacturing an electronic device having a vapor deposition material formed on a substrate,
the method for manufacturing an electronic device uses an apparatus for manufacturing an electronic device, the apparatus comprising: a chamber in which a substrate and a mask are arranged; an evaporation source that evaporates an evaporation material onto the substrate through the mask; and an alignment means for aligning the alignment means,
The aligning apparatus is aligned by the aligning method of claim 20,
the method for manufacturing an electronic device further includes a step of performing vapor deposition of the vapor deposition material by the evaporation source.
Technical Field
The invention relates to an alignment apparatus, a film forming apparatus, an alignment method, a film forming method, and a method of manufacturing an electronic device.
Background
Displays used in display devices include various types such as liquid crystal displays. Among them, organic electroluminescence displays are excellent in characteristics such as response speed, viewing angle, and reduction in thickness, and in recent years, the field of use is widely spread to monitors, televisions, smartphones, and the like.
The organic electric field light emitting display has a basic configuration in which an organic layer is formed between a cathode electrode and an anode electrode facing each other. In order to form an organic layer of an organic electroluminescent display and a metal layer to be an electrode, a film forming apparatus deposits a vapor deposition material from an evaporation source onto a substrate in a vacuum chamber through a mask having a predetermined pattern formed therein. In this case, in order to attach the vapor deposition substance to a desired position on the substrate, it is necessary to fix the relative positional relationship between the mask and the substrate with high accuracy. Therefore, the film deposition apparatus uses the alignment device to align the mask and the substrate before the start of vapor deposition, thereby accurately positioning the mask and the substrate.
Patent document 1 (japanese patent application laid-open No. 2006-176809) discloses a method of aligning a substrate and a mask using an alignment apparatus having an alignment stage. In the alignment device of patent document 1, image data obtained by capturing images of marks arranged on a substrate and a mask with a CCD camera is analyzed. Then, it is determined whether or not the relative position of the substrate and the mask is within the allowable range based on the positional relationship between the marks of the substrate and the mask. When the substrate is out of the allowable range, the alignment device drives the alignment stage to move the substrate supported by the hook member in the XY direction or rotate the substrate about a Z axis (θ direction) orthogonal to the XY plane, thereby adjusting the relative position of the substrate and the mask. Then, by fixing the substrate and the mask, film formation such as a mask pattern can be performed at a desired position.
Patent document 1: japanese patent laid-open publication No. 2006 and 176809
As a result of intensive studies, the inventors have found that alignment accuracy is lowered when a deviation occurs between the center position of the alignment stage and the center position of the substrate when the alignment apparatus rotates the substrate or the mask by θ. One of the reasons for this is that when the alignment stage is rotated by θ about a position away from the center position of the stage, the driving accuracy of the alignment stage is lowered as the rotation center position is further away from the center position of the stage. For example, when the center position of the stage is deviated from the center position of the substrate, not only the rotational motion but also the translational motion occurs even if the substrate is intended to be rotated θ about the center position of the substrate (or about the center position of the stage).
However, the technique of patent document 1 does not describe aligning the center position of the mounting table with the center position of the substrate, and there is a possibility that the alignment accuracy is lowered. In addition, in the case of using an alignment apparatus that adjusts the position of the mask instead of or together with the substrate, when the mask center position is displaced from the stage center position, the same alignment accuracy is also degraded.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object of the present invention is to improve alignment accuracy when aligning a substrate and a mask with an alignment stage in a film deposition apparatus.
Means for solving the problems
The present invention adopts the following configuration. That is to say that the first and second electrodes,
an alignment apparatus for aligning a substrate and a mask, comprising a substrate, a mask, a first substrate, a second substrate,
the alignment device has:
a substrate support member supporting the substrate;
an alignment stage connected to the substrate support member to translate or rotate the substrate supported by the substrate support member;
a control unit that drives the alignment stage; and
a position acquisition unit that detects a substrate alignment mark provided on the substrate to acquire position information,
the control part
The position acquisition means acquires position information of the substrate alignment mark a plurality of times while rotating the alignment stage about a stage center position that is a center of the alignment stage,
acquiring information on a center position of the table based on the plurality of acquired position information,
and relatively moving the substrate or a 2 nd substrate different from the substrate with respect to the substrate supporting member so that a substrate center position as a center of the substrate or the 2 nd substrate comes on a rotation axis of the alignment stage passing through the stage center position.
The present invention also adopts the following configuration. That is to say that the first and second electrodes,
an alignment apparatus for aligning a substrate and a mask, comprising a substrate, a mask, a first substrate, a second substrate,
the alignment device has:
a mask supporting member supporting the mask;
an alignment stage connected to the mask support member to translate or rotate the mask supported by the mask support member;
a control unit that drives the alignment stage; and
a position acquisition unit that detects a mask alignment mark provided on the mask to acquire position information,
the control part
The position acquisition means acquires position information of the mask alignment mark a plurality of times while rotating the alignment stage about a stage center position that is a center of the alignment stage,
acquiring information on a center position of the table based on the plurality of acquired position information,
the mask is relatively moved with respect to the mask support member so that a mask center position, which is a center of the mask, comes on a rotation axis of the alignment stage passing through the stage center position.
The present invention also adopts the following configuration. That is to say that the first and second electrodes,
An alignment method for aligning a substrate and a mask in an alignment apparatus, the alignment apparatus comprising: a substrate support member supporting the substrate; aligning the stage to translate or rotate the substrate supported by the substrate support member; a control unit that drives the alignment stage; and a position acquisition unit that detects a substrate alignment mark provided on the substrate to acquire position information,
the alignment method has the following steps:
a step in which the position acquisition means acquires position information of the substrate alignment mark a plurality of times while the control unit rotates the alignment stage about a stage center position that is a center of the alignment stage;
a step in which the control unit acquires information on the center position of the mounting table based on a plurality of pieces of the position information; and
and a step in which the control unit relatively moves the substrate or a 2 nd substrate different from the substrate with respect to the substrate support member so that a substrate center position, which is a center of the substrate or the 2 nd substrate, comes on a rotation axis of the alignment stage passing through the stage center position.
The present invention also adopts the following configuration. That is to say that the first and second electrodes,
an alignment method for aligning a substrate and a mask in an alignment apparatus, the alignment apparatus comprising: a mask supporting member supporting the mask; aligning the stage to translate or rotate the mask supported by the mask supporting member; a control unit that drives the alignment stage; and a position acquisition unit that detects a mask alignment mark provided on the mask to acquire position information,
the alignment method has the following steps:
a step in which the position acquisition means acquires position information of the mask alignment mark a plurality of times while the control unit rotates the alignment stage about a stage center position that is a center of the alignment stage;
a step in which the control unit acquires information on the center position of the mounting table based on a plurality of pieces of the position information; and
and a step in which the control unit relatively moves the mask with respect to the mask support member so that a mask center position, which is a center of the mask, comes on a rotation axis of the alignment stage passing through the stage center position.
Effects of the invention
According to the present invention, it is possible to improve the alignment accuracy when aligning the substrate and the mask using the alignment stage in the film deposition apparatus.
Drawings
Fig. 1 is a plan view showing the entire configuration of an apparatus for manufacturing an electronic device.
FIG. 2 is a sectional view showing the structure of a film forming apparatus.
Fig. 3 is a diagram showing the structure of the substrate support mechanism.
Fig. 4 is a block diagram of the structure associated with the alignment device.
Fig. 5 is a diagram illustrating an imaging area and a coordinate system based on a camera.
Fig. 6 is a flowchart illustrating the processing of embodiment 1.
Fig. 7 is a diagram illustrating a method of acquiring the center coordinates of the alignment stage.
Fig. 8 is a diagram for explaining a method of aligning the substrate center position with the mounting table center position.
Fig. 9 is a diagram illustrating alignment of the substrate and the mask.
Fig. 10 is a flowchart for explaining the processing of embodiment 2.
Fig. 11 is a sectional view showing the structure of a film formation apparatus according to embodiment 3.
Fig. 12 is a flowchart for explaining the processing of embodiment 3.
Fig. 13 is a diagram for explaining a method of aligning the mask center position with the stage center position.
Fig. 14 is a diagram showing a general layer structure of an organic EL element.
Description of the reference numerals
10. A substrate; 210. a substrate supporting unit; 220. a mask; 261. a camera; 270. a control unit; 280. the stage is aligned.
Detailed Description
Hereinafter, preferred embodiments of the present invention will be described in detail. However, the following embodiments are merely exemplary of preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. In the following description, the hardware configuration and software configuration of the apparatus, the process flow, the manufacturing conditions, the dimensions, the materials, the shapes, and the like are not particularly limited, and the scope of the present invention is not limited thereto.
The present invention is suitable for forming a vapor deposition film, particularly an organic film, on a film formation object such as a substrate. The present invention can also be understood as an alignment apparatus, a film forming apparatus, a vapor deposition apparatus including the film forming apparatus, and a control method thereof. The invention can also be understood as an alignment method or a film-forming method. The present invention may also be understood as an apparatus for manufacturing an electronic device or a method for manufacturing an electronic device. The present invention can also be understood as a program that causes a computer to execute the control method and a storage medium that stores the program. The storage medium may also be a non-transitory storage medium that can be read by a computer.
[ embodiment 1]
A basic structure of the alignment device according to embodiment 1 will be described with reference to the drawings. The alignment apparatus is typically configured as a part of the film forming apparatus. A film deposition apparatus is used for depositing and forming a thin film on a substrate or a structure in which a laminate is formed on the substrate (hereinafter, also referred to as "substrate or the like") in the production of various electronic devices such as semiconductor devices, magnetic devices, and electronic components, optical components, and the like. More specifically, the film forming apparatus is preferably used for manufacturing electronic devices such as light emitting elements, photoelectric conversion elements, and touch panels. The film forming apparatus is preferably used for manufacturing an organic light emitting element such as an organic el (electro luminescence) element, and an organic photoelectric conversion element such as an organic thin film solar cell. Examples of the electronic device include a display device (for example, an organic EL display device) including a light-emitting element, an illumination device (for example, an organic EL illumination device), a sensor (for example, an organic CMOS image sensor) including a photoelectric conversion element, and the like.
(film formed on substrate)
Fig. 14 schematically shows a general layer structure of an organic EL element. In a general organic EL device shown in fig. 14, an anode 1001, a hole injection layer 1002, a hole transport layer 1003, an organic light emitting layer 1004, an electron transport layer 1005, an electron injection layer 1006, and a cathode 1007 are sequentially formed on a
When a film having a certain desired shape is formed on a substrate or the like, a mask having a mask pattern that is suitable for the shape of the formed film is used. Thus, each layer to be formed can be arbitrarily configured. In this case, in order to form a film at a desired position on the substrate, it is necessary to align the relative position of the substrate or the like and the mask with high accuracy.
(production line of electronic devices)
Fig. 1 is a plan view schematically showing a part of the structure of a production line of electronic devices. The production line is used for manufacturing a display panel of an organic EL display device for a smart phone, for example. In the case of manufacturing a display panel for a smart phone, for example, a film of organic EL is formed on a substrate having a size of about 1800mm × about 1500mm or about 900mm × about 1500mm, and then the substrate is cut to prepare a plurality of small-sized panels. As shown in fig. 1, a film formation cluster 1 in a production line of an organic EL display device generally includes a plurality of
The
The film formation cluster 1 is connected in the flow direction of the
In the
(film Forming apparatus)
Each of the
Fig. 2 is a sectional view schematically showing the structure of the film formation apparatus. In the following description, an XYZ rectangular coordinate system in which the vertical direction is the Z direction is used. In the XYZ rectangular coordinate system, when the substrate is fixed so as to be parallel to a horizontal plane (XY plane) at the time of film formation, the width direction (direction parallel to the short side) of the substrate is defined as the X direction, and the length direction (direction parallel to the long side) is defined as the Y direction. In addition, the rotation angle around the Z axis is represented by θ.
The film forming apparatuses in the respective film forming chambers have fine portions different in evaporation source difference, mask difference, and the like, but have substantially the same basic configuration (particularly, configuration related to transfer and alignment of substrates). The common structure of the film forming apparatuses in the respective film forming chambers will be described below. In the following description, an upward deposition structure in which a film is formed in a state in which the film formation surface of the substrate is oriented downward in the direction of gravity during film formation is described, but the present invention is not limited thereto, and a downward deposition structure in which a film is formed in a state in which the film formation surface of the substrate is oriented upward in the direction of gravity during film formation may be used. In addition, the substrate may be vertically erected, and the deposition may be performed in a side direction in which the deposition surface is substantially parallel to the direction of gravity.
The film forming apparatus has a
The
The
The
A
The
(Structure for alignment)
The
As the
The
A
In the present embodiment, a plurality of
Typically, the substrate alignment marks 104 are formed on the substrate by photolithography, and the mask alignment marks 224 are formed on the mask by machining. However, the method of forming the mark is not limited thereto. The shape and size of the mark can be set arbitrarily according to the performance of the camera and the capability of image analysis.
The
(alignment-related functional Block)
Fig. 4 is a block diagram for explaining a flow of control using the apparatus according to the embodiment, and shows components related to the alignment apparatus. The
The image processing unit 272 analyzes image data optically captured by the
The arithmetic unit 274 performs various arithmetic operations based on the image data. During normal alignment, the image processing unit calculates the amount of movement of the substrate in the XY θ direction based on the detected positional deviation of the alignment mark. As a process unique to the present invention, the center position of the
The controller 276 converts the movement amount of the substrate or the like calculated by the calculation unit into a driving amount of a stepping motor, a servo motor, or the like provided in each actuator of the
As described above, the
Since the position of the
The device includes four cameras 261a to 261d, and each camera captures an image of each of the
(substrate supporting unit)
The structure of the
However, the configuration of the chucking mechanism is not limited to the example of fig. 3, and the number and arrangement of the chucking mechanisms may be appropriately changed according to the size, shape, film formation conditions, and the like of the substrate to be processed. Further, the substrate may be placed on the support instead of the clamping method.
When the
In the substrate supporting state, the
Here, reference numeral 104 in fig. 3 denotes a substrate alignment mark attached to four corners of the
(treatment procedure)
The flow of the processing of the present embodiment will be described with reference to the drawings. In the flow of fig. 6, the substrate center is aligned with the alignment stage center before the alignment of the
(step S101) the
(step S102) the
(step S103) the
(step S104) the
Here, a method of acquiring the mounting table center coordinates in S103 to S104 will be described.
Fig. 7(a) is a diagram for explaining an example of the acquisition method, and shows a case where the
In FIG. 7(a),
In addition, with reference Csub(ta1)The substrate center position at time ta1 is denoted by reference character Csub (ta3)Indicating the substrate center position at time ta 3. Then, as shown in fig. 7(a), since the substrate center position is not aligned with the stage center position, the substrate center position moves as the θ rotation progresses. In order to solve this problem, the substrate center position and the stage center position need to be aligned, but the
Specifically, the
Next, another example of the method for acquiring the center coordinates of the mounting table will be described with reference to fig. 7 (b). With
In this example, first, at a time tb1, the
Then, the
In addition, any method other than the above-described method may be used as long as the alignment mark 104 of the
Returning to the flow for continuous explanation.
(step S105) the
(105_ a) the cameras 261a to d optically capture images in the
(105_ b) the
(105_ C) on the other hand, the
(105_ d) the
(105_ e) accordingly, the
(step S106) the
Fig. 9(a) shows image data of the
The
In the illustrated example, the
As described above, in the film deposition apparatus including the alignment apparatus of the present embodiment, since the alignment control is performed in a state where the center positions of the
[ embodiment 2]
The configuration and control of embodiment 2 will be explained. The same components and processes as those in embodiment 1 are denoted by the same reference numerals, and the description thereof is simplified.
Fig. 10 is a flowchart illustrating a process flow of the present embodiment. The present flow includes a stage center coordinate storage step (step 1) and a position alignment step (step 2) performed each time a film is formed on each substrate. That is, the information acquired by the 1 st substrate is used for alignment of a substrate (also referred to as the 2 nd substrate) different from the substrate (also referred to as the 1 st substrate) used for acquiring the information of the center position of the stage.
[ step 1 ]
The 1 st process includes steps S101, S103, S104, and S201.
(steps S101, S103, and S104) the same processing as in embodiment 1 is performed for these steps. That is, the center coordinates C of the alignment stage are acquired based on the result of optical imaging of the
(step S201) the
[ 2 nd step ]
(step S201) the
(step S202) the
As described above, in the film deposition apparatus including the alignment apparatus of the present embodiment, as in embodiment 1, since alignment control is performed in a state where the
In the above flow, the 2 nd step is performed immediately after the 1 st step, but only the 1 st step may be executed as the "stage center coordinate detection mode". When the apparatus is assembled or maintained, the mounting table center coordinate detection mode is performed and coordinate values are stored, so that both improvement of alignment accuracy and improvement of tact time can be achieved.
[ embodiment 3]
Fig. 11 is a sectional view schematically showing the structure of the
In the configuration of the present embodiment, one
In the present embodiment, the
The flow of processing in the present embodiment will be described with reference to fig. 12. The processing in steps S301 to S304 is the same as in steps S101 to S104 in embodiment 1.
(step S301) the
(step S302) the
(step S303) the
(step S304) the
Next (step S305), the
The processing of step S305 will be described with reference to fig. 13, in comparison with embodiment 1. In the present embodiment, the center position alignment is performed with reference to the mask alignment mark 224. First, the cameras 261a to d generate image data of the
On the other hand, the
(step S306) the
(step S307) the
As described above, in the film deposition apparatus including the alignment apparatus of the present embodiment, since the alignment control is performed in a state where the center positions of the
[ embodiment 4]
In embodiment 3, only the mask center position and the stage center position are aligned. However, in the film deposition apparatus having the configuration of fig. 11, it is also possible to align 3 of the mask center position, the substrate center position, and the stage center position. In this case, the substrate center position may be aligned with the mounting table center position by the same method as in step S105 of fig. 6 before or after step S305.
When this embodiment is compared with embodiment 1 or 3, it takes time to align both the substrate and the mask, but the alignment accuracy can be further improved.
[ embodiment 5]
In steps S303 and S304 of embodiment 3, the stage center coordinates are acquired based on image data obtained by performing optical imaging on the substrate 10 a plurality of times. However, if the configuration is such that the position of the
[ embodiment 6]
In steps S305 to S307 of embodiment 3, first, the mask center is aligned with the stage center, then the
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