阅读说明：本技术 具有改善的冷却功率的电子构件和具有电子构件的机动车 (Electronic component with improved cooling power and motor vehicle with electronic component ) 是由 T.克伦克 T.施耐德 M.普列斯 A.勒赫 于 2019-06-12 设计创作，主要内容包括：本发明公开了一种尤其是用于机动车(200)电子的构件(100),所述构件具有至少一个具有用于排出热量的冷却面(52)的部件(50)并且具有至少一个壳体区段(20),所述壳体区段用于在所述至少一个部件(50)的冷却面(52)和所述至少一个壳体区段(20)之间构成冷却剂通道(40),其中,所述至少一个壳体区段(20)至少区域性地与所述至少一个部件(50)的冷却面(52)相间隔并且具有构造在冷却剂通道(40)中的冷却结构(30)。此外本发明还公开了一种机动车(200)。(The invention relates to a component (100), in particular for electronics of a motor vehicle (200), comprising at least one component (50) having a cooling surface (52) for dissipating heat, and comprising at least one housing section (20) for forming a coolant channel (40) between the cooling surface (52) of the at least one component (50) and the at least one housing section (20), wherein the at least one housing section (20) is at least partially spaced apart from the cooling surface (52) of the at least one component (50) and has a cooling structure (30) formed in the coolant channel (40). The invention further relates to a motor vehicle (200).)

1. Component (100), in particular for electronics of a motor vehicle (200), having at least one component (50) having a cooling surface (52) for dissipating heat and having at least one housing section (20) for forming a coolant channel (40) between the cooling surface (52) of the at least one component (50) and the at least one housing section (20), characterized in that the at least one housing section (20) is at least regionally spaced apart from the cooling surface (52) of the at least one component (50) and has a cooling structure (30) formed in the coolant channel (40).

2. The component of claim 1, wherein the cooling structure (30) of the at least one housing section (20) has a ramp element (10) projecting into a coolant channel (40).

3. The component according to claim 2, wherein the ramp element (10) has at least one linear and/or non-linear section (11a, 11b, 14) or linear plane (11) at least in some regions in the flow direction (X) of the coolant and reduces the distance (A) between the cooling surface (52) and the at least one housing section (20) at least in some regions by a slope.

4. The component of one of claims 1 to 3, wherein the cooling structure (30) of the at least one housing section (20) has a profile (60).

5. The component according to claim 4, wherein the profile (60) is at least regionally thermally conductively connected to a cooling surface (52) of at least one component (50).

6. A member according to claim 4 or 5, wherein the profile (60) is designed in the form of ribs (64), columns and/or walls (62).

7. The component of one of claims 1 to 6, wherein the profiles (60) of the ramp elements (10) and/or cooling structures (30) are arranged in rows.

8. The component of one of claims 1 to 7, wherein the at least one housing section (20) is thermally conductive.

9. The component of one of claims 1 to 8, wherein the at least one housing section (20) is formed in one piece or in several pieces with the cooling structure (30).

10. The component of one of claims 1 to 9, wherein the at least one housing section (20) with the cooling structure (30) consists of metal and is produced by a casting process, a milling process or a press bending process.

11. A motor vehicle (200) having at least one electronic component (100) according to one of the preceding claims, wherein the coolant channel of the at least one component (100) is in fluid communication with a motor vehicle coolant circuit (210).

Technical Field

The invention relates to an electronic component, in particular for a motor vehicle, having at least one component having a cooling surface for dissipating heat and having at least one housing section for forming a coolant channel between the cooling surface of the at least one component and the at least one housing section. The invention also relates to a motor vehicle.

Background

Electronic components for handling high powers, such as power semiconductors and in particular Insulated Gate Bipolar Transistors (IGBTs), require cooling devices to remove the excess heat. Heat sinks with fins or heat bars are usually arranged on such components. The cooling device is usually positioned in the coolant channel and is surrounded by the coolant of the coolant circuit.

In particular, Insulated Gate Bipolar Transistors (IGBTs) can be a costly component of power electronics and therefore decisively determine the price of said power electronics. Designing heat sinks with heat sink bars or so-called Pin-Fin or turbulence columns, which are usually manufactured in expensive cold rolling processes, is a factor in pricing. However, such a structure of the heat sink is necessary in order to be able to reliably dissipate the generated heat.

DE 102006057796 a1 describes a device with electronic components which are connected in a thermally conductive manner to a water-cooled heat sink via an air heat sink. The water-cooled heat sink has a coolant channel extending in a zigzag shape, which is reduced in its cross section by a plurality of projections. The protrusions serve to generate a vortex flow of the coolant.

Furthermore, the structure of the cooling device can be replaced in order to increase the heat removal in order to promote the turbulence of the coolant in the region of the cooling plate by using inserts. Such inserts are formed from plastic and cause turbulence of the coolant. No heat is conducted through such an insert.

Disclosure of Invention

The object of the invention is to provide a component of the type mentioned at the outset with an efficient and cost-effective cooling device. The object is achieved by the electronic component according to the invention.

According to one aspect of the invention, an electronic component, in particular for a motor vehicle, is provided. The component has at least one component with a cooling surface for removing heat. Furthermore, the component has at least one housing section for forming a coolant channel between a cooling surface of the at least one component and the at least one housing section. According to the invention, the at least one housing section is at least regionally spaced apart from the cooling surface of the at least one component and has a cooling structure formed in the coolant channel.

The electronic component may have at least one component to be cooled. Such components may be, for example, power semiconductors, motors, electrical switches and the like. The electronic component can preferably be a power electronics of a vehicle. These components may generate heat in the form of joule heat during operation. Such components must be thermally regulated in order to achieve long-term operation and to comply with specified operating conditions. For this purpose, the at least one component can have one or more cooling surfaces, which can be flowed around or surrounded by a coolant in order to dissipate heat.

By using at least one housing section of the cooling structure formed in the formed coolant channel, electronic components without complex cooling structures can be used. In order to achieve the necessary cooling of the components, a cooling structure is integrated into the housing or at least one housing section of the electronic component in order to replace the costly structured cooling plate with a Pin-Fin structure. The cooling structure is arranged here on the side of the coolant channel opposite the cooling surface of the component and can act on the coolant.

The cooling structure of the at least one housing section serves to deflect the coolant as it flows through the coolant channel. In particular, the cooling structure can optimize the incident flow or inflow flow of the surface to be cooled of at least one component and increase the turbulence of the flow in order to increase the heat transfer.

The introduction of the cooling structure into at least one housing section can be realized technically simply by a slight modification of the production method. This can be achieved, for example, by adapting the casting mold. Since components with planar or unstructured cooling surfaces can be used in the component, this measure enables the cost for at least one component to be reduced and the cooling capacity of the component to be maximized.

The use of a ramp element projecting into the coolant channel as a cooling structure of at least one housing section enables the coolant to be guided or deflected relative to the cooling surface of at least one component while flowing through the coolant channel. This results in an intensified incident flow to the cooling surface, which additionally results in a higher degree of turbulence of the coolant in the region of the cooling surface. Thereby increasing the possible heat transfer through the coolant. The ramp element can preferably be of trench-shaped design and/or have at least on one side a flank which rises in the flow direction.

According to one embodiment of the component, the ramp element has, at least in regions, a linear and/or nonlinear section or slope in the flow direction of the coolant. The ramp element reduces the distance between the cooling plate and the at least one housing section at least in some regions by means of an inclined plane or a raised section.

The cooling structure of at least one housing section may alternatively or additionally have a profile. The profile can be designed, for example, as a so-called tractor tread. The profile may have ribs or walls arranged obliquely or parallel to one another. The walls can preferably extend through the coolant channel between the at least one housing section and the cooling surface. The profile provided with the ribs extends regionally through the coolant channel. The profile extends here through the coolant channel orthogonally to the throughflow direction of the coolant. The profiled cylinder can have a circular, oval, rectangular or drop-shaped cross section. The shape of the profile may vary locally within the coolant channel and cause a vortex of coolant flowing through the channel. The turbulence of the coolant increases the heat quantity which is transported by the coolant from the cooling surface per unit time.

If the contour is connected at least in regions to the cooling surface in a heat-conducting manner, the cooling efficiency can be further increased. Heat transfer from the cooling surface of the at least one component into the cooling structure or profile can thereby be achieved, whereby the cooling surface is increased.

Depending on the embodiment of the component, the profiles of the ramp elements and/or of the cooling structure are arranged in rows. The cooling structure is filled in surface fashion by this arrangement of the contour and/or the ramp elements, as a result of which a uniform optimization of the cooling power over the entire coolant channel can be achieved.

The rows of cooling structures of at least one housing section can alternatively or additionally be arranged offset to one another, so that a higher degree of turbulence of the coolant can be generated by the cooling structures.

If at least one housing section is thermally conductive, the cooling power of the component can be further increased. At least partial heating of the coolant takes place by absorbing heat from at least one component via the cooling surface. The heat-conducting design of the at least one housing section enables the at least one housing section to absorb heat from the coolant and to function as a heat exchanger.

According to a further embodiment of the component, the at least one housing section with the cooling structure is formed in one piece or in multiple pieces. The at least one housing section can thus be designed, depending on the manufacturing process and the field of application, as a plurality of parts that can be connected to one another or as a single piece.

The component can be designed particularly economically, i.e. the at least one housing section with the cooling structure is composed of metal and is produced by a casting process, a milling process or a press bending process. Thereby, a maximized cooling effect can be achieved, wherein the expensive and expensive Pin-Fin structure can be replaced by an inexpensive manufacturing process.

The at least one housing section can be produced, for example, by an inexpensive aluminum die casting process. The cooling structure can preferably be integrated in the at least one housing section during the production process.

According to a further aspect of the invention, a motor vehicle is provided having at least one electronic component according to the invention, wherein the coolant channel of at least one component is in fluid-conducting communication with a vehicle coolant circuit.

The electronics according to the invention can achieve cost savings, since the cooling components of the components are technically simpler and less expensive to design. In particular, Insulated Gate Bipolar Transistors (IGBTs) which are heated to a high degree can be cooled in a targeted and efficient manner.

Embodiments of the present invention are explained in detail below with reference to the drawings. In the drawings:

fig. 1 shows a schematic view of a ramp element according to a first embodiment of the invention;

fig. 2 shows a schematic view of a ramp element according to a second embodiment of the invention;

fig. 3 shows a plan view of a housing section with a cooling structure according to an embodiment of the invention;

fig. 4 shows a plan view of a housing section with a cooling structure according to another embodiment of the invention;

FIG. 5 shows section A-A in FIG. 3;

fig. 6 shows a plan view of a housing section with a cooling structure according to a further embodiment of the invention;

FIG. 7 shows section A-A in FIG. 6;

fig. 8 shows a schematic view of a motor vehicle according to an embodiment of the invention.

Identical structural elements have the same reference symbols in each case in the figures.

Detailed Description

Fig. 1 shows a schematic view of a ramp element 10 according to a first embodiment of the invention of an electronic component 100 (see fig. 5). The ramp element 10 has a linearly rising inclined plane 11. The plane 11 rises in the flow direction of the coolant.

The ramp element 10 ends on a cylindrically shaped section 12, whereby the width B of the flat surface 11 decreases as the slope rises. The ramp element 10 can be integrated on its bottom face 13 with the housing section of the component 100 (see fig. 5) or can be connected to it afterwards.

Fig. 2 shows a schematic view of a ramp element 10 according to a second embodiment of the invention. In contrast to the embodiment shown in fig. 1, the ramp element 10 has a section 14 which is shaped in a regionally non-linear manner. The non-linearly shaped section 14 is arranged between the two linearly rising sections 11a, 11b and has a radius of curvature R.

The coolant flowing past the ramp element 10 can flow onto at least one linear and/or non-linear ramp or section 14 and thereby convert kinetic energy into potential energy. The coolant can thereby be flushed onto the cooling plate arranged above the ramp element 10.

Fig. 3 shows a plan view of a housing section 20 with a cooling structure 30 according to an embodiment of the invention. The side of the housing section 20 facing the cooling surface of the component can be seen. A cooling structure 30 is arranged on the housing section 20.

The cooling structure 30 is formed integrally with the housing section 20 and has a plurality of ramp elements 10. The ramp element 10 is designed according to the embodiment shown in fig. 1 and has linearly shaped planes and/or sections 11a, 11b which are higher and higher with the flow X of the coolant. The ramp elements 10 are arranged here in uniformly designed rows in the coolant channel 40. Each row has the same number of ramp elements 10.

The coolant, which may be water or an aqueous solution, for example, impinges directly on the ramp element 10 or the moat and is thereby pressed onto the component or onto the cooling plate of the component. The ramp element 10 additionally acts as an obstacle and thus causes a vortex of the coolant. The cooling effect can be increased by the vortex.

Fig. 4 shows a plan view of a housing section 20 with a cooling structure 30 according to another embodiment of the invention. In contrast to the cooling structure 30 shown in fig. 3, the ramp elements 10 are positioned on the housing section 20 in rows offset from one another. It is thereby possible to prevent unused flow channels between the ramp elements 10, thereby further increasing the swirl degree of the coolant and achieving uniform cooling efficiency throughout the coolant channel 40.

Fig. 5 shows a cross-sectional view a-a in fig. 3. The component 100 is shown here at least in some regions in cross section. The component 100 is an electronic component 100 and has a component 50 with a cooling surface 52. The component 50 is, for example, an Insulated Gate Bipolar Transistor (IGBT). A coolant channel 40 through which coolant flows is formed between the cooling surface 52 and the housing section 20. The arrows indicate the flow X of the coolant. In particular, the effect of the ramp element 10 on the coolant by the cooling structure 30 of the housing section is shown.

The ramp element 10 forms a distance a between the ramp element 10 and the component 50 at least in some regions by means of inclined surfaces or raised sections 11, 14.

Fig. 6 shows a plan view of a housing section 20 with a cooling structure 30 according to another embodiment of the invention. In contrast to the already mentioned cooling structure 30, the cooling structure 30 according to this exemplary embodiment is designed in the form of a profile 60. The profile 60 represents a tractor tread and has a plurality of walls 62, the walls 62 being arranged mutually inclined in rows and constituting the cooling structure 30. Whether profile 60 is in contact with cooling surface 52 determines whether rib 64 may be used, which only projects regionally into coolant channel 40.

Fig. 7 shows the section a-a in fig. 6. The dimensions of the walls 62 of the profile 60 in the coolant channel 40 are indicated here. A thermally conductive connection is preferably present between the cooling surface 52 and the profile 60. The coolant channel 40 is formed between the housing section 20 and a cooling surface 52 of the component 50. The coolant passage 40 is interrupted regionally by a wall 62 to create a vortex of the coolant.

Fig. 8 shows a schematic illustration of a motor vehicle 200 according to an embodiment of the invention. The motor vehicle 200 is an electrically driven vehicle or a hybrid vehicle. The motor vehicle 200 has a component 100 designed as a power electronics 100 for driving an electric drive. For cooling the component 100, a connection of the coolant channel 40 to a coolant circuit 210 of the motor vehicle 200 is provided.

List of reference numerals

10 ramp element

11 linearly rising plane of ramp element

11a, 11b linearly rising section

12 cylindrical end section

13 bottom surface of ramp element

14 non-linearly shaped section

20 housing segment

30 cooling structure

40 coolant channels

50 parts

52 cooling surface of component

60 profile

62-profile wall

64-profile rib

100 electronic component

200 motor vehicle

210 coolant circuit of a motor vehicle

X-ray flow

Radius of curvature of the non-linearly shaped section

Width of B ramp element

Distance between A-part and cooling structure