阅读说明：本技术 半导体封装件 (Semiconductor package ) 是由 村井亮司 辻夏树 于 2017-05-24 设计创作，主要内容包括：冷却器(1)具有：冷却板(1a)；冷却鳍片(1b),其设置于冷却板(1a)的下表面的中央部；以及下凸出部(1c),其设置于冷却板(1a)的下表面的外周部。半导体元件(3)设置于冷却板(1a)的上表面。母线(5)与半导体元件(3)连接。冷却机构(8)包围冷却器(1)的下表面以及侧面。O形环(9)设置在下凸出部(1c)的下表面与冷却机构(8)的底面之间。螺栓(10)贯穿冷却机构(8)的侧壁而将冷却器(1)螺纹固定于冷却机构(8)。(A cooler (1) is provided with: a cooling plate (1 a); a cooling fin (1b) provided at the center of the lower surface of the cooling plate (1 a); and a lower protrusion (1c) provided on the outer peripheral portion of the lower surface of the cooling plate (1 a). The semiconductor element (3) is provided on the upper surface of the cooling plate (1 a). The bus bar (5) is connected to the semiconductor element (3). The cooling mechanism (8) surrounds the lower surface and the side surface of the cooler (1). An O-ring (9) is provided between the lower surface of the lower protrusion (1c) and the bottom surface of the cooling mechanism (8). The bolt (10) penetrates the side wall of the cooling mechanism (8) to fix the cooler (1) to the cooling mechanism (8) by screw thread.)

1. A semiconductor package, comprising:

a cooler having a cooling plate, a cooling fin provided at a central portion of a lower surface of the cooling plate, and a lower protrusion provided at an outer peripheral portion of the lower surface of the cooling plate;

a semiconductor element provided on an upper surface of the cooling plate;

a bus bar connected to the semiconductor element;

a cooling mechanism surrounding a lower surface and a side surface of the cooler;

an O-ring disposed between a lower surface of the lower protrusion and a bottom surface of the cooling mechanism; and

and a bolt that penetrates a side wall of the cooling mechanism to fix the cooler to the cooling mechanism by screwing.

2. The semiconductor package according to claim 1,

the lower protruding portion is composed of a hard metal harder than the cooling plate,

the bolt is screwed into the lower projection.

3. The semiconductor package according to claim 1 or 2,

the cooler also has an upper protrusion and a resin,

the upper protrusion is provided on an outer peripheral portion of the upper surface of the cooling plate,

the resin covers the semiconductor element and the upper protruding portion.

4. The semiconductor package according to claim 3,

the upper protruding portion is composed of a hard metal harder than the cooling plate,

the bolt is screwed into the upper projection.

5. The semiconductor package according to claim 3,

the bolt penetrates through the upper protruding part, and a nut is installed at the front end of the bolt.

6. The semiconductor package according to claim 3,

embedding a nut having a threaded hole in a side surface of the upper protrusion,

the bolt is screwed into the nut.

7. The semiconductor package according to any one of claims 1 to 6,

the side wall is inclined so as to spread upward from the bottom surface of the cooling mechanism,

the side face of the cooler is inclined so as to be opposed to an inner side face of the side wall.

8. A semiconductor package, comprising:

a cooler having a cooling plate, a cooling fin provided at a central portion of a lower surface of the cooling plate, and a lower protrusion provided at an outer peripheral portion of the lower surface of the cooling plate;

a semiconductor element provided on an upper surface of the cooling plate;

a bus bar connected to the semiconductor element;

a cooling mechanism surrounding a lower surface and a side surface of the cooler;

an O-ring disposed between a side surface of the lower protrusion and an inner side surface of a side wall of the cooling mechanism; and

a bolt penetrating the side wall to screw-fix the cooler to the cooling mechanism,

the inner side surface of the side wall is inclined so as to spread upward from the bottom surface of the cooling mechanism,

the side face of the cooler is inclined so as to be opposed to the inner side face of the side wall.

9. The semiconductor package according to claim 8,

the outer side surface of the side wall is perpendicular to the bottom surface of the cooling mechanism.

10. The semiconductor package according to any one of claims 1 to 9,

the semiconductor element is formed of a wide bandgap semiconductor.

Technical Field

The present invention relates to a semiconductor package in which a cooler is screwed to a cooling mechanism.

Background

In the semiconductor package, a semiconductor element is provided on the upper surface of a cooler with an insulating substrate interposed therebetween. The heat generated from the semiconductor element is dissipated through the cooling fins provided on the lower surface of the cooler. Conventionally, an O-ring is provided between a cooling mechanism and a cooler, and the cooler is fixed to the cooling mechanism by bolts from the upper surface of the cooler. However, there is a problem that it is necessary to secure an insulation distance between the external connection portion of the bus bar protruding from the resin and the bolt head, and the package size becomes large. In order to solve this problem, for example, a structure in which an O-ring and a bolt are disposed on a side surface has been proposed (for example, see patent document 1).

Patent document 1: japanese patent laid-open No. 2008-16515

Disclosure of Invention

However, if the cooler is fixed to the cooling mechanism in a state where the O-ring is provided on the vertical side surface of the cooler, the O-ring may slip off due to gravity, and the O-ring may be displaced. In addition, in order to improve the compatibility between the cooling mechanism and the cooler, high-precision dimensional control of each component is required. Therefore, there is a problem that assembly is difficult.

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a semiconductor package which can be reduced in size and can be easily assembled.

The semiconductor package according to the present invention is characterized by comprising: a cooler having a cooling plate, a cooling fin provided at a central portion of a lower surface of the cooling plate, and a lower protrusion provided at an outer peripheral portion of the lower surface of the cooling plate; a semiconductor element provided on an upper surface of the cooling plate; a bus bar connected to the semiconductor element; a cooling mechanism surrounding a lower surface and a side surface of the cooler; an O-ring disposed between a lower surface of the lower protrusion and a bottom surface of the cooling mechanism; and a bolt that penetrates a side wall of the cooling mechanism to fix the cooler to the cooling mechanism by screwing.

ADVANTAGEOUS EFFECTS OF INVENTION

In the present invention, the cooler is screwed to the cooling mechanism by a bolt that penetrates a side wall of the cooling mechanism. Thus, the head portion of the bolt is not provided on the upper surface of the cooling plate on which the semiconductor element is provided, and therefore, it is not necessary to secure an insulation distance between the external connection portion of the bus bar and the bolt. Further, since the O-ring is provided between the lower surface of the lower projection provided on the outer peripheral portion of the lower surface of the cooling plate and the bottom surface of the cooling mechanism, the O-ring can be prevented from being displaced. Therefore, the package size can be reduced and the assembly is easy.

Drawings

Fig. 1 is a sectional view showing a semiconductor package according to embodiment 1 of the present invention.

Fig. 2 is a cross-sectional view showing a semiconductor package according to a comparative example.

Fig. 3 is a sectional view showing a semiconductor package according to embodiment 2 of the present invention.

Fig. 4 is a sectional view showing a semiconductor package according to embodiment 3 of the present invention.

Fig. 5 is a sectional view showing a semiconductor package according to embodiment 4 of the present invention.

Fig. 6 is a sectional view showing a semiconductor package according to embodiment 5 of the present invention.

Fig. 7 is a sectional view showing a semiconductor package according to embodiment 6 of the present invention.

Fig. 8 is a sectional view showing a semiconductor package according to embodiment 7 of the present invention.

Fig. 9 is a sectional view showing a semiconductor package according to embodiment 8 of the present invention.

Fig. 10 is a sectional view showing a semiconductor package according to embodiment 9 of the present invention.

Detailed Description

A semiconductor package according to an embodiment of the present invention will be described with reference to the drawings.

The same or corresponding components are denoted by the same reference numerals, and redundant description may be omitted.