阅读说明：本技术 一种用于芯片镀膜工艺的治具拼接结构 (Jig splicing structure for chip coating process ) 是由 蒋海兵 于 2020-02-17 设计创作，主要内容包括：本发明揭示了一种用于芯片镀膜工艺的治具拼接结构,包括避镀治具,所述避镀治具上设置有第一隔条和第二隔条,所述第一隔条和第二隔条相互垂直设置,并在所述避镀治具的工作面上形成若干个用于安放镀膜治具的工作位,所述工作位的尺寸与镀膜治具的尺寸相同,所述镀膜治具的上表面边缘向外延伸形成一延展部,安放好的镀膜治具的延展部之间的间距小于0.5mm。本发明由于采用了避镀治具和镀膜治具进行搭配,采用小间隙法进行避镀,避镀效果好,在不需要改进工艺的基础上能够直接使用,且生产陈本低廉,提升整体效益。(The invention discloses a jig splicing structure for a chip coating process, which comprises a coating avoiding jig, wherein a first parting bead and a second parting bead are arranged on the coating avoiding jig, the first parting bead and the second parting bead are mutually and vertically arranged, a plurality of working positions for placing coating jigs are formed on the working surface of the coating avoiding jig, the size of each working position is the same as that of the coating jig, the edge of the upper surface of the coating jig extends outwards to form an extension part, and the distance between the extension parts of the placed coating jigs is smaller than 0.5 mm. The invention adopts the plating avoiding jig and the film coating jig for matching, adopts a small clearance method for avoiding plating, has good plating avoiding effect, can be directly used on the basis of not needing to improve the process, has low production cost and improves the overall benefit.)

1. The utility model provides a tool mosaic structure for chip coating process which characterized in that: including keeping away to plate tool (800), it is provided with first parting bead (810) and second parting bead (820) to keep away on plating tool (800), first parting bead (810) and second parting bead (820) mutually perpendicular set up, and keep away to form work position (830) that a plurality of is used for laying the coating film tool on the working face of plating tool (800), the size of work position (830) is the same with the size of coating film tool for the coating film tool just puts into in work position (830), the upper surface edge of coating film tool outwards extends and forms an extension portion, and the interval between the extension portion of the coating film tool of laying is less than 0.5 mm.

2. The jig splicing structure of claim 1, wherein: the edge of the plating avoiding jig (800) protrudes upwards, and the first division bar (810) and the second division bar (820) are arranged at the concave position in the middle of the flange of the plating avoiding jig (800).

3. The jig splicing structure of claim 2, wherein the number of the first division bars (810) is two, the number of the second division bars (820) is nine, the first division bars (810) divide the concave position of the plating avoiding jig (800) into three parts, the number of the second division bars (820) is three, each group divides the empty position divided by the first division bars (810) into four parts, the working positions (830) are formed, and the working positions (830) are in a rectangular array of 3 × 4.

4. The jig splicing structure of claim 1, wherein: the coating jig comprises a jig body (100); the jig comprises a jig body (100), a plurality of chip grooves (200), a plurality of pin grooves (300) and a plurality of pin grooves (200), wherein the chip grooves (200) are arranged on the top surface of the jig body (100) in an array mode, and the center of the bottom wall of each chip groove (200) is provided with the pin groove (300) penetrating through the jig body (200); the thimble groove (300) comprises a needle outlet hole (310) arranged at the center of the bottom wall of the chip groove (200) and a needle inlet hole (320) arranged at the bottom surface of the jig body (100); the first wire groove group (400) is arranged on the top surface of the coating jig and comprises a longitudinal wire groove (410) and a transverse wire groove (420), the longitudinal wire groove (410) is arranged between two rows of chip grooves (200) which are adjacent left and right, and the transverse wire groove (420) is arranged between two rows of chip grooves (200) which are adjacent up and down; the second wire groove group (500) is arranged on the bottom surface of the jig body (100) and comprises a plurality of sections of connecting wire grooves (510), and two adjacent wire inlet holes (320) are respectively connected to two ends of each connecting wire groove (510).

5. The jig splicing structure of claim 4, wherein: the coating jig further comprises a grabbing hole (700) used for grabbing to perform feeding and discharging operations by the clamping jaw, and the grabbing hole (700) is formed in the extending portion of the jig body (100).

6. The jig splicing structure of claim 5, wherein: and a counter bore (830) corresponding to the grabbing hole (700) is arranged on the second division bar (820).

7. The jig splicing structure of claim 5, wherein: the upper surface of the coating jig is also covered with blue gel (900).

8. The jig splicing structure of claim 7, wherein: an opening (910) is arranged at the position of the blue gel (900) corresponding to the grabbing hole (700).

9. The jig splicing structure of claim 8, wherein: the length of the opening (910) is consistent with that of the grabbing hole (700), and the two ends of the opening (910) are in a shape of Chinese character 'mi'.

10. The jig splicing structure of claim 1, wherein: the distance between the extension parts of the placed film coating jigs is less than 0.1 mm.

Technical Field

The invention relates to a jig structure in a chip coating process, in particular to a jig splicing structure for the chip coating process.

Background

When a chip is produced, the chip needs to be coated, the current chip coating process generally adopts sputtering, proper inert gas is introduced as a medium in a vacuum environment, the inert gas is accelerated to impact a target material, so that atoms on the surface of the target material are impacted, and a coating film is formed on the surface. Because of the technical characteristics of sputtering, the fixture and the chip are easily polluted, so that NG products are generated, the plating is generally avoided by improving the process, the cost of the improved process is too high, and the required time is long, so that a fixture splicing structure capable of solving the problem that the fixture and the chip are easily polluted is needed.

Disclosure of Invention

The invention mainly aims to provide a jig splicing structure for a chip coating process, which solves the problem that a jig and a chip are easily polluted in a sputtering process.

The invention provides a jig splicing structure for a chip coating process, which comprises a coating avoiding jig, wherein a first parting bead and a second parting bead are arranged on the coating avoiding jig, the first parting bead and the second parting bead are mutually and vertically arranged, a plurality of working positions for placing coating jigs are formed on a working surface of the coating avoiding jig, the size of each working position is the same as that of the coating jig, the edge of the upper surface of the coating jig extends outwards to form an extension part, and the distance between the extension parts of the placed coating jigs is smaller than 0.5 mm.

As a further scheme of the invention: the edge of the plating avoiding jig protrudes upwards, and the first division bar and the second division bar are arranged at the concave position in the middle of the flange of the plating avoiding jig.

According to a further scheme of the invention, the number of the first division bars is two, the number of the second division bars is nine, the first division bars divide the concave position of the plating avoiding jig into three parts, the number of the second division bars is three, and each group divides the vacancy divided by the first division bars into four parts to form the working positions, so that the working positions are in a rectangular array of 3 × 4.

As a further scheme of the invention: the coating jig comprises a jig body; the chip grooves are arranged on the top surface of the jig body in an array mode, and a thimble groove penetrating through the jig body is formed in the center of the bottom wall of each chip groove; the thimble groove comprises a needle outlet hole arranged at the center of the bottom wall of the chip groove and a needle inlet hole arranged at the bottom surface of the jig body; the first wire groove group is arranged on the top surface of the film coating jig and comprises a longitudinal wire groove and a transverse wire groove, the longitudinal wire groove is arranged between two rows of chip grooves which are adjacent left and right, and the transverse wire groove is arranged between two rows of chip grooves which are adjacent up and down; the second wire groove group is arranged on the bottom surface of the jig body and comprises a plurality of sections of connecting wire grooves, and two adjacent wire inlet holes are respectively connected to two ends of each connecting wire groove (510).

As a further scheme of the invention: the coating jig further comprises a grabbing hole used for grabbing to perform feeding and discharging operations by the clamping jaw, and the grabbing hole is formed in the extending portion of the jig body.

As a further scheme of the invention: and counter bores corresponding to the grabbing holes are arranged on the second parting strips.

As a further scheme of the invention: blue glue covers the upper surface of the coating jig.

As a further scheme of the invention: an opening is formed in the position, corresponding to the grabbing hole, of the blue gel.

As a further scheme of the invention: the length of the opening is consistent with that of the grabbing hole, and the two ends of the opening are in a shape of a Chinese character 'mi'.

As a further scheme of the invention: the distance between the extension parts of the placed film coating jigs is less than 0.1 mm.

The invention has the beneficial effects that: the invention adopts the plating avoiding jig and the film coating jig for matching, adopts a small clearance method for avoiding plating, has good plating avoiding effect, can be directly used on the basis of not needing to improve the process, has low production cost and improves the overall benefit.

Drawings

FIG. 1 is a schematic structural view of a jig according to the present invention;

FIG. 2 is an enlarged view at A in FIG. 1;

FIG. 3 is a second perspective view of the jig of the present invention;

FIG. 4 is a schematic structural view of a splice structure provided by the present invention;

fig. 5 is a schematic structural diagram of a blue gel provided by the present invention.

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

As shown in fig. 1 to 5, the jig splicing structure for a chip coating process provided by the present invention includes a plating avoiding jig 800, the plating avoiding jig 800 is provided with a first division bar 810 and a second division bar 820, the first division bar 810 and the second division bar 820 are perpendicular to each other, and a plurality of working positions 830 for placing coating jigs are formed on a working surface of the plating avoiding jig 800, as shown in fig. 4, the working positions 830 are square grids, the size of the working positions 830 is the same as that of the coating jigs, so that the coating jigs are just placed in the working positions 830, the upper surface edges of the coating jigs extend outward to form an extension portion, the distance between the extension portions of the placed coating jigs is less than 0.5mm, and the sputtering material is prevented from contaminating the bottom of the coating jigs and the chips by using a very small distance. When the coating device works, a plurality of coating jigs are placed in the working position 830, the extension parts of the coating jigs are erected on the first parting strips 810 and the second parting strips 820, and preferably, sealing strips with soft rubber texture can be arranged at the positions where the extension parts of the coating jigs are in contact with the parting strips, so that the coating avoiding effect is enhanced.

The edge of the plating avoiding jig 800 protrudes upwards, the first parting bead 810 and the second parting bead 820 are disposed at the concave position in the middle of the flange of the plating avoiding jig 800, and correspondingly, the distance between the extending part of the film plating jig adjacent to the flange of the plating avoiding jig 800 and the extending part of the film plating jig is equal to the distance between the extending parts of the two film plating jigs.

The number of the first division bars 810 is two, the number of the second division bars 820 is nine, the recessed positions of the plating avoiding jig 800 are divided into three parts by the first division bars 810, the number of the second division bars 820 is three, and each group divides the vacant positions divided by the first division bars 810 into four parts to form the working positions 830, so that the working positions 830 are in a rectangular array of 3 × 4.

The coating jig further comprises a grabbing hole 700 for grabbing the clamping jaw to perform loading and unloading operations, the grabbing hole 700 is arranged at the extending part of the jig body 100, and the grabbing hole 700 is a long-strip-shaped through hole.

The counter bore 830 corresponding to the grabbing hole 700 is arranged on the second parting bead 820, and the counter bore 830 is that when the coating jig is grabbed, a mechanical clamping jaw and the like need to pass through the grabbing hole 700 to grab, and the extending part of the coating jig is in contact with the parting bead, so that a clearance needs to be provided for the mechanical clamping jaw to avoid interference.

The upper surface of the coating jig is also covered with blue glue 900, and the blue glue is a layer of glue film used for bonding the chip on the coating jig when the chip is coated with a film and has the effect similar to a double-sided adhesive tape.

The position department that blue glue 900 corresponds grabbing hole 700 is provided with opening 910, and general blue glue 900 can cover the upper surface of whole coating film tool, including the extension portion of coating film tool, has also covered grabbing hole 700 simultaneously, consequently need set up opening 910 in relevant position department, makes things convenient for mechanical clamping jaw to snatch the coating film tool, and the structure of full coverage has simultaneously also avoided grabbing hole 700 to become the culprit of polluting the coating film tool bottom.

The length of the opening 910 is the same as the length of the grasping hole 700, and the two ends of the opening 910 are arranged in a shape of a Chinese character 'mi'.

The distance between the extending parts of the mounted coating jig is less than 0.1mm, and theoretically, the smaller the distance is, the better, but in consideration of the processing cost, the distance is preferably 0.1 mm.

The coating jig comprises a jig body 100, a chip groove 200, a thimble groove 300, a first wire groove group 400 and a second wire groove group 500.

Wherein, a plurality of chip slots 200 are arranged on the top surface of the jig body 100 in an array, and the center of the bottom wall of each chip slot 200 is provided with an ejector pin slot 300 penetrating through the jig body 200; chip groove 200 is used for placing the chip, and the usable floor area that can each coating film tool is promoted by chip groove 200 array setting by the at utmost, so not only save the cost, can raise the efficiency moreover.

The thimble groove 300 includes a needle outlet 310 disposed at the center of the bottom wall of the chip groove 200 and a needle inlet 320 disposed at the bottom surface of the jig body 100, and after the chip is sputtered on the coating jig, the thimble enters from the needle inlet 320 and exits from the needle outlet 310 to eject the chip for blanking.

The first wire groove group 400 is arranged on the top surface of the coating jig and comprises a longitudinal wire groove 410 and a transverse wire groove 420, the longitudinal wire groove 410 is arranged between two rows of chip grooves 200 which are adjacent left and right, the transverse wire groove 420 is arranged between two rows of chip grooves 200 which are adjacent up and down, and the first wire groove group is arranged on the top surface of the jig body, so that air between a glue surface and the chip grooves is discharged to the outside from the first wire groove group when blue glue is adhered from the gluing jig in the gluing process.

On the bottom surface of tool body 100 was located to second wire casing group 500, second wire casing group 500 included multistage connecting wire casing 510, and two adjacent needle holes 320 were connected respectively at the both ends of connecting wire casing 510, made through setting up second wire casing group in tool body bottom surface and arranged the air between thimble and the thimble groove to the external world at thimble unloading in-process, so not only promoted chip production's yields, but also improved machining efficiency, increased the life of thimble.

Furthermore, the film coating jig for the semiconductor chip further comprises a positioning through hole 600, the positioning through hole 600 is arranged on the top surface of the film coating jig, and the positioning through hole 600 is used for being inserted and positioned with the positioning column on the rubberizing jig, so that the rubberizing accuracy is ensured, and material waste and time loss caused by misoperation are prevented.

Further, in an embodiment provided by the present invention, the chip to be plated is square, so that the distance between the chip grooves 200 in two adjacent rows on the left and right is equal to the distance between the chip grooves 100 in two adjacent rows on the top and bottom, and certainly, the chip board may be rectangular or circular instead of being square, and then the chip grooves 100 are matched therewith.

Furthermore, the distance between the two rows of chip grooves 200 adjacent to each other on the left and right and the distance between the two rows of chip grooves 100 adjacent to each other on the upper and lower sides have a value ranging from 0.9mm to 1.1mm, and the distance in the preferred embodiment of the present invention is 1mm, because if the distance is too small, the process requirement is high, the input cost is increased, and the first wire groove group 400 is relatively designed to be narrow due to position limitation, so that the exhaust effect is not good, and if the distance is too large, the effective use area utilization rate of the film coating jig is not high, so that the cost is increased, the film coating efficiency is reduced, and therefore, setting the distance to 1mm is a preferred embodiment which integrates the two factors.

Further, two ends of the connecting wire groove 510 may be respectively connected to two vertically adjacent needle inlet holes 320, may also be respectively connected to two horizontally adjacent needle inlet holes 320, and may also be respectively provided with the connecting wire groove 510 between two vertically adjacent needle inlet holes 320 and between two horizontally adjacent needle inlet holes 320; according to the invention, two ends of the connecting wire slot 510 are preferably respectively connected with the two vertically adjacent needle inlet holes 320, and the die sinking cost can be saved by the shortest total length of the wire slot.

The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.