阅读说明：本技术 一种循环蒸发散热的芯片冷却装置 (Circulating evaporation heat dissipation chip cooling device ) 是由 丁刚 于 2020-06-01 设计创作，主要内容包括：本发明公开了一种循环蒸发散热的芯片冷却装置,包括半导体,所述半导体固定连接在芯片右端面上,所述芯片固定连接在电路板右端面上,所述半导体右端面设有散热机构,所述散热机构包括第一水冷头,所述第一水冷头固定连接在所述半导体右端面上,本发明通过半导体对芯片进行散热,设置有冷凝水收集机构,解决了半导体冷端容易出现冷凝水的问题,对半导体热端通过水冷,风冷和蒸发冷三重散热,极大的提高了热端的散热效率。(The invention discloses a chip cooling device for circulating evaporation heat dissipation, which comprises a semiconductor, wherein the semiconductor is fixedly connected to the right end face of a chip, the chip is fixedly connected to the right end face of a circuit board, the right end face of the semiconductor is provided with a heat dissipation mechanism, the heat dissipation mechanism comprises a first water cooling head, and the first water cooling head is fixedly connected to the right end face of the semiconductor.)

1. The utility model provides a radiating chip cooling device of circulation evaporation, includes the semiconductor, its characterized in that: the semiconductor is fixedly connected on the right end face of the chip, the chip is fixedly connected on the right end face of the circuit board, the right end face of the semiconductor is provided with a heat dissipation mechanism, the heat dissipation mechanism comprises a first water-cooling head, the first water-cooling head is fixedly connected on the right end face of the semiconductor, a first water-cooling cavity is arranged in the first water-cooling head, a second water-cooling head is arranged on the right side of the first water-cooling head, a second water-cooling cavity is arranged in the second water-cooling head, the upper end of the first water-cooling cavity is communicated with the upper end of the second water-cooling cavity through an upper pipeline, the lower end of the first water-cooling cavity is communicated with the lower end of the second water-cooling cavity through a lower pipeline, a first circulating pump is arranged in the upper pipeline, the right end face of the second water-cooling head is fixedly provided with, in the evaporation space, ten cooling fins are uniformly and fixedly arranged on the right end face of the cooling plate, a rotating shaft is rotatably arranged between the upper inner side wall and the lower inner side wall of the evaporation space, forty fixing rods are uniformly and fixedly arranged on the rotating shaft, evaporation absorbent cotton is fixedly arranged on the fixing rods, a motor is fixedly arranged on the front end wall of the evaporation box body, a motor shaft is controlled by the motor, blades are fixedly arranged on the motor shaft and are arranged in the evaporation space, the motor is used as the center, four output connectors are uniformly arranged on the front end face of the evaporation box body, a recovery box is arranged on the right side of the front end of the evaporation box body, four input connectors are uniformly arranged on the front end face of the recovery box, a recovery cavity is arranged in the recovery box, and the recovery cavity is connected; four condensed water collecting mechanisms are arranged on the upper end face and the lower end face of the evaporation box body and the front side and the rear side of the left end face of the evaporation box body, each condensed water collecting mechanism comprises a collecting pipeline, the collecting pipelines are fixedly connected to the evaporation box body and communicated with the evaporation space, a sliding fixing piece is fixedly arranged on the left side of each collecting pipeline, far away from the side inner wall of the semiconductor body, a sliding rod is arranged in the sliding fixing piece in a sliding mode, an electromagnet is fixedly arranged close to the end face of the semiconductor, a magnet is fixedly arranged close to the end face of the semiconductor, absorbent cotton is fixedly arranged close to the end face of the semiconductor, and the magnet, far away from the end wall of the semiconductor; the quick-witted case is equipped with condensation mechanism outward, condensation mechanism includes the condensing box, the condensing box left end is equipped with four first joints, first joint respectively with output joint passes through the input pipeline and connects, be equipped with two circulation water cavities, two from top to bottom in the condensing box the circulation water cavity passes through the switch-on of communicating pipe, two terminal surfaces are equipped with top connection and lower clutch respectively about the condensing box, the top connection with the lower clutch switch-on circulation water cavity, the top connection with the lower clutch passes through the circulating pipe and connects, be equipped with the second circulating pump in the middle of the circulating pipe, the condensing box right-hand member face is equipped with four second joints, the second joint with first joint passes through the condenser pipe switch-on, the second joint respectively with input joint passes through the output pipeline and connects.

2. The chip cooling device of claim 1, wherein: the heat dissipation mechanism and the condensed water collection mechanism are arranged in the case, the condensation mechanism is arranged outside the case, and the first water-cooling cavity, the upper pipeline, the second water-cooling cavity and the lower pipeline are communicated and completely sealed.

3. The chip cooling device of claim 1, wherein: the evaporation box body drives the rotating shaft and the fixed rod to rotate without being influenced by the radiating fins, and ten drip tubes are respectively arranged right above the ten groups of evaporation absorbent cotton.

4. The chip cooling device of claim 1, wherein: the left end of the semiconductor is a cold end, and the right end of the semiconductor is a hot end.

Technical Field

The invention relates to the field of chip heat dissipation, in particular to a circulating evaporation heat dissipation chip cooling device.

Background

The chip is a large-scale integrated circuit, the heat power consumption is with several W to hundreds of W inequality, and the temperature that the chip can stable work most can not exceed 80 degrees centigrade, so must dispel the heat to the chip through the heat abstractor, just can make chip stable work, present radiating mode is mainly air cooling, water-cooling and the cold three kinds of semiconductor, these three kinds of radiating mode all have their drawback, cooling efficiency is not enough and the easy deposition of fan like air cooling, water-cooling reveals easily and leads to the circuit board short circuit to install troublesome, semiconductor cooling's cold junction produces the comdenstion water easily and leads to the circuit board to burn out.

Disclosure of Invention

The invention aims to solve the technical problem of providing a circulating evaporation heat dissipation chip cooling device, which overcomes the defects that the cooling efficiency of air cooling is not enough, and a circuit board is burnt out due to the fact that condensed water is easily generated at the cold end of semiconductor cooling.

The invention is realized by the following technical scheme.

The invention relates to a chip cooling device for circulating evaporation heat dissipation, which comprises a semiconductor, wherein the semiconductor is fixedly connected on the right end surface of a chip, the chip is fixedly connected on the right end surface of a circuit board, the right end surface of the semiconductor is provided with a heat dissipation mechanism, the heat dissipation mechanism comprises a first water cooling head, the first water cooling head is fixedly connected on the right end surface of the semiconductor, a first water cooling cavity is arranged in the first water cooling head, the right side of the first water cooling head is provided with a second water cooling head, a second water cooling cavity is arranged in the second water cooling head, the upper end of the first water cooling cavity is communicated with the upper end of the second water cooling cavity through an upper pipeline, the lower end of the first water cooling cavity is communicated with the lower end of the second water cooling cavity through a lower pipeline, a first circulating pump is arranged in the upper pipeline, the right end surface of the second water cooling head, an evaporation box body is fixedly arranged on the right end face of the heat dissipation plate to surround the evaporation space, and in the evaporation space, the right end face of the heat dissipation plate is uniformly and fixedly provided with ten heat dissipation plates, a rotating shaft is rotatably arranged between the upper inner side wall and the lower inner side wall of the evaporation space, forty fixed rods are uniformly fixed on the rotating shaft, evaporative absorbent cotton is fixed on the fixed rods, the front end wall of the evaporation box body is fixedly provided with a motor, the motor is controlled by a motor shaft, blades are fixedly arranged on the motor shaft and are arranged in the evaporation space, four output connectors are uniformly arranged on the front end surface of the evaporation box body by taking the motor as the center, a recovery box is arranged on the right side of the front end of the evaporation box body, four input connectors are uniformly arranged on the front end face of the recovery box, a recovery cavity is arranged in the recovery box, and the recovery cavity is connected with the evaporation space through ten dropper pipes; four condensed water collecting mechanisms are arranged on the upper end face and the lower end face of the evaporation box body and the front side and the rear side of the left end face of the evaporation box body, each condensed water collecting mechanism comprises a collecting pipeline, the collecting pipelines are fixedly connected to the evaporation box body and communicated with the evaporation space, a sliding fixing piece is fixedly arranged on the left side of each collecting pipeline, far away from the side inner wall of the semiconductor body, a sliding rod is arranged in the sliding fixing piece in a sliding mode, an electromagnet is fixedly arranged close to the end face of the semiconductor, a magnet is fixedly arranged close to the end face of the semiconductor, absorbent cotton is fixedly arranged close to the end face of the semiconductor, and the magnet, far away from the end wall of the semiconductor; the quick-witted case is equipped with condensation mechanism outward, condensation mechanism includes the condensing box, the condensing box left end is equipped with four first joints, first joint respectively with output joint passes through the input pipeline and connects, be equipped with two circulation water cavities, two from top to bottom in the condensing box the circulation water cavity passes through the switch-on of communicating pipe, two terminal surfaces are equipped with top connection and lower clutch respectively about the condensing box, the top connection with the lower clutch switch-on circulation water cavity, the top connection with the lower clutch passes through the circulating pipe and connects, be equipped with the second circulating pump in the middle of the circulating pipe, the condensing box right-hand member face is equipped with four second joints, the second joint with first joint passes through the condenser pipe switch-on, the second joint respectively with input joint passes through the output pipeline and connects.

Preferably, the heat dissipation mechanism and the condensed water collection mechanism are both arranged in a case, the condensation mechanism is arranged outside the case, and the first water-cooling cavity, the upper pipeline, the second water-cooling cavity and the lower pipeline are communicated and completely closed.

Preferably, the evaporation box body drives the rotating shaft and the fixing rod to rotate without being influenced by the radiating fins, and ten drip tubes are respectively arranged right above the ten groups of evaporation absorbent cotton.

Preferably, the left end of the semiconductor is a cold end, and the right end of the semiconductor is a hot end.

The invention has the beneficial effects that: the invention dissipates heat to the chip through the semiconductor, has a condensed water collecting mechanism, has solved the problem that the cold end of the semiconductor is apt to produce the condensed water, cool the hot end of the semiconductor through the water cooling, the air-cooled and evaporates the cold triple heat dissipation, has greatly raised the heat-dissipating efficiency of the hot end, secondly the air-cooled radiator fan of the invention is placed in the apparatus, through the filtration of the condensed water collecting mechanism, make the dust difficult to adhere to the fan, the efficiency of the air-cooled is not disturbed by the dust, in addition the water-cooling plant of the invention can be totally sealed and distributed in a small range, reduce the risk revealed to the lowest, separate integrated water-cooling equipment of arranging outside chassis in the chassis, have both increased the cooling range, have reduced the difficulty of installation.

Drawings

In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an embodiment of the present invention;

FIG. 2 is a schematic view of the embodiment of the present invention in the direction of A-A in FIG. 1;

FIG. 3 is a schematic view of the embodiment of the present invention in the direction B-B in FIG. 1;

FIG. 4 is a schematic view of the embodiment of the present invention in the direction of C-C in FIG. 2;

FIG. 5 is an enlarged view of the embodiment of the present invention at D in FIG. 3.

Detailed Description

The invention will now be described in detail with reference to fig. 1-5, wherein for ease of description the orientations described hereinafter are now defined as follows: the up, down, left, right, and front-back directions described below correspond to the up, down, left, right, and front-back directions in the projection relationship of fig. 1 itself.

The chip cooling device with circulating evaporation heat dissipation described in conjunction with fig. 1-5 includes a semiconductor 13, the semiconductor 13 is fixedly connected to the right end face of a chip 12, the chip 12 is fixedly connected to the right end face of a circuit board 11, the right end face of the semiconductor 13 is provided with a heat dissipation mechanism 90, the heat dissipation mechanism 90 includes a first water cooling head 14, the first water cooling head 14 is fixedly connected to the right end face of the semiconductor 13, a first water cooling cavity 15 is provided in the first water cooling head 14, a second water cooling head 19 is provided on the right side of the first water cooling head 14, a second water cooling cavity 20 is provided in the second water cooling head 19, the upper end of the first water cooling cavity 15 is communicated with the upper end of the second water cooling cavity 20 through an upper pipeline 17, the lower end of the first water cooling cavity 15 is communicated with the lower end of the second water cooling cavity 20 through a lower pipeline 21, a first circulating pump 18 is provided in the upper, the right end face of the second water cooling head 19 is fixedly provided with a heat dissipation plate 22, the right side of the heat dissipation plate 22 is provided with an evaporation space 28, the right end face of the heat dissipation plate 22 is fixedly provided with an evaporation box body 24 to surround the evaporation space 28, the right end face of the heat dissipation plate 22 is uniformly and fixedly provided with ten heat dissipation plates 23, a rotating shaft 25 is rotatably arranged between the upper inner side wall and the lower inner side wall of the evaporation space 28, the rotating shaft 25 is uniformly and fixedly provided with forty fixing rods 26, the fixing rods 26 are fixedly provided with evaporation absorbent cotton 27, the front end wall of the evaporation box body 24 is fixedly provided with a motor 40, the motor 40 is controlled to be provided with a motor shaft 41, the motor shaft 41 is fixedly provided with blades 42 arranged in the evaporation space 28, the motor 40 is taken as the center, the front end face of the evaporation box body 24 is uniformly provided with four output connectors 43, four input connectors 47 are uniformly arranged on the front end face of the recovery box 60, a recovery cavity 61 is arranged in the recovery box 60, and the recovery cavity 61 is connected with the evaporation space 28 through ten dropper pipes 62; four condensed water collecting mechanisms 91 are arranged on the upper end face and the lower end face of the evaporation box body 24 and the front side and the rear side of the left end face of the evaporation box body 24, each condensed water collecting mechanism 91 comprises a collecting pipeline 29, each collecting pipeline 29 is fixedly connected to the evaporation box body 24 and communicated with the evaporation space 28, the inner wall of the left side of each collecting pipeline 29, far away from the corresponding semiconductor 13, is fixedly provided with a sliding fastener 31, each sliding fastener 31 is internally provided with a sliding rod 30 in a sliding manner, each sliding fastener 31 is fixedly provided with an electromagnet 33, close to the corresponding semiconductor 13, each sliding rod 30 is fixedly provided with a magnet 34, close to the corresponding semiconductor 13, each magnet 34 is fixedly provided with absorbent cotton 35, close to the corresponding semiconductor 13, and each magnet 34 is fixedly connected with the end wall, far; a condensing mechanism 92 is arranged outside the chassis, the condensing mechanism 92 comprises a condensing box 70, four first joints 44 are arranged at the left end of the condensing box 70, the first joint 44 is respectively connected with the output joint 43 through an input pipeline 72, two circulating water chambers 51 are arranged in the condenser tank 70 from top to bottom, the two circulating water chambers 51 are communicated through a communicating pipe 52, the upper and lower end surfaces of the condensation tank 70 are respectively provided with an upper joint 48 and a lower joint 49, the upper joint 48 and the lower joint 49 are communicated with the circulating water cavity 51, the upper joint 48 and the lower joint 49 are connected by a circulation pipe 71, a second circulation pump 50 is provided in the middle of the circulation pipe 71, four second joints 46 are arranged on the right end face of the condensation tank 70, the second joints 46 are communicated with the first joints 44 through condensation pipes 45, the second connectors 46 are respectively connected to the input connectors 47 via output lines 73.

Advantageously, the heat dissipating mechanism 90 and the condensed water collecting mechanism 91 are both disposed in the chassis, the condensing mechanism 92 is disposed outside the chassis, and the first water-cooling cavity 15, the upper pipeline 17, the second water-cooling cavity 20 and the lower pipeline 21 are communicated and completely sealed.

Advantageously, the evaporation box 24 drives the rotation shaft 25 and the fixing rod 26 to rotate, without being affected by the heat sink 23, and ten of the droppers 62 are respectively disposed right above ten groups of the evaporation absorbent cotton 27.

Advantageously, the semiconductor 13 has a cold side at the left end and a hot side at the right end.

In the initial state, the spring 32 is in a stretched state, and the first water cooling chamber 15, the upper pipe 17, the second water cooling chamber 20 and the lower pipe 21 are filled with the coolant.

The chip 12 heats, the semiconductor 13 is electrified, the first circulating pump 18 is electrified, the cooling liquid in the closed space of the first water-cooling cavity 15, the upper pipeline 17, the second water-cooling cavity 20 and the lower pipeline 21 is circulated, the heat at the hot end of the semiconductor 13 is carried away to the heat dissipation plate 22, the heat dissipation plate 22 is further dissipated by the heat dissipation plate 23, the electromagnet 33 is electrified alternately, the repelling magnet 34 drives the absorbent cotton 35 to approach and contact the semiconductor 13, the spring 32 stretches, the electromagnet 33 is powered off, the absorbent cotton 35 returns to the initial position under the action of the spring 32, the electromagnet 33 is electrified and powered off alternately and repeatedly, the absorbent cotton 35 moves up and down continuously, the condensed water at the cold end of the semiconductor 13 and near the chip 12 and the circuit board 11 is carried away by the absorbent cotton 35 in the up-and-down movement process of the absorbent cotton 35, the motor 40 is electrified, the motor shaft 41 is controlled to drive, the evaporation of condensed water in the absorbent cotton 35 is accelerated, the wet air near the absorbent cotton 35 is absorbed through the collecting pipeline 29, and absorbs the heat radiated from the radiation fins 23 into the condensation duct 45 through the input duct 72, the second circulation pump 50 is activated to circulate the cooling water in the circulation water chamber 51 and the circulation duct 71 to condense the hot and humid air in the condensation duct 45, the condensed water flows into the recovery chamber 61 through the output duct 73, the water is dripped on the evaporation absorbent cotton 27 through the drip pipe 62, the weight of the dripped evaporation absorbent cotton 27 is increased, the evaporation absorbent cotton 27 starts to rotate clockwise, the evaporation absorbent cotton 27 rotates to the middle of the radiating fin 23, the water in the evaporation absorbent cotton 27 is evaporated by the heat radiated from the radiating fin 23, the heat is taken away by evaporation, the water is sucked into the condensing tube 45 by the blade 42 again for condensation, the evaporation circulation is realized, after the chip 12 does not need to radiate heat any more, the first circulation pump 18, the motor 40, the second circulation pump 50 and the electromagnet 33 are de-energized.

The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.