阅读说明：本技术 一种结构功能一体化的封装结构及其实现方法 (Structure-function integrated packaging structure and implementation method thereof ) 是由 陈瑜 孙同帅 姜鑫 莫尚军 刘晓 杨德梦 于 2019-09-23 设计创作，主要内容包括：本发明涉及微波电路封装技术领域,公开了一种结构功能一体化的封装结构及其实现方法。结构如下：将芯片和集成天线粘接到芯片载板上,芯片载板和具有开孔外壳焊接成一个整体,并使芯片和集成天线处于外壳的腔体内,集成天线正对外壳上的开孔,集成天线与外壳腔体耦合出向外辐射的信号,外壳的内腔中设置阻隔板形成两个隔开的腔体,芯片和集成天线分别位于两个隔开的腔体,芯片所在腔体用于激励微波信号,天线部分所在腔体用于传输信号,使得信号从外壳开孔处耦合出。该结构封装壳体设置针对天线的开孔,使外壳具有封装和信号传输两种功能,实现结构功能一体化；该结构有利于小型化、轻型化和大规模集成化产品的发展。(The invention relates to the technical field of microwave circuit packaging, and discloses a structure-function integrated packaging structure and an implementation method thereof. The structure is as follows: the chip and the integrated antenna are adhered to the chip carrier plate, the chip carrier plate and the shell with the opening are welded into a whole, the chip and the integrated antenna are located in the cavity of the shell, the integrated antenna is opposite to the opening of the shell, the integrated antenna is coupled with the cavity of the shell to form an outward radiation signal, a blocking plate is arranged in the inner cavity of the shell to form two separated cavities, the chip and the integrated antenna are respectively located in the two separated cavities, the cavity where the chip is located is used for exciting a microwave signal, and the cavity where the antenna part is located is used for transmitting the signal, so that the signal is coupled out from the opening of the shell. The structure packaging shell is provided with an opening aiming at the antenna, so that the shell has two functions of packaging and signal transmission, and the structural function integration is realized; the structure is beneficial to the development of miniaturization, light weight and large-scale integration products.)

1. The utility model provides a packaging structure of structural function integration, its characterized in that, including shell, chip carrier plate, chip, integrated antenna and the baffler that has the trompil, chip and integrated antenna bond on the chip carrier plate, the chip carrier plate welds into a whole with the shell that has the trompil to make chip and integrated antenna be in the cavity of shell, integrated antenna just to the trompil on the shell, integrated antenna and shell cavity coupling go out the signal of outside radiation, set up the baffler in the inner chamber of shell and form two separated cavities, chip and integrated antenna are located two separated cavities respectively.

2. The structure-function integrated package structure of claim 1, wherein the barrier plate is made of a non-absorbing material.

3. The structure-function integrated package structure of claim 1, wherein the chip is bonded by soldering.

4. The structurally-functionally-integrated package structure of claim 1, wherein one or more integrated antennas are bonded to the chip carrier.

5. The structure-and-function package structure of claim 4, wherein the shape of the integrated antenna comprises a rectangle, a circle, or a sector.

6. The structure-and-function package according to claim 5, wherein the shape of the opening is identical to the shape of the integrated antenna, and the opening is vertically aligned with the position of the integrated antenna.

7. The structurally-functionally-integrated package structure of claim 1, wherein a circle of V-shaped grooves with a thickness greater than that of the cap by 0.1mm ± 0.02mm is formed at a position where the chip carrier is soldered to the package.

8. The structure-and-function integrated package structure of claim 7, wherein the angle of the V-shaped groove is 30 °.

9. A method for realizing a structure-function integrated packaging structure is characterized by comprising the following steps:

firstly, a chip and an integrated antenna are bonded on a chip carrier plate, and an opening is arranged on a packaging shell;

then adjusting the combination position of the chip carrier and the packaging shell to ensure that the integrated antenna on the chip carrier is opposite to the opening on the packaging shell;

after the combination position is adjusted, a blocking plate is arranged inside the chip carrier or the packaging shell, and the arrangement position of the group of the blocking plates needs to meet the requirements: a cavity formed by the chip carrier and the packaging shell is divided into two independent cavities, and the chip and the integrated antenna are respectively positioned in the two independent cavities;

after the barrier plate is arranged, the chip carrier plate and the packaging shell are welded into a whole under the adjusted combination position.

Technical Field

The invention relates to the technical field of microwave circuit packaging, in particular to a structure and function integrated packaging structure and an implementation method thereof.

Background

The development of monolithic integrated circuits (MMICs) has remained highly consistent with the growth of society in many respects. In the development process, cost and performance play a leading role in promoting, so that a smaller monolithic circuit with higher integration degree gradually replaces a traveling wave tube and an electron tube. With the rapid development of microelectronic and microwave vacuum electronic devices, the performance requirements for various microwave components and devices are higher and higher, especially in aerospace and military electronic technologies, the use environment of electronic equipment is very severe, and the performance of various components, especially microwave devices, must meet very severe requirements, such as vacuum airtightness, excellent heat dissipation performance, high mechanical strength, high thermal shock resistance and temperature cycle capability, and the like. This must be solved by the materials and structures used, and the structural improvement mainly depends on the package housing of the device, so the development of the package housing becomes an important component of microwave technology. The conventional microwave circuit packaging sequence is as follows: the MMIC chip and the integrated antenna are bonded in a cavity, and then microwave signals on the MMIC are led to the end of the integrated antenna in a coupling mode to carry out signal transmission. The cavity is sealed in a sealing welding mode. The packaging implementation method has the defects of multiple assembly processes and larger packaging volume, so that the reasonable selection of the packaging structure is an effective way for eliminating harmful sealing stress and improving the sealing strength, the assembly processes can be simplified through the integrated design of the packaging structure, and the requirements of high-efficiency transmission of microwave signals and miniaturization of microwave products are met.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: aiming at the existing problems, a structure and function integrated packaging structure and a realization method thereof are provided.

The technical scheme adopted by the invention is as follows: the utility model provides a packaging structure of structural function integration, is including shell, chip carrier plate, chip, integrated antenna and the baffler that has the trompil, chip and integrated antenna bond on the chip carrier plate, the chip carrier plate welds into a whole with the trompil shell has to make chip and integrated antenna be in the cavity of shell, integrated antenna just to the trompil on the shell, integrated antenna and shell cavity coupling go out the signal of outside radiation, set up the baffler in the inner chamber of shell and form two separated cavitys, chip and integrated antenna are located two separated cavitys respectively.

Furthermore, the barrier plate is made of non-wave-absorbing materials.

Furthermore, the chips are bonded in a welding mode.

Furthermore, one or more integrated antennas are bonded on the chip carrier plate.

Further, the shape of the integrated antenna comprises a rectangle, a circle and a sector.

Further, the shape of the opening is consistent with the shape of the integrated antenna, and the opening is vertically aligned with the position of the integrated antenna.

Furthermore, a circle of V-shaped groove which is 0.1mm +/-0.02 mm larger than the thickness of the sealing cover is arranged at the position where the chip carrier plate is welded with the shell.

Further, the angle of the V-shaped groove is 30 degrees.

The invention also discloses a method for realizing the structure-function integrated packaging structure, which comprises the following steps:

firstly, a chip and an integrated antenna are bonded on a chip carrier plate, and an opening is arranged on a packaging shell;

then adjusting the combination position of the chip carrier and the packaging shell to ensure that the integrated antenna on the chip carrier is opposite to the opening on the packaging shell;

after the combination position is adjusted, a blocking plate is arranged inside the chip carrier or the packaging shell, and the arrangement position of the group of the blocking plates needs to meet the requirements: a cavity formed by the chip carrier and the packaging shell is divided into two independent cavities, and the chip and the integrated antenna are respectively positioned in the two independent cavities;

after the barrier plate is arranged, the chip carrier plate and the packaging shell are welded into a whole under the adjusted combination position.

Compared with the prior art, the beneficial effects of adopting the technical scheme are as follows:

(1) the chip and the integrated antenna are packaged together, so that the packaging size is reduced, the assembly process is simple, and the operation is convenient.

(2) The packaging shell is provided with an opening aiming at the antenna, and electromagnetic waves radiated to the space in the cavity of the packaging shell by the antenna are transmitted with wave signals of a TE10 mode coupled out of the cavity hole, so that the shell has two functions of packaging and signal transmission, and the structural function integration is realized; furthermore, the volume of the package is further reduced, which is beneficial to the development of miniaturization, light weight and large-scale integration products.

(3) Compared with the traditional mode of switching through microstrip line waveguide, the structure utilizes the chip integrated antenna to greatly reduce the loss of microwave signals in the transmission process and improve the transmission efficiency of the microwave signals.

Drawings

Fig. 1 is a schematic view of a structure and function integrated package structure of the present invention.

Detailed Description

The invention is further described below with reference to the accompanying drawings.

Technology on chip (AiP) is the integration of a single or multiple element antenna (antenna elements are rectangular, circular, sector, etc.) into an RF package, typically using an integrated circuit packaging process. In the millimeter wave transceiver, an antenna array (integrated antenna) is integrated in a package, and the on-chip integrated antenna is favorable for greatly reducing the loss of microwave signals in the transmission process, improving the transmission efficiency of the microwave signals and providing enough signal gain; on the other hand, the microwave signal transmission and the integration of the packaging shell are facilitated, and the size minimization is realized.