阅读说明：本技术 一种具有电磁屏蔽功能的封装结构及制备方法 (Packaging structure with electromagnetic shielding function and preparation method ) 是由 张凯 曹立强 于 2019-08-22 设计创作，主要内容包括：本发明公开了一种具有电磁屏蔽功能的封装结构及制备方法,结构包括：第一介质层；第二介质层,设置有凹槽,形成于第一介质层上；导电层,形成于凹槽的底部和侧壁及第二介质层的水平表面上；芯片,芯片功能引出面的相对面置于所述凹槽底部的导电层上；第三介质层,填充于凹槽内,与位于第二介质的水平表面上的导电层持平；重布线层,通过第二开口与芯片功能引出端以及与导电层电连接。本发明提供的具有电磁屏蔽功能的封装结构及制备方法,通过一次性制作底部和侧面的金属层来实现电磁屏蔽功能,降低了工艺难度,节约成本,由于没有金属层裸露在外,增强了电磁屏蔽层的可靠性,整体厚度和体积可以做的更小,相对来说更大面积的金属层更加易于散热。(The invention discloses a packaging structure with an electromagnetic shielding function and a preparation method thereof, wherein the structure comprises the following steps: a first dielectric layer; the second medium layer is provided with a groove and is formed on the first medium layer; the conducting layer is formed on the bottom and the side wall of the groove and the horizontal surface of the second dielectric layer; the opposite surface of the chip function leading-out surface is arranged on the conducting layer at the bottom of the groove; the third dielectric layer is filled in the groove and is flush with the conductive layer on the horizontal surface of the second dielectric; and the rewiring layer is electrically connected with the chip function leading-out end and the conductive layer through the second opening. According to the packaging structure with the electromagnetic shielding function and the preparation method thereof, the electromagnetic shielding function is realized by manufacturing the metal layers at the bottom and the side at one time, the process difficulty is reduced, the cost is saved, the reliability of the electromagnetic shielding layer is enhanced because no metal layer is exposed outside, the whole thickness and the whole volume can be smaller, and the metal layer with a larger area is relatively easy to radiate heat.)

1. A package structure with electromagnetic shielding function, comprising:

a first dielectric layer;

the second medium layer is provided with a groove and is formed on the first medium layer;

the conducting layer is formed on the bottom and the side wall of the groove and the horizontal surface of the second dielectric layer;

the opposite surface of the chip function leading-out surface is arranged on the conductive layer at the bottom of the groove;

the third dielectric layer is filled in the groove and is flush with the conductive layer on the horizontal surface of the second dielectric layer;

and the rewiring layer is electrically connected with the chip function leading-out end and the conductive layer through the second opening.

2. The package structure with electromagnetic shielding function according to claim 1, further comprising:

and the second adhesion layer is formed on the conductive layer at the bottom of the groove and adheres to the chip.

3. The package structure with electromagnetic shielding function according to claim 1 or 2, wherein the groove is a trapezoidal groove, and a bottom opening of the trapezoidal groove is smaller than an upper opening.

4. The package structure with electromagnetic shielding function according to claim 1, further comprising:

and the solder balls are formed on the rewiring layer and used for leading out the functions of the chip.

5. The package structure with electromagnetic shielding function according to claim 4, further comprising:

and the solder balls are formed on the redistribution layer and used for leading out the functions of the chip.

6. A preparation method of a packaging structure with an electromagnetic shielding function is characterized by comprising the following steps:

preparing a first adhesive layer on a carrier sheet;

preparing a first dielectric layer on the adhesion layer;

manufacturing a second dielectric layer on the first dielectric layer, and manufacturing a groove on the second dielectric layer;

preparing a conductive layer on the bottom and the side wall of the groove and the horizontal surface of the second dielectric layer;

preparing a first opening on the conductive layer on the horizontal surface of the second medium to expose the second medium;

attaching the opposite surface of the chip function leading-out surface to the conducting layer at the bottom of the groove;

preparing a third dielectric layer, filling the groove and keeping the groove level with the conductive layer on the horizontal surface of the second dielectric layer;

a second opening is formed in the position, opposite to the function leading-out end of the chip on the third medium layer, so that the function leading-out end of the chip is exposed;

and preparing a rewiring layer on the third dielectric layer, and electrically connecting the rewiring layer with the chip function leading-out end and the conductive layer through a second opening.

7. The method for manufacturing a package structure with electromagnetic shielding function according to claim 6, wherein after the step of forming the first opening in the conductive layer on the horizontal surface of the second dielectric to expose the second dielectric, and before the step of attaching the opposite surface of the chip function leading face to the conductive layer at the bottom of the groove, the method further comprises:

and forming a second adhesion layer on the conductive layer at the bottom of the groove.

8. The method for manufacturing a package structure with electromagnetic shielding function according to claim 6, further comprising, after the step of manufacturing a redistribution layer on the third dielectric layer:

and preparing a plurality of solder balls on the redistribution layer, and exporting the functions of the chip.

9. The method for preparing a package structure with electromagnetic shielding function according to claim 8, further comprising, after the step of preparing a plurality of solder balls by the redistribution layer:

and preparing an insulating medium layer on the rewiring layer to cover part of the solder balls.

10. The method for manufacturing a package structure with an electromagnetic shielding function according to claim 9, further comprising, after the step of preparing an insulating dielectric layer on the redistribution layer to cover a portion of the solder balls:

removing the slide glass and the first adhesive layer;

and cutting the corresponding position of the first opening on the insulating medium layer to form a plurality of packaging structures with electromagnetic shielding functions.

Technical Field

The invention relates to the technical field of semiconductor packaging, in particular to a packaging structure with an electromagnetic shielding function and a preparation method thereof.

Background

With the popularization of wireless electronic devices, the integration level of radio frequency chips is higher and higher, and the number of radio frequency devices in a package body is increased, which causes the problem of direct electromagnetic interference between devices and between modules, and the problem of electromagnetic interference between modules, which puts higher requirements on how to electromagnetically shield devices with stronger electromagnetic radiation in a limited space.

At present, in a conventional electromagnetic shielding method, an electromagnetic shielding metal shell is applied outside a package body after the package is completed, but the package cost of the metal shell is high, various devices inside the package body cannot be shielded, and the metal shell is exposed outside and easily damaged by external water vapor and pollutants.

Disclosure of Invention

Therefore, the embodiment of the invention provides a packaging structure with an electromagnetic shielding function and a preparation method thereof, and overcomes the defects that the packaging cost of a shielding device in the prior art is high and various devices in a packaging body cannot be shielded.

In a first aspect, an embodiment of the present invention provides a package structure with an electromagnetic shielding function, including: a first dielectric layer; the second medium layer is provided with a groove and is formed on the first medium layer; the conducting layer is formed on the bottom and the side wall of the groove and the horizontal surface of the second dielectric layer; the opposite surface of the chip function leading-out surface is arranged on the conductive layer at the bottom of the groove; the third dielectric layer is filled in the groove and is flush with the conductive layer on the horizontal surface of the second dielectric layer; and the rewiring layer is electrically connected with the chip function leading-out end and the conductive layer through the second opening.

In an embodiment, the package structure with electromagnetic shielding function further includes: and the second adhesion layer is formed on the conductive layer at the bottom of the groove and adheres to the chip.

In one embodiment, the groove is a trapezoidal groove, and the bottom opening of the trapezoidal groove is smaller than the upper opening.

In an embodiment, the package structure with electromagnetic shielding function further includes: and the solder balls are formed on the redistribution layer and used for leading out the functions of the chip.

In a second aspect, an embodiment of the present invention provides a method for manufacturing a package structure with an electromagnetic shielding function, including the following steps: preparing an adhesive layer on a slide; preparing a first dielectric layer on the adhesion layer; manufacturing a second dielectric layer on the first dielectric layer, and manufacturing a groove on the second dielectric layer; preparing a conductive layer on the bottom and the side wall of the groove and the horizontal surface of the second dielectric layer; preparing a first opening on the conductive layer on the horizontal surface of the second medium to expose the second medium; attaching the opposite surface of the chip function leading-out surface to the conducting layer at the bottom of the groove; preparing a third dielectric layer, filling the groove and keeping the groove level with the conductive layer on the horizontal surface of the second dielectric layer; a second opening is formed in the position, opposite to the function leading-out end of the chip on the third medium layer, so that the function leading-out end of the chip is exposed; and preparing a rewiring layer on the third dielectric layer, and electrically connecting the rewiring layer with the chip function leading-out end and the conductive layer through a second opening.

In an embodiment, after the step of preparing the first opening in the conductive layer on the horizontal surface of the second medium to expose the second medium, and before the step of attaching the opposite surface of the chip function leading-out surface to the conductive layer at the bottom of the groove, the method further includes: and forming a second adhesion layer on the conductive layer at the bottom of the groove.

In an embodiment, after the step of preparing the redistribution layer on the third dielectric layer, the method further includes: and preparing a plurality of solder balls on the redistribution layer, and exporting the functions of the chip.

In an embodiment, after the step of preparing a plurality of solder balls by the redistribution layer, the method further includes: and preparing an insulating medium layer on the rewiring layer to cover part of the solder balls.

In an embodiment, after the step of preparing the redistribution layer to cover a portion of the solder balls, the method further includes: removing the slide glass and the first adhesive layer; and cutting the corresponding position of the first opening on the insulating medium layer to form a plurality of packaging structures with electromagnetic shielding functions.

The technical scheme provided by the embodiment of the invention has the following advantages:

1. according to the packaging structure with the electromagnetic shielding function, the electromagnetic shielding function is realized by manufacturing the metal layers at the bottom and the side at one time, the reliability of the electromagnetic shielding layer is enhanced because no metal layer is exposed outside, the whole thickness and the size can be smaller, and the metal layer with a larger area is relatively easier to dissipate heat.

2. According to the packaging method with the electromagnetic shielding function, the electromagnetic shielding function is realized by manufacturing the metal layers at the bottom and the side at one time, the process for manufacturing the metal column in the prior art is omitted, the process steps are reduced, the process difficulty is reduced, and the cost is saved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic diagram of a package structure with an electromagnetic shielding function according to an embodiment of the present invention;

fig. 2 is a schematic diagram of another package structure with an electromagnetic shielding function according to an embodiment of the present invention;

fig. 3 is a flowchart of a specific example of a method for manufacturing a package structure with an electromagnetic shielding function according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of a first adhesion layer and a first dielectric layer sequentially formed on a slide glass according to an embodiment of the present disclosure;

FIG. 5 is a schematic diagram of a second dielectric layer and a trench structure according to an embodiment of the present invention;

fig. 6 is a schematic diagram of preparing a conductive layer and a first opening according to an embodiment of the invention;

FIG. 7 is a schematic diagram of chip placement provided in an embodiment of the invention;

FIG. 8 is a schematic diagram of a third dielectric layer structure provided in an embodiment of the invention;

FIG. 9 is a schematic view of forming a second opening according to an embodiment of the present invention;

fig. 10 is a schematic diagram of a redistribution layer provided in an embodiment of the present invention;

fig. 11 is a flowchart of another specific example of a method for manufacturing a package structure with an electromagnetic shielding function according to an embodiment of the present invention.

Reference numerals:

101-a slide; 102-a first adhesive layer; 103-a first dielectric layer; 104-a second dielectric layer;

105-a groove; 106-a conductive layer; 107-first opening; 108-chip; 109-a third dielectric layer;

110 — a second opening; 111-a rewiring layer; 112-solder balls; 113-an insulating dielectric layer;

114-second adhesive layer.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.