阅读说明：本技术 具有提高抗冲击性能的集成电路板 (Integrated circuit board with improved impact resistance ) 是由 徐红燕 廖雄 于 2019-10-21 设计创作，主要内容包括：本发明公开了具有提高抗冲击性能的集成电路板,包括散热底板,所述散热底板的顶部固定连接有导热柱,所述导热柱的顶部固定连接有电路板本体,所述电路板本体底部的两侧均固定连接有缓冲垫,所述缓冲垫的底部与散热底板的顶部固定连接,所述缓冲垫与导热柱之间有填充有灌封胶,所述电路板本体包括主基体。本发明通过散热底板、导热柱、电路板本体、缓冲垫、灌封胶、主基体、电路层和防干扰层的配合使用,能够有效的解决传统集成电路板抗冲击性较差的问题,提高了集成电路板的强度和抗冲击的能力,具有良好的散热性,防止了由于电路板使用时间过长出现元件或电路的老化,提高了电路板的使用寿命。(The invention discloses an integrated circuit board with improved impact resistance, which comprises a heat dissipation base plate, wherein the top of the heat dissipation base plate is fixedly connected with a heat conduction column, the top of the heat conduction column is fixedly connected with a circuit board body, two sides of the bottom of the circuit board body are fixedly connected with cushion pads, the bottom of the cushion pad is fixedly connected with the top of the heat dissipation base plate, pouring sealant is filled between the cushion pad and the heat conduction column, and the circuit board body comprises a main body. The heat dissipation base plate, the heat conduction column, the circuit board body, the buffer cushion, the pouring sealant, the main body, the circuit layer and the anti-interference layer are matched for use, so that the problem of poor impact resistance of the traditional integrated circuit board can be effectively solved, the strength and impact resistance of the integrated circuit board are improved, the heat dissipation performance is good, the aging of elements or circuits due to overlong service time of the circuit board is prevented, and the service life of the circuit board is prolonged.)

1. Integrated circuit board with improve shock resistance, including radiating bottom plate (1), its characterized in that: the heat dissipation base plate comprises a heat dissipation base plate (1), a top fixedly connected with heat conduction column (2), a top fixedly connected with circuit board body (3) of the heat conduction column (2), a cushion pad (4) fixedly connected with on two sides of the bottom of the circuit board body (3), a bottom of the cushion pad (4) and the top fixedly connected with of the heat dissipation base plate (1), a pouring sealant (5) is filled between the cushion pad (4) and the heat conduction column (2), the circuit board body (3) comprises a main body (6), a top fixedly connected with circuit layer (7) of the main body (6), a top fixedly connected with anti-interference layer (8) of the circuit layer (7), and the main body (6) and the circuit layer (7) are bonded into an integrated structure through an adhesive layer.

2. The integrated circuit board with improved impact resistance of claim 1, wherein: the anti-interference layer (8) is made of an electromagnetic film and is uniformly coated on the surface of the circuit layer (7).

3. The integrated circuit board with improved impact resistance of claim 1, wherein: the heat dissipation base plate (1) is a metal copper base plate, through holes are uniformly formed in the heat dissipation base plate (1), and the heat conduction columns (2) are made of insulating heat conduction materials.

4. The integrated circuit board with improved impact resistance of claim 1, wherein: the circuit board comprises a circuit board body (3), wherein supporting legs (9) are fixedly connected to the two sides of the circuit board body (3), and the bottoms of the supporting legs (9) are fixedly connected with the top of a heat dissipation bottom plate (1).

5. The integrated circuit board with improved impact resistance of claim 1, wherein: the buffer pad (4) is made of a vibration absorption material made of unsaturated polyester resin, and the buffer pad (4) is communicated with the through hole in the surface of the heat dissipation base plate (1).

Technical Field

The invention relates to the technical field of circuit boards, in particular to an integrated circuit board with improved impact resistance.

Background

The integrated circuit board is made by a semiconductor manufacturing process, a plurality of transistors, resistors, capacitors and other components are manufactured on a small single crystal silicon chip, and the components are combined into a complete electronic circuit by a multilayer wiring or tunnel wiring method.

Disclosure of Invention

The invention aims to provide an integrated circuit board with improved impact resistance, which has the advantage of improved impact resistance and solves the problems that the existing integrated circuit board is too low in strength and impact resistance, often bends or deforms in use, and meanwhile, the existing circuit board is poor in heat dissipation performance, high in element aging rate and low in service life of products.

In order to achieve the purpose, the invention provides the following technical scheme: integrated circuit board with improve shock resistance, including the heat dissipation bottom plate, the top fixedly connected with heat conduction post of heat dissipation bottom plate, the top fixedly connected with circuit board body of heat conduction post, the equal fixedly connected with blotter in both sides of circuit board body bottom, the bottom of blotter and the top fixed connection of heat dissipation bottom plate, it has the packing to have the casting glue between blotter and the heat conduction post, the circuit board body includes main base member, the top fixedly connected with circuit layer of main base member, the top fixedly connected with jam-proof layer of circuit layer, main base member and circuit layer bond into an organic whole structure through the adhesive layer.

Preferably, the interference prevention layer is made of an electromagnetic film and is uniformly coated on the surface of the circuit layer.

Preferably, the heat dissipation bottom plate is a metal copper bottom plate, through holes are uniformly formed in the heat dissipation bottom plate, and the heat conduction columns are made of insulating heat conduction materials.

Preferably, the two sides of the circuit board body are fixedly connected with supporting legs, and the bottoms of the supporting legs are fixedly connected with the top of the heat dissipation bottom plate.

Preferably, the buffer pad is made of a shock absorbing material made of unsaturated polyester resin, and the buffer pad is communicated with the through hole on the surface of the heat dissipation base plate.

Compared with the prior art, the invention has the following beneficial effects:

1. the heat dissipation base plate, the heat conduction column, the circuit board body, the buffer cushion, the pouring sealant, the main body, the circuit layer and the anti-interference layer are matched for use, so that the problem of poor impact resistance of the traditional integrated circuit board can be effectively solved, the strength and impact resistance of the integrated circuit board are improved, the heat dissipation performance is good, the aging of elements or circuits due to overlong service time of the circuit board is prevented, and the service life of the circuit board is prolonged.

2. The anti-interference layer is arranged, so that an anti-interference effect can be conveniently achieved on the circuit board, the conductive transmission effect of the circuit board is improved, the anti-interference effect is good, the heat dissipation bottom plate is arranged, the metal copper has good heat conduction and heat dissipation capacity, the service life of the circuit board is prolonged, the supporting legs are arranged, the heat dissipation bottom plate and the circuit board body can be connected, the stability is further improved, the buffer cushion is arranged, the impact acting force from the outside can be effectively buffered and absorbed, and the chip is effectively protected from external mechanical shock.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic view of the structure of the circuit board body according to the present invention.

In the figure: 1. a heat dissipation base plate; 2. a heat-conducting column; 3. a circuit board body; 4. a cushion pad; 5. pouring a sealant; 6. a main body; 7. a circuit layer; 8. an interference prevention layer; 9. support the feet.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be configured in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The components used in the present invention are all standard components or components known to those skilled in the art, and the structure and principle thereof can be known to those skilled in the art through technical manuals or through routine experiments.

Referring to fig. 1-2, the integrated circuit board with improved impact resistance includes a heat dissipating base plate 1, the heat dissipating base plate 1 is a metal copper base plate, and the heat dissipating base plate 1 is uniformly provided with through holes, the heat conducting columns 2 are made of insulating heat conducting material, the top of the heat dissipating base plate 1 is fixedly connected with the heat conducting columns 2, the top of the heat conducting columns 2 is fixedly connected with a circuit board body 3, two sides of the circuit board body 3 are fixedly connected with supporting legs 9, the bottom of the supporting legs 9 is fixedly connected with the top of the heat dissipating base plate 1, two sides of the bottom of the circuit board body 3 are fixedly connected with cushion pads 4, the cushion pads 4 are made of shock absorbing material made of unsaturated polyester resin, the cushion pads 4 are mutually communicated with the through holes on the surface of the heat dissipating base plate 1, the bottom of the cushion pads 4 is fixedly connected, the circuit board body 3 comprises a main body 6, a circuit layer 7 is fixedly connected to the top of the main body 6, an anti-interference layer 8 is fixedly connected to the top of the circuit layer 7, the anti-interference layer 8 is made of an electromagnetic film and is uniformly coated on the surface of the circuit layer 7, the main body 6 and the circuit layer 7 are bonded into an integrated structure through an adhesive layer, the anti-interference layer 8 is arranged, an anti-interference effect can be conveniently played on a circuit board, the conductive transmission effect of the circuit board is improved, the anti-interference effect is good, the heat dissipation bottom plate 1 is arranged, metal copper has good heat conduction and heat dissipation capacity, the service life of the circuit board is prolonged, the supporting legs 9 are arranged, the heat dissipation bottom plate 1 and the circuit board body 3 can be connected, the stability is further improved, the cushion pad 4 is arranged, the impact force from the outside can be effectively buffered and absorbed, and the chip is effectively protected from, through the cooperation use of radiating bottom plate 1, heat conduction post 2, circuit board body 3, blotter 4, casting glue 5, main substrate 6, circuit layer 7 and jam-proof layer 8, can effectually solve the relatively poor problem of traditional integrated circuit board shock resistance, improved integrated circuit board's intensity and impact resistance's ability, have good thermal diffusivity, prevented because the ageing of component or circuit appears in the overlength of circuit board live time, improved the life of circuit board.

When the heat dissipation base plate 1 is used, the heat dissipation base plate 1 made of the metal copper base plate has good heat dissipation performance, aging of elements or circuits due to overlong service life of a circuit board is prevented, the service life of the circuit board is prolonged, impact force from the outside can be effectively buffered and absorbed through the cushion pad 4 made of the vibration absorption material made of unsaturated polyester resin, and the chip is effectively protected from external mechanical vibration.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.