阅读说明：本技术 供应装置、方法和处理装置 (Supply device, method and processing device ) 是由 乌维·魏纳 安德烈亚斯·古德拉特 安德烈亚斯·穆勒 米夏埃尔·霍夫曼 克里斯托夫·舒斯特 于 2020-02-24 设计创作，主要内容包括：按照不同的实施方式,一种供应装置(350)可以具有：用于运输各一个蒸发钳锅的两个钳锅载体(304、1304)；支架,该支架具有至少一个停放区域(312、314)和移动结构(306),其中,这样来设置用于在支架上移动两个钳锅载体(304、1304)的移动结构(306),使得两个钳锅载体(304、1304)可以同时布置在一个停放区域(312、314)中的停放位置中并且能交替地进入真空腔室(802)内的运行位置中；冷却流体供应机构(602),该冷却流体供应机构设置用于,当从停放位置移动进入运行位置时,同时用冷却流体供应两个钳锅载体(304、1304)。(According to various embodiments, a supply device (350) may have: two crucible carriers (304, 1304) for transporting one evaporation crucible each; a rack having at least one parking region (312, 314) and a moving structure (306), wherein the moving structure (306) for moving the two crucible carriers (304, 1304) on the rack is provided such that the two crucible carriers (304, 1304) can be arranged simultaneously in a parking position in one parking region (312, 314) and alternately into an operating position within the vacuum chamber (802); a cooling fluid supply mechanism (602) configured to simultaneously supply the two crockery carriers (304, 1304) with cooling fluid when moving from the parking position into the operating position.)

1. A supply device (350) having:

two crucible carriers (304, 1304) for transporting one evaporation crucible each;

a rack (302) having at least one parking region (312, 314) and a moving structure (306), wherein the moving structure (306) for moving the two crucible carriers (304, 1304) on the rack (302) is provided such that the two crucible carriers (304, 1304) can be arranged simultaneously in a parking position in the at least one parking region (312, 314) and alternately into an operating position within the vacuum chamber (802);

a cooling fluid supply mechanism (602) configured to simultaneously supply the two crockery carriers (304, 1304) with cooling fluid when moving from the parking position into the operating position.

2. The supply arrangement (350) according to claim 1, wherein the cooling fluid supply means (602) are further provided for simultaneously supplying the two crucible carriers (304, 1304) with cooling fluid when each of the two crucible carriers (304, 1304) is in the parking position.

3. The supply device (350) according to claim 1 or 2, wherein the cooling fluid supply means (602) are arranged for providing at least two separate cooling circuits by means of a cooling fluid.

4. Supply device (350) according to claim 1 or 2, wherein at least one of the two crockery carriers (304, 1304) has a chamber door with a surrounding sealing surface.

5. Supply device (350) according to claim 1 or 2, wherein at least one of the two crockery carriers (304, 1304) has a movement mechanism.

6. Supply device (350) according to claim 1 or 2, wherein the movement structure (306) provides a plurality of movement paths along which the movement between the parking position and the operating position can be carried out.

7. The supply device (350) according to claim 6, wherein the moving structure (306) further has a guiding system providing a plurality of moving paths.

8. Supply device (350) according to claim 1 or 2, wherein the moving structure (306) has lifting means for adjusting the vertical position in which the movement between the parking position and the operating position is carried out.

9. The supply device (350) according to claim 1 or 2, wherein said moving structure (306) further has: at least one chassis for transporting each of the two pincer-pot carriers (304, 1304).

10. Supply device (350) according to claim 1 or 2, wherein the at least one parking zone (312, 314) has a plurality of parking zones (312, 314), wherein the moving structure (306) is arranged such that the two pot carriers (304, 1304) can be replaced by one another in their parking position between the plurality of parking zones (312, 314).

11. A processing apparatus has:

supply device (350) according to claim 1 or 2,

a vacuum chamber (802), wherein the vacuum chamber (802) has a chamber opening into which the moving structure (306) opens.

12. A method, having:

heating (1201) the evaporation charge arranged in the first evaporator nip in a vacuum chamber (802) to a temperature at which the evaporation charge changes into the gas phase;

before the evaporation material is cooled to less than half of said temperature, the first evaporation pincer pot is removed (1203) from the vacuum chamber (802) and the second evaporation pincer pot is moved (1203) into the vacuum chamber (802);

the first evaporator pincer pot is cooled (1205) during the movement by means of a cooling fluid.

Technical Field

The invention relates to a supply device, a method and a processing device.

Background

High power electron beams (e.g., with powers of several kilowatts) are commonly used in vacuum processing equipment to heat substrates or workpieces, melt materials, or vaporize coating materials.

For example, the material (e.g., copper) can be heated by means of an electron beam in such a way that it is liquefied and then evaporated in a targeted manner. The generated vapor is ultimately deposited as a coating on a substrate. The storage of the material is done in a crock. After the consumption of the material, the pots must be refilled cyclically accordingly.

The evaporation of the layer material (also referred to as evaporation material or coating material) separated off on the substrate from the crucible (also referred to as evaporation crucible) usually takes place, in which the evaporation material is heated by means of an electron beam. This crock may be a so-called "cold" (also referred to as cooled) or "hot" crock. A hot pot is understood to mean an uncooled pot made of a material (also referred to as pot material) which has a lower thermal conductivity than the evaporated material (e.g. copper). The hot crucible can be made, for example, of a crucible material that is resistant to high temperatures, such as oxides or borides. Graphite is also considered as a material for the crucible in some cases, in which case the evaporated material with graphite forms no compounds or only very little or no compounds.

The cold crucible (also referred to as cooled crucible) can be, for example, a water-cooled copper crucible, for example, because of the good thermal conductivity of copper and the low cost of water as cooling medium.

The consumption of the evaporation material is usually compensated in such a way that additional evaporation material is brought into the crucible (also referred to as refilling). The filling of the crockery with the evaporant can be carried out, for example, under vacuum in such a way that the rod-shaped evaporant is fed from below to the crockery. Refilling under vacuum is not common when evaporation material is consumed very much, because the amount of evaporation material stored under vacuum is limited. In this case, the crucible is therefore usually removed from the vacuum and refilled under atmospheric pressure.

Disclosure of Invention

It has been recognized according to various embodiments that refilling of the evaporation material obviously requires a lot of time, since the crucible is cooled in the treatment device and can only be removed from this treatment device afterwards. The throughput of the processing plant is therefore smaller, the costs are increased and more personnel and labor are required. According to various embodiments, a supply device, a method and a treatment device are provided which significantly reduce the duration of interruptions which may be required for refilling a crockery with evaporation material.

According to various embodiments, it is obviously ready to replace the pots to be refilled with already refilled pots, wherein the cooling of the pots to be refilled can be done outside the vacuum chamber. The crucible to be refilled can be cooled outside the vacuum chamber in such a way that thermal energy is continuously extracted from the crucible to be refilled by means of a cooling fluid separately from atmospheric gas. It is therefore clear that as short an interruption as possible can be achieved, so that the processing device only stops operating briefly. For example, the crucible can be prepared for refilling with evaporation material in such a way that all safety-relevant requirements can be met and that no damage can occur to the equipment or the evaporation material can become unusable. For example, continuous operation of the processing device can be achieved.

According to a different embodiment, the supply device has: two tong-pan carriers for transporting one evaporation tong-pan each; a support with a parking area and a displacement structure, wherein the displacement structure is provided for displacing the two crucible carriers on the support in such a way that the two crucible carriers can be arranged simultaneously in a parking position in the parking area and alternately into an operating position in the vacuum chamber; and the cooling fluid supply mechanism is arranged for simultaneously supplying cooling fluid to the two pincer-pot carriers when moving from the parking position into the running position.

Drawings

In the figure:

fig. 1 shows a tonguer device according to various embodiments in a schematic side view or cross-sectional view;

fig. 2 shows a vacuum device according to various embodiments in a schematic side view or cross-sectional view;

fig. 3A, 3B, 4A, 4B, 5, 6A and 6B show the supply device according to different embodiments in different views, respectively;

fig. 10 shows a treatment device according to various embodiments in a schematic top view;

fig. 7A, 7B, 8A, 8B, 9A, 9B and 11 show a supply device according to different embodiments in a schematic side view or cross-sectional view, respectively; and is

Fig. 12 shows a method for operating a supply device in a schematic flow chart.

Detailed Description

In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology, such as "upper," "lower," "front," "rear," etc., is used with reference to the orientation of the figure(s) being described. Because components of the embodiments can be positioned in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting. It is understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. It goes without saying that the features of the different exemplary embodiments described herein can be combined with one another, if not specifically stated otherwise. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.

Within the scope of the present description, the terms "connected", "coupled" and "coupled" are used to indicate direct and indirect connections (e.g. resistive or conductive, e.g. electrically conductive), direct or indirect connections and direct or indirect connections. Identical or similar elements in the figures are provided with identical reference numerals if appropriate.

According to various embodiments, the terms "coupled (gekoppelt)" or "coupled (Kopplung)" may be understood as (e.g. mechanical, hydrostatic, thermal and/or electrical) e.g. direct or indirect connection and/or interaction. The plurality of elements may be coupled to each other, for example, along an interaction chain along which interactions (e.g., signals) can be transmitted. Two elements coupled to each other can interact with each other, for example, in an alternating manner, for example, mechanically, hydrostatically, thermally and/or electrically. According to various embodiments, "joining" is understood to mean mechanical (e.g., physical or physical) joining, for example by direct physical contact. The engagement means may be arranged to transmit mechanical interaction (e.g. force, torque, etc.).

Control may be understood as intentionally affecting the system. The state of the system can be changed according to the specification. Regulation can be understood as control, in which the change in state of the system is additionally counteracted by disturbances. The control can obviously have a forward-oriented control section and thus implement a flow control that converts the input variable into the output variable. However, the control section can also be part of the control loop, so that the control is carried out. In contrast to purely positive control, regulation indicates that the output variable has a continuous influence on the input variable, which influence is imposed (feedback) by the regulating circuit. In other words, the adjustment is used as an alternative or in addition to the control, or is performed as an alternative or in addition to the control. During the regulation, the actual value of the regulated variable (determined, for example, on the basis of the measured value) is compared with the feedback value (nominal value or predefined or predetermined value) and the regulated variable can be influenced accordingly by means of the regulated variable (if an adjusting mechanism is used) in such a way that the deviation of the corresponding actual value of the regulated variable from the feedback value is as small as possible.

According to various embodiments, the evaporator crucible (also referred to as a melting crucible or simply crucible) can be arranged in a permanently water-cooled and hermetically closable enclosure (also referred to as a crucible housing). The enclosure housing may optionally have a lid that opens and closes automatically. After the evaporation process is completed and before the vacuum chamber is ventilated, the encapsulating housing can be closed and its interior loaded with a protective gas.

According to various embodiments, copper may be evaporated, for example. It may be necessary to heat the copper to a temperature of about 1400 c or higher in the evaporating pincer-pot for this purpose. The evaporator crucible can, for example, have graphite or be formed from graphite.

As long as the process of heating the copper (or other evaporant) is performed under vacuum, there is little or no need to protect the graphite crucible or copper from oxidation. The vacuum chuck may optionally be entirely enclosed with a radiation shield to prevent heat radiation from entering the vacuum chamber or components mounted therein. During the evaporation process, a large amount of copper vapor may condense on the substrate to be coated and, for example, also in the entire environment.

According to various embodiments, the evaporation material may also be a material other than copper. More generally, the evaporation material may, for example, have or be formed from copper (Cu), silver (Ag), tin (Sn), indium (In) and/or gold (Au). Such evaporant materials may, for example, have or be formed from alloys of other noble metal compounds and, for example, copper (Cu), silver (Ag), tin (Sn), indium (In) and/or gold (Au). However, it is also possible in principle to evaporate other types of evaporation materials, for example metals.

On the basis of the significantly longer cooling time of the evaporator pincer pots after the end of the evaporation, two evaporator pincer pots with corresponding encapsulation shells can be used. Each of the two evaporator pincer pots can be mounted on a separate chamber door flange. The unused evaporator pans can be maintained accordingly during operation together with the other evaporator pans and refilled (e.g. refilled) with evaporating material again. The filled evaporating jacketed kettle can be replaced by another jacketed kettle after the evaporation period is finished. In this way, one or more replacements of two or more pots with respect to one another can be carried out. One or more of the replacement processes may, for example, be performed alternately in each case. The two evaporator pans or their enclosing housings can be permanently connected to the medium supply.

The medium supply can, for example, have at least one cooling fluid supply which, for example, provides a supply of cooling water and/or protective gas. The medium connection means (e.g. cooling water and/or protective gas) can be permanently connected to each of the two evaporator pans and thus remain operational, for example, during a replacement process.

According to different embodiments, high safety requirements can be met. Contamination or damage to the evaporator pan and to the evaporation material can be prevented in that, on account of a corresponding replacement of the two evaporator pans with respect to one another, a corresponding cooling time can be observed.

The supply device provided according to the different embodiments can generally also be used with other types of cupola and/or other types of evaporant, such as an oxide evaporant, a graphite evaporant or an evaporant of another compound.

Within the framework of this description, the metal (also referred to as metallic material) may have (or consist of) at least one metallic element (that is to say one or more metallic elements), for example at least one element from the following group of elements: copper (Cu), iron (Fe), titanium (Ti), nickel (Ni), silver (Ag), chromium (Cr), platinum (Pt), gold (Au), magnesium (Mg), aluminum (Al), zirconium (Zr), tantalum (Ta), molybdenum (Mo), tungsten (W), vanadium (V), barium (Ba), indium (In), calcium (Ca), hafnium (Hf), samarium (Sm), silver (Ag) and/or lithium (Li). Furthermore, the metal can also have or be formed from a metal compound (e.g. an intermetallic compound or an alloy), for example a compound composed of at least two metal elements (e.g. elements from the element group), such as bronze or brass, or for example a compound composed of at least one metal element (e.g. elements from the element group) and at least one non-metal element (e.g. carbon), such as steel.

According to various embodiments, the substrate may have or be formed from at least one of the following materials: ceramics, glass, semiconductors (e.g. amorphous, polycrystalline or monocrystalline semiconductors, such as silicon), metals (e.g. aluminum, copper, iron, steel, platinum, gold, etc.), polymers (e.g. plastics) and/or mixtures of different materials, such as composite materials (e.g. carbon fiber reinforced carbon or carbon fiber reinforced plastics). The substrate may be provided as a plate or as a tape (e.g., a film). The substrate can, for example, have or be formed from a plastic film, a semiconductor film, a metal film and/or a glass film and can optionally be coated. The substrate may alternatively or additionally have fibers, such as glass fibers, carbon fibers, metal fibers and/or plastic fibers, for example in the form of a braid, a mesh, a knit, or a felt or a hook and loop (Flies), for example.

Fig. 1 shows a tonguer device 100 according to various embodiments in a schematic side view or cross-sectional view.

The pincer-cooker device 100 can have a housing 102, which is, for example, formed from several parts. The housing 102 may, for example, be provided to be overpressure resistant and/or gas permeable, even if the housing is spliced and/or closed. The multipart housing 102 facilitates access to the housing interior 102 i.

The multipart housing 102 may have a housing slot 102w (also referred to as a crockery carrier slot 102w) and a separate (e.g., removable) housing cover 102d (also referred to as a cover rack). The housing cover 102d may, for example, be frame-shaped and/or may be penetrated by the opening 102o (also referred to as steam outlet 102 o). The housing cover 102d may rest with its edges on the housing slot 102 w. The housing slot 102w may be open toward the housing cover 102d and provide a housing interior chamber 102 i. The vapor outlet 102o may partially expose the housing interior chamber 102 i.

The tonger device 100 may also have a tonger 104. The crockery 104 can have or be formed by at least one (that is to say one or more) container 104b (also referred to as evaporation material container).

The crucible 104, for example each evaporation material container 104b, can have a recess 104t (also referred to as a crucible interface (tiegelhauen)) in which the evaporation material 106 is arranged. The evaporation material 106 may generally be a material that melts and/or changes to a vapor phase under the influence of heat. For this purpose, the evaporation vessel 104b can be provided, for example, so as to be fluid-tight downwards, so that no liquefied evaporation material can exit from this evaporation vessel. The recess 104t may be arranged, for example, below the steam outlet 102 o.

The conversion of the vaporiser to the vapour phase may also be referred to as thermal vaporisation. Thermal evaporation can have both a transition from a liquid phase to a gas phase and a direct transition from a solid phase to a gas phase (also known as sublimation).

The crucible 104 may be at least partially (that is to say some or all of the components of the crucible) made of a material that is resistant to high temperatures, that is to say has or is formed from such a material that is resistant to high temperatures. The at least one evaporation vessel 104b can, for example, be made of or have a material that is resistant to high temperatures.

By a high temperature resistant material is meant a material that has a decomposition temperature (e.g., melting point and/or sublimation temperature) under vacuum (e.g., with the exclusion of oxygen) of greater than about 2500 ℃, such as greater than about 2750 ℃, for example greater than about 3000 ℃. The high temperature resistant material may for example have or be formed from carbon, for example in a modified carbide or carbide such as graphite. The high temperature resistant material may optionally have fibers. The high-temperature-resistant material can be, for example, a fiber composite material or be formed from a fiber composite material, wherein the fiber composite material can, for example, comprise carbon.

The high-temperature-resistant material may, for example, have carbon fiber reinforced carbon (CFC) or be formed from carbon fiber reinforced carbon. Carbon fibre-reinforced carbon may for example enable cost-effective manufacture. Carbon fiber reinforced carbon may, for example, be facilitated to be cost effective to process and/or have a higher flexural strength.

Other crucible types, such as water-cooled copper crucibles and/or crucibles without shell 102, may alternatively be used.

The crucible apparatus 100 can also have a crucible holding structure 108 that holds the crucible 104 within the housing 102.

The housing 102 may optionally have a radiation shield 102 s. The radiation shield 102s may, for example, prevent heat transfer from the crucible 104 through the housing 102. The jawset apparatus 100 may optionally have a gas supply structure 110. The gas supply structure 110 may have one or more gas outlets (e.g., in the form of gas distributors) that are, for example, directed at the crucible 104.

The tonger device 100 may optionally have a cover seal 112. The cover seal 112 may be provided to close or at least partially cover the steam outlet 102o when it should not be evaporated.

The power introduced into the evaporation material 106 by an electron beam (not shown) heats the evaporation material 106 and causes the evaporation material to eventually turn into the vapor phase (also referred to as evaporation of the evaporation material 106). The vaporized material 106 may exit the vapor outlet 102o and accumulate on a substrate (not shown), that is, a layer is formed thereon.

The housing 102, such as the housing slot 102w and/or the housing cover 102d, may alternatively be water cooled. The pincer pot 104 may alternatively or additionally be water cooled.

The cap seal 112 may optionally be water cooled.

The housing slot 102w and/or the housing cover 102d may have a cooling structure 1104, for example. The cooling structure 1104 may, for example, have one or more fluid lines, for example, provided by a double-walled housing tank 102w and/or a double-walled housing cover 102d cavity.

Fig. 2 shows a vacuum device 200 according to various embodiments, for example with a crucible device 100 and/or an evaporation crucible 104, in a schematic side view or cross-sectional view.

According to various embodiments, the vacuum device 200 comprises: a vacuum chamber 224 (also referred to as a vacuum treatment chamber or evaporation chamber) in which an evaporation region 224r is arranged, wherein the evaporation region 224r can have a space, for example, during operation of the vacuum apparatus 200. The vacuum chamber 224 may also have at least one (that is to say exactly one or more than one) impact region 224a, 224 b.

The vacuum apparatus 200 may also have at least one, that is to say exactly one or more than one, electron gun 122, which has, for example, an electron beam source 112q and a deflection system 142a for deflecting an electron beam 23 into at least one impact region 224a, 224 b. The electron beam source 112q may have an electron source (e.g., a cathode, such as a hot cathode) and an electron beam shaping element (e.g., an anode)

The deflection sequence may for example represent a series of nominal impact points and/or a nominal trajectory (also called nominal deflection trajectory) to which the electron beam 23 is directed (that is to say that the nominal impact points should be initiated by means of the electron beam 23.) the or each deflection sequence may define a trajectory 155 which is closed in itself or a series of nominal impact points 155 along a trajectory 155 which is closed in itself, which should be irradiated (so-called impact points 155) more generally describes impact points 155 of a deflection diagram (also called deflection diagram), such as may for example relate to deflection angles (α) (also called deflection sequences)_x(t),α_y(t)), the deflection angle is deflected by the electron beam 23 out of its rest position.

The or each crucible 104 may, for example, be arranged in a housing 102, which is then arranged in the vacuum chamber 224.

In the evaporation region 224r, the workpiece 202 to be coated can be arranged and/or transported, for example during evaporation of the evaporation material. The substrate 202 may, for example, have or be formed by a plate-shaped or strip-shaped substrate 202.

The substrate 202 may be fixedly disposed in the coated region 224 r. The substrate 202 may alternatively be transported along the transport path 111p in the coating region 224r, for example by means of a transport device. The transport device can, for example, have a plurality of transport rollers 282 that contact the substrate.

The spacing of the electron beam source 112q from the evaporation material and/or the housing 102 may, for example, be in the range of about 0.3m to about 5m, such as in the range of between about 1m to about 2 m. The target may alternatively or additionally be arranged in a vacuum, for example during irradiation and/or evaporation. The electron beam source 112q may provide an electron beam having a power of several kilowatts (kW), for example, an electron beam having a beam power in a range of about 1kW to about 1 MW.

One or more electron beam guns 122 may be powered by an energy supply 120. The energy supply 120 may, for example, provide an acceleration voltage and/or a cathode current of the electron beam gun 122. The acceleration voltage may be provided by means of a transformer of the energy supply 120.

According to various embodiments, the chamber housing 224, for example the or each vacuum chamber 224 provided within the chamber housing, may be arranged such that a pressure in the range of about 10mbar to about 1mbar (in other words a rough vacuum) may be provided therein, or a smaller pressure, for example in the range of about 1mbar to about 10mbar may be provided therein^-3A pressure in the mbar range (in other words a medium vacuum), or less, for example at about 10^-3mbar to about 10^-7A pressure in the mbar range (in other words a high vacuum), or less, e.g. a pressure less than a high vacuum, such as less than about 10^-7A pressure of mbar. For this purpose, the chamber housing 224 can be designed in a stable manner such that it is acted upon by the air pressure in the pumped-out state.

The chamber housing 224, for example the or each vacuum chamber 224 provided therein, can be joined with a supply device, as will be explained more precisely below.

Fig. 3A shows a supply device 300 (for example a subsequent supply device 350) according to various embodiments in a schematic side view or cross-sectional view and fig. 3B shows the supply device 300 in a schematic top view 300B.

The delivery device 300 may have a cradle 302 that may have parking regions, such as a first parking region 312 and a second parking region 314. Furthermore, the supply device 300 has one or more than one crucible carrier 304 for transporting the individual evaporator crucibles.

If the crucible carrier 304 is arranged in the first parking area 312, this crucible carrier can be brought into the first parking position. If the crockery carrier 304 is arranged in the second parking zone 314, this crockery carrier can be brought into a second parking position 314 p. More than one crochet carrier 304 may also be moved in a similar manner.

The stand 302 may have a movement structure 306 which is arranged such that the crockery carrier 304 can be moved 301 (also referred to as a first movement 301) between a first parking position 312p and a second parking position 314 p.

The displacement structure 306 and the or each pot carrier 304 are arranged relative to one another in such a way that the pot carrier 304 is mounted so as to be movable relative to the support 302. They may for example have one or more than one bearing element, which bearing elements provide bearings staggered with respect to each other.

The displacement structure 306 and the or each pot carrier 304 can be arranged relative to one another, for example, in such a way that the pot carrier 304 can be displaced flat on the displacement structure 306 and/or the displacement structure 306 guides the displacement 301 of the pot carrier 304, for example, along the displacement path 301.

The movement path 301 may for example be linear and/or parallel to the horizontal direction 101, 301. This simplifies the structural design.

The moving structure 306 may for example have a guiding system or may be formed by a guiding system, such as one or more guide rails or one or more further guiding elements (e.g. profile rail guiding structures). The moving structure 306 and/or the crockery carrier 304 may alternatively or additionally have one or more rolling bodies (e.g., wheels and/or rollers) and/or one or more sliding bodies.

The or each pot carrier 304 may, for example, have a chassis with a plurality of rolling bodies.

Other bearing elements may also be used to support the crockery carrier 304 on the moving structure 306.

The movement structure 306 and/or the crockery carrier 304 may optionally have a drive which can drive the movement. The drive can be, for example, an electric drive (e.g., an electric motor).

Furthermore, the moving structure 306 can be provided for moving 303 the pot carrier 304 to the side of the racks in the operating position 316p (also referred to as second moving 303), for example out of the first parking position 312p and/or the second parking position 314 p. The operating position 316p may, for example, be disposed in the vacuum chamber 224. To this end, the moving structure 306 may provide an additional moving path 303 towards the operating position 316 p.

The additional movement path 303 may for example be linear and/or parallel to the horizontal direction 101, 301. This simplifies the structural design.

The additional movement path 303 may for example be transverse to the movement path 301.

Fig. 4A shows a supply device 400 according to various embodiments in a schematic side view or in a cross-sectional view and fig. 4B shows the supply device 300 in a schematic top view 400 a.

The supply device 400 may be arranged as the supply device 300, but with the difference that the movement path 301 is curved (e.g. circular). The movement path 301 may alternatively be parallel to the horizontal direction 101, 301.

For this purpose, the displacement structure 306 can be supported, for example, in a rotatable manner, for example by means of a rotary bearing 402.

Fig. 5 shows a supply device 500 according to various embodiments in a schematic side view or in a cross-sectional view.

The supply device 500 may be arranged as the supply device 300 or 400, with the difference that the movement path 301 is parallel to the vertical direction 105 (or has at least one vertical direction component). This enables a space-saving structural design.

For this purpose, the displacement mechanism 306 can, for example, have a lifting device which displaces the pot carrier 304 along the displacement path 301.

The supply means 300 to 500 may also be arranged differently depending on the desired configuration and the prevailing edge conditions. The moving structure 306 may, for example, have a turntable and a lifting device to provide parking positions on multiple planes. The turntable and/or the lifting device may alternatively or additionally provide more than two parking positions, respectively.

Fig. 6A shows a supply device 600 according to various embodiments, for example one of the supply devices 300 to 500, in a schematic side view or cross-sectional view.

The supply device 600 may have a media supply 602 configured to provide a supply with one or more media. The one or more media may for example have one of the following media types: cooling fluid (e.g., cooling gas and/or cooling liquid), signal lines, and/or power supplies.

Reference is next made to the cooling fluid supply mechanism for a simpler understanding. The medium supply 602 can, for example, have or be formed by at least one cooling fluid supply 602.

The cooling fluid supply 602 may, for example, have a cooling fluid source and/or a cooling fluid reservoir. The cooling fluid supply mechanism 602 may optionally have a circulation device for circulating the cooling fluid. Thus, for example, one or more than one cooling circuit may be provided. The cooling fluid supply 602 may optionally have a heat sink, such as a heat exchanger, or at least be coupled to this heat sink.

The media supply 602 may have a supply interface 602t and a connection structure 602v coupled to the supply interface 602 t.

The connecting structure 602v may have one or more cooling fluid lines, such as one or more gas lines and/or one or more liquid lines.

The connection 602v may optionally have one or more corresponding media lines for supplying one or more additional media types. The connecting structure 602v may, for example, have one or more power supply lines to supply the drive of the vice-pan carrier 304. The connection structure 602v may optionally have one or more signal lines to actuate sensors of the crockery carrier 304 or of the evaporating crockery, as will be explained in more detail later.

The connecting structure 602v can be configured, for example, to be flexible or to be very long, so that this connecting structure can be connected and/or remain connected without interruption to the crockery carrier 304, for example, during a movement between these positions, in each of the parking positions 312p, 314p and the operating position 316 p.

Fig. 6B shows, in a schematic side view or cross-sectional view, a supply device 600 according to various embodiments in an arrangement 600B with two crucible carriers 304, 1304.

The supply device 600b may have a first crucible carrier 304 in the first parking position 312p or the second parking position 314 p. The supply device 600b may have a second crucible carrier 1304, which is then in the operating position 316 p.

The connecting structure 602v can be configured, for example, to be flexible or long, such that it is connected to the first crucible carrier 304 when the first crucible carrier is moved, for example, without interruption, in the first parking position 312p or in the second parking position 314p or between these two parking positions. The connecting structure 602v may provide a first cooling fluid circuit for the first pincer-pot carrier 304.

The connecting structure 602v may be configured, for example, to be flexible or long, such that it is connected to the second crucible carrier 1304 when the second crucible carrier 1304 is moved, for example, without interruption, in the operating position 316p or in the second parking position 314p or between these two positions. The connection structure 602v may provide a second cooling fluid circuit for the second vise pot carrier 1304.

Fig. 7A shows a supply device 700 according to various embodiments, for example one of the supply devices 300 to 600, in a schematic side view or cross-sectional view, and fig. 7B shows the supply device 700 at the time of the transfer 700B. The supply device 700 may have a crockery carrier 304, 1304, which is in a parking position, for example in the first/ second parking position 312p or 314 p.

The pot carriers 304, 1304 can have a displacement mechanism 702, by means of which a plurality of rolling elements 702w are rotatably mounted. By means of the displacement mechanism 702, for example, an evaporator pan can be supported, for example, on the displacement structure 306. The movement mechanism 702 may, for example, provide the cart 702 or a portion of the cart.

The movement mechanism 702 may facilitate movement into or out of the run position 316p and/or provide additional movement paths 303.

The mobile structure 306 alternatively or additionally has one or more chassis 704. The or each base 704 may have a support surface 704a on which the crockery carriers 304, 1304 may rest. The bearing surface 704a may have one or more guide elements (e.g., guide profiles) that provide additional travel paths 303. The or each chassis 704 may have a displacement mechanism by means of which a plurality of rolling bodies 704w are rotatably supported.

The mobile structure 306 may optionally have one or more than one guide element 706 (e.g., a guide profile) on which the chassis 704 may rest. The one or more guide elements 706 may provide the path of movement 303.

The chassis 704 may facilitate movement into or out of the park positions 314p, 312p and/or provide a path of movement 301.

The supply device (see fig. 7B) can have a crockery carrier 304, 1304, which is brought into or out of an operating position 700B (also referred to as a transfer 700B), for example an operating position 116 p.

The transfer 700b may have transferring the crockery carriers 304, 1304 between the rack 302 and the vacuum chamber 802. To this end, the vacuum chamber 802 may have a bearing surface 802f, for example provided by means of one or more guide elements that are flush with and/or at the level of the bearing surface 704a of the transfer structure 406.

Fig. 8A shows a supply device 800 according to various embodiments, for example one of the supply devices 300 to 700, in a schematic side view or in a cross-sectional view, and fig. 8B shows the supply device 800 at the time of transfer 800B.

The supply device 800 may have a crockery carrier 304, 1304, which is in a parking position, such as the parking position 312p or 314 p.

The pot carriers 304, 1304 can have a chamber door 802t, by means of which a matching chamber opening in the vacuum chamber 802 can be vacuum-tightly closed when the supply device 800 is in the operating position 116 p. The chamber door 802t may protrude from the movement mechanism 702 (e.g., in a vertical direction and/or in a horizontal direction). The chamber door 802t may, for example, overlap a chamber opening through which the movement mechanism passes. On the side facing the chamber opening, the chamber door 802t may have a sealing surface, by means of which the vacuum chamber is vacuum-tightly closed. The sealing surface can, for example, have a groove into which the sealing ring is inserted.

In order to compensate for the height differences caused by the excess height of the chamber door 802t, the displacement mechanism 306 can have a lifting device 814, by means of which the bearing surface 704a can be displaced in the vertical direction. When the pot carriers 304, 1304 are moved into or out of the operating position, the supporting surface 704a can be brought into a position in which this supporting surface 704a is flush with the supporting surface 802f of the vacuum chamber by means of the lifting device 814.

Fig. 9A shows a supply device 900 according to various embodiments, for example one of the supply devices 300 to 800, in a schematic side view or cross-sectional view, and fig. 9B shows the supply device 900 at the time of the transfer 900B.

The connecting structure 602v may have a connecting node 902, which is fixed or at least arranged in a positionally fixed manner on the mobile structure 306, for example on the chassis 704 of the mobile structure. The connection structure 602v may also have a (e.g., flexible) first connection structure section 612a (e.g., a chain or the like) that couples the supply interface 602t with the connection node 902. The connection structure 602v may also have a (e.g., flexible) second connection structure section 612b (e.g., a chain or the like) that couples the casserole carrier 304, 1304 (e.g., the cavity door 802t of the casserole carrier) with the connection node 902.

The first connecting structure section 612a can, for example, follow the first movement 301 of the pot carrier 304, 1304 into or out of the parking position 312p, 314 p. The second connecting structure section 612p can be moved into or out of the operating position 316p, for example, following the second movement 303 of the pot carrier 304, 1304. This enlarges the latitude for movement of the crockery carrier 304, 1304.

Fig. 10 shows a processing device 1000 according to various embodiments in a schematic top view.

The processing apparatus may have a vacuum apparatus 200 and a supply apparatus 350, such as one of the supply apparatuses 300 to 900.

The processing device 1000 may have a vacuum chamber 802 within which the coating chamber 224r is disposed. The vacuum chamber 224 may have one or more vacuum pumps 804 (e.g., a primary vacuum pump and/or an advanced vacuum pump) to provide a vacuum inside the vacuum chamber 224 and/or in the coating chamber 224 r.

The processing device 300a may also have a plurality of electron beam guns 122 arranged to irradiate the evaporant in the impact region 224 a.

The supply interface 602t (also referred to as a media feed point) can be provided in a fixed position relative to the vacuum chamber 802 and/or the pedestal 302.

In the or each parking position 312p, 314p, the first and/or second pot carrier 304, 1304 may have a spacing 1001a from the vacuum chamber 802. The spacing 1001a may be, for example, in the range of about 0.5m to about 1 m. Spacing 1001a may, for example, account for the irregular outer contour of vacuum chamber 802.

The moving structure 306 may optionally provide a transfer location 318 p. The second movement 303 may be performed, for example, between a transfer position 318p and a run position 316 p. The first movement 301 may be performed, for example, between a transfer position 318p and one or more parking positions 312p, 314 p.

The first movement 301 may, for example, move the evaporator crucible 104 a distance 1001d in the range of about 1m to about 10m, for example in the range of about 4.5m to about 4.8 m.

Fig. 11 shows a supply device 350 according to various embodiments in a schematic side view or cross-sectional view.

The supply device 350 may have a crockery carrier 304, 1304 and a crockery device 100 carried by means of said crockery carrier 304, 1304.

The connection node 902 may have a vacuum sleeve structure that extends, for example, through the chamber door 802 t. The vacuum sleeve arrangement may have one or more vacuum sleeves, each of which is assigned to a media type provided by the media supply 602. The vacuum sleeve structure may for example have or be formed by one or more cooling fluid vacuum sleeves, one or more signal vacuum sleeves and/or one or more power vacuum sleeves.

Each vacuum sleeve of the vacuum sleeve arrangement may have a respective media-type connection (e.g., a cooling fluid connection, an electrical connection, etc.) on the outside of the chamber door 802t (facing away from the evaporator pincer pot), to which the second connecting arrangement section 612p may be coupled.

The gas supply structure 110 can be coupled to the supply port 602t for example in a gas-conducting manner by means of a connecting node 902 (for example a vacuum sleeve structure). Alternatively or additionally, the cooling structure 1104 may be fluidly coupled to the supply port 602t via a connection node 902 (e.g., a vacuum sleeve structure).

A sensor device 1106 (e.g., having at least one pressure sensor and/or temperature sensor) may optionally be signally coupled with the supply interface 602t by way of a connection node 902 (e.g., a vacuum sleeve structure). A drive 1102 (e.g., which may have at least one electric motor) of the movement mechanism 702 may optionally be electrically coupled with the supply interface 602t via a connection node 902. The drive mechanism 1102 may, for example, provide movement of the chassis 704 relative to the mobile structure 306.

A medium supply 602 (e.g., a cooling fluid supply of the medium supply) may be provided for simultaneously supplying a plurality of crucible carriers 304, 1304 with a cooling fluid, e.g., a cooling liquid and/or a cooling gas. A media supply 602 (e.g., a signal supply of the media supply) may optionally be provided for simultaneously supplying a plurality of crockery carriers 304, 1304 with signals, e.g., control signals. A media supply 602 (e.g., a power supply of the media supply) may optionally be provided for simultaneously supplying a plurality of the skillet carriers 304, 1304 with electrical power, such as power current.

The plurality of vice-pan carriers 304, 1304 may have two, three, four, five, six, seven, eight, nine, ten, or more than ten vice-pan carriers 304, 1304.

When a plurality of skillet carriers are arranged in different positions, at least one of which is a run position, an alternative one is a transfer position and the remaining positions are park positions, the plurality of skillet carriers 304, 1304 can be supplied simultaneously.

When one or more than one of the plurality of crucible carriers 304, 1304 is changed in its position, for example, moved between the operating position and the transfer position, between the operating position and the parking position and/or between the transfer position and the parking position, the plurality of crucible carriers 304, 1304 can be supplied simultaneously.

It is therefore apparent that an evaporation crucible 104 can be provided which can be continuously supplied with at least cooling fluid by means of the crucible carrier 304, 1304. This makes it possible to remove the evaporation crucible 104 from the vacuum chamber 802 while still hot and to cool it outside the vacuum chamber 802.

The evaporator pincer-cooker 104 can obviously be embedded in a gas cushion by means of cooling gas, so that this evaporator pincer-cooker is separated from its surroundings (for example air) by means of the gas cushion. The cooling gas can for this purpose, for example, have an inert gas, such as argon, nitrogen or another gas which reacts slowly. The cooling gas may, for example, be free of oxygen.

The air cushion may be provided, for example, in the housing interior chamber 102 i. This enables less gas to be consumed because the housing 102 prevents gas from flowing out of the gas cushion. The air cushion may also be provided in other ways.

In other words, a gas cushion may be formed around the crucible 104, the gas cushion being arranged in a vacuum. The gas cushion can be separated from the vacuum gas by means of a housing. The gas cushion can alternatively be separated in another way from the vacuum gas in which the crucible is arranged.

Fig. 12 shows a method 1200 for operating a supply device, for example one of the supply devices 350, 300 to 900, in a schematic flow chart.

The method 1200 may have: in 1201, the evaporation material arranged in the first evaporator pan is heated in the vacuum chamber to a temperature at which the evaporation material changes into the gas phase, and in 1203 the first evaporator pan is removed from the vacuum chamber and the second evaporator pan is moved into the vacuum chamber before the evaporation material has cooled to less than half the temperature, and in 1205 the first evaporator pan is cooled by means of a (e.g. flowing) cooling fluid and/or a cooling fluid circuit during the movement and/or outside the vacuum chamber (e.g. during evaporation of the evaporation material out of the second evaporator pan).

Heating may be accomplished by one or more electron beams.

Heating 1201 can have the step of heating the vaporized material or a portion of the vaporized material to a temperature greater than 1500 ℃ (e.g., greater than about 2000 ℃, such as greater than about 2500 ℃, such as greater than about 3000 ℃).

The heating 1201 may optionally have: thermally evaporating the evaporation material arranged in the first and/or second evaporation pincer pots by means of one or more electron beams; the substrate may optionally be coated with an evaporation material, wherein, for example, thermal evaporation is carried out in a high vacuum.

The method 1200 may have: at 1203, the first evaporation pincer-pot is embedded in an air cushion, which separates the first evaporation pincer-pot from the vacuum surrounding the first evaporation pincer-pot. The gas cushion can be formed and/or circulated around the first evaporator crucible by means of a cooling gas.

The method 1200 may optionally have: at 1203, the first evaporation grip pot embedded in the air cushion is removed from the vacuum or vacuum chamber.

The method 1200 may optionally have: the substrate is coated with the evaporated evaporant.

The method 1200 can optionally be carried out according to an evaporation cycle which has thermal evaporation and coating in a first phase (also referred to as coating phase) and which has, in a second phase (also referred to as maintenance phase), evaporation material (and, for example, a crucible) embedded in an (for example, at least slightly flowing) gas cushion (having a pressure greater than the high vacuum) and the evaporation material cooled outside the vacuum chamber by means of the gas cushion. The first and second evaporator pans may be handled in accordance with one evaporation cycle, for example in a push-pull manner.

Next, an example related to the contents described previously and the contents shown in the drawings will be described.

Example 1 is a supply device having: two or more than two tong-pan carriers for transporting one steaming tong-pan each; a support having at least one parking region and a displacement mechanism, wherein the displacement mechanism is provided for displacing two or more evaporator pans (for example a first evaporator pan and a second evaporator pan) on the support such that the two or more evaporator pans can be brought simultaneously (for example arranged) into a parking position in the at least one parking region and (for example out of the parking position) alternately into a operating position in the vacuum chamber and/or next to the support; a cooling fluid supply mechanism configured to simultaneously supply cooling fluid to two or more of the crockery carriers when moving from the parking position into the operating position. In order to bring the two crucible carriers into the respective parking positions, the two crucible carriers can be moved, for example, simultaneously and/or successively, for example, out of and/or into the operating position.

Example 2 is the supply device according to example 1, wherein the cooling fluid supply means are further provided for simultaneously supplying the two or more crucible carriers with a cooling fluid when each of the two or more crucible carriers is in the parking position, wherein the cooling fluid supply means are provided for example for supplying a first crucible carrier with the first cooling fluid and simultaneously supplying a second crucible carrier with the second cooling fluid when a first and/or a second of the two or more crucible carriers is in the parking position.

Example 3 is the supply arrangement according to example 1 or 2, wherein the cooling fluid supply means are arranged for providing at least two separate cooling circuits by means of the cooling fluid (e.g. providing a first cooling circuit for the first pincer-pot carrier and a second cooling circuit for the second pincer-pot carrier).

Example 4 is the supply of any of examples 1-3, wherein at least one (e.g., each) of the two or more crucible carriers has a chamber door with a surrounding sealing surface; wherein the first crucible carrier has, for example, a first chamber door with a circumferential first sealing surface; and/or wherein the second crucible carrier has, for example, a second chamber door with a circumferential second sealing surface.

Example 5 is the supply apparatus according to example 4, wherein each chamber door of the two or more than two nipper pot carriers has a cooling fluid structure for coupling a cooling fluid supply mechanism; wherein the first chamber door, for example, has a first cooling fluid connection for coupling a cooling fluid supply mechanism; and/or wherein the second chamber door, for example, has a second cooling fluid connection for coupling a cooling fluid supply mechanism.

Example 6 is the supply apparatus according to any of examples 1-5, wherein at least one or each of the two or more than two crockery carriers further comprises: a pincer-pot housing providing a cavity to accommodate an evaporation pincer-pot.

Example 7 is the supply apparatus of example 6, wherein the crockery housing has a gas supply structure disposed therein and configured to be coupled with a cooling fluid supply mechanism.

Example 8 is the supply apparatus of example 7, wherein the cooling fluid junction is disposed on a side of the chamber door opposite the sealing face; wherein the first cooling fluid connection is arranged, for example, on the side of the first chamber door opposite the first sealing surface; and/or wherein the second cooling fluid connection is arranged, for example, on a side of the second chamber door opposite the second sealing face.

Example 9 is the supply 350 of any of examples 1-8, wherein at least one (e.g., each) of the two or more crucible carriers has a movement mechanism; wherein, the first tongued pot carrier is provided with a first moving mechanism for example; and/or wherein the second crucible carrier has, for example, a second movement mechanism that is different from the first movement mechanism.

Example 10 is the supply of any of examples 1-9, wherein the moving structure has a plurality of moving paths along which movement between the parked position and the run position can be accomplished.

Example 11 is the supply of example 10, wherein the mobile structure further comprises a guide system (e.g., a rail system) that provides a plurality of movement paths.

Example 12 is the supply arrangement according to any one of examples 1 to 11, wherein the moving structure has a lifting device for adjusting a vertical position in which the movement between the parking position and the operating position is performed.

Example 13 is the supply apparatus of any of examples 1-12, wherein the cooling fluid supply mechanism is configured to simultaneously supply two or more of the crockery carriers with additional cooling fluid that is different from the cooling fluid (e.g., in a condensed state).

Example 14 is the supply apparatus according to any one of examples 1 to 13, wherein the moving structure further includes: at least one (that is to say one or more than one) chassis for transporting each of the two or more than two crockery carriers; for example, a first chassis for transporting a first crucible carrier into and/or out of a first receiving region and a second chassis for transporting a second crucible carrier into and/or out of a second receiving region.

Example 15 is the supply of example 14, wherein at least one chassis has a lifting device for adjusting the transport height.

Example 16 is the supply of examples 9 or 15, wherein at least one chassis (e.g., the first chassis and/or the second chassis) has a drive for driving the transport.

Example 17 is the supply arrangement according to any one of examples 1 to 16, wherein at least one parking area has a plurality of parking areas (e.g. arranged at a distance from each other), wherein the movement structure is arranged such that two or more crockery carriers can be interchanged between the plurality of parking areas in their parking positions.

Example 18 is the supply apparatus of any of examples 1-17, wherein at least one (one or more) of the two or more than two colander carriers has a pressure sensor coupled to the cooling fluid supply; the cooling fluid supply is provided for controlling and/or regulating the supply of cooling fluid and/or additional cooling fluid by means of a pressure sensor.

Example 19 is the supply apparatus of any of examples 1-18, wherein the cooling fluid supply mechanism has a supply interface and a cooling fluid conduit coupled to the supply interface, wherein the supply interface is configured to be positionally fixed relative to the at least one parking area, for example; and wherein the cooling fluid line is provided, for example, for selectively delivering cooling fluid to the parking position and the operating position.

Example 20 is a supply apparatus, for example according to any one of examples 1 to 19, comprising: a support having a mobile structure and at least one parking area, wherein the at least one parking area provides a plurality of parking positions; wherein the movement structure is arranged in such a way that the evaporation pincer pots can move on the support between each of the plurality of parking positions and the operating position in the vacuum chamber; a cooling fluid supply having a supply port and a cooling fluid line coupled thereto, wherein the supply port is arranged to be positionally fixed relative to the at least one parking zone; and wherein the cooling fluid line is configured to selectively deliver cooling fluid to each of the plurality of parking positions and to each of the operating positions.

Example 21 is a supply device, for example according to any of examples 1 to 20, wherein one or more (for example each) of the two crucible carriers has a connection node (for example a vacuum jacket structure, for example with a cooling fluid vacuum jacket), wherein the connection node preferably has a cooling fluid connection for coupling a cooling fluid supply and/or a second cooling fluid connection for coupling an evaporating crucible transported by means of the crucible carrier, wherein the first cooling fluid connection and the second cooling fluid connection are arranged, for example, on mutually opposite sides of the connection node; the first cooling fluid connection and the second cooling fluid connection are in fluid-conducting connection with one another, for example, by means of a vacuum jacket structure (for example, a cooling fluid vacuum jacket).

Example 22 is a processing apparatus comprising: the supply apparatus according to any of examples 1 to 21, a vacuum chamber, wherein the vacuum chamber has a chamber opening into which a moving structure (e.g. a transport path of the moving structure) opens.

Example 23 is a method, for example, for operating a supply apparatus according to any one of examples 1 to 21, having: heating the evaporation material arranged in the first evaporation pincer pot to a temperature in the vacuum chamber, at which temperature the evaporation material changes into the gas phase; before the evaporation material is cooled to less than half of the temperature, the first evaporation pincer pot is removed from the vacuum chamber (e.g., on a pincer pot carrier) and the second evaporation pincer pot is moved into the vacuum chamber; the first evaporator crucible is cooled during the displacement by means of a cooling fluid, wherein the cooling fluid is supplied, for example, to the crucible carrier. If the evaporator crucible is, for example, a graphite crucible, this can be cooled indirectly with a cooling fluid, so that the evaporator crucible is not subjected to excessive thermally induced stresses. The cooling takes place, for example, indirectly in such a way that the evaporator pincer pot discharges heat/thermal radiation to a protective gas surrounding the evaporator pincer pot, which protective gas is arranged in a pincer pot housing, wherein the pincer pot housing is traversed by a cooling fluid. The removal of the heat radiation optionally also takes place on other components in the surroundings of the evaporator crucible. If the evaporator pincer pot is, for example, a copper pincer pot, this evaporator pincer pot can be cooled directly with a cooling fluid, for example, in such a way that the copper pincer pot is flowed through by the cooling fluid. The temperature of the evaporator pincer-pot can thus be kept as low as possible, for example below the melting point of copper.