阅读说明：本技术 一种柔性led显示屏的制作方法 (Manufacturing method of flexible LED display screen ) 是由 李七虎 郑利强 于 2019-09-30 设计创作，主要内容包括：本发明公开一种柔性LED显示屏的制作方法,包括焊接步骤：取出待焊接电路基板,所述电路基板上设有熔焊物料和元器件；使用激光对所述熔焊物料进行定点加热,使得所述熔焊物料融化并附着在所述电路基板以及元器件上；待熔焊物料冷却。通过激光对焊接部位的锡膏进行定点局部焊接,避免了高温对电路板、LED灯源及其他元器件的损伤,简化制程,增加产品的使用寿命,节省物料资源。(The invention discloses a manufacturing method of a flexible LED display screen, which comprises the following welding steps: taking out the circuit substrate to be welded, wherein the circuit substrate is provided with fusion welding materials and components; heating the fusion welding material at a fixed point by using laser, so that the fusion welding material is melted and attached to the circuit substrate and the components; and cooling the material to be welded. The solder paste at the welding part is locally welded at a fixed point by laser, so that the damage of high temperature to a circuit board, an LED lamp source and other components is avoided, the manufacturing process is simplified, the service life of the product is prolonged, and material resources are saved.)

1. A manufacturing method of a flexible LED display screen is characterized by comprising the following steps:

a welding step: taking out the circuit substrate to be welded, wherein the circuit substrate is provided with a fusion welding material and a light-emitting component;

heating the fusion welding material at a fixed point by using laser, so that the fusion welding material is melted and attached to the circuit substrate and the light-emitting component;

and (3) a protective layer pressing step: and taking out the protective layer, arranging a position avoidance hole on the protective layer corresponding to the position of the component, and pressing the protective layer and the circuit substrate to obtain the display screen.

2. The method for manufacturing a flexible LED display screen according to claim 1, wherein the welding step further comprises:

printing a welding material: taking out the circuit board, and printing the fusion welding material on the welding part of the circuit board by using fusion welding material printing equipment;

a light-emitting component mounting step: and the light-emitting component is pasted or inserted corresponding to the fusion welding material, so that the light-emitting component is initially installed on the circuit board to form the circuit substrate.

3. The method of claim 2, wherein the step of printing the fusion welding material further comprises a step of etching a circuit:

and taking out the base material with the conducting layer, washing off the unnecessary conducting layer in a circuit etching mode, and reserving the necessary conducting layer to form the circuit board.

4. The method for manufacturing the flexible LED display screen according to claim 3, wherein the step of circuit etching further comprises a step of conductive layer lamination:

and taking out the base material and the conductive film, and laminating the conductive film and the transparent flexible base material to form the base material with the conductive layer.

5. The method for manufacturing a flexible LED display screen according to claim 1, wherein the step of welding further comprises:

flexible circuit board pressfitting step: pressing one end of the flexible circuit board corresponding to the circuit interface of the circuit substrate;

assembling: and connecting the other end of the flexible circuit board with a controller.

6. The method for manufacturing the flexible LED display screen according to claim 1, wherein a dispensing step after the protective layer laminating step is as follows: and filling the gap between the avoiding hole and the component by using glue.

7. The method according to any one of claims 1 to 6, wherein the solder material is solder paste, the components are LED beads, and the circuit substrate is a transparent flexible thin film circuit substrate.

8. The manufacturing method of the flexible LED display screen according to claim 1, wherein the laser welding temperature is 0-150 ℃.

9. The method as claimed in claim 8, wherein the laser welding temperature is 125 ℃.

10. The method for manufacturing the flexible LED display screen according to claim 1, wherein the time for heating the fusion welding material by the laser is 0.1-1 second.

Technical Field

The invention relates to the technical field of display screens, in particular to a manufacturing method of a flexible LED display screen.

Background

The LED display screen is composed of small LED light source connecting circuit boards, and information is displayed and transmitted by displaying contents such as characters, pictures, videos and the like on the screen. With the development of science and technology, we have entered the information age, and the development of LED display screens is also rapidly developed with the development of the age, and in order to meet the needs of the society, various LED display screens, such as transparent LED display screens, flexible LED display screens, etc., are now on the market.

At present, no matter what kind of LED display screen is on the market, wave soldering or reflow soldering is mostly adopted for connection and combination between an LED lamp source or other components and a circuit board, the process flow is complex, the whole circuit board, the LED lamp source or other components are transmitted into a cavity heated to a certain temperature for high-temperature heating soldering, so that the circuit board, the LED lamp source or other components are damaged to a certain extent, the circuit board which is not high-temperature resistant in material per se is not suitable, for example, the circuit board which is made of PET and the like is used as a base material, the material is yellow due to high temperature, the circuit board can be melted, conductive adhesive is also adopted in the market to stick the LED lamp source or other components on a transparent flexible circuit board to complete circuit connection operation, but the LED lamp source or other components fall off in the scheme, the welding is not firm, causes LED display screen life not long, the unstable problem of performance.

Therefore, the prior art needs to be improved.

Disclosure of Invention

In view of the above drawbacks and deficiencies of the prior art, that is, in view of the above background art, it is necessary to provide a method for manufacturing a flexible LED display, which not only can get rid of the conventional LED display manufacturing scheme, but also can achieve the purpose of efficiently welding an LED light source or other components in a short time by using local welding in a welding manner, thereby simplifying the process flow.

In order to achieve the purpose, the invention provides a manufacturing method of a flexible LED display screen, which adopts the following technical scheme: a manufacturing method of a flexible LED display screen is characterized by comprising the following steps: a welding step: taking out the circuit substrate to be welded, wherein the circuit substrate is provided with a fusion welding material and a light-emitting component; heating the fusion welding material at a fixed point by using laser, so that the fusion welding material is melted and attached to the circuit substrate and the light-emitting component; and a protective layer pressing step: and taking out the protective layer, arranging a position avoidance hole on the protective layer corresponding to the position of the component, and pressing the protective layer and the circuit substrate to obtain the display screen.

Preferably, the welding step further comprises: printing a welding material: taking out the circuit board, using fusion welding material printing equipment to print fusion welding materials on the welding part of the circuit board, and installing the light-emitting component: and the light-emitting component is pasted or inserted corresponding to the fusion welding material, so that the light-emitting component is initially installed on the circuit board to form the circuit substrate.

Preferably, the step of printing the welding material further comprises a circuit etching step before the step of printing the welding material: and taking out the base material with the conducting layer, washing away the unnecessary conducting layer in an etching mode, and reserving the necessary conducting layer to form the circuit board.

Preferably, the step of circuit etching further comprises, before the step of circuit etching, a step of laminating a conductive layer: and taking out the base material and the conductive film, and laminating the conductive film and the transparent flexible base material to form the base material with the conductive layer.

Preferably, the soldering step further comprises a flexible circuit board pressing step: pressing one end of the flexible circuit board corresponding to the circuit interface of the circuit substrate; and an assembling step: and connecting the other end of the flexible circuit board with a controller.

Preferably, the dispensing step after the protective layer pressing step: and filling the gap between the avoiding hole and the component by using a photo-adhesive.

Preferably, the fusion welding material is low-temperature solder paste, and the components are LED lamp beads.

Preferably, the circuit substrate is a transparent flexible circuit substrate.

Preferably, the laser welding temperature is 0-150 ℃.

Preferably, the temperature of the laser welding is 125 ℃.

Preferably, the time for heating the fusion welding material by using the laser is 0.1-1 second.

Has the advantages that:

1. compared with the prior art, the manufacturing method of the flexible LED display screen disclosed by the invention has the advantages that the solder paste at the part to be welded is subjected to fixed-point laser welding in a laser welding mode, the solder paste can be rapidly melted in a short time, the LED lamp source or other components and the circuit board are welded together, and the solder paste can be rapidly shaped in a short time after the laser is removed to realize welding and fixing, so that the process flow is simplified, and the working efficiency is improved.

2. The solder paste at the welding part is locally welded at a fixed point by laser, except that the solder paste at the welding part can bear the temperature, the circuit board and other components cannot bear high-temperature heating, the damage of high temperature to the circuit board, the LED lamp source and other components is avoided, the service life of the product is prolonged, and material resources are saved.

3. The solder paste at the welding position is locally welded at a fixed point by laser, so that the problems that an LED lamp source or other components fall off and the performance is unstable in a conductive adhesive bonding connection mode are solved, and a circuit board which is made of materials and does not resist high temperature can be taken into consideration, so that the manufacturing process of the LED display screen is more perfect.

4. The gap between the avoiding hole and the component is filled by the optical cement to realize secondary limiting, so that the LED lamp source or other components are fixed in the optical cement, and the LED lamp source or other components cannot fall off due to left-right shaking. Even adopt conducting resin to paste LED lamp source or other components and parts and accomplish circuit connection on transparent flexible circuit board, the steadiness of guarantee LED lamp source or other components and parts that also can be fine realizes the stability of circuit, and product life increases.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a block diagram of an embodiment flow structure;

FIG. 2 is a schematic diagram of a display screen according to an embodiment;

FIG. 3 is a schematic view of a solder paste structure according to an embodiment.

The reference numbers illustrate:

1. the circuit board, 2, the melting welding material, 2, the tin cream, 3, light emitting component, 3, LED lamp pearl, 30, pin, 4, flexible line way board, 5, controller, 6, the laminating glue, 7, protective layer, 70, keep away the hole, 8, welding part, 9, copper foil circuit.

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.

In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

Please refer to fig. 1, fig. 2, and fig. 3, which illustrate a method for manufacturing a flexible LED display screen, wherein, for convenience of description, fig. 3 is a schematic structural diagram illustrating a light emitting device 3 standing up, and the method specifically includes the following steps:

s1, conducting layer laminating step: taking out a base material and a conductive film, and laminating the conductive film and the transparent flexible base material, wherein the base material can be a transparent flexible film material such as PI, PEN, PET, and the like, the conductive film can be a copper foil film, zinc oxide, tin, and the like, and the invention is not particularly limited.

S2: circuit etching step: taking out the substrate with the conducting layer, washing off the unnecessary conducting layer by an etching mode, and reserving the required conducting layer to form the circuit board, wherein the etching mode is a chemical etching or laser etching technical mode and is a conventional means in the technical field, and in the embodiment, the circuit board is a transparent flexible circuit board with a copper foil circuit 9.

S3: and 2, printing the welding material: using a welding material 2 printing device or using a spot coating device to spot coat the welding material 2 on the welding part 8; the spot printing of the soldering material 2 is performed on the soldering portion 8 of the circuit board. The circuit board is placed on the carrier, so that the circuit board is kept flat, the solder paste 2 is convenient to print, and the solder paste 2 is printed by using solder paste printing equipment commonly used by a Surface Mount Technology (SMT). The invention is not limited specifically, the welding material 2 may be conductive adhesive, low temperature solder paste 2 or normal temperature solder paste 2, and in this embodiment, the welding material 2 is the low temperature solder paste 2, so that the welding temperature of the solder paste 2 is not too high, the welding time and the cooling time of the solder paste 2 are reduced, the process flow is shortened, and the component damage is reduced.

S4: light-emitting component 3 mounting step: light-emitting component 3 corresponds solder paste 2 carries out paster or grafting, makes its preliminary mounting form on the circuit board circuit substrate 1, light-emitting component 3 can be emitting diode, LED lamp unit etc. in this embodiment light-emitting component 3 is LED lamp pearl 3, the pin 30 of light-emitting component 3 is also the lamp base and the contact of solder paste 2 of LED lamp pearl 3 in this example exactly to can adhere to just when melting on component pin 30 is upper, in this embodiment light-emitting component 3 is LED lamp pearl 3. Specifically, the circuit board printed with the solder paste 2 is placed into SMT equipment by a carrier, and the LED lamp beads 3 are mounted on the circuit board. For products with large size specifications, the mechanical arm mode can be used for carrying out surface mounting on the 2 side of the circuit board.

S5, welding: taking out and waiting to weld circuit substrate 1, be equipped with solder paste 2 and LED lamp pearl 3 on circuit substrate 1, it is right to use laser solder paste 2 heats, makes the melting welding material 2 melt and adhere to on circuit substrate 1 and the components and parts, laser welding is realized through the laser instrument, puts into the laser instrument with circuit substrate 1, sweeps the mode of penetrating solder paste 2 through the laser, melts solder paste 2 in the twinkling of an eye, when waiting that melting welding material 2 cools off, the lamp pearl has just welded on circuit substrate 1, accomplishes the welding of lamp pearl. In order to improve the welding efficiency, a multi-head laser can be used, and all laser heads work simultaneously to weld. The wavelength and the welding time of the laser are adjusted according to different conditions such as the type of the solder paste 2 and the printing amount of the solder paste 2, corresponding parameters are adjusted, the welding temperature generated by the laser is 0-150 ℃, 0-130 ℃, 50-110 ℃ and the like, the welding temperature generated by the laser is 125 ℃ in the embodiment, the heating time of the fusion welding material 2 is 0.1-1 second, the laser can melt the solder paste 2 instantly, the damage of high temperature to components can be reduced to the maximum extent, the solder paste 2 can be rapidly shaped in a short time after the laser is moved away, welding fixation is realized, the process flow is simplified, and the working efficiency is improved.

S6: and (3) pressing the protective layer 7: taking out the protective layer 7, arranging a position avoiding hole 70 on the protective layer 7 corresponding to the component, and pressing the protective layer 7 and the circuit substrate 1 to expose the LED lamp bead 3 from the position avoiding hole 70 to obtain the display screen. One side of the protection layer 7 is slightly shorter than the circuit substrate 1, so that one edge of the circuit substrate 1 exposes the circuit interface of the circuit substrate 1.

S7: dispensing: glue 6 is used for filling the clearance between the avoiding hole 70 and the component, so that the LED lamp beads 3 are surrounded by the photosynthetic glue 6 or are wrapped and limited, in the embodiment, the LED lamp beads 3 are surrounded by the photosynthetic glue 6 without clearance to realize secondary limitation, and the combination of the LED lamp beads 3 and the circuit substrate 1 is more stable. The glue may be a photosynthetic glue, a shadowless glue (UVglue), a thermosetting glue, etc., the present invention is not limited specifically, in this embodiment, the glue is a shadowless glue, and the glue is dispensed by a dispensing device, which is a common device, and is cured by UV light.

S8: a second pressing step: and pressing one end of the flexible circuit board 4 corresponding to the interface circuit of the circuit substrate 1 to complete the circuit connection of the circuit substrate 1 and the flexible circuit board 4.

S9, an assembling step: and connecting the other end of the flexible circuit board 4 with a controller 5 to complete the manufacture of the flexible transparent LED display screen.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.