阅读说明：本技术 一种芯片散热封装结构 (Chip heat dissipation packaging structure ) 是由 曹立强 徐成 孙鹏 于 2019-09-29 设计创作，主要内容包括：本发明涉及芯片封装领域,具体涉及一种芯片散热封装结构,包括：装载有工作芯片的基板；安装在工作芯片上、用于对工作芯片进行散热的半导体制冷芯片；以及,安装在半导体制冷芯片上、用于对半导体制冷芯片进行散热的微流道芯片。本发明通过在工作芯片上设置半导体制冷芯片,使得工作芯片散热的热量能够直接进行主动散发,再通过在半导体制冷芯片上设置微流道芯片,通过微流道芯片对半导体制冷芯片进行散热,从而使得工作芯片的散热效率更高,散热效果明显。在工作芯片与基板之间还安装有热电转换层,热电转换层用于将工作芯片的热量转化为电能并驱动半导体制冷芯片或微流道芯片工作,避免了设置外接电源,节约了能源。(The invention relates to the field of chip packaging, in particular to a chip heat dissipation packaging structure, which comprises: a substrate on which a working chip is mounted; the semiconductor refrigeration chip is arranged on the working chip and used for radiating the working chip; and the micro-channel chip is arranged on the semiconductor refrigeration chip and used for radiating the semiconductor refrigeration chip. According to the invention, the semiconductor refrigeration chip is arranged on the working chip, so that the heat dissipated by the working chip can be directly and actively dissipated, and then the micro-channel chip is arranged on the semiconductor refrigeration chip to dissipate the heat of the semiconductor refrigeration chip, so that the working chip has higher heat dissipation efficiency and obvious heat dissipation effect. A thermoelectric conversion layer is further arranged between the working chip and the substrate and used for converting heat of the working chip into electric energy and driving the semiconductor refrigeration chip or the micro-channel chip to work, an external power supply is avoided, and energy is saved.)

1. A chip heat dissipation package structure, comprising:

a substrate (1) on which a working chip (2) is loaded;

a semiconductor refrigeration chip (3) mounted on a side of the working chip (2) opposite to the substrate (1) for dissipating heat from the working chip (2); and;

a micro flow channel chip (4) mounted on the side of the semiconductor refrigeration chip (3) opposite to the working chip (2) for dissipating heat from the semiconductor refrigeration chip (3).

2. The chip heat dissipation package structure of claim 1, wherein the semiconductor refrigeration chip (3) and/or the micro flow channel chip (4) are provided with through-silicon-vias.

3. The chip heat dissipation packaging structure according to claim 1 or 2, wherein a thermal interface material layer (5) for filling a surface gap formed when the semiconductor refrigeration chip (3) is in contact with the working chip (2) is further disposed between the semiconductor refrigeration chip (3) and the working chip (2).

4. The chip heat dissipation package structure according to claim 3, wherein the material of the thermal interface material layer (5) is a thermally conductive adhesive, a thermally conductive gel, or a thermally conductive paste.

5. The chip heat dissipation package structure according to any one of claims 1 to 4, wherein a thermoelectric conversion layer (6) is further disposed between the working chip (2) and the substrate (1), the thermoelectric conversion layer (6) is electrically connected to the semiconductor cooling chip (3) and/or the micro flow channel chip (4), and the thermoelectric conversion layer (6) is used for converting thermal energy of the working chip (2) into electrical energy.

6. The chip heat dissipation package structure according to claim 5, wherein the thermoelectric conversion layer (6) is made of a silicon germanium film or a tellurium antimony bismuth block.

7. The chip heat dissipation package structure according to claim 5 or 6, wherein the thermoelectric conversion layer is electrically connected to the substrate (1), a fluid guiding wiring layer (42) is disposed on the micro channel chip (4), and the chip heat dissipation package structure further comprises a through silicon via interposer (7), wherein one end of the through silicon via interposer (7) is electrically connected to the fluid guiding wiring layer (42) and the other end is electrically connected to the substrate (1).

8. The chip heat dissipation package structure of claim 7, wherein the projected area of the semiconductor refrigeration chip (3) on the substrate (1) is smaller than the projected area of the micro flow channel chip (4) on the substrate (1), and the semiconductor refrigeration chip (3) is electrically connected with the micro flow channel chip (4).

9. The chip heat dissipation package structure according to any one of claims 5 to 8, wherein a chip active layer (21) is disposed on the active chip (2), and the thermoelectric conversion layer (6) abuts against the chip active layer (21).

Technical Field

The invention relates to the field of chip packaging, in particular to a chip heat dissipation packaging structure.

Background

With the continuous improvement of the integration level and functions of electronic devices, the heat flux density of some devices in electronic products and electronic equipment is increased, and higher requirements are provided for heat dissipation technology.

The most widely used heat dissipation technology at present is air cooling technology, which refers to a heat dissipation method for removing heat generated by electronic components through air flow, and includes natural convection and forced convection. The natural convection air cooling technology mainly utilizes the gaps of all components in the equipment and the heat conduction, convection and radiation of the shell to achieve the cooling and heat dissipation purposes. Natural convection is often used for cooling electronic components that generate less heat because of its very limited cooling heat dissipation capacity. Forced convection refers to the flow of a medium under the action of external force, and mainly takes heat away by means of forced air flow around devices such as fans and the like.

The air cooling technology mainly carries out heat dissipation through air heat transfer, and the heat conductivity coefficient of air is small, so that the defects of unobvious heat dissipation effect and low heat dissipation efficiency exist.

Disclosure of Invention

Therefore, the technical problem to be solved by the present invention is to overcome the defects of the prior art that the air cooling technology has an unobvious heat dissipation effect and low heat dissipation efficiency, thereby providing a chip heat dissipation package structure.

In order to solve the technical problems, the technical scheme adopted by the invention is as follows:

a chip heat dissipation package structure includes:

a substrate on which a working chip is loaded;

the semiconductor refrigeration chip is arranged on one side, opposite to the substrate, of the working chip and used for dissipating heat of the working chip; and;

and the micro-channel chip is arranged on one side of the semiconductor refrigeration chip opposite to the working chip and used for dissipating heat of the semiconductor refrigeration chip.

Furthermore, the semiconductor refrigeration chip and/or the micro-channel chip are provided with silicon through holes.

Furthermore, a thermal interface material layer used for filling a surface gap formed when the semiconductor refrigeration chip is in contact with the working chip is arranged between the semiconductor refrigeration chip and the working chip.

Further, the thermal interface material layer is made of heat-conducting adhesive, heat-conducting gel or heat-conducting paste.

Further, a thermoelectric conversion layer is arranged between the working chip and the substrate, the thermoelectric conversion layer is electrically connected with the semiconductor refrigeration chip and/or the micro-channel chip, and the thermoelectric conversion layer is used for converting the heat energy of the working chip into electric energy.

Furthermore, the thermoelectric conversion layer is made of a silicon germanium film or a tellurium antimony bismuth block.

Furthermore, the thermoelectric conversion layer is electrically connected with the substrate, a fluid guide wiring layer is arranged on the micro-channel chip, the chip heat dissipation packaging structure further comprises a silicon through hole adapter plate, one end of the silicon through hole adapter plate is electrically connected with the fluid guide wiring layer, and the other end of the silicon through hole adapter plate is electrically connected with the substrate.

Furthermore, the projection area of the semiconductor refrigeration chip on the substrate is smaller than the projection area of the micro-channel chip on the substrate, and the semiconductor refrigeration chip is electrically connected with the micro-channel chip.

Furthermore, a chip active layer is arranged on the working chip, and the thermoelectric conversion layer is abutted to the chip active layer.

The technical scheme of the invention has the following advantages:

1. the invention provides a chip heat radiation packaging structure, a semiconductor refrigeration chip is a refrigeration device based on Peltier effect, which utilizes the Peltier effect of semiconductor, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, the two ends of the galvanic couple can respectively absorb heat and emit heat, thereby realizing the purpose of refrigeration, the micro-channel chip is a device which can carry out heat radiation and refrigeration through the heat exchange effect of cooling liquid by arranging a plurality of micro-channels on the chip and circulating cooling liquid in the micro-channels, the invention leads the heat radiated by the working chip to be directly and actively radiated by arranging the semiconductor refrigeration chip on the surface of the working chip, then the micro-channel chip is arranged on the semiconductor refrigeration chip, and the semiconductor refrigeration chip is radiated by the micro-channel chip, therefore, the heat dissipation efficiency of the working chip is higher, and the heat dissipation effect is obvious.

2. According to the chip heat dissipation packaging structure provided by the invention, the silicon through holes can transmit signals and can improve the heat dissipation performance of the chip, and the semiconductor refrigeration chip and the micro-channel chip have better heat dissipation performance by arranging the silicon through holes on the semiconductor refrigeration chip and/or the micro-channel chip, so that the heat dissipation efficiency of the working chip can be further improved, and the heat dissipation effect of the working chip is enhanced.

3. According to the chip heat dissipation packaging structure provided by the invention, due to the problem of surface roughness, when the semiconductor refrigeration chip is installed on the working chip, surface gaps exist on the surfaces of the semiconductor refrigeration chip and the working chip, and the thermal conductivity coefficient of air is small, so that larger thermal contact resistance is caused.

4. The chip heat dissipation packaging structure provided by the invention has the advantages that the heat conduction adhesive, the heat conduction gel and the heat conduction paste are common thermal interface materials, and the sources are wide and easy to obtain.

5. According to the chip heat dissipation packaging structure provided by the invention, the thermoelectric conversion layer is arranged between the working chip and the substrate, the thermoelectric conversion layer can convert heat emitted by the working chip into electric energy, and the working chip is electrically connected with the semiconductor chip and/or the micro-channel chip, so that the electric energy converted by the thermoelectric conversion layer can be used for driving the semiconductor chip or the micro-channel chip to work, the complicated operation of an external power supply is avoided, meanwhile, the heat generated by the working chip can be utilized, and the energy is saved.

6. According to the chip heat dissipation packaging structure provided by the invention, the silicon germanium film or the tellurium antimony bismuth block is a common material capable of realizing thermoelectric conversion, and the source is wide and easy to obtain.

7. According to the chip heat dissipation packaging structure provided by the invention, the fluid guide wiring layer is arranged on the micro-channel chip, one end of the silicon through hole adapter plate is connected with the fluid guide wiring layer, the other end of the silicon through hole adapter plate is connected with the substrate, and the thermoelectric conversion layer is electrically connected with the substrate, so that electric energy converted by the thermoelectric conversion layer can be transmitted to the silicon through hole adapter plate through the substrate, and then the electric energy is transmitted to the fluid guide wiring layer through the silicon through hole adapter plate, so that voltage is applied to the fluid guide wiring layer, cooling liquid in the micro-channel chip can flow towards a specific direction to realize heat dissipation of a semiconductor refrigeration chip, and the purpose of driving the micro-channel chip to work by using heat dissipated by the working chip is realized.

8. According to the chip heat dissipation packaging structure provided by the invention, the projection area of the semiconductor refrigeration chip on the substrate is set to be smaller than the projection area of the micro-channel chip on the substrate, and the semiconductor refrigeration chip is electrically connected with the micro-channel chip, so that on one hand, electric energy converted by the thermoelectric conversion layer can be transferred to the semiconductor refrigeration chip through the micro-channel chip, and therefore, the electric connection between the thermoelectric conversion layer and the semiconductor refrigeration chip is realized, on the other hand, the structure of the chip heat dissipation packaging structure is more compact, and the size of the chip packaging structure is reduced.

9. According to the chip heat dissipation packaging structure provided by the invention, the chip active layer is an area which is mainly used for dissipating heat on the working chip, and the thermoelectric conversion layer is arranged to be abutted against the chip active layer, so that the thermoelectric conversion layer can convert the heat dissipated by the working chip as much as possible, the energy utilization rate of the heat dissipated by the working chip is improved, and the energy is further saved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic structural diagram of a chip heat dissipation package structure in embodiment 1 of the present invention;

reference numerals:

1. a substrate; 2. a working chip; 21. a chip active layer; 3. a semiconductor refrigeration chip; 31. PN node; 4. a micro flow channel chip; 41. a micro flow channel; 42. a fluid-directing wiring layer; 5. a layer of thermal interface material; 6. a thermoelectric conversion layer; 7. silicon through hole adapter plate.

Detailed Description

The following examples are provided to further understand the present invention, not to limit the scope of the present invention, but to provide the best mode, not to limit the content and the protection scope of the present invention, and any product similar or similar to the present invention, which is obtained by combining the present invention with other prior art features, falls within the protection scope of the present invention.