阅读说明：本技术 中央处理器组件及其散热控制方法、电子设备、手机 (central processing unit assembly and heat dissipation control method thereof, electronic equipment and mobile phone ) 是由 张加亮 于 2018-06-11 设计创作，主要内容包括：本发明公开了一种中央处理器组件及其散热控制方法、电子设备、手机,所述中央处理器组件包括：中央处理器本体、中央处理器屏蔽盖和第一热电制冷器,所述第一热电制冷器夹设在所述中央处理器本体与所述中央处理器屏蔽盖之间且与直流电源相连。根据本公开的中央处理器组件,通过设置第一热电制冷器,可以提高中央处理器本体的散热效果,使得中央处理器本体可以长时间处于最佳状态运行。(The invention discloses a central processing unit assembly and a heat dissipation control method thereof, electronic equipment and a mobile phone, wherein the central processing unit assembly comprises: the central processing unit comprises a central processing unit body, a central processing unit shielding cover and a first thermoelectric refrigerator, wherein the first thermoelectric refrigerator is clamped between the central processing unit body and the central processing unit shielding cover and is connected with a direct-current power supply. According to the central processing unit assembly disclosed by the invention, the first thermoelectric refrigerator is arranged, so that the heat dissipation effect of the central processing unit body can be improved, and the central processing unit body can be in the optimal state for a long time to operate.)

1. A central processing unit assembly, comprising:

A central processing unit body;

a CPU shielding cover; and

The first thermoelectric refrigerator is clamped between the central processing unit body and the central processing unit shielding cover and is connected with a direct current power supply.

2. The central processor assembly of claim 1, wherein the first thermoelectric chiller comprises:

A thermoelectric cooling material;

The first conducting strip is electrically connected with the thermoelectric refrigerating material piece and is clamped between a heat absorption area of the thermoelectric refrigerating material piece and the central processing unit body;

the second conducting strip is electrically connected with the thermoelectric refrigerating material piece and is clamped between the heat release area of the thermoelectric refrigerating material piece and the CPU shielding cover,

The first conducting strip and the second conducting strip are respectively in conducting connection with two ends of the direct-current power supply.

3. The cpu assembly of claim 2, wherein a first thermally conductive material is disposed between the first conductive plate and the cpu body.

4. The cpu assembly of claim 3, wherein the first thermally conductive material is a thermally conductive paste, a thermally conductive pad, or a thermally conductive adhesive.

5. The cpu assembly of claim 2, wherein a second thermally conductive material is disposed between the second conductive plate and the cpu shield cover.

6. The CPU assembly of claim 5, wherein said second thermally conductive material is a thermally conductive paste, a thermally conductive pad, or a thermally conductive paste.

7. The cpu assembly of claim 2 wherein said thermoelectric cooling material is an N-type semiconductor.

8. The cpu assembly of claim 2, wherein the first and second conductive sheets are each a copper sheet or an aluminum sheet.

9. The cpu assembly of claim 2, wherein a heat sink is disposed on a side of the cpu shield cover away from the second conductive plate.

10. The central processor assembly of claim 1, further comprising: and the ventilation device is used for producing airflow which circulates from the central processor body to the central processor shielding cover.

11. An electronic device, comprising: the central processor assembly according to any one of claims 1-10.

12. an electronic device, comprising: the camera assembly comprises a camera body and a second thermoelectric refrigerator, the second thermoelectric refrigerator is connected with a direct current power supply, and a heat absorption area of the second thermoelectric refrigerator is connected with the camera body in a heat conduction mode.

13. an electronic device, comprising: the display screen assembly comprises a display screen body and a third thermoelectric refrigerator, wherein the third thermoelectric refrigerator is connected with a direct-current power supply, and a heat absorption area of the third thermoelectric refrigerator is connected with the display screen body in a heat conduction mode.

14. A cellular phone, comprising:

a non-heat generating member;

A heating element;

and the heat absorption area of the fourth thermoelectric refrigerator is in heat conduction connection with the heating element, the heat release area of the fourth thermoelectric refrigerator is in heat conduction connection with the non-heating element, and the fourth thermoelectric refrigerator is in electric conduction connection with a direct-current power supply.

15. The mobile phone of claim 14, wherein the heating element is at least one of a central processor body, a camera body and a display screen body.

16. A heat dissipation control method for controlling a cpu assembly according to any one of claims 1 to 10, comprising the steps of:

Detecting the real-time temperature of the central processing unit body;

When the real-time temperature is larger than or equal to a first preset temperature value, controlling the direct-current power supply to output voltage to the first thermoelectric refrigerator;

And when the real-time temperature is less than or equal to a second preset temperature value, controlling the direct-current power supply to stop outputting voltage to the first thermoelectric refrigerator, wherein the second preset temperature value is less than the first preset temperature value.

17. The heat dissipation control method according to claim 16, further comprising the step of:

And when the direct current power supply outputs voltage to the first thermoelectric refrigerator, if the detected real-time temperature is gradually increased, controlling the direct current power supply to increase the voltage value output to the first thermoelectric refrigerator.

Technical Field

The present disclosure relates to the field of electronic technologies, and in particular, to a central processing unit assembly, a heat dissipation control method thereof, an electronic device, and a mobile phone.

background

the use scene of the mobile phone has higher and higher requirements on the working performance of a Central Processing Unit (CPU), the CPU continuously improves the working frequency and increases the energy consumption for completing more tasks, and when the CPU continuously works with high performance, the CPU heats seriously, which causes the CPU to work in a frequency reduction manner, thereby affecting the user experience. In order to solve the technical problem, in the related art, a heat dissipation material such as a heat dissipation fin can be attached to the surface of the CPU to improve the temperature rise of the whole CPU, but the effect of the heat dissipation method is limited, and an ideal heat dissipation effect cannot be achieved.

BRIEF SUMMARY OF THE PRESENT DISCLOSURE

The present disclosure is directed to solving at least one of the technical problems of the prior art. Therefore, the disclosure provides a central processing unit assembly, which has an obvious heat dissipation effect and can effectively improve the temperature rise problem of the CPU, so that the CPU does not need to reduce the frequency to work, and the user experience can be guaranteed. In addition, the disclosure also provides a heat dissipation control method, electronic equipment and a mobile phone.

A central processor assembly according to an embodiment of the first aspect of the present disclosure, includes: a central processing unit body; a CPU shielding cover; and the first thermoelectric refrigerator is clamped between the central processor body and the central processor shielding cover and is connected with a direct current power supply. Therefore, the heat dissipation effect of the central processing unit body can be effectively improved.

According to the electronic device of the second aspect of the present disclosure, the central processing unit assembly of the first aspect of the present disclosure is included, so that the central processing unit assembly can continuously and efficiently operate, and thus the user experience of the electronic device is improved.

An electronic device according to an embodiment of a third aspect of the present disclosure includes: the camera assembly comprises a camera body and a second thermoelectric refrigerator, the second thermoelectric refrigerator is connected with a direct current power supply, and a heat absorption area of the second thermoelectric refrigerator is connected with the camera body in a heat conduction mode. Therefore, the camera assembly can continuously and efficiently work, so that the user experience of the electronic equipment is improved.

An electronic device according to a fourth aspect embodiment of the present disclosure includes: the display screen assembly comprises a display screen body and a third thermoelectric refrigerator, wherein the third thermoelectric refrigerator is connected with a direct-current power supply, and a heat absorption area of the third thermoelectric refrigerator is connected with the display screen body in a heat conduction mode. Therefore, the display screen assembly can continuously and efficiently work, so that the user experience of the electronic equipment is improved.

According to the fifth aspect of the disclosure, the mobile phone includes: a non-heat generating member; a heating element; and the heat absorption area of the fourth thermoelectric refrigerator is in heat conduction connection with the heating element, the heat release area of the fourth thermoelectric refrigerator is in heat conduction connection with the non-heating element, and the fourth thermoelectric refrigerator is in electric conduction connection with a direct-current power supply. Therefore, the heating element can continuously and efficiently work, so that the user experience of the mobile phone is improved.

The heat dissipation control method according to the sixth aspect of the present disclosure is used for controlling the cpu assembly according to the first aspect of the present disclosure, and includes the following steps: detecting the real-time temperature of the central processing unit body; when the real-time temperature is larger than or equal to a first preset temperature value, controlling the direct-current power supply to output voltage to the first thermoelectric refrigerator; and when the real-time temperature is less than or equal to a second preset temperature value, controlling the direct-current power supply to stop outputting voltage to the first thermoelectric refrigerator, wherein the second preset temperature value is less than the first preset temperature value. Therefore, the double effects of energy conservation and high-efficiency heat dissipation can be considered.

additional aspects and advantages of the disclosure will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the disclosure.

Drawings

FIG. 1 is a schematic diagram of the operation of a central processor assembly according to one embodiment of the present disclosure;

FIG. 2 is a schematic diagram of an electronic device according to one embodiment of the present disclosure.

reference numerals:

A central processor unit 100;

A central processing unit body 1; a detector 11; a CPU shield cover 2;

A first thermoelectric refrigerator 3; a first conductive sheet 31; the second conductive sheet 32; a thermoelectric cooling material piece 33;

A first heat conductive material member 4; a second heat conductive material piece 5; a heat sink 6; a ventilation device 7;

A DC power supply 200;

A camera assembly 300; a camera body 301; a second thermoelectric chiller 302;

A display screen assembly 400; a display screen body 401; a third thermoelectric chiller 402;

an electronic device 1000;

a mobile phone A; a non-heat generating member a 1; a heating element a 2; fourth thermoelectric cooler a 3.

Detailed Description

Reference will now be made in detail to the embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and intended to be illustrative of the present disclosure, and should not be construed as limiting the present disclosure.

The following disclosure provides many different embodiments, or examples, for implementing different features of the disclosure. To simplify the disclosure of the present disclosure, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present disclosure. Further, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present disclosure provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the applicability of other processes and/or the use of other materials.

next, referring to fig. 1, a central processor assembly 100 according to an embodiment of the first aspect of the present disclosure is described.

As shown in fig. 1, the cpu assembly 100 includes: a Central Processing Unit body 1 (i.e., a CPU, a Central Processing Unit), a shield cover 2 (i.e., a CPU shield cover), and a first thermoelectric refrigerator 3. The first thermoelectric refrigerator 3 is sandwiched between the cpu body 1 and the cpu shield cover 2 and connected to the dc power supply 200, that is, the heat absorption region of the first thermoelectric refrigerator 3 is connected to the cpu body 1 in a heat conducting manner, the heat release region of the first thermoelectric refrigerator 3 is connected to the cpu shield cover 2 in a heat conducting manner, and the first thermoelectric refrigerator 3 is electrically connected to the dc power supply 200 in an electrically conducting manner.

From this, utilize the peltier effect, through set up first thermoelectric refrigerator 3 on central processing unit body 1, when central processing unit body 1 temperature is higher, control direct current power supply 200 output voltage transmits central processing unit body 1's temperature to central processing unit shield cover 2, thereby can obtain faster, more effective radiating effect, make central processing unit body 1's temperature maintain in suitable range value, make central processing unit body 1's performance can remain throughout at the optimum, the temperature rise of the whole machine of electronic equipment 1000 who sets up this central processing unit subassembly 100 has been improved, user experience has been promoted.

In short, according to the central processing unit assembly 100 of the embodiment of the present disclosure, the first thermoelectric cooler 3 is disposed between the central processing unit body 1 and the central processing unit shielding cover 2, and the heat of the central processing unit body 1 is transferred to the central processing unit shielding cover 2 by controlling the dc power supply 200, so that the temperature of the central processing unit body 1 can be always maintained in a suitable range, thereby ensuring that the central processing unit body 1 can always maintain a high-performance working state, and greatly improving the user experience.

In addition, according to the central processing unit assembly 100 of the embodiment of the present disclosure, the spatial layout characteristics and the operating temperature characteristics of the central processing unit body 1 and the central processing unit shielding cover 2 are skillfully utilized, and the first thermoelectric refrigerator 3 is arranged between the two, so that the heat of the central processing unit body 1 can be skillfully released only by a very short path, and further, the heat dissipation efficiency and the heat dissipation effect can be effectively improved, the heat dissipation reliability is high, and the overall structure of the central processing unit assembly 100 is very simple and easy, and is convenient to implement and suitable for popularization and application.

In some specific embodiments of the present disclosure, as shown in fig. 1, the first thermoelectric refrigerator 3 may include: the CPU comprises a first conducting strip 31, a second conducting strip 32 and a thermoelectric refrigerating material piece 33, wherein the first conducting strip 31 is clamped between a heat absorption area of the thermoelectric refrigerating material piece 33 and the CPU body 1, the second conducting strip 32 is clamped between a heat prevention area of the thermoelectric refrigerating material piece 33 and the CPU shielding cover 2, the thermoelectric refrigerating material piece 33 is electrically connected between the first conducting strip 31 and the second conducting strip 32, and the first conducting strip 31 and the second conducting strip 32 are respectively electrically connected with two ends of a DC power supply 200.

In this way, during the operation of the first thermoelectric cooler 3, the thermoelectric cooling material 33 can be connected to the dc power supply 200 through the first conductive sheet 31 and the second conductive sheet 32 at the two ends of the thermoelectric cooling material to control the activation of the thermoelectric cooling material 33, and the positive and negative poles of the dc power supply 200 determine the heat conducting direction of the thermoelectric cooling material 33. Next, the operation principle will be described by taking the example in which the thermoelectric cooling material 33 is an N-type semiconductor.

When the thermoelectric cooling material 33 is an N-type semiconductor, the positive and negative poles of the dc power supply 200 determine the direction of the N-type particles, that is, the heat transfer direction. More specifically, as shown in fig. 1, a heat absorbing region is formed below the N-type semiconductor, a heat releasing region is formed above the N-type semiconductor, the dc power supply 200 is turned on, electrons move in the N-type semiconductor from bottom to top, and heat generated below the N-type semiconductor is transferred to the top to be released, so that the temperature of the bottom of the N-type semiconductor can be lowered, and thus, the cpu body 1 can be cooled by the N-type semiconductor by disposing the cpu body 1 below the N-type semiconductor.

In short, by arranging the N-type semiconductor on the central processing unit body 1, the heat absorption region of the N-type semiconductor is close to the central processing unit body 1 through the first conductive sheet 31, the heat release region of the N-type semiconductor is close to the central processing unit shielding cover 2 through the second conductive sheet 32, and voltage is applied to the N-type semiconductor by controlling the direct-current power supply 200, so that heat on the central processing unit body 1 can be rapidly released to the central processing unit shielding cover 2, thereby achieving the effects of effectively reducing temperature and dissipating heat, and maintaining the temperature of the central processing unit body 1 within a reasonable range.

Of course, the disclosure is not limited thereto, and the thermoelectric cooling material 33 may be made of semiconductor materials having other laminated structures besides N-type semiconductors, which will not be described herein. In addition, the first conductive sheet 31 and the second conductive sheet 32 can be formed by processing copper sheets, so that both the conductive effect and the heat conduction effect can be considered, and the heat dissipation effect of the first thermoelectric refrigerator 3 can be better exerted. Of course, the disclosure is not limited thereto, and other materials, such as aluminum sheets, may also be used to fabricate the first conductive sheet 31 and the second conductive sheet 32, which are not described herein.

In addition, as can be seen from the above discussion, when the first thermoelectric refrigerator 3 is constructed as the above structure, the first thermoelectric refrigerator 3 is very simple and easy, has very low cost, not only can achieve effective cooling and heat dissipation effects, but also can be conveniently assembled with the cpu body 1 and the cpu shield cover 2, and is easy to popularize and apply. Of course, the present disclosure is not limited thereto, and the first thermoelectric cooler 3 may also be configured in other structures, for example, a metal wire may be used instead of the first conductive sheet 31 and the second conductive sheet 32, and the description thereof is omitted.

in order to further improve the heat dissipation effect, as shown in fig. 1, a first heat conductive material 4 may be disposed between the first conductive plate 31 and the cpu body 1. For example, the first heat conductive material member 4 may be a heat conductive paste, a heat conductive pad, a heat conductive paste, or the like. Therefore, the speed of releasing heat from the cpu body 1 to the thermoelectric cooling material 33 can be further increased, thereby improving the heat dissipation efficiency and the heat dissipation effect.

In order to further improve the heat dissipation effect, as shown in fig. 1, a second heat conductive material 5 may be disposed between the second conductive sheet 32 and the cpu shield cover 2. For example, the second heat conductive material 5 may be a heat conductive paste, a heat conductive pad, a heat conductive paste, or the like. Therefore, the speed of releasing heat from the thermoelectric refrigerating material piece 3 to the CPU shielding cover 2 can be further improved, and the heat dissipation efficiency and the heat dissipation effect are improved.

In order to further improve the heat dissipation effect, as shown in fig. 1, a heat sink 6 may be further disposed on a side of the cpu shielding cover 2 away from the second conductive sheet 32. Therefore, the space can be fully utilized, so that the heat released to the CPU shielding cover 2 can be released more quickly, the thermoelectric refrigerating material piece 33 can be ensured to reliably and effectively release the heat of the CPU body 1, and the heat dissipation efficiency and the heat dissipation effect are further improved.

in order to further improve the heat dissipation effect, as shown in fig. 1, the cpu assembly 100 may further include: and a ventilation device 7, wherein the ventilation device 7 is used for making airflow circulating from the central processor body 1 to the central processor shielding cover 2. Therefore, on one hand, the heat released to the shielding cover 2 of the cpu can be released more quickly, and on the other hand, the cpu body 1 can release the heat to the thermoelectric cooling material 33 more quickly, so that the heat dissipation efficiency and the heat dissipation effect can be further improved.

Next, with reference to fig. 1, a heat dissipation control method according to an embodiment of a second aspect of the present disclosure is described.

Specifically, the heat dissipation control method according to the embodiment of the present disclosure is used to control the central processing unit assembly 100 according to the first aspect of the embodiment described above. The heat dissipation control method according to the embodiment of the present disclosure includes the steps of: detecting the real-time temperature of the central processing unit body 1; when the real-time temperature is greater than or equal to the first preset temperature value, controlling the dc power supply 200 to output a voltage to the first thermoelectric refrigerator 3: and when the real-time temperature is less than or equal to a second preset temperature value, controlling the direct current power supply 200 to stop outputting the voltage to the first thermoelectric refrigerator 3, wherein the second preset temperature value is less than the first preset temperature value.

Specifically, for "detecting the real-time Temperature of the cpu body 1", the detection may be performed by an external or internal detection device 11, for example, when the cpu body 1 itself includes an NTC (Negative Temperature Coefficient), the NTC may be used as the internal detection device 11 to perform the detection, and the NTC feeds back the direct current power supply 200, so that the direct current power supply 200 applies an appropriate voltage value to the first thermoelectric cooler 3 according to the situation.

like this, when detecting that the temperature of central processing unit body 1 reaches first predetermined temperature value, can control DC power supply 200 to the output of first thermoelectric cooler 3 and predetermine the voltage value, make the heat of central processing unit body 1 release away fast, ensure that central processing unit body 1 can work with best performance for a long time. When the temperature of the cpu body 1 is decreased to the target value, the detecting device 11 may feed back a signal to the dc power supply 200 to notify the dc power supply 200 to turn off the output voltage, thereby saving power consumption.

Therefore, the heat dissipation control method according to the embodiment of the disclosure can effectively improve the heat dissipation effect of the central processing unit body 1, so that the temperature of the central processing unit body 1 is always maintained within an ideal value range, thereby solving the problem of frequency reduction of the central processing unit body 1 due to overhigh temperature, and further effectively improving the use experience of a user.

The heat dissipation control method according to the embodiment of the present disclosure may further include the steps of: when the dc power supply 200 outputs a voltage to the first thermoelectric refrigerator 3, if the detected real-time temperature gradually increases, the dc power supply 200 is controlled to increase the value of the voltage output to the first thermoelectric refrigerator 3. Specifically, since the cooling capacity of the first thermoelectric cooler 3 is related to the voltage value applied by the dc power supply 200, the cooling capacity of the first thermoelectric cooler 3 can be accurately controlled by controlling the voltage value applied by the dc power supply 200, and the first thermoelectric cooler 3 can exhibit a corresponding cooling capacity according to the heat generation condition of the cpu body 1, thereby ensuring a reliable heat dissipation effect of the cpu body 1.

Next, referring to fig. 2, an electronic apparatus 1000 according to an embodiment of the third aspect of the present disclosure is described.

The electronic device 1000 according to the embodiment of the present disclosure is not limited in kind, and may be, for example, a mobile phone a, a tablet computer, a display, a smart watch, a smart speaker, a smart headset, etc., and other configurations, such as a battery, etc., and operations of the electronic device 1000 according to the embodiment of the present disclosure are known to those skilled in the art and will not be described in detail herein.