阅读说明：本技术 一种igbt控制器自冷散热器 (Self-cooling radiator of IGBT (insulated Gate Bipolar transistor) controller ) 是由 夏彬 贺智威 于 2020-04-30 设计创作，主要内容包括：本发明公开一种IGBT控制器自冷散热器,包括水冷板、冷凝器和水冷管道,所述冷凝器设置于所述水冷板的上方,所述水冷板内填充有冷却液,所述冷凝器的内部抽真空处理,所述冷凝器的上表面安装有若干第一散热片,所述水冷管道的两端分别连通所述水冷板和冷凝器。本设计结构简单科学,占用空间小,采用了冷凝器内部抽真空的方案,在水冷板上挤出铝翅片增加散热面积使之与空气进行自然对流,同时在冷凝器表面增加散热片,使用冷却风扇对散热片进行散热以达到对控制器进行冷却的效果,适于推广应用。(The invention discloses a self-cooling radiator of an IGBT (insulated gate bipolar transistor) controller, which comprises a water-cooling plate, a condenser and a water-cooling pipeline, wherein the condenser is arranged above the water-cooling plate, cooling liquid is filled in the water-cooling plate, the interior of the condenser is vacuumized, a plurality of first cooling fins are arranged on the upper surface of the condenser, and two ends of the water-cooling pipeline are respectively communicated with the water-cooling plate and the condenser. This design simple structure science, occupation space is little, has adopted the inside evacuation's of condenser scheme, extrudes aluminium fin on the water-cooling board and increases heat radiating area and make it carry out natural convection with the air, increases the fin on the condenser surface simultaneously, uses cooling fan to dispel the heat in order to reach and carries out refrigerated effect to the controller, is suitable for popularization and application.)

1. The utility model provides a IGBT controller self-cooling radiator, its characterized in that, includes water-cooling board, condenser and water-cooling pipeline, the condenser set up in the top of water-cooling board, the water-cooling inboard intussuseption is filled with the coolant liquid, the inside evacuation of condenser is handled, the last surface mounting of condenser has a plurality of first fin, the both ends of water-cooling pipeline communicate respectively water-cooling board and condenser.

2. The self-cooling radiator for the IGBT controller as claimed in claim 1, wherein said condenser has a plurality of heat-dissipating studs formed on the upper surface thereof, each of said first heat-dissipating fins has a mounting hole for engaging said heat-dissipating stud, and said first heat-dissipating fins are mounted on said heat-dissipating studs at intervals from top to bottom.

3. The IGBT controller self-cooling radiator according to claim 1 or 2, wherein the first cooling fin is wavy.

4. The IGBT controller self-cooling radiator according to claim 1 or 2, wherein the first heat dissipation fin is in interference fit with the heat dissipation column, and a thermal grease is applied to the joint of the first heat dissipation fin and the heat dissipation column.

5. The IGBT controller self-cooling radiator according to claim 1 or 2, further comprising a cooling fan mounted on said condenser and blowing cooling to said first heat sink.

6. The self-cooling radiator for the IGBT controller as claimed in claim 1 or 2, wherein the water-cooling plate is composed of a water-cooling plate shell and a water-cooling plate base plate, the water-cooling plate shell and the water-cooling plate base plate are welded by friction stir welding, and the water-cooling plate base plate is provided with a second cooling fin.

7. The self-cooling radiator for the IGBT controller as claimed in claim 6, wherein the water-cooled plate base plate and the second heat sink plate are integrally extruded by an aluminum extrusion process.

8. The IGBT controller self-cooling radiator according to claim 6, wherein the bottom of the condenser is soldered to the second heat sink.

9. The IGBT controller self-cooling radiator according to claim 2, wherein the condenser is composed of a condenser shell and a condenser top plate, the condenser shell and the condenser top plate are welded by friction stir welding, and the heat-radiating column is welded on the condenser top plate by brazing.

Technical Field

The invention relates to the field of radiator structures, in particular to a self-cooling radiator of an IGBT (insulated gate bipolar transistor) controller.

Background

Insulated Gate Bipolar Transistor (IGBT) heat dissipation performance of a motor controller and becomes an important factor affecting safety, reliability and dynamic performance of a motor and even an electric vehicle. Because the integration of the motor controller is smaller and smaller at present, the heat flux density is larger and larger. Therefore, the cooling of the motor controller is important, and the use effect and the service life of the motor controller are influenced. At present, most of controller radiators on the market adopt natural cooling, air cooling and water cooling, the scheme that the radiators are tightly attached to the controller is adopted in the natural cooling, a layer of high-heat-conductivity silicone grease is smeared between the radiators and the controller, thermal contact resistance is reduced, the controller transfers heat to the radiators, the radiators transfer the temperature of a radiator substrate to fins through heat conduction, and the fins and air carry out natural convection to take away the heat. The liquid cooling radiator conducts heat of the controller to cooling liquid through the water cooling plate, and the cooling liquid is cooled through the water pump or the water cooling unit so as to achieve the effect of recycling of the cooling liquid. But the natural cooling radiating efficiency is low, and the carried heat is less; the water-cooled radiator needs an external circulating water pump or a water chilling unit, so that the heat dissipation effect is good, the power consumption is increased, the installation difficulty and the maintenance difficulty are increased, meanwhile, the integration level is low, and the occupied area is large.

Disclosure of Invention

The invention aims to overcome the problems mentioned in the prior art, and provides a self-cooling radiator for an IGBT controller.

The technical scheme adopted by the invention for solving the technical problems is as follows: the utility model provides a IGBT controller self-cooling radiator, includes water-cooling board, condenser and water-cooling pipeline, the condenser set up in the top of water-cooling board, the water-cooling inboard intussuseption is filled with the coolant liquid, the inside evacuation of condenser is handled, the last surface mounting of condenser has a plurality of first fin, the both ends of water-cooling pipeline communicate respectively water-cooling board and condenser. Because the condenser of inside evacuation has been linked together the cooling runner of water-cooling board, has reduced the boiling point of coolant liquid (water), makes the coolant liquid gasify more easily in order to take away more heats to the condenser, takes away the heat through the fin heat dissipation of condenser, and the coolant liquid (water) flows back to water-cooling board department and forms the circulation after condenser heat dissipation liquefaction.

Furthermore, a plurality of heat dissipation columns are formed on the upper surface of the condenser, each first heat dissipation sheet is provided with a mounting hole matched with the heat dissipation column, and the first heat dissipation sheets are mounted on the heat dissipation columns at intervals from top to bottom. The first radiating fin is wavy, and the contact area of the first radiating fin and air is increased; the first radiating fin and the radiating column are in interference fit, and heat-conducting silicone grease is coated at the joint of the first radiating fin and the radiating column, so that thermal contact resistance is reduced, and heat conduction is increased.

Further, the cooling device also comprises a cooling fan, wherein the cooling fan is installed on the condenser through a bolt and used for blowing and cooling the first cooling fins.

Furthermore, the water cooling plate consists of a water cooling plate shell and a water cooling plate bottom plate, a connecting hole for connecting the igbt controller is formed in the water cooling plate shell, the water cooling plate shell and the water cooling plate bottom plate are welded by friction stir welding, a second radiating fin is arranged on the water cooling plate bottom plate, and the water cooling plate bottom plate and the second radiating fin are extruded integrally by adopting an aluminum extrusion forming process, so that the welding times are reduced, and the welding thermal resistance is reduced; and the bottom of the condenser is welded on the second radiating fin by brazing.

Further, the condenser comprises condenser shell and condenser roof, condenser shell and condenser roof adopt friction stir welding to weld, the heat dissipation post adopts the brazing to weld in on the condenser roof.

The invention has the beneficial effects that: the design structure is simple and scientific, the scheme of vacuumizing the interior of the condenser is adopted, the aluminum fins are extruded on the water cooling plate to increase the heat dissipation area so as to carry out natural convection with air, meanwhile, the cooling fins are added on the surface of the condenser, and the cooling fans are used for dissipating heat of the cooling fins so as to achieve the effect of cooling the controller; meanwhile, the radiating fins, the water cooling plate and the condenser are integrated together, so that the occupied space is reduced.

Drawings

FIG. 1 is an exploded view of the present invention;

FIG. 2 is a perspective view of the structure of the present invention;

FIG. 3 is a schematic view of a connection structure of a first heat sink and a heat-dissipating stud according to the present invention.

Detailed Description

The invention will be further described with reference to the accompanying drawings.

As shown in fig. 1 to 3, a self-cooling radiator for an IGBT controller comprises a water-cooling plate, a condenser and a water-cooling pipeline 1, wherein the water-cooling plate is composed of a water-cooling plate shell 9 and a water-cooling plate bottom plate 7, a connecting hole for connecting an IGBT controller 8 is formed in the water-cooling plate shell 9, and the IGBT controller 8 is connected with the water-cooling plate shell 9 through a bolt; the contact part between the water cooling plate shell and the water cooling plate is coated with high-thermal conductivity silicone grease to reduce thermal resistance, and the water cooling plate shell 9 and the water cooling plate bottom plate 7 are welded by friction stir welding; the condenser consists of a condenser shell 6 and a condenser top plate 3, and the condenser shell 6 and the condenser top plate 3 are welded by friction stir welding; the condenser set up in the top of water-cooling board, the water-cooling inboard intussuseption is filled with the coolant liquid, the inside vacuum-pumping of condenser is handled, the last surface mounting of condenser roof 3 has a plurality of heat dissipation posts 2, heat dissipation post 2 adopts the brazing to weld in on the condenser roof 3, install a plurality of first fin 4 on the heat dissipation post 2, each all be equipped with the cooperation on the first fin 4 the mounting hole of heat dissipation post 2, first fin 4 from top to bottom the interval install in on the heat dissipation post 2. The two ends of the water-cooling pipeline 1 are respectively communicated with the water-cooling plate and the condenser, and the condenser is provided with a cooling fan 5 for performing blast cooling on the first cooling fin 4. The first radiating fin 4 is wavy, the first radiating fin 4 and the radiating column 2 are in interference fit, and heat-conducting silicone grease is coated at the joint of the first radiating fin 4 and the radiating column 2, so that thermal contact resistance is reduced, and heat conduction is increased. The water cooling plate bottom plate 7 is provided with a second radiating fin, and the water cooling plate bottom plate 7 and the second radiating fin are extruded integrally by adopting an aluminum extrusion forming process, so that the welding times are reduced, and the welding thermal resistance is reduced; the bottom of the condenser shell 6 is soldered to the second heat sink.

Because the internally vacuumized condenser is communicated with the cooling flow channel of the water cooling plate, the boiling point of cooling liquid (water) is reduced, when the cooling liquid is water, the boiling point of the water is 6.9696 ℃ at 1000pa, 17.495 ℃ at 2000pa, 100 ℃ at 101325pa, and when the interior of the flow channel is vacuumized, the boiling point of the water can be changed into the boiling point of the waterReduce, the vacuum is higher, the boiling point is lower more, when the controller generates heat, the water heat absorption, thereby take place the phase change reaction and take away the heat, this heat is working fluid's evaporation latent heat, water vapor can get into the condenser through water-cooling pipeline, the cooling fan and the first fin of condenser can make vapor temperature reduce condensation in the twinkling of an eye for water backward flow income water-cooling board, thereby form the circulation and reach the cooling effect to the controller, consequently, at inside runner, only water-cooling inboard is inside to be full of liquid water, get into in the condenser through water-cooling pipeline when water gasification. Meanwhile, a part of heat can be taken away by a second radiating fin between the water cooling plate bottom plate and the condenser shell, the width of a fin of the second radiating fin is required to ensure enough supporting strength and process processing difficulty, the height/thickness of the fin is recommended to be less than or equal to 8, and the height of a fin gauge/fin is recommended to be less than or equal to 8>The heat dissipation effect is best when the temperature is 0.28 ℃. For the top fins, the forced air convection heat transfer coefficient isWherein the content of the first and second substances,_Vthe flow velocity near the heat dissipation fins is L along the moving direction of the fluid, and the smaller L, the larger the convective heat transfer coefficient is, so that the fan fixed at the long side of the heat dissipation fins can generate a larger convective heat transfer coefficient.

The above description is only a preferred embodiment of the present invention, and the scope of the present invention should not be limited thereby, and all the simple equivalent changes and modifications made in the claims and the description of the present invention are within the scope of the present invention.