阅读说明：本技术 包括受压缩热界面材料(tim)和包括柔性部分的电磁(emi)屏蔽的器件 (Device including a compressed Thermal Interface Material (TIM) and Electromagnetic (EMI) shielding including a flexible portion ) 是由 V·萨胡 M·塞迪 于 2018-06-11 设计创作，主要内容包括：一种设备,其包括管芯(1220)、耦合至管芯的热界面材料(270)(TIM)和耦合至热界面材料(TIM)的电磁(EMI)屏蔽(300)。电磁(EMI)屏蔽被配置成压缩热界面材料(TIM)。电磁(EMI)屏蔽包括柔性部分(300b)。在一些实现中,热界面材料(TIM)被电磁(EMI)屏蔽压缩,以使得热界面材料(TIM)的厚度减小约至少10-20％。(An apparatus includes a die (1220), a thermal interface material (270) (TIM) coupled to the die, and an Electromagnetic (EMI) shield (300) coupled to the Thermal Interface Material (TIM). An electromagnetic interference (EMI) shield is configured to compress a Thermal Interface Material (TIM). An Electromagnetic (EMI) shield includes a flexible portion (300 b). In some implementations, the Thermal Interface Material (TIM) is compressed by the Electromagnetic (EMI) shield such that the thickness of the Thermal Interface Material (TIM) is reduced by about at least 10-20%.)

1. A device, comprising:

a die;

a Thermal Interface Material (TIM) provided over the die; and

an Electromagnetic (EMI) shield coupled to the Thermal Interface Material (TIM), the Electromagnetic (EMI) shield including a flexible portion, wherein the Electromagnetic (EMI) shield is configured to compress the Thermal Interface Material (TIM).

2. The device of claim 1, wherein the flexible portion of the Electromagnetic (EMI) shield comprises a stiffness that will result in a displacement in a range of about 50-500 microns when a load in a range of 2-90 newtons (N) is applied to the Electromagnetic (EMI) shield.

3. The device of claim 1, wherein the Thermal Interface Material (TIM) is compressed by the Electromagnetic (EMI) shield such that the thickness of the Thermal Interface Material (TIM) is reduced by about at least 10-20%.

4. The device of claim 1, wherein the Electromagnetic (EMI) shield is coupled to a spring.

5. The device of claim 1, wherein the Electromagnetic (EMI) shield is coupled to a pin to provide a load that compresses the Thermal Interface Material (TIM).

6. The device of claim 1, wherein the die is part of a package and/or package on package (PoP).

7. The device of claim 1, wherein the device is incorporated into an apparatus selected from the group consisting of: music players, video players, entertainment units, navigation devices, communication devices, mobile phones, smart phones, personal digital assistants, fixed location terminals, tablet computers, wearable devices, internet of things (IoT) devices, laptop computers, servers, and devices in automobiles.

8. An apparatus, comprising:

a die;

a Thermal Interface Material (TIM) provided over the die; and

means for Electromagnetic (EMI) shielding coupled to the Thermal Interface Material (TIM), the means for Electromagnetic (EMI) shielding comprising a flexible portion, wherein the means for Electromagnetic (EMI) shielding is configured to compress the Thermal Interface Material (TIM).

9. The apparatus of claim 8, wherein the flexible portion of the means for Electromagnetic (EMI) shielding comprises a stiffness that will result in a displacement in a range of about 50-500 microns when a load in a range of 2-90 newtons (N) is applied to the Electromagnetic (EMI) shielding.

10. The apparatus of claim 8, wherein the Thermal Interface Material (TIM) is compressed by the means for Electromagnetic (EMI) shielding such that the thickness of the Thermal Interface Material (TIM) is reduced by about at least 10-20%.

11. The apparatus of claim 8, wherein the means for Electromagnetic (EMI) shielding is coupled to a spring.

12. The apparatus of claim 8, wherein the means for Electromagnetic (EMI) shielding is coupled to a pin means to provide a load to compress the Thermal Interface Material (TIM).

13. The apparatus of claim 8, wherein the apparatus is incorporated into an apparatus selected from the group consisting of: music players, video players, entertainment units, navigation devices, communication devices, mobile phones, smart phones, personal digital assistants, fixed location terminals, tablet computers, wearable devices, internet of things (IoT) devices, laptop computers, servers, and devices in automobiles.

14. A method for fabricating a device, comprising:

providing a die;

forming a Thermal Interface Material (TIM) over the die; and

coupling an Electromagnetic (EMI) shield to the Thermal Interface Material (TIM) such that the Electromagnetic (EMI) shield compresses the Thermal Interface Material (TIM), wherein the Electromagnetic (EMI) shield comprises a flexible portion.

15. The method of claim 14, wherein the flexible portion of the Electromagnetic (EMI) shield comprises a stiffness that will result in a displacement in a range of about 50-500 microns when a load in a range of 2-90 newtons (N) is applied to the Electromagnetic (EMI) shield.

16. The method of claim 14, wherein the Thermal Interface Material (TIM) is compressed by the Electromagnetic (EMI) shield such that the thickness of the Thermal Interface Material (TIM) is reduced by about at least 10-20%.

17. The method of claim 14, wherein coupling the Electromagnetic (EMI) shield comprises coupling the Electromagnetic (EMI) shield to a spring.

18. The method of claim 14, wherein coupling the Electromagnetic (EMI) shield comprises coupling the Electromagnetic (EMI) shield to a pin to provide a load that compresses the Thermal Interface Material (TIM).

19. The method of claim 14, wherein the device is incorporated into an apparatus selected from the group consisting of: music players, video players, entertainment units, navigation devices, communication devices, mobile phones, smart phones, personal digital assistants, fixed location terminals, tablet computers, wearable devices, internet of things (IoT) devices, laptop computers, servers, and devices in automobiles.