阅读说明：本技术 电子设备 (Electronic device ) 是由 蔡荣哲 胡逸群 洪志斌 于 2019-09-12 设计创作，主要内容包括：一种电子设备包含主衬底、半导体封装结构和至少一个热管。所述半导体封装结构电连接到所述主衬底,且包含裸片安装部分、半导体裸片和覆盖结构。所述半导体裸片安置在所述裸片安装部分上。所述覆盖结构覆盖所述半导体裸片。所述热管与所述覆盖结构接触以用于耗散掉由所述半导体裸片产生的热量。(An electronic device includes a primary substrate, a semiconductor package structure, and at least one heat pipe. The semiconductor package structure is electrically connected to the primary substrate and includes a die mounting portion, a semiconductor die, and a cover structure. The semiconductor die is disposed on the die mount portion. The cover structure covers the semiconductor die. The heat pipe is in contact with the cover structure for dissipating heat generated by the semiconductor die.)

1. An electronic device, comprising:

a master substrate;

a semiconductor package structure electrically connected to the primary substrate and comprising:

a die mounting portion;

a semiconductor die disposed on the die mount portion; and

a cover structure covering the semiconductor die; and

at least one heat pipe in contact with the cover structure for dissipating heat generated by the semiconductor die.

2. The electronic device defined in claim 1 wherein the semiconductor package structure further comprises a package substrate that includes the die-mount portion, the semiconductor die being attached to the die-mount portion of the package substrate and electrically connected to the package substrate by flip-chip bonding; and the cover structure is a lid structure that covers the semiconductor die.

3. The electronic device defined in claim 2 wherein the semiconductor package structure further includes a thermal interface material between the semiconductor die and the lid structure.

4. The electronic device of claim 2, wherein the lid structure is a cap structure and is in contact with a surface of the package substrate.

5. The electronic device defined in claim 2 wherein the cover structure includes a base and four locating pins disposed at four corners of the base, an inner surface of each of the locating pins being in contact with a portion of a side surface of the package substrate.

6. The electronic device of claim 2, wherein the heat pipe includes a first portion adjacent to the cover structure and a second portion adjacent to the primary substrate.

7. The electronic device of claim 6, wherein the heat pipe is a U-shaped heat pipe and includes one first portion and two second portions, wherein the first portion connects the two second portions, the first portion is disposed on the cover structure, and the two second portions extend through the primary substrate.

8. The electronic apparatus of claim 6, wherein each of the second portions includes a horizontal section disposed on a surface of the primary substrate.

9. The electronic device of claim 6, further comprising a heat sink disposed on the first portion of the heat pipe.

10. The electronic device of claim 2, further comprising a heat sink, wherein the heat pipe includes a first portion adjacent to the cover structure and a second portion substantially perpendicular to the first portion, the heat sink disposed on the first portion of the heat pipe, and the second portion of the heat pipe connected to the heat sink.

11. The electronic device of claim 2, wherein the heat pipe includes a first portion disposed on the lid structure and a second portion that extends through the package substrate.

12. The electronic device of claim 2, wherein the heat pipe includes a first portion disposed on the lid structure and a second portion connected to a thermal via of the package substrate.

13. The electronic device of claim 2, wherein the heat pipe is located between the semiconductor die and the lid structure.

14. The electronic device defined in claim 1 wherein the semiconductor package structure further comprises a package substrate that includes the die-mount portion, the semiconductor die being attached to the die-mount portion of the package substrate and electrically connected to the package substrate by flip-chip bonding; the cover structure is a vapor chamber covering the semiconductor die; and the heat pipe includes a first portion adjacent the vapor chamber and a second portion adjacent the primary substrate.

15. The electronic device defined in claim 1 wherein the semiconductor package structure further comprises a package substrate that includes the die-mount portion, the semiconductor die being attached to the die-mount portion of the package substrate and electrically connected to the package substrate by a plurality of bond wires; the cover structure is a molding compound that covers the semiconductor die and the bonding wires; and the heat pipe includes a first portion adjacent the molding compound and a second portion adjacent the primary substrate.

16. The electronic device defined in claim 1 wherein the semiconductor package structure further comprises a die attach pad that includes the die mount portion and a plurality of pins that surround the die attach pad and that are electrically connected to the primary substrate, the semiconductor die being attached to the die mount portion of the die attach pad and being electrically connected to the pins by a plurality of bond wires; the cover structure is a molding compound that covers the semiconductor die, the die attach pad, the bonding wires, and portions of the pins; and the heat pipe includes a first portion adjacent the semiconductor die and a second portion adjacent the primary substrate.

17. The electronic apparatus of claim 16, wherein each of the second portions includes a horizontal section disposed on a surface of the primary substrate.

18. The electronic device defined in claim 16 wherein a portion of each of the pins extends through the host substrate.

19. The electronic device defined in claim 1 wherein the semiconductor packaging structure further comprises a die attach pad that includes the die mount portion and a plurality of heat pipes that surround the die attach pad and that are electrically connected to the primary substrate, the semiconductor die being attached to the die mount portion of the die attach pad and being electrically connected to a first portion of the heat pipes by a plurality of bond wires; the cover structure is a molding compound that covers the semiconductor die, the die attach pad, the bonding wires, and the first portion of the heat pipe; and the heat pipe further includes a second portion adjacent to the primary substrate.

20. The electronic device of claim 19, wherein each of the second portions of the heat pipes includes a horizontal section disposed on a surface of the primary substrate.

21. The electronic device defined in claim 19 wherein each of the second portions of the heat pipes extends through the primary substrate.

Technical Field

The present disclosure relates to an electronic device, and to an electronic device comprising at least one heat pipe.

Background

Specifications of semiconductor package structures may include high speed data transfer capacity, high data capacity, and a smaller footprint. Heat dissipation is also a problem with such semiconductor package structures. During operation, high speed data transfer may result in a large amount of heat being generated and may increase the temperature of the semiconductor package structure. Due to the small size of the semiconductor package structure, it may be difficult to dissipate the heat. If the heat is not efficiently dissipated, the performance of the semiconductor package may be degraded or the semiconductor package may be damaged or rendered inoperable.

Disclosure of Invention

In some embodiments, an electronic device includes a host substrate, a semiconductor package structure, and at least one heat pipe. The semiconductor package structure is electrically connected to the main substrate and includes a die mounting portion, a semiconductor die, and a cover structure. A semiconductor die is disposed on the die mount portion. The cover structure covers the semiconductor die. The heat pipe is in contact with the cover structure for dissipating heat generated by the semiconductor die.

Drawings

Aspects of some embodiments of the disclosure are readily understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that the various structures may not be drawn to scale, and that the dimensions of the various structures may be arbitrarily increased or decreased for clarity of discussion.

Fig. 1 illustrates an exploded perspective view of an electronic device, in accordance with some embodiments of the present disclosure.

Fig. 2 illustrates an assembled cross-sectional view of the electronic device of fig. 1.

Fig. 3 illustrates an assembled cross-sectional view of an electronic device, according to some embodiments of the present disclosure.

Fig. 4 illustrates an exploded perspective view of an electronic device, in accordance with some embodiments of the present disclosure.

Fig. 5 illustrates an assembled perspective view of the electronic device of fig. 4.

Fig. 6 illustrates a front view of the electronic device of fig. 5.

Fig. 7 illustrates a top view of the electronic device of fig. 5.

Fig. 8 illustrates an exploded perspective view of an electronic device, in accordance with some embodiments of the present disclosure.

Fig. 9 illustrates an assembled perspective view of the electronic device of fig. 8.

Fig. 10 illustrates a cross-sectional view of an electronic device, in accordance with some embodiments of the present disclosure.

Fig. 11 illustrates a cross-sectional view of an electronic device, in accordance with some embodiments of the present disclosure.

Fig. 12 illustrates a cross-sectional view of an electronic device, in accordance with some embodiments of the present disclosure.

Fig. 13 illustrates a cross-sectional view of an electronic device, in accordance with some embodiments of the present disclosure.

Fig. 14 illustrates a cross-sectional view of an electronic device, in accordance with some embodiments of the present disclosure.

Fig. 15 illustrates a cross-sectional view of an electronic device, in accordance with some embodiments of the present disclosure.

Fig. 16 illustrates an exploded perspective view of an electronic device, in accordance with some embodiments of the present disclosure.

Fig. 17 illustrates a cross-sectional view of the electronic device of fig. 16.

Fig. 18 illustrates a cross-sectional view of an electronic device, in accordance with some embodiments of the present disclosure.

Fig. 19 illustrates an exploded perspective view of an electronic device, according to some embodiments of the present disclosure.

Fig. 20 illustrates an assembled perspective view of the electronic device of fig. 19.

Fig. 21 illustrates a cross-sectional view of the electronic device of fig. 20.

Fig. 22 illustrates an exploded perspective view of an electronic device, according to some embodiments of the present disclosure.

Fig. 23 illustrates an assembled perspective view of the electronic device of fig. 22.

Fig. 24 illustrates a cross-sectional view of the electronic device of fig. 23.

Fig. 25 illustrates an exploded perspective view of an electronic device, according to some embodiments of the present disclosure.

Fig. 26 illustrates an assembled perspective view of the electronic device of fig. 25.

Fig. 27 illustrates a cross-sectional view of the electronic device of fig. 26.

Fig. 28 illustrates an exploded perspective view of an electronic device, in accordance with some embodiments of the present disclosure.

Fig. 29 illustrates an assembled perspective view of the electronic device of fig. 28.

Fig. 30 illustrates a cross-sectional view of the electronic device of fig. 29.

Fig. 31 illustrates an exploded perspective view of an electronic device, in accordance with some embodiments of the present disclosure.

Fig. 32 illustrates an assembled perspective view of the electronic device of fig. 31.

Fig. 33 illustrates a cross-sectional view of the electronic device of fig. 32.

Fig. 34 illustrates an exploded perspective view of an electronic device, in accordance with some embodiments of the present disclosure.

Fig. 35 illustrates an assembled perspective view of the electronic device of fig. 34.

Fig. 36 illustrates a cross-sectional view of the electronic device of fig. 35.

Fig. 37 illustrates an exploded perspective view of an electronic device, in accordance with some embodiments of the present disclosure.

Fig. 38 illustrates an assembled perspective view of the electronic device of fig. 37.

FIG. 39 illustrates a cross-sectional view taken along line 39-39 of the electronic device of FIG. 38.

FIG. 40 illustrates a cross-sectional view taken along line 40-40 of the electronic device of FIG. 38.

Fig. 41 illustrates an exploded perspective view of an electronic device, according to some embodiments of the present disclosure.

Fig. 42 illustrates an assembled perspective view of the electronic device of fig. 41.

Fig. 43 illustrates a cross-sectional view of the electronic device of fig. 42.

Fig. 44 illustrates an exploded perspective view of an electronic device, according to some embodiments of the present disclosure.

Fig. 45 illustrates a cross-sectional view of the assembled electronic device of fig. 44.

Fig. 46 illustrates an exploded perspective view of an electronic device, according to some embodiments of the present disclosure.

Fig. 47 illustrates a cross-sectional view of the assembled electronic device of fig. 46.

Detailed Description

Common reference numerals are used throughout the drawings and the detailed description to refer to the same or like components. Embodiments of the present disclosure will be readily understood by the following detailed description in conjunction with the accompanying drawings.

The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to illustrate certain aspects of the present disclosure. Of course, these are merely examples and are not intended to be limiting. For example, in the following description, the formation of a first feature over or on a second feature may include embodiments in which the first and second features are formed or disposed in direct contact, and may also include embodiments in which additional features may be formed or disposed between the first and second features such that the first and second features may not be in direct contact. Further, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

To meet the specifications for an increasing number of functions, the number of devices integrated in a semiconductor package structure should be increased. Therefore, the power density and the number of heat sources are increased, and the thermal resistance (thermal resistance) is relatively large. In addition, it is difficult to dissipate (dissite) heat generated by devices in the center of the semiconductor package. To address the above issues, in some comparative embodiments, a fan is provided. The fan is attached to the semiconductor package structure to dissipate heat at the periphery of the semiconductor package structure through an air flow. However, such fans may not dissipate heat generated by equipment at the center of the semiconductor package structure. In some comparative embodiments, the number of substrate vias or the thickness of the metal layer is increased. However, the improvement in heat dissipation efficiency is slight. In some comparative embodiments, a Thermal Interface Material (TIM) is used between the device and the package substrate. However, the temperature of the device at the center of the semiconductor package structure may not be reduced significantly.

At least some embodiments of the present disclosure provide electronic devices with highly improved heat dissipation efficiency. In some embodiments, the electronic device includes at least one heat pipe (heat pipe) in contact with a cover structure (cover structure) of the semiconductor package structure for dissipating heat generated by a semiconductor die of the semiconductor package structure.

Fig. 1 illustrates an exploded perspective view of an electronic device 1 according to some embodiments of the present disclosure. Fig. 2 illustrates an assembled cross-sectional view of the electronic device 1 of fig. 1. An electronic device (electronic device)1 includes a host substrate 2, a semiconductor package 3, and at least one heat pipe 4.

The host substrate 2 (e.g., a Printed Circuit Board (PCB)) has a first surface 21 (e.g., a top surface) and a second surface 22 (e.g., a bottom surface) opposite the first surface 21, and includes a body 24, a first protective layer 26, and a second protective layer 28. The body 24 has a first surface 241 (e.g., a top surface) and a second surface 242 (e.g., a bottom surface) opposite the first surface 241. The body 24 may include a plurality of passivation layers (not shown) and a plurality of circuit layers (not shown) interposed between the passivation layers. The first protective layer 26 and the second protective layer 28 may be solder resist layers. As shown in fig. 1, the primary substrate 2 defines a plurality of through-holes 23 extending in the primary substrate 2. That is, the through-hole 23 extends through the main body 24, the first protective layer 26, and the second protective layer 28. Further, the first protective layer 26 may define a plurality of openings 261 that extend through the first protective layer 26 to expose portions of the circuit layer of the body 24. That is, the opening 261 does not extend through the body 24 and the second protective layer 28.

The semiconductor package structure 3 may be a flip-chip Ball Grid Array (BGA) package and is electrically connected to the first surface 21 of the main substrate 2. Semiconductor package structure 3 includes a package substrate 30, a semiconductor die 32, a thermal bonding material 34, a cover structure 36, a plurality of internal connection elements 37 (e.g., solder bumps), and a plurality of external connection elements 38 (e.g., solder bumps). The package substrate 30 has a first surface 301 (e.g., a top surface) and a second surface 302 (e.g., a bottom surface) opposite the first surface 301, and may include a plurality of passivation layers and at least one circuit layer (e.g., redistribution layer (RDL)) located between the passivation layers. Package substrate 30 may further include a die mounting portion 303 for receiving semiconductor die 32.

Semiconductor die 32 is electrically connected to first surface 301 of package substrate 30. Semiconductor die 32 has a first surface 321 (e.g., a backside surface) and a second surface 322 (e.g., an active surface) opposite first surface 321, and includes interconnection elements 37 (e.g., solder bumps) adjacent its second surface 322. The semiconductor die 32 is attached to a die mounting portion 303 of the package substrate 30 and is electrically connected to the first surface 301 of the package substrate 30 through an interconnect element 37 (e.g., solder bumps) in a flip-chip bonding manner. An underfill (underfill)39 may be further included to cover and protect the internal connection elements 37 (e.g., solder bumps). Capping structure 36 may be a metal lid structure (metal lid structure) that caps semiconductor die 32. The capping structure 36 (e.g., a metal cap structure) is a cap structure (cap structure) or a top plate structure (hatstructure), and includes a substrate (base plate)361, a peripheral sidewall 362, and a bottom rim portion (bottom edge) 363. Peripheral sidewall 362 extends from substrate 361 to bottom rim portion 363 so as to define a receiving space for receiving semiconductor die 32. The cover structure 36 (e.g., a metal cover structure) may be integrally formed as a one-piece structure. The bottom frame rim portion 363 is attached or adhered to the first surface 301 of the package substrate 30.

A thermal bonding material 34, such as a Thermal Interface Material (TIM) having a thermal conductivity greater than or equal to about 3W/mK, about 4W/mK, or about 5W/mK, is located between semiconductor die 32 and a cover structure 36, such as a metal lid structure. That is, thermal bonding material 34 (e.g., Thermal Interface Material (TIM)) is used to bond first surface 321 of semiconductor die 32 to an inner bottom surface of substrate 361 of cover structure 36 (e.g., metal lid structure). The external connection elements 38 (e.g., solder bumps) are adjacent to the second surface 302 of the package substrate 30. Bottom portions of the external connection elements 38 (e.g., solder bumps) are disposed in the openings 261 of the first protective layer 26 such that the circuit layers of the package substrate 30 are electrically connected to the circuit layers of the main body 24 of the main substrate 2.

The heat pipe 4 is in contact with a cover structure 36 (e.g., a metal lid structure) for dissipating heat generated by the semiconductor die 32. The heat pipe 4 is an enclosed hollow structure and may comprise a wick structure on the inner surface of the wall of the heat pipe 4. A working liquid 43 may be present in the heat pipe 4. The material of the working liquid 43 may be water, ethanol, acetone, isopropanol, chlorofluorocarbon (CFC), or other suitable material. In one embodiment, the heat pipe 4 is a U-shaped heat pipe and comprises one first portion 41 and two second portions 42. The first portion 41 connects the two second portions 42. The heat pipe 4 is integrally formed. The first portion 41 is adjacent to the cover structure 36 (e.g., a metal cap structure) and the second portion 42 is adjacent to the host substrate 2. As shown in fig. 2, the first portion 41 is disposed on and in contact with a top surface of a substrate 361 of the cover structure 36 (e.g., a metal lid structure). The two second portions 42 extend through the host substrate 2. That is, a part of the end 421 of the second portion 42 is disposed in the through hole 23 of the main substrate 2. An end 421 of the second portion 42 may protrude from the second surface 22 of the main substrate 2. Further, the solder material 44 may be applied to the end 421 of the second portion 42 and the second surface 22 of the primary substrate 2 so as to fix the end 421 of the second portion 42 of the heat pipe 4 to the primary substrate 2.

As shown in fig. 2, during operation of semiconductor die 32, heat generated by semiconductor die 32 will be absorbed by capping structure 36 (e.g., a metal cap structure) in order to obtain a uniform temperature distribution. The heat of the cover structure 36 (e.g., a metal cap structure) will then be absorbed by the first portion 41 of the heat pipe 4 and transferred or conducted to the end 421 of the second portion 42 of the heat pipe 4. The heat of the end 421 of the second portion 42 of the heat pipe 4 is then conducted by the copper layer of the primary substrate 2 or other heat dissipation device. Because the first portion 41 of the heat pipe 4 is in close proximity to the first surface 321 of the semiconductor die 32, the heat dissipation efficiency is relatively high. Furthermore, the first portion 41 of the heat pipe 4 may be positioned near or directly above a hot spot (hot spot) of the semiconductor package structure 3 in order to increase heat dissipation efficiency.

Fig. 3 illustrates an assembled cross-sectional view of an electronic device 1a according to some embodiments of the present disclosure. The electronic device 1a is similar to the electronic device 1 of fig. 1 and 2, and the differences are described below. The end 421 of the second portion 42 of the heat pipe 4 is a horizontal section (horizontal segment) disposed on the first surface 21 of the primary substrate 2. The end 421 of the second portion 42 of the heat pipe 4 is parallel to and disposed on the first surface 21 of the primary substrate 2. Further, the end 421 of the second portion 42 of the heat pipe 4 is thermally and physically connected to the main body 24 of the main substrate 2 through the solder material 45 in the opening 262 of the first protective layer 26.

Fig. 4 illustrates an exploded perspective view of an electronic device 1b according to some embodiments of the present disclosure. Fig. 5 illustrates an assembled perspective view of the electronic apparatus 1b of fig. 4. Fig. 6 illustrates a front view of the electronic device 1b of fig. 5. Fig. 7 illustrates a top view of the electronic device 1b of fig. 5. The electronic device 1b is similar to the electronic device 1 of fig. 1 and 2, and the differences are described below. The cover structure 46 (e.g., a metal cap structure) of the semiconductor package structure 3b includes a substrate 461 and four positioning pins 462 disposed at four corners of the substrate 461. The inner surface 4621 of each of the positioning pins 462 is in contact with a portion of the side surface 304 of the package substrate 30. The bottom portions of the positioning pins 462 may not be attached to or contact the first surface 241 of the main substrate 24. That is, there may be a gap between the bottom portion of the positioning pin 462 and the first surface 241 of the main substrate 24.

Thermal bonding material 34, e.g., Thermal Interface Material (TIM), is located between semiconductor die 32 and a cover structure 46, e.g., a metal cap structure. That is, thermal bonding material 34 (e.g., Thermal Interface Material (TIM)) is used to bond first surface 321 of semiconductor die 32 to an inner bottom surface of substrate 461 of cover structure 46 (e.g., metal cap structure). The heat pipe 4 is in contact with a cover structure 46 (e.g., a metal lid structure) for dissipating heat generated by the semiconductor die 32. In one embodiment, the heat pipe 4 is a U-shaped heat pipe and comprises one first portion 41 and two second portions 42. The first portion 41 connects the two second portions 42. As shown in fig. 6, the first portion 41 is disposed on and in contact with a top surface of a substrate 461 of a cover structure 46 (e.g., a metal cap structure). The two second portions 42 extend through the host substrate 2.

Fig. 8 illustrates an exploded perspective view of an electronic device 1c according to some embodiments of the present disclosure. Fig. 9 illustrates an assembled perspective view of the electronic apparatus 1c of fig. 8. The electronic apparatus 1c is similar to the electronic apparatus 1b of fig. 4 to 7, and differences are described below. The cover structure 46 (e.g., metal lid structure) of the electronic device 1c further defines a plurality of grooves 4611 on the top surface of the substrate 461. The first portion 41 of the heat pipe 4 is seated in the groove 4611. In addition, the electronic apparatus 1c further includes a heat sink (heat sink) 5. The heat sink 5 includes a base plate 51 and a plurality of heat radiating fins 52 disposed on the base plate 51. The base plate 51 of the heat sink 5 may be attached to the top surface of the base plate 461 of the cover structure 46 (e.g., a metal cover structure). That is, the base 51 of the heat sink 5 may be disposed on and in contact with the first portion 41 of the heat pipe 4. In one embodiment, the depth of the groove 4611 may be substantially equal to the outer diameter of the first portion 41 of the heat pipe 4, such that the substrate 51 of the heat sink 5 may be securely attached to the top surface of the substrate 461 of the cover structure 46. In one embodiment, the base plate 51 of the heat sink 5 is thermally connected to the first portion 41 of the heat pipe 4 in order to improve heat dissipation efficiency. In one embodiment, the size of the substrate 51 of the heat sink 5 in a top view may be the same as the size of the substrate 461 of the cover structure 46 (e.g., metal lid structure).

Fig. 10 illustrates a cross-sectional view of an electronic device 1d, in accordance with some embodiments of the present disclosure. The electronic device 1d is similar to the electronic device 1 of fig. 1 and 2, and differences are described below. The second portion 42 of the heat pipe 4 of the electronic device 1d extends upward. The second portion 42 may be substantially perpendicular to the first portion 41. In addition, the electronic apparatus 1d further includes a heat sink 5 d. The heat sink 5d includes a base plate 51 and a plurality of heat radiating fins 52 disposed on the base plate 51. The base plate 51 of the heat sink 5d may be attached to the top surface of the base plate 361 of the cover structure 36 (e.g., a metal lid structure). That is, the base 51 of the heat sink 5d may be disposed on the first portion 41 of the heat pipe 4 and between the second portions 42 of the heat pipe 4.

In one embodiment, the second portion 42 of the heat pipe 4 may be in contact with a side surface of the heat sink 5 d. That is, the second portion 42 of the heat pipe 4 is connected to the heat sink 5 d. In one embodiment, the cover structure 36 (e.g., a metal lid structure) of the electronic apparatus 1d may further define a plurality of grooves on the top surface of the substrate 361, and the first portion 41 of the heat pipe 4 is disposed in the grooves. In one embodiment, the depth of the groove may be substantially equal to the outer diameter of the first portion 41 of the heat pipe 4, such that the base plate 51 of the heat sink 5d may be securely attached to the top surface of the base plate 361 of the cover structure 36. Note that the groove of the substrate 361 may be omitted. In one embodiment, the base plate 51 of the heat sink 5d is thermally connected to the first portion 41 of the heat pipe 4 in order to improve heat dissipation efficiency. In one embodiment, the width of the base 51 of the heat sink 5d in top view may be the same as the length of the base 461 of the first portion 41 of the heat pipe 4.

Fig. 11 illustrates a cross-sectional view of an electronic device 1e, in accordance with some embodiments of the present disclosure. The electronic apparatus 1e is similar to the electronic apparatus 1d of fig. 10, and differences are described below. The width of the base plate 51 of the heat sink 5e in the top view may be greater than or equal to the width of the base plate 51 of the heat sink 5d of fig. 10 in the top view. The heat sink 5e further defines a plurality of positioning holes 53 recessed from the bottom surface of the base plate 51. Each of the second portions 42 of the heat pipe 4e of the electronic apparatus 1e is inserted into each of the positioning holes 53. The length of the second portion 42 of the heat pipe 4e may be substantially equal to the depth of the positioning hole 53.

Fig. 12 illustrates a cross-sectional view of an electronic device 1f, according to some embodiments of the present disclosure. The electronic device 1f is similar to the electronic device 1 of fig. 1 and 2, and differences are described below. The package substrate 30f of the semiconductor package structure 3f defines a plurality of through holes 304. Two second portions 42 of the heat pipe 4f extend through the package substrate 30 f. That is, a portion of the end 421 of the second portion 42 is disposed in the through hole 304 of the package substrate 30 f. The end 421 of the second portion 42 may be connected to an external thermal connection element 381. Therefore, the heat of the end 421 of the second portion 42 can be conducted to the host substrate 2 through the external thermal connection member 381.

Fig. 13 illustrates a cross-sectional view of an electronic device 1g, in accordance with some embodiments of the present disclosure. The electronic apparatus 1g is similar to the electronic apparatus 1f of fig. 12, and differences are described below. The conductive material is filled in the through-hole 304 of the package substrate 30g of the semiconductor package structure 3g so as to form the thermal via 305. The end 421 of the second portion 42 of the heat pipe 4g may be thermally or physically connected to the thermal via 305 of the package substrate 30 g. The bottom end of the thermal via 305 is connected to an external thermal connection component 381. Therefore, the heat of the end 421 of the second portion 42 can be conducted to the host substrate 2 through the thermal via 305 and the external thermal connection member 381.

Fig. 14 illustrates a cross-sectional view of an electronic device 1h, according to some embodiments of the present disclosure. The electronic apparatus 1h is similar to the electronic apparatus 1f of fig. 12, and differences are described below. The heat pipe 4h is located between the semiconductor die 32 and a cover structure 36 (e.g., a metal lid structure). Thermal bonding material 34, such as a Thermal Interface Material (TIM), is used to bond first portion 41 of heat pipe 4h to first surface 321 of semiconductor die 32. The inner bottom surface of the base plate 361 of the cover structure 36 (e.g., a metal cover structure) is thermally or physically connected to the first portion 41 of the heat pipe 4 h.

Fig. 15 illustrates a cross-sectional view of an electronic device 1i, according to some embodiments of the present disclosure. The electronic apparatus 1i is similar to the electronic apparatus 1g of fig. 13, and the differences are described below. Heat pipe 4i is located between semiconductor die 32 and a cover structure 36 (e.g., a metal lid structure). Thermal bonding material 34, such as a Thermal Interface Material (TIM), is used to bond first portion 41 of heat pipe 4i to first surface 321 of semiconductor die 32. The inner bottom surface of the base plate 361 of the cover structure 36 (e.g., a metal cover structure) is thermally or physically connected to the first portion 41 of the heat pipe 4 i.

Fig. 16 illustrates an exploded perspective view of an electronic device 1j according to some embodiments of the present disclosure. Fig. 17 illustrates a cross-sectional view of the electronic apparatus 1j of fig. 16. The electronic device 1j is similar to the electronic device 1 of fig. 1 and 2, and differences are described below. The cover structure 36j of the electronic device 1j of the semiconductor package structure 3j is a vapor chamber covering the semiconductor die 32. The cover structure 36j (e.g., vapor chamber) includes a top wall 364, a bottom wall 365, a wick structure 366, a plurality of wick rods 367, and a working liquid 368. The top and bottom walls 364, 365 are sealed together at their peripheral rims to define an enclosed space (i.e., an enclosed cavity). Core structure 366 is on the inner surface of top wall 364 and bottom wall 365. Each of the core rods 367 is connected at both ends to the top and bottom walls 364 and 365, respectively. The working liquid 368 is disposed in an enclosed space (i.e., an enclosed cavity).

Thermal bonding material 34 is located between semiconductor die 32 and cover structure 36j (e.g., a vapor cavity). That is, thermal bonding material 34 (e.g., Thermal Interface Material (TIM)) is used to bond first surface 321 of semiconductor die 32 to a bottom surface of bottom wall 365 of cover structure 36j (e.g., vapor cavity). The heat pipe 4 is in contact with a cover structure 36j (e.g., a vapor chamber) for dissipating heat generated by the semiconductor die 32. The first portion 41 is disposed on and in contact with a top surface of a top wall 364 of the cover structure 36j (e.g., a vapor chamber). Two second portions 42 of the heat pipe 4 extend through the primary substrate 2.

Fig. 18 illustrates a cross-sectional view of an electronic device 1k, according to some embodiments of the present disclosure. The electronic device 1k is similar to the electronic device 1 of fig. 1 and 2, and the differences are described below. In the semiconductor package structure 3k of the electronic apparatus 1k, the semiconductor die 32 is attached or bonded to the die mounting portion 303 of the package substrate 30 through a die attach adhesive 391, and is electrically connected to the package substrate 30 through a plurality of bonding wires 35. The cover structure 36k of the electronic device 1k includes a molding compound (molding compound)40 and a metal plate lid (metal plate) 401. The molding compound 40 covers the semiconductor die 32, the bonding wires 35, and the first surface 301 of the package substrate 30. A sheet metal cover 401 is disposed on the top surface of the molding compound 40. A first portion 41 of the heat pipe 4 is adjacent to the molding compound 40 and a second portion 42 of the heat pipe 4 is adjacent to the primary substrate 2. As shown in fig. 18, the first portion 41 is disposed on and in contact with the top surface of the sheet metal cover 401. The two second portions 42 extend through the host substrate 2.

Fig. 19 illustrates an exploded perspective view of an electronic device 1m according to some embodiments of the present disclosure. Fig. 20 illustrates an assembled perspective view of the electronic apparatus 1m of fig. 19. Fig. 21 illustrates a cross-sectional view of the electronic apparatus 1m of fig. 20. The electronic apparatus 1m includes a main substrate 2, a semiconductor package structure 3m, and at least one heat pipe 4 m.

The main substrate 2, e.g., a Printed Circuit Board (PCB), has a first surface 21, e.g., a top surface, and a second surface 22, e.g., a bottom surface, opposite the first surface 21, and includes a body 24, a first protective layer 26, and a second protective layer 28. The body 24 has a first surface 241 (e.g., a top surface) and a second surface 242 (e.g., a bottom surface) opposite the first surface 241. The body 24 may include a plurality of passivation layers (not shown) and a plurality of circuit layers (not shown) between the passivation layers. The first protective layer 26 and the second protective layer 28 may be solder resist layers. Further, the first protective layer 26 may define a plurality of openings 261 that extend through the first protective layer 26 to expose portions of the circuit layers of the body 24.

The semiconductor package structure 3m may be a Quad Flat Package (QFP) and is electrically connected to the first surface 21 of the primary substrate 2. The semiconductor package structure 3m includes a die attach pad (die attach pad)60, a plurality of leads (leads)62, a die attach adhesive 64, the semiconductor die 32, a thermal bonding material 34, a plurality of bond wires 66, and a cover structure 68. Die attach pad 60 has a first surface 601 (e.g., a top surface) and a second surface 602 (e.g., a bottom surface) opposite first surface 601. Die attach pad 60 can further include a die mount portion 603 for receiving semiconductor die 32. The pins 62 surround the die attach pad 60 and are electrically connected to the primary substrate 2. The semiconductor die 32 is attached or bonded to the die attach pad 60 die mount portion 603 through a die attach adhesive 64 and electrically connected to the pins 62 through bond wires 66. The cover structure 68 is a molding compound that covers the semiconductor die 32, the die attach pad 60, the bond wires 66, portions of the pins 62, and a portion of the heat pipe 4 m. The first portion 41 of the heat pipe 4m is attached or bonded to the first surface 321 of the semiconductor die 32 through the thermal bonding material 34. The end 421 of the second portion 42 of the heat pipe 4m is a horizontal section disposed on the first surface 21 of the primary substrate 2. The end 421 of the second portion 42 of the heat pipe 4m is parallel to and disposed on the first surface 21 of the primary substrate 2. Further, the end 421 of the second portion 42 of the heat pipe 4m is thermally and physically connected to the main body 24 of the main substrate 2. As shown in fig. 19 to 21, the heat pipe 4m extends from the left side to the right side of the cover structure 68 (e.g., molding compound). Thus, the ends 421 of the second portion 42 of the heat pipe 4m are disposed on the left and right sides of the cover structure 68 (e.g., molding compound), respectively.

Fig. 22 illustrates an exploded perspective view of an electronic device 1n according to some embodiments of the present disclosure. Fig. 23 illustrates an assembled perspective view of the electronic apparatus 1n of fig. 22. Fig. 24 illustrates a cross-sectional view of the electronic apparatus 1n of fig. 23. The electronic apparatus 1n is similar to the electronic apparatus 1m of fig. 19 to 21, and differences are described below. In the electronic device 1n of fig. 22 to 24, the heat pipe 4n extends from the front side to the rear side of the cover structure 68 (e.g., mold compound). Thus, the ends 421 of the second portion 42 of the heat pipe 4n are disposed on the front and back sides, respectively, of the cover structure 68 (e.g., mold compound).

Fig. 25 illustrates an exploded perspective view of an electronic device 1p, according to some embodiments of the present disclosure. Fig. 26 illustrates an assembled perspective view of the electronic apparatus 1p of fig. 25. Fig. 27 illustrates a cross-sectional view of the electronic apparatus 1p of fig. 26. The electronic apparatus 1p is similar to the electronic apparatus 1m of fig. 19 to 21, and differences are described below. In the electronic apparatus 1p of fig. 25 to 26, the two second portions 42 of the heat pipe 4p penetrate the primary substrate 2. Further, the end of the lead 62p also penetrates the main substrate 2.

Fig. 28 illustrates an exploded perspective view of an electronic device 1q, according to some embodiments of the present disclosure. Fig. 29 illustrates an assembled perspective view of the electronic apparatus 1q of fig. 28. Fig. 30 illustrates a cross-sectional view of the electronic apparatus 1q of fig. 29. The electronic apparatus 1q is similar to the electronic apparatus 1n of fig. 22 to 24, and differences are described below. In the electronic apparatus 1q of fig. 28 to 30, the two second portions 42 of the heat pipe 4q penetrate the host substrate 2. Further, the end of the lead 62q also penetrates the main substrate 2.

Fig. 31 illustrates an exploded perspective view of an electronic device 1r according to some embodiments of the present disclosure. Fig. 32 illustrates an assembled perspective view of the electronic apparatus 1r of fig. 31. Fig. 33 illustrates a cross-sectional view of the electronic apparatus 1r of fig. 32. The electronic apparatus 1r is similar to the electronic apparatus 1m of fig. 19 to 21, and differences are described below. In the electronic apparatus 1r of fig. 31 to 33, the heat pipe 4m of fig. 19 to 21 is omitted, and the pin 62r is in the heat pipe type rather than a solid strip. Semiconductor die 32 is electrically connected to pins 62r (e.g., heat pipes) through bond wires 66. The cover structure 68 covers portions of the semiconductor die 32, the die attach pad 60, the bond wires 66, and the pins 62r (e.g., heat pipes). An end 621r of the lead 62r (e.g., heat pipe) is a horizontal section disposed on the first surface 21 of the primary substrate 2. Further, an end 621r of the lead wire 62r (e.g., heat pipe) is thermally and electrically connected to the main body 24 of the main substrate 2. That is, the lead 62r (e.g., heat pipe) is a thermal connection path, and is also an electrical connection path.

Fig. 34 illustrates an exploded perspective view of an electronic device 1s, according to some embodiments of the present disclosure. Fig. 35 illustrates an assembled perspective view of the electronic apparatus 1s of fig. 34. Fig. 36 illustrates a cross-sectional view of the electronic apparatus 1s of fig. 35. The electronic apparatus 1s is similar to the electronic apparatus 1r of fig. 31 to 33, and differences are described below. In the electronic apparatus 1s of fig. 34 to 36, an end 621s of a pin 62s (e.g., a heat pipe) penetrates the primary substrate 2.

Fig. 37 illustrates an exploded perspective view of an electronic device 1t according to some embodiments of the present disclosure. Fig. 38 illustrates an assembled perspective view of the electronic apparatus 1t of fig. 37. FIG. 39 illustrates a cross-sectional view taken along line 39-39 of the electronic device 1t of FIG. 38. FIG. 40 illustrates a cross-sectional view taken along line 40-40 of the electronic device 1t of FIG. 38. The electronic device 1t comprises a main substrate 2, a semiconductor package structure 7 and at least one heat pipe 4.

The host substrate 2 (e.g., a Printed Circuit Board (PCB)) is similar to the host substrate 2 of fig. 1 and 2. The main substrate 2 has a first surface 21 (e.g., a top surface) and a second surface 22 (e.g., a bottom surface) opposite to the first surface 21, and includes a body 24, a first protective layer 26, and a second protective layer 28. The body 24 has a first surface 241 (e.g., a top surface) and a second surface 242 (e.g., a bottom surface) opposite the first surface 241. The first protective layer 26 and the second protective layer 28 may be solder resist layers. The primary substrate 2 defines a plurality of through-holes 23 extending in the primary substrate 2. That is, the through-hole 23 extends through the main body 24, the first protective layer 26, and the second protective layer 28. Further, the first protective layer 26 may define a plurality of openings 261 that extend through the first protective layer 26 to expose portions of the circuit layers of the body 24.

The semiconductor package structure 7 may be a wire Bonding (BGA) package and is electrically connected to the first surface 21 of the main substrate 2. Semiconductor package structure 7 includes a package substrate 70, a semiconductor die 72, a die-attach adhesive 71, a plurality of bond wires 74, a cover structure 78, and a plurality of external connection elements 79 (e.g., solder bumps). The package substrate 70 has a first surface 701 (e.g., a top surface) and a second surface 702 (e.g., a bottom surface) opposite the first surface 701, and may include a plurality of passivation layers and at least one circuit layer (e.g., a redistribution layer (RDL)) located between the passivation layers. The package substrate 70 may further include a die mounting portion 703 for receiving the semiconductor die 72. The semiconductor die 72 is electrically connected to the first surface 701 of the package substrate 70. The semiconductor die 72 has a first surface 721 (e.g., an active surface) and a second surface 722 (e.g., a backside surface) opposite the first surface 721. The second surface 722 of the semiconductor die 72 is attached to the die mount portion 703 of the package substrate 70 by the die attach adhesive 71. The first surface 721 of the semiconductor die 72 is electrically connected to the first surface 701 of the package substrate 70 through the bonding wires 74. The cover structure 78 may be a molding compound that covers the first surface 701 of the package substrate 70, the semiconductor die 72, and the bond wires 74.

The heat pipe 4 is in contact with a cover structure 78 (e.g., a molding compound) for dissipating heat generated by the semiconductor die 72. In one embodiment, the heat pipe 4 is a U-shaped heat pipe and comprises one first portion 41 and two second portions 42. The first portion 41 connects the two second portions 42. The first portion 41 of the heat pipe 4 is disposed on and in contact with the first surface 721 of the semiconductor die 72 and is covered by a cover structure 78 (e.g., a molding compound). That is, the first portion 41 of the heat pipe 4 is embedded in the cover structure 78 (e.g., molding compound). The two second portions 42 extend through the host substrate 2. The direction of extension of the first portion 41 of the heat pipe 4 is perpendicular to the direction of extension of the joining line 74. Thus, the first portion 41 of the heat pipe 4 is located between the two rows of bond wires 74. For example, as shown in fig. 39, the extending direction of the first portion 41 of the heat pipe 4 is the normal direction of fig. 39, and the extending direction of the bonding wire 74 is from the right side to the left side or from the left side to the right side of fig. 39.

As shown in fig. 37-40, during operation of the semiconductor die 72, heat generated by the semiconductor die 72 will be absorbed by the first portion 41 of the heat pipe 4 and transferred or conducted to the end 421 of the second portion 42 of the heat pipe 4. The heat of the end 421 of the second portion 42 of the heat pipe 4 is then conducted by the copper layer of the primary substrate 2 or other heat sink. Because the first portion 41 of the heat pipe 4 is in close proximity to the first surface 721 of the semiconductor die 72, the heat dissipation efficiency is relatively high.

Fig. 41 illustrates an exploded perspective view of an electronic device 1u, according to some embodiments of the present disclosure. Fig. 42 illustrates an assembled perspective view of the electronic apparatus 1u of fig. 41. Fig. 43 illustrates a cross-sectional view of the electronic device 1u of fig. 42. The electronic apparatus 1u is similar to the electronic apparatus 1t of fig. 37 to 40, and differences are described below. The end 421 of the second portion 42 of the heat pipe 4 is a horizontal section disposed on the first surface 21 of the primary substrate 2. The end 421 of the second portion 42 of the heat pipe 4 is parallel to and disposed on the first surface 21 of the primary substrate 2. Further, the end 421 of the second portion 42 of the heat pipe 4 is thermally and physically connected to the main body 24 of the main substrate 2 through the solder material 45 in the opening 262 of the first protective layer 26.

Fig. 44 illustrates an exploded perspective view of an electronic device 1v according to some embodiments of the present disclosure. Fig. 45 illustrates a cross-sectional view of the assembled electronic device 1v of fig. 44. The electronic apparatus 1v is similar to the electronic apparatus 1t of fig. 37 to 40, and differences are described below. The extension direction of the first portion 41 of the heat pipe 4 is parallel to the extension direction of the bonding line 74. Thus, the first portion 41 of the heat pipe 4 is positioned adjacent to two opposing joining lines 74. That is, the first portion 41 of the heat pipe 4 is disposed between two bond wires 74 in the same row. For example, as shown in fig. 45, the extending direction of the first portion 41 of the heat pipe 4 is from the right side to the left side or from the left side to the right side of fig. 45, and the extending direction of the bonding wire 74 is from the right side to the left side or from the left side to the right side of fig. 45.

Fig. 46 illustrates an exploded perspective view of an electronic device 1w according to some embodiments of the present disclosure. Fig. 47 illustrates a sectional view of the assembled electronic apparatus 1w of fig. 46. The electronic apparatus 1w is similar to the electronic apparatus 1v of fig. 44 to 45, and differences are described below. The end 421 of the second portion 42 of the heat pipe 4 is a horizontal section disposed on the first surface 21 of the primary substrate 2. The end 421 of the second portion 42 of the heat pipe 4 is parallel to and disposed on the first surface 21 of the primary substrate 2. Further, the end 421 of the second portion 42 of the heat pipe 4 is thermally and physically connected to the main body 24 of the main substrate 2 through the solder material 45 in the opening 262 of the first protective layer 26.

Unless otherwise specified, spatial descriptions such as "above," "below," "upper," "left," "right," "lower," "top," "bottom," "vertical," "horizontal," "side," "above," "below," "upper," "on … …," "under … …," and the like are directed relative to the orientation shown in the figures. It is to be understood that the spatial descriptions used herein are for purposes of illustration only and that actual implementations of the structures described herein may be spatially arranged in any orientation or manner, provided that the embodiments of the present disclosure are not offset by such arrangements.

As used herein, the terms "substantially", "essentially" and "about" are used to describe and explain minor variations. When used in conjunction with an event or circumstance, the terms may refer to the exact instance in which the event or circumstance occurs, as well as the instance in which the event or circumstance occurs in close proximity. For example, when used in conjunction with numerical values, the terms can refer to a range of variation that is less than or equal to ± 10% of the stated numerical value, such as less than or equal to ± 5%, less than or equal to ± 4%, less than or equal to ± 3%, less than or equal to ± 2%, less than or equal to ± 1%, less than or equal to ± 0.5%, less than or equal to ± 0.1%, or less than or equal to ± 0.05%. For example, a first value can be considered "substantially" the same as or equal to a second value if the first value varies from less than or equal to ± 10% of the second value, such as less than or equal to ± 5%, less than or equal to ± 4%, less than or equal to ± 3%, less than or equal to ± 2%, less than or equal to ± 1%, less than or equal to ± 0.5%, less than or equal to ± 0.1%, or less than or equal to ± 0.05%. For example, "substantially" perpendicular may refer to a range of angular variation of less than or equal to ± 10 ° from 90 °, such as less than or equal to ± 5 °, less than or equal to ± 4 °, less than or equal to ± 3 °, less than or equal to ± 2 °, less than or equal to ± 1 °, less than or equal to ± 0.5 °, less than or equal to ± 0.1 °, or less than or equal to ± 0.05 °.

Two surfaces can be considered coplanar or substantially coplanar if the displacement between the two surfaces is no more than 5 μm, no more than 2 μm, no more than 1 μm, or no more than 0.5 μm. A surface may be considered substantially flat if the displacement between the highest and lowest points of the surface is no more than 5 μm, no more than 2 μm, no more than 1 μm, or no more than 0.5 μm.

As used herein, the singular terms "a" and "the" may include plural referents unless the context clearly dictates otherwise.

As used herein, the terms "conductive", "electrically conductive" and "conductivity" refer to the ability to transfer electrical current. Conductive materials generally refer to those materials that exhibit little or no resistance to current flow. One measure of conductivity is Siemens (Siemens) per meter (S/m). Typically, the conductive material has a conductivity greater than about 10⁴S/m (e.g. at least 10)⁵S/m or at least 10⁶S/m) of the above-mentioned material. The electrical conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

Further, amounts, ratios, and other numerical values are sometimes presented herein in a range format. It is to be understood that such a range format is used for convenience and brevity, and should be interpreted flexibly to include not only the numerical values explicitly recited as the limits of the range, but also to include all the individual numerical values or sub-ranges encompassed within that range as if each numerical value and sub-range is explicitly recited.

While the present disclosure has been described and illustrated with reference to particular embodiments thereof, such description and illustration are not intended to be limiting. It should be understood by those skilled in the art that various changes may be made and equivalents substituted without departing from the true spirit and scope of the disclosure as defined by the appended claims. The description may not be drawn to scale. Due to manufacturing processes and tolerances, there may be a difference between the artistic rendition in this disclosure and the actual device. There may be other embodiments of the disclosure that are not specifically illustrated. The specification and drawings are to be regarded in an illustrative rather than a restrictive sense. Modifications may be made to adapt a particular situation, material, composition of matter, method, or process to the objective, spirit and scope of the present disclosure. All such modifications are intended to be within the scope of the claims appended hereto. Although the methods disclosed herein have been described with reference to particular operations performed in a particular order, it should be understood that these operations may be combined, sub-divided, or reordered to form equivalent methods without departing from the teachings of the present disclosure. Accordingly, unless specifically indicated herein, the order and grouping of the operations is not a limitation of the present disclosure.