阅读说明：本技术 用于大功率芯片散热的静电闪蒸微喷雾循环冷却系统 (Electrostatic flash evaporation micro-spray circulating cooling system for heat dissipation of high-power chip ) 是由 田加猛 王军锋 张闫 陈斌 周致富 于 2020-07-13 设计创作，主要内容包括：本发明涉及一种用于大功率芯片散热的静电闪蒸微喷雾循环冷却系统,其包括喷雾室、荷电腔室以及冷却介质制冷循环管路机构；通过冷却介质制冷循环管路机构能将液态冷却介质送入荷电腔室内,经过荷电腔室得到的荷电液滴能进入喷雾室的微通道喷嘴内,以经由微通道喷嘴将荷电液滴在喷雾液滴电场作用下靶向沉积在热沉的表面,对热沉冷却后的冷却介质返回至冷却介质制冷循环管路机构内,以使得通过热沉温度传感器采集的热沉当前温度与所述循环冷却控制器内预设的目标温度相一致。本发明能有效解决大功率芯片高效散热,同时提高冷却效率,缩小系统体积,满足国防及航空航天领域对冷却系统小型化、集成化以及高可靠性的技术要求。(The invention relates to an electrostatic flash evaporation micro-spray circulating cooling system for heat dissipation of a high-power chip, which comprises a spray chamber, a charge chamber and a cooling medium refrigeration circulating pipeline mechanism, wherein the spray chamber is provided with a spray inlet and a spray outlet; liquid cooling medium can be sent into the charge chamber through the cooling medium refrigeration cycle pipeline mechanism, charged liquid drops obtained through the charge chamber can enter the micro-channel nozzle of the spray chamber, so that the charged liquid drops are deposited on the surface of the heat sink in a targeted mode under the action of a spray liquid drop electric field through the micro-channel nozzle, and the cooling medium after cooling the heat sink returns to the cooling medium refrigeration cycle pipeline mechanism, so that the current temperature of the heat sink acquired through the heat sink temperature sensor is consistent with the preset target temperature in the cycle cooling controller. The invention can effectively solve the problem of high-efficiency heat dissipation of the high-power chip, simultaneously improves the cooling efficiency, reduces the system volume, and meets the technical requirements of miniaturization, integration and high reliability of the cooling system in the fields of national defense and aerospace.)

1. The utility model provides a little fog circulative cooling system of static flash distillation for high-power chip heat dissipation which characterized by: the cooling system comprises a spray chamber (14) capable of containing a high-power chip to be radiated, a charge chamber (11) capable of enabling a cooling medium to carry charges, and a cooling medium refrigeration cycle pipeline mechanism which can be in adaptive connection with the spray chamber (14) and the charge chamber (11);

the charging chamber (11) is positioned above the spray chamber (14), the charging chamber (11) is communicated with a micro-channel nozzle (13) in the spray chamber (14), a heat sink (15) which can be in contact fit with a high-power chip to be radiated is arranged in the spray chamber (14), the heat sink (15) is positioned right below the micro-channel nozzle (13) in the spray chamber (14), and a heat sink temperature sensor (18) capable of detecting the temperature state of the heat sink (15) is arranged on the heat sink (15);

the device also comprises a circulating cooling controller (2) capable of controlling the working state of the cooling medium refrigeration circulating pipeline mechanism and a high-voltage static electricity generating device which can be adaptively and electrically connected with the charge cavity (11) and the micro-channel nozzle (13), wherein the high-voltage static electricity generating device and the heat sink temperature sensor (18) are electrically connected with the circulating cooling controller (2); the high-voltage electrostatic generating device is matched with the charging chamber (11) to enable the liquid cooling medium passing through the charging chamber (11) to carry charges, and a spray droplet electric field can be formed between the micro-channel nozzle (13) and the heat sink (15) through the matching of the high-voltage electrostatic generating device and the micro-channel nozzle (13);

liquid cooling media can be sent into the charge chamber (11) through the cooling medium refrigeration circulation pipeline mechanism, charged liquid drops obtained through the charge chamber (11) can enter the micro-channel nozzle (13) of the spray chamber (14), so that the charged liquid drops are deposited on the surface of the heat sink (15) in a targeted mode under the action of a spray liquid drop electric field through the micro-channel nozzle (13), and the cooling media after cooling the heat sink (15) return to the cooling medium refrigeration circulation pipeline mechanism; the circulating cooling controller (2) controls the cooling medium refrigeration circulating pipeline mechanism to circularly cool the cooling medium with required dosage among the charge chamber (11), the spray chamber (14) and the cooling medium refrigeration circulating pipeline mechanism, so that the current temperature of the heat sink (15) acquired by the heat sink temperature sensor (18) is consistent with the preset target temperature in the circulating cooling controller (2).

2. The electrostatic flash evaporation micro-spray circulation cooling system for high-power chip heat dissipation according to claim 1, which is characterized in that: the cooling medium which is circularly cooled in the charging chamber (11), the spraying chamber (14) and the cooling medium refrigeration circulating pipeline mechanism comprises liquid ammonia;

the cooling medium refrigeration cycle pipeline mechanism comprises a first gas-liquid separator (3) which can be communicated with a spray chamber (14) and a gas compressor (4) which is connected with a gas outlet of the first gas-liquid separator (3), the gas outlet of the gas compressor (4) is connected with an inlet end of a condenser (5), an outlet end of the condenser (5) can be connected with a liquid storage tank (7) through a second gas-liquid separator (23), the liquid storage tank (7) is connected with a charge chamber (11) through a liquid storage tank conveying pipeline, and a throttle valve (8) is arranged on the liquid storage tank conveying pipeline;

the liquid storage tank (7) is provided with an electric heater (6) capable of heating the liquid storage tank (7), and the electric heater (6), the throttle valve (8) and the gas compressor (4) are all electrically connected with the circulating cooling controller (2) so as to control the working states of the electric heater (6), the throttle valve (8) and the gas compressor (4) through the circulating cooling controller (2).

3. The electrostatic flash evaporation micro-spray circulation cooling system for high-power chip heat dissipation according to claim 2, characterized in that: the first gas-liquid separator (3) is connected with a liquid outlet of the spray chamber (14) through a first connecting pipe (31), the first gas-liquid separator (3) is connected with an inlet of the condenser (5) through a second connecting pipe (32), and the first gas-liquid separator (3) is connected with a gas inlet of the gas compressor (4) through a third connecting pipe (33);

the liquid storage tank conveying pipeline is connected with an inlet of the condenser (5) through a bypass pipe (43), a bypass valve (9) is arranged on the bypass pipe (43), a flow sensor (10) is arranged on the liquid storage tank conveying pipeline, the flow sensor (10) is located between a connecting portion of the bypass pipe (43) and the liquid storage tank conveying pipeline and the charge chamber (11), and the flow sensor (10) is electrically connected with the circulating cooling controller (2).

4. The electrostatic flash evaporation micro-spray circulation cooling system for high-power chip heat dissipation according to claim 1, which is characterized in that: the charging chamber (11) comprises an insulating shell (26), a ring electrode (30) arranged in the insulating shell (26) and a chamber electrode (29) penetrating into the insulating shell (26), wherein the ring electrode (30) is adjacent to a chamber inlet (27) of the charging chamber (11), and the chamber electrode (29) is located between the ring electrode (30) and a chamber outlet (28) of the charging chamber (11);

the chamber electrode (29) comprises an electrode connecting part (46) and an electrode discharging part (45), the electrode discharging part (45) and the electrode connecting part (46) are L-shaped, and the electrode connecting part (46) can be electrically connected with the high-voltage electrostatic discharging device after penetrating out of the insulating shell (26).

5. The electrostatic flash evaporation micro-spray circulation cooling system for high-power chip heat dissipation according to claim 1, which is characterized in that: the micro-channel nozzle (13) comprises a nozzle shell (44), a nozzle cavity (25) positioned in the nozzle shell (44), a nozzle connecting pipe (24) arranged on the nozzle shell (44) and a nozzle electrode (21) which is matched and connected with the nozzle shell (44);

the nozzle connecting pipe (24) is communicated with the nozzle cavity (25), and the nozzle shell (44) is fixedly connected with the spray chamber (14); the lower part in the nozzle shell (44) is provided with liquid spraying channels (19) distributed in an array manner, the liquid spraying channels (19) are communicated with the nozzle cavity (25), and charged liquid drops entering the nozzle cavity (25) through the nozzle connecting pipe (24) can be sprayed out in a mist manner through the liquid spraying channels (19); after the nozzle electrode (21) is electrically connected with the high-voltage static electricity generating device, a spray droplet electric field can be generated between the nozzle shell (44) and the heat sink (15).

6. The electrostatic flash evaporation micro-spray circulation cooling system for high-power chip heat dissipation according to claim 5, wherein: the nozzle electrode (21) is positioned in the nozzle shell (44) or at the end part of the nozzle shell (44), and the nozzle electrode (21) and the nozzle connecting pipe (24) are respectively positioned at the two ends of the nozzle shell (44); the particle size of the mist-shaped liquid drops sprayed out through the liquid spraying channel (19) is 5-15 mu m.

7. The electrostatic flash evaporation micro-spray circulation cooling system for high-power chip heat dissipation according to claim 1, which is characterized in that: the heat sink temperature sensor (18) is a T-shaped film thermocouple arranged on the heat sink (15) in a magnetron sputtering coating mode, and an anti-oxidation protective layer is sprayed on the T-shaped film thermocouple.

8. The electrostatic flash evaporation micro-spray circulation cooling system for high-power chip heat dissipation according to claim 1, which is characterized in that: the high-voltage static electricity generating device comprises a first high-voltage static electricity generator (1) and a second high-voltage static electricity generator (22), wherein the first high-voltage static electricity generator (1) is electrically connected with the charge chamber (11), the second high-voltage static electricity generator (22) is electrically connected with the micro-channel nozzle (13), and the first high-voltage static electricity generator (1) and the second high-voltage static electricity generator (22) are electrically connected with the circulating cooling controller (2).

9. The electrostatic flash evaporation micro-spray circulation cooling system for high-power chip heat dissipation according to claim 1, which is characterized in that: the circulating cooling controller (2) is also electrically connected with a pressure sensor (16) for measuring the pressure state in the spraying chamber (14) and a spraying temperature sensor (17) for measuring the temperature state in the spraying chamber (14).

10. The electrostatic flash evaporation micro-spray circulation cooling system for high-power chip heat dissipation according to claim 5 or 6, which is characterized in that: the liquid spraying channels (19) are positioned below the bottom of the nozzle cavity (25), 2 multiplied by 2 array of liquid spraying channels (19) are arranged in the nozzle shell (44), the inner diameter of the liquid spraying channels (19) is 0.1 plus or minus 0.01 mm, and the distance between the liquid spraying channels (19) is 10 plus or minus 0.1 mm.

Technical Field

The invention relates to a circulating cooling system, in particular to an electrostatic flash evaporation micro-spray circulating cooling system for heat dissipation of a high-power chip, and belongs to the technical field of heat dissipation of chips.

Background

Electronic devices of high-power chips are widely applied to the fields of aerospace, national defense, industrial and agricultural production and biomedicine due to the advantages of long service life, high reliability, small volume, light weight and the like. With the increasing of the power density of the chip and the decreasing of the heat dissipation area, and the special application requirements of miniaturization, integration and light weight in the aerospace field, the power density of the high-power chip exceeds 500W/cm²The heat generated by the friction of the aircraft with high-speed airflow when the aircraft returns to the atmosphere. The famous 10 ℃ rule states that: the service life of the electronic device is closely related to the temperature, and when the working temperature is exceeded (such as the LED junction temperature of 80 ℃), the service life is shortened by 50% when the temperature is increased by 10 ℃. At present, no efficient compact cooling system developed for the heat dissipation problem of the high-power chip exists in the market.

The existing heat dissipation technology applied to high-power chips includes: air cooling, liquid cooling, heat pipe cooling, microchannel cooling, thermoelectric cooling, and the like. Although the integration degree is higher, the sensible heat or partial latent heat of the working medium is only utilized, the cooling capacity is insufficient, and the further improvement of high-power chips such as a laser and the like is greatly limited. Therefore, a new efficient and compact cooling technology is urgently needed to be developed to solve the problem of heat dissipation of the high-power chip.

The electrostatic spraying technology realizes targeted deposition under the action of electric field force after liquid drops are charged by establishing an electrostatic field between a spray head and a target, has the advantages of high atomization quality, low working medium consumption, uniform liquid drop deposition, high deposition amount and the like, and is widely applied to the industrial engineering fields of pesticide spraying, industrial spraying, spray combustion, industrial dedusting, desulfurization, waste gas purification and the like.

The cooling capacity of flash evaporation and spray of the refrigerant is strong, the problem of heat dissipation of a high-power chip is expected to be solved, however, due to the fact that bubbles are generated inside and on the surface of the refrigerant under the flash evaporation effect, the bubbles are broken to cause explosive breakage of the refrigerant, the atomization effect is poor, a large spray cone angle (90 degrees) is formed, accurate cooling is difficult to implement for a high-power semiconductor chip with the heat dissipation area being only dozens of square millimeters, a large amount of working media are deposited or splashed outside the heat dissipation surface, and cooling efficiency is lowered and energy is wasted easily. In addition, in order to obtain better atomization and cooling effects, the spraying distance is often set to be more than 30 mm, so that the spraying cavity is large in size, and the design and packaging of a miniaturized and integrated cooling system are difficult to realize.

Disclosure of Invention

The invention aims to overcome the defects in the prior art, and provides an electrostatic flash evaporation micro-spray circulating cooling system for high-power chip heat dissipation, which can effectively solve the problem of high-efficiency heat dissipation of a high-power chip, simultaneously improve the cooling efficiency, reduce the system volume, and meet the technical requirements of national defense and aerospace fields on miniaturization, integration and high reliability of the cooling system.

According to the technical scheme provided by the invention, the electrostatic flash evaporation micro-spray circulating cooling system for heat dissipation of the high-power chip comprises a spray chamber capable of accommodating the high-power chip to be cooled, a charge chamber capable of enabling a cooling medium to carry charges and a cooling medium refrigeration circulating pipeline mechanism which can be in adaptive connection with the spray chamber and the charge chamber;

the charging chamber is positioned above the spraying chamber and is communicated with the microchannel nozzle in the spraying chamber, a heat sink which can be in contact fit with a high-power chip to be radiated is arranged in the spraying chamber, the heat sink is positioned right below the microchannel nozzle in the spraying chamber, and a heat sink temperature sensor capable of detecting the temperature state of the heat sink is arranged on the heat sink;

the high-voltage static electricity generating device is matched and electrically connected with the charge chamber and the micro-channel nozzle, and the high-voltage static electricity generating device and the heat sink temperature sensor are electrically connected with the circulating cooling controller; the high-voltage static electricity generating device is matched with the charge cavity, so that the liquid cooling medium passing through the charge cavity carries charges, and a spray droplet electric field can be formed between the micro-channel nozzle and the heat sink through the matching of the high-voltage static electricity generating device and the micro-channel nozzle;

liquid cooling medium can be sent into the charge chamber through the cooling medium refrigeration circulation pipeline mechanism, charged liquid drops obtained through the charge chamber can enter the micro-channel nozzle of the spray chamber, so that the charged liquid drops are deposited on the surface of the heat sink in a targeted manner under the action of a spray liquid drop electric field through the micro-channel nozzle, and the cooling medium after cooling the heat sink returns to the cooling medium refrigeration circulation pipeline mechanism; the circulating cooling controller controls the cooling medium refrigeration circulating pipeline mechanism to circularly cool the cooling medium with required dosage among the charge chamber, the spray chamber and the cooling medium refrigeration circulating pipeline mechanism, so that the current temperature of the heat sink acquired by the heat sink temperature sensor is consistent with the preset target temperature in the circulating cooling controller.

The cooling medium which is circularly cooled in the charging chamber, the spraying chamber and the cooling medium refrigeration circulating pipeline mechanism comprises liquid ammonia;

the cooling medium refrigeration cycle pipeline mechanism comprises a first gas-liquid separator and a gas compressor, wherein the first gas-liquid separator can be communicated with the spray chamber, the gas compressor is connected with a gas outlet of the first gas-liquid separator, a gas outlet of the gas compressor is connected with an inlet end of a condenser, an outlet end of the condenser can be connected with a liquid storage tank through a second gas-liquid separator, the liquid storage tank is connected with the charge cavity through a liquid storage tank conveying pipeline, and a throttle valve is arranged on the liquid storage tank conveying pipeline;

the liquid storage tank is provided with an electric heater capable of heating the liquid storage tank, and the electric heater, the throttle valve and the gas compressor are all electrically connected with the circulating cooling controller so as to control the working states of the electric heater, the throttle valve and the gas compressor through the circulating cooling controller.

The first gas-liquid separator is connected with a liquid outlet of the spray chamber through a first connecting pipe, connected with an inlet of the condenser through a second connecting pipe, and connected with a gas inlet of the gas compressor through a third connecting pipe;

the liquid storage tank conveying pipeline is connected with an inlet of the condenser through a bypass pipe, a bypass valve is arranged on the bypass pipe, a flow sensor is arranged on the liquid storage tank conveying pipeline and is positioned between a connecting part of the bypass pipe and the liquid storage tank conveying pipeline and the charge chamber, and the flow sensor is electrically connected with the circulating cooling controller.

The charging chamber comprises an insulating shell, an annular electrode arranged in the insulating shell and a chamber electrode penetrating into the insulating shell, the annular electrode is adjacent to a chamber inlet of the charging chamber, and the chamber electrode is positioned between the annular electrode and a chamber outlet of the charging chamber;

the cavity electrode comprises an electrode connecting part and an electrode discharging part, the electrode discharging part and the electrode connecting part are L-shaped, and the electrode connecting part penetrates out of the insulating shell and then can be electrically connected with the high-voltage electrostatic discharging device.

The micro-channel nozzle comprises a nozzle shell, a nozzle cavity positioned in the nozzle shell, a nozzle connecting pipe arranged on the nozzle shell and a nozzle electrode which is in adaptive connection with the nozzle shell;

the nozzle connecting pipe is communicated with the nozzle cavity, and the nozzle shell is fixedly connected with the spray chamber; the lower part in the nozzle shell is provided with liquid spraying channels distributed in an array manner, the liquid spraying channels are communicated with the nozzle cavity, and charged liquid drops entering the nozzle cavity through the nozzle connecting pipe can be sprayed out in a fog form through the liquid spraying channels; after the nozzle electrode is electrically connected with the high-voltage static electricity generating device, a spray droplet electric field can be generated between the nozzle shell and the heat sink.

The nozzle electrode is positioned in the nozzle shell or at the end part of the nozzle shell, and the nozzle electrode and the nozzle connecting pipe are respectively positioned at two ends of the nozzle shell; the particle size of the mist-shaped liquid drops sprayed out through the liquid spraying channel is 5-15 mu m.

The heat sink temperature sensor is a T-shaped thin-film thermocouple arranged on the heat sink in a magnetron sputtering coating mode, and an anti-oxidation protective layer is sprayed on the T-shaped thin-film thermocouple.

The high-voltage static electricity generating device comprises a first high-voltage static electricity generator and a second high-voltage static electricity generator, wherein the first high-voltage static electricity generator is electrically connected with the charge chamber, the second high-voltage static electricity generator is electrically connected with the micro-channel nozzle, and the first high-voltage static electricity generator and the second high-voltage static electricity generator are electrically connected with the circulating cooling controller.

The circulating cooling controller is also electrically connected with a pressure sensor for measuring the pressure state in the spraying chamber and a spraying temperature sensor for measuring the temperature state in the spraying chamber.

The liquid spraying channels are positioned below the bottom of the nozzle cavity, 2 multiplied by 2 array of liquid spraying channels are arranged in the nozzle shell, the inner diameter of the liquid spraying channels is 0.1 +/-0.01 mm, and the distance between the liquid spraying channels is 10 +/-0.1 mm.

The invention has the advantages that:

1. liquid ammonia with low boiling point and high latent heat is used as a cooling medium, and the flash evaporation effect is added, so that micron-sized charged liquid drops can impact the surface of the heat sink at high speed and generate complex phase change heat exchange processes such as nucleate boiling, transitional boiling, liquid film evaporation and the like with the surface of the heat sink, the heat exchange efficiency is greatly improved, and the lower surface temperature is maintained (the liquid ammonia is used for cooling the heat sink), and (<80 degrees C), the surface heat flux density of the heat sink can reach 500W/cm²The above.

2. The invention enables the cooling medium to carry charges through the charge chamber, and can form a droplet spray electric field between the micro-channel nozzle and the heat sink, thereby the invention has high atomization quality, low working medium consumption, uniform droplet deposition and high deposition amount through the electrostatic atomization technology, can cool the heat sink in a targeted way while greatly improving the cooling efficiency and the uniformity, shortens the spray distance, and can reduce the volume of the spray chamber to 10 × 20 × 20 mm³。

3. The liquid spraying channels in the micro-channel nozzle are distributed in an array mode, liquid drops with micron-sized particle diameters can be generated through the liquid spraying channels, and the atomization quality is high. The liquid spraying channels of the 2 x 2 array completely cover the surface of the heat sink, so that the risks of chip temperature steep rise, sintering, failure and the like caused by incomplete cooling are avoided.

4. The device comprises a heat sink temperature sensor, a spray temperature sensor, a pressure sensor, a flow sensor, a circulating cooling controller, an electric heater, a gas compressor, a throttle valve and a bypass valve, wherein the heat sink temperature sensor is used for collecting heat sink temperature, the spray temperature sensor is used for obtaining temperature in a spray cavity, the pressure sensor is used for obtaining pressure in the spray cavity, the flow sensor is used for obtaining flow of cooling media entering a charge cavity, and the circulating cooling controller is used for adjusting voltage output by a high-voltage static electricity generating device, power of the electric heater, power of the gas compressor, throttle valve and opening of the bypass valve according to target temperature of a.

5. The first gas-liquid separator and the second gas-liquid separator are used for introducing the separated steam into the condenser for secondary condensation, so that the condensation efficiency is greatly improved, and meanwhile, only liquid medium enters the liquid storage tank, and the steam is prevented from generating adverse effects on flash evaporation and spraying.

6. The cooling effect is strong, the resource is saved, the structure is compact, the cooling system is small in size, the long-term operation is safe and reliable, and the cooling system can be used for efficient and compact heat dissipation of high-power chips such as computer CPUs, lasers, radars and the like.

Drawings

FIG. 1 is a schematic diagram of the present invention.

FIG. 2 is a cross-sectional view of a microchannel nozzle of the present invention.

FIG. 3 is a schematic view of the liquid ejection channel in the microchannel nozzle of the present invention.

Fig. 4 is a schematic diagram of a charging chamber of the present invention.

Description of reference numerals: 1-high voltage static first generator, 2-circulating cooling controller, 3-first gas-liquid separator, 4-gas compressor, 5-condenser, 6-electric heater, 7-liquid storage tank, 8-throttle valve, 9-bypass valve, 10-flow sensor, 11-charge chamber, 12-electromagnetic valve, 13-microchannel nozzle, 14-spray chamber, 15-heat sink, 16-pressure sensor, 17-spray temperature sensor, 18-heat sink temperature sensor, 19-spray channel, 20-external connecting sleeve, 21-nozzle electrode, 22-high voltage static second generator, 23-second gas-liquid separator, 24-nozzle connecting pipe, 25-nozzle cavity, 26-insulating shell, 27-cavity inlet, etc, 28-chamber outlet, 29-chamber electrode, 30-ring electrode, 31-first connecting pipe, 32-second connecting pipe, 33-third connecting pipe, 34-first switching valve, 35-fourth connecting pipe, 36-fifth connecting pipe, 37-sixth connecting pipe, 38-second switching valve, 39-seventh connecting pipe, 40-liquid storage tank conveying first pipe, 41-third switching valve, 42-liquid storage tank conveying second pipe, 43-bypass pipe, 44-nozzle shell, 45-electrode discharging part and 46-electrode connecting part.

Detailed Description

The invention is further illustrated by the following specific figures and examples.

As shown in fig. 1: in order to effectively solve the problem of high-efficiency heat dissipation of a high-power chip and improve the cooling efficiency, the invention comprises a spray chamber 14 capable of accommodating the high-power chip to be cooled, a charge chamber 11 capable of enabling a cooling medium to carry charges and a cooling medium refrigeration circulating pipeline mechanism which can be in adaptive connection with the spray chamber 14 and the charge chamber 11;

the charging chamber 11 is positioned above the spray chamber 14, the charging chamber 11 is communicated with a micro-channel nozzle 13 in the spray chamber 14, a heat sink 15 which can be in contact fit with a high-power chip to be radiated is arranged in the spray chamber 14, the heat sink 15 is positioned right below the micro-channel nozzle 13 in the spray chamber 14, and a heat sink temperature sensor 18 which can detect the temperature state of the heat sink 15 is arranged on the heat sink 15;

the device also comprises a circulating cooling controller 2 capable of controlling the working state of a cooling medium refrigeration circulating pipeline mechanism and a high-voltage static electricity generating device which can be adaptively and electrically connected with the charge cavity 11 and the micro-channel nozzle 13, wherein the high-voltage static electricity generating device and the heat sink temperature sensor 18 are electrically connected with the circulating cooling controller 2; the liquid cooling medium passing through the charging chamber 11 can carry charges through the cooperation of the high-voltage static electricity generating device and the charging chamber 11, and a spray droplet electric field can be formed between the micro-channel nozzle 13 and the heat sink 15 through the cooperation of the high-voltage static electricity generating device and the micro-channel nozzle 13;

liquid cooling medium can be sent into the charge chamber 11 through the cooling medium refrigeration cycle pipeline mechanism, charge liquid drops obtained through the charge chamber 11 can enter the micro-channel nozzle 13 of the spray chamber 14, so that the charge liquid drops are deposited on the surface of the heat sink 15 in a targeted manner under the action of a spray liquid drop electric field through the micro-channel nozzle 13, and the cooling medium after cooling the heat sink 15 returns to the cooling medium refrigeration cycle pipeline mechanism; the circulating cooling controller 2 controls the cooling medium refrigeration circulating pipeline mechanism to circularly cool the cooling medium with required dosage among the charge chamber 11, the spray chamber 14 and the cooling medium refrigeration circulating pipeline mechanism, so that the current temperature of the heat sink 15 acquired by the heat sink temperature sensor 18 is consistent with the target temperature preset in the circulating cooling controller 2.

The spray chambers 14 are generally vertically distributed, and in fig. 1, with the spray chamber 14 as a reference direction, an end of the spray chamber 14 adjacent to the charging chamber 11 is an upper end, an end of the spray chamber 14 away from the charging chamber 11 is a lower end, and the charging chamber 11 is located above the spray chamber 14, specifically, the charging chamber 11 is located above the upper end. Specifically, a high-power chip needing heat dissipation is placed in the spray chamber 14, the spray chamber 14 is a relatively closed cavity, the heat sink 15 is located at the bottom in the spray chamber 14, the high-power chip is in contact connection with the heat sink 15, namely, the high-power chip can perform heat exchange with the heat sink 15, and when the heat sink 15 is cooled by using a cooling medium, the heat dissipation of the high-power chip can be realized through the matching between the heat sink 15 and the high-power chip. When the heat sink 15 and the high-power chip are used for heat dissipation, the normal use of the high-power chip and a system prepared or formed by the high-power chip cannot be influenced by the cooling medium, namely, the cooling medium is in contact with the surface of the heat sink 15 to cool the heat sink 15, the cooling medium is not in contact with the high-power chip, the sealing performance of the high-power chip during heat dissipation is not required to be improved, the cost is not increased, and the cooling efficiency is improved. The cooling medium cooled by the heat sink 15 enters the cooling medium refrigeration cycle pipeline mechanism again, so that the cooling medium is cooled circularly.

The charging chamber 11 is located above the spray chamber 14, the cooling medium passes through the charging chamber 11 and then enters the microchannel nozzle 13 in the spray chamber 14, and the cooling medium is enabled to carry electric charges when passing through the charging chamber 11, so that charged liquid droplets are formed. The charged liquid drops have a flash evaporation effect when being sprayed out through the micro-channel nozzle 13, and meanwhile, the sprayed charged liquid drops are deposited on the surface of the heat sink 15 in a targeted mode under the action of a spray liquid drop electric field, so that heat exchange between the cooling medium and the heat sink 5 is realized, resource waste is avoided, and cooling efficiency is improved.

In the embodiment of the invention, after the high-voltage static electricity generating device is matched with the charging chamber 11, the cooling medium passing through the charging chamber 11 can carry charges and form charged liquid drops; meanwhile, the high-voltage electrostatic generating device is matched with the micro-channel nozzle 13, a spray droplet electric field can be formed between the micro-channel nozzle 13 and the heat sink 15, and at the moment, the heat sink 15 needs to be grounded.