阅读说明：本技术 一种sot-227金属陶瓷管壳结构 (SOT-227 metal ceramic tube shell structure ) 是由 王立伟 于 2021-08-12 设计创作，主要内容包括：本发明公开了一种SOT-227金属陶瓷管壳结构,涉及半导体器件技术领域,具体为管壳壳体和内部电极,所述管壳壳体包括铁镍合金边框,所述无氧铜底板的中部烧结有钼过渡片,所述内部电极设置于氮化铝陶瓷基片表面,所述第一铜钼铜电极片、第二铜钼铜电极片和第三铜钼铜电极片从左至右依次烧结在氮化铝陶瓷基片表面,所述第二铜钼铜电极片表面设置有导气沟,所述内部电极的上方设置有外部电极。该SOT-227金属陶瓷管壳结构,通过将采用塑料封装形式的SOT-227塑封管壳变换为金属陶瓷管壳,提高了该系列封装产品的最高工作温度和管壳整体的稳定性和可靠性；且陶瓷管壳产品尺寸与塑封产品保持一致,达到了兼容互换的目的；实用性强,易于推广使用。(The invention discloses an SOT-227 metal ceramic tube shell structure, which relates to the technical field of semiconductor devices, in particular to a tube shell and an internal electrode, wherein the tube shell comprises an iron-nickel alloy frame, a molybdenum transition sheet is sintered in the middle of an oxygen-free copper bottom plate, the internal electrode is arranged on the surface of an aluminum nitride ceramic substrate, a first copper-molybdenum-copper electrode sheet, a second copper-molybdenum-copper electrode sheet and a third copper-molybdenum-copper electrode sheet are sequentially sintered on the surface of the aluminum nitride ceramic substrate from left to right, an air guide groove is arranged on the surface of the second copper-molybdenum-copper electrode sheet, and an external electrode is arranged above the internal electrode. According to the SOT-227 metal ceramic tube shell structure, the SOT-227 plastic package tube shell adopting a plastic package form is converted into the metal ceramic tube shell, so that the highest working temperature of a series of packaged products and the overall stability and reliability of the tube shell are improved; the size of the ceramic tube shell product is consistent with that of the plastic package product, so that the purpose of compatibility and interchange is achieved; the practicability is strong, and the popularization and the use are easy.)

1. A kind of SOT-227 cermet tube shell structure, including tube shell body (1) and internal electrode (2), characterized by that: the shell (1) comprises an iron-nickel alloy frame (5), an oxygen-free copper bottom plate (6) is installed at the bottom of the iron-nickel alloy frame (5), a molybdenum transition sheet (7) is sintered in the middle of the oxygen-free copper bottom plate (6), an aluminum nitride ceramic substrate (8) is sintered at the top of the molybdenum transition sheet (7), the internal electrode (2) is arranged on the surface of the aluminum nitride ceramic substrate (8), the internal electrode (2) comprises a first copper-molybdenum-copper electrode sheet (9), a second copper-molybdenum-copper electrode sheet (10) and a third copper-molybdenum-copper electrode sheet (11), the first copper-molybdenum-copper electrode sheet (9), the second copper-molybdenum-copper electrode sheet (10) and the third copper-molybdenum-copper electrode sheet (11) are sequentially sintered on the surface of the aluminum nitride ceramic substrate (8) from left to right, an air guide groove (12) is formed in the surface of the second copper-molybdenum-copper electrode sheet (10), and an external electrode (4) is arranged above the internal electrode (2), the external electrode (4) comprises a cover plate (3), a first electrode plate (13), a second electrode plate (14), a third electrode plate (15), a fourth electrode plate (16) and an alumina insulator (17), wherein the cover plate (3) is internally connected with the first electrode plate (13), the second electrode plate (14), the third electrode plate (15) and the fourth electrode plate (16) in sequence through the alumina insulator (17), and a connecting lead (18) is sintered at the bottoms of the first electrode plate (13), the second electrode plate (14), the third electrode plate (15) and the fourth electrode plate (16).

2. The SOT-227 cermet package structure of claim 1 wherein: the aluminum oxide insulator (17) has an insulating effect, and the maximum bearable torque of the aluminum oxide insulator (17) is 1.25 N.M.

3. The SOT-227 cermet package structure of claim 1 wherein: first grooves (19) with the width of 0.3mm are formed between the first copper molybdenum copper electrode plates (9), second grooves (20) with the width of 0.3mm are formed between the second copper molybdenum copper electrode plates (10), and third grooves (21) with the width of 0.3mm are formed between the third copper molybdenum copper electrode plates (11).

4. The SOT-227 cermet package structure of claim 1 wherein: the width of the air guide grooves (12) is 0.2mm, the maximum depth of the air guide grooves is 0.05mm, and the distance between the air guide grooves (12) is 1.0 mm.

5. The SOT-227 cermet package structure of claim 1 wherein: the surfaces of the first copper molybdenum copper electrode slice (9), the second copper molybdenum copper electrode slice (10) and the third copper molybdenum copper electrode slice (11) are plated with nickel, and the thickness of a nickel layer formed after nickel plating is 3-9 mu m.

6. The SOT-227 cermet package structure of claim 1 wherein: the internal electrode (2) and the external electrode (4) are connected in a lead-tin-silver alloy soldering lug sintering mode, and the passing current capacity value range is 300A.

7. The SOT-227 cermet package structure of claim 1 wherein: the connection mode between the cover plate (3) and the shell and tube shell (1) is laser welding.

8. The SOT-227 cermet package structure of claim 1 wherein: the first electrode plate (13), the second electrode plate (14) and the first copper-molybdenum-copper electrode plate (9) are connected through lead-tin-silver alloy soldering lugs.

9. The SOT-227 cermet package structure of claim 1 wherein: and the third electrode plate (15) is connected with the third copper-molybdenum-copper electrode plate (11) through a lead-tin-silver alloy soldering lug.

10. The SOT-227 cermet package structure of claim 1 wherein: the fourth electrode plate (16) is connected with the second copper-molybdenum-copper electrode plate (10) through a lead-tin-silver alloy soldering lug.

Technical Field

The invention relates to the technical field of semiconductor devices, in particular to an SOT-227 metal ceramic tube shell structure.

Background

A semiconductor refers to a material having a conductivity between that of a conductor and an insulator at normal temperature. Semiconductors, which are a material having a controlled conductivity ranging from an insulator to a conductor, are widely used in various electronic devices in daily life, for example, LEDs are devices manufactured by using semiconductors. Commonly used semiconductor materials are silicon, germanium, gallium arsenide, and the like;

at present, semiconductor discrete devices such as imported SOT-227 external power MOSFETs and the like are all in a plastic packaging form, plastic packaging products are generally accepted as non-sealing devices, and the plastic packaging form is filled and coated inside the semiconductor discrete devices, but the sealing property still cannot meet the high-reliability requirement.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides an SOT-227 metal ceramic tube shell structure, which solves the problems that the prior imported SOT-227 external power MOSFET and other semiconductor discrete devices are all in a plastic packaging form, plastic packaging products are known as non-sealing devices, and the plastic packaging form is filled and coated inside, but the sealing performance still cannot meet the high reliability requirement.

In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides a SOT-227 cermet tube shell structure, includes tube shell and internal electrode, the tube shell includes the iron-nickel alloy frame, and the bottom of iron-nickel alloy frame installs anaerobic copper bottom plate, the middle part sintering of anaerobic copper bottom plate has molybdenum transition piece, and the top sintering of molybdenum transition piece has aluminium nitride ceramic substrate, internal electrode sets up in aluminium nitride ceramic substrate surface, internal electrode includes first copper molybdenum copper electrode piece, second copper molybdenum copper electrode piece and third copper molybdenum copper electrode piece, first copper molybdenum copper electrode piece, second copper molybdenum copper electrode piece and third copper molybdenum copper electrode piece are sintered in proper order on aluminium nitride ceramic substrate surface from a left side to the right side, second copper molybdenum copper electrode piece surface is provided with the air guide ditch, the top of internal electrode is provided with external electrode, external electrode includes apron, first electrode piece, second electrode piece, The novel electrode plate comprises a third electrode plate, a fourth electrode plate and an alumina insulator, wherein the cover plate is internally connected with the first electrode plate, the second electrode plate, the third electrode plate and the fourth electrode plate in sequence through the alumina insulator, and connecting leads are sintered at the bottoms of the first electrode plate, the second electrode plate, the third electrode plate and the fourth electrode plate.

Optionally, the alumina insulator has an insulating effect, and the maximum bearable torque of the alumina insulator is 1.25N · M.

Optionally, a first groove with a width of 0.3mm is arranged between the first copper molybdenum copper electrode plates, a second groove with a width of 0.3mm is arranged between the second copper molybdenum copper electrode plates, and a third groove with a width of 0.3mm is arranged between the third copper molybdenum copper electrode plates.

Optionally, the width of the air guide grooves is 0.2mm, the depth of the air guide grooves is 0.05mm at most, and the distance between the air guide grooves is 1.0 mm.

Optionally, the surfaces of the first copper molybdenum copper electrode plate, the second copper molybdenum copper electrode plate and the third copper molybdenum copper electrode plate are plated with nickel, and the thickness of the nickel layer formed after nickel plating is 3-9 μm.

Optionally, the internal electrode and the external electrode are connected by sintering a lead-tin-silver alloy soldering lug, and the current passing capacity value range is 300A.

Optionally, the connection mode between the cover plate and the shell-and-tube shell is laser welding.

Optionally, the first electrode plate and the second electrode plate are connected with the first copper-molybdenum-copper electrode plate through lead-tin-silver alloy soldering lugs.

Optionally, the third electrode plate is connected with the third copper-molybdenum-copper electrode plate through a lead-tin-silver alloy soldering lug.

Optionally, the fourth electrode plate is connected with the second copper-molybdenum-copper electrode plate through a lead-tin-silver alloy soldering lug.

The invention provides an SOT-227 metal ceramic tube shell structure, which has the following beneficial effects:

according to the SOT-227 metal ceramic tube shell structure, the SOT-227 plastic package tube shell adopting a plastic package form is converted into the metal ceramic tube shell, so that the highest working temperature of a series of packaged products and the overall stability and reliability of the tube shell are improved; the size of the ceramic tube shell product is consistent with that of the plastic package product, so that the purpose of compatibility and interchange is achieved; the practicability is strong, and the popularization and the use are easy.

Drawings

FIG. 1 is a schematic view of an elevational structure of a frame made of an iron-nickel alloy according to the present invention;

FIG. 2 is a schematic top view of a first copper molybdenum copper electrode sheet according to the present invention;

FIG. 3 is a schematic view of the structure of the air guide channel of the present invention;

FIG. 4 is a schematic front view of the cover plate according to the present invention;

FIG. 5 is a schematic top view of the cover plate according to the present invention.

In the figure: 1. a shell of the pipe; 2. an internal electrode; 3. a cover plate; 4. an external electrode; 5. an iron-nickel alloy frame; 6. an oxygen-free copper bottom plate; 7. a molybdenum transition piece; 8. an aluminum nitride ceramic substrate; 9. a first copper molybdenum copper electrode sheet; 10. a second copper molybdenum copper electrode sheet; 11. a third copper molybdenum copper electrode slice; 12. an air guide channel; 13. a first electrode sheet; 14. a second electrode sheet; 15. a third electrode sheet; 16. a fourth electrode sheet; 17. an alumina insulator; 18. connecting a lead; 19. a first trench; 20. a second trench; 21. and a third trench.

Detailed Description

Referring to fig. 1 to 5, the present invention provides a technical solution: the SOT-227 metal ceramic tube shell structure comprises a tube shell body 1 and an internal electrode 2, wherein the tube shell body 1 comprises an iron-nickel alloy frame 5, an oxygen-free copper base plate 6 is installed at the bottom of the iron-nickel alloy frame 5, a molybdenum transition sheet 7 is sintered in the middle of the oxygen-free copper base plate 6, an aluminum nitride ceramic substrate 8 is sintered at the top of the molybdenum transition sheet 7, the internal electrode 2 is arranged on the surface of the aluminum nitride ceramic substrate 8, the internal electrode 2 comprises a first copper-molybdenum-copper electrode sheet 9, a second copper-molybdenum-copper electrode sheet 10 and a third copper-molybdenum-copper electrode sheet 11, the first copper-molybdenum-copper electrode sheet 9, the second copper-molybdenum-copper electrode sheet 10 and the third copper-molybdenum-copper electrode sheet 11 are sequentially sintered on the surface of the aluminum nitride ceramic substrate 8 from left to right, an air guide groove 12 is formed in the surface of the second copper-molybdenum-copper electrode sheet 10, an external electrode 4 is arranged above the internal electrode 2, and the external electrode 4 comprises a cover plate 3, The welding electrode comprises a first electrode plate 13, a second electrode plate 14, a third electrode plate 15, a fourth electrode plate 16 and an alumina insulator 17, wherein the first electrode plate 13, the second electrode plate 14, the third electrode plate 15 and the fourth electrode plate 16 are sequentially connected to the inside of a cover plate 3 through the alumina insulator 17, connecting leads 18 are sintered at the bottoms of the first electrode plate 13, the second electrode plate 14, the third electrode plate 15 and the fourth electrode plate 16, and the cover plate 3 and a shell 1 are connected in a laser welding mode;

the method comprises the following specific operations that an iron-nickel alloy frame 5 is used as a material for replacing a plastic package tube shell, an oxygen-free copper bottom plate 6, a molybdenum transition sheet 7 and an aluminum nitride ceramic substrate 8 are used as bottom layer parts, an internal electrode 2 is arranged on the surface of the aluminum nitride ceramic substrate 8, a first electrode sheet 13, a second electrode sheet 14, a third electrode sheet 15, a fourth electrode sheet 16, an aluminum oxide insulator 17 and a connecting lead 18 are arranged inside a cover plate 3, the cover plate 3 is made of iron-nickel alloy, nickel is plated on the surface, the aluminum nitride ceramic substrate 8 is aluminum nitride ceramic, the connection mode between the cover plate 3 and a tube shell 1 is laser welding, a metal tube shell product is obtained after seamless production after welding, and meanwhile, the size of the ceramic tube shell product is consistent with that of the plastic package tube shell product, and the purpose of compatibility and interchange is achieved; the practicability is strong, and the popularization and the use are easy.

As shown in fig. 5, the alumina insulator 17 has an insulating effect, and the maximum bearable torque of the alumina insulator 17 is 1.25N · M;

the cover plate 3 is sequentially connected with a first electrode plate 13, a second electrode plate 14, a third electrode plate 15 and a fourth electrode plate 16 through an aluminum oxide insulator 17, the aluminum oxide insulator 17 has an insulating effect and avoids current transmission, the maximum bearable torque of the aluminum oxide insulator 17 is 1.25 N.M, the firmness of connection between the cover plate 3 and each electrode plate is improved, and the practicability and reliability of the whole SOT-227 ceramic tube shell structure are improved.

As shown in fig. 2-3, a first groove 19 with a width of 0.3mm is provided between the first copper molybdenum copper electrode sheets 9, a second groove 20 with a width of 0.3mm is provided between the second copper molybdenum copper electrode sheets 10, a third groove 21 with a width of 0.3mm is provided between the third copper molybdenum copper electrode sheets 11, the width of the air guide groove 12 is 0.2mm, the depth is 0.05mm at most, the distance between the air guide grooves 12 is 1.0mm, the surfaces of the first copper molybdenum copper electrode sheets 9, the second copper molybdenum copper electrode sheets 10 and the third copper molybdenum copper electrode sheets 11 are plated with nickel, the thickness of the nickel layer formed after plating is 3 μm to 9 μm, the connection mode between the internal electrodes 2 and the external electrodes 4 is a lead-tin-silver alloy soldering sheet sintering connection, the current capacity value range is 300A, the first electrode sheets 13 and the second electrode sheets 14 are connected with the first copper molybdenum copper electrode sheets 9 by a lead-tin-silver alloy soldering sheet, and the third copper electrode sheets 15 are connected with the third copper molybdenum copper electrode sheets 11 by a lead-tin-silver alloy soldering sheet, the fourth electrode plate 16 is connected with the second copper-molybdenum-copper electrode plate 10 through a lead-tin-silver alloy soldering lug;

third slot 21, second slot 20 and first slot 19 are used for conveniently separating first copper molybdenum copper electrode piece 9 of arranging, second copper molybdenum copper electrode piece 10 and third copper molybdenum copper electrode piece 11, third slot 21, the setting of second slot 20 and first slot 19 still makes things convenient for the later stage dismouting, first copper molybdenum copper electrode piece 9 when avoiding the dismouting, influence each other between second copper molybdenum copper electrode piece 10 and the third copper molybdenum copper electrode piece 11, and the setting of air guide channel 12 is then the bubble of being convenient for in the guide lead tin silver solder of sintering in-process flows, make the bubble in the lead tin silver solder along the inside discharge that realizes that flows of air guide channel 12, thereby realize the welded effect of sclausura hole.

To sum up, when the SOT-227 metal ceramic tube shell structure is used, firstly, the iron-nickel alloy frame 5 is used as a material for replacing a plastic package tube shell, and the oxygen-free copper bottom plate 6, the molybdenum transition sheet 7 and the aluminum nitride ceramic substrate 8 are used as bottom layer parts;

then the internal electrode 2 is placed on the surface of the aluminum nitride ceramic substrate 8, the first electrode plate 13, the second electrode plate 14, the third electrode plate 15, the fourth electrode plate 16, the aluminum oxide insulator 17 and the connecting lead 18 are placed inside the cover plate 3, the cover plate 3 is made of iron-nickel alloy, nickel is plated on the surface of the cover plate, the aluminum nitride ceramic substrate 8 is made of aluminum nitride ceramic, the connection mode between the cover plate 3 and the shell 1 of the tube shell is laser welding, a metal tube shell product is obtained after seamless welding, meanwhile, the size of the ceramic tube shell product is consistent with that of a plastic package product, and the purpose of compatibility and interchange is achieved; the practicability is strong, and the popularization and the use are easy;

and finally, the third groove 21, the second groove 20 and the first groove 19 are used for conveniently separating and arranging the first copper molybdenum copper electrode plate 9, the second copper molybdenum copper electrode plate 10 and the third copper molybdenum copper electrode plate 11, the third groove 21, the second groove 20 and the first groove 19 are convenient to disassemble and assemble at the later stage, the first copper molybdenum copper electrode plate 9 is prevented from being disassembled and assembled, the second copper molybdenum copper electrode plate 10 and the third copper molybdenum copper electrode plate 11 are mutually influenced, and the air guide groove 12 is convenient for guiding air bubbles in the lead-tin-silver solder to flow in the sintering process, so that the air bubbles in the lead-tin-silver solder flow along the inside of the air guide groove 12 to realize discharge, and the effect of welding without holes is realized.