阅读说明：本技术 倒装式致冷晶片及包含其的封装结构 (Flip-over type cooling wafer and encapsulating structure comprising it ) 是由 罗丕丞 林倖妍 黄柏昭 邓亚欣 粟华新 于 2018-06-04 设计创作，主要内容包括：本发明提供一种倒装式致冷晶片及包含其的封装结构,该倒装式致冷晶片包括一第一侧导热基板、一第二侧导热基板、以及一设置于该第一侧导热基板及该第二侧导热基板之间的珀尔帖效应层。该第二侧导热基板面积大于该第一侧导热基板,并朝一或二侧方向延伸以相对该第一侧导热基板形成突出侧。该珀尔帖效应层的正极端子及负极端子设置于一或二侧方向的该突出侧上。该珀尔帖效应层的正极端子及负极端子馈入反向电源,以令该第一侧导热基板及该第二侧导热基板的冷热逆反,面积较大的该第二侧导热基板作为冷面乘载高温元件,面积较小的该第一侧导热基板作为热面与散热体接触排热。(The present invention provides a kind of flip-over type cooling wafer and the encapsulating structure comprising it, which includes one first side heat-conducting substrate, second side heat-conducting substrate and one be set to Peltier effect layer between the first side heat-conducting substrate and second side heat-conducting substrate.Second side heat-conducting substrate area is greater than the first side heat-conducting substrate, and extends towards one or two side directions and form prominent side with the opposite first side heat-conducting substrate.The positive terminal and negative terminal of the Peltier effect layer are set on the protrusion side of one or two side directions.The positive terminal and negative terminal feed-in reverse electrical source of the Peltier effect layer, to enable the cold and hot converse of the first side heat-conducting substrate and second side heat-conducting substrate, the biggish second side heat-conducting substrate of area multiplies load high-temperature components as huyashi-chuuka (cold chinese-style noodles), and the lesser first side heat-conducting substrate of area contacts heat extraction as hot face and radiator.)

1. a kind of flip-over type cooling wafer, it is characterised in that including；

One first side heat-conducting substrate；

One second side heat-conducting substrate, second side heat-conducting substrate area are greater than the first side heat-conducting substrate, and towards one or two sides Prominent side is formed with the opposite first side heat-conducting substrate to extending；And

One Peltier effect layer is set between the first side heat-conducting substrate and second side heat-conducting substrate, the Peltier effect The positive terminal and negative terminal of layer are set on the protrusion side of one or two side directions；

Wherein, the positive terminal of the Peltier effect layer and negative terminal feed-in reverse electrical source, to enable the first side heat-conducting substrate And second side heat-conducting substrate is cold and hot converse, is multiplied using the biggish second side heat-conducting substrate of area as huyashi-chuuka (cold chinese-style noodles) and carries high temperature member Part allows all high-temperature components on the huyashi-chuuka (cold chinese-style noodles) to maintain identical operation temperature, the lesser first side heat-conducting substrate of area Heat extraction is contacted as hot face and radiator.

2. flip-over type cooling wafer as described in claim 1, which is characterized in that positive terminal and negative pole end on the protrusion side The direction of son downward, and be directed through conducting resinl adhesion or welding with the power connector on the upside of circuit board and electrically combined.

3. flip-over type cooling wafer as described in claim 1, which is characterized in that the Peltier effect layer has multiple p-types half Semiconductor die and N-type semiconductor crystal grain, and imitated in the first side heat-conducting substrate and second side heat-conducting substrate towards the Peltier Answering has the circuit layer that multiple P-type semiconductor crystal grain and the N-type semiconductor crystal grain is connected to enable first side on the side of layer Heat-conducting substrate and second side heat-conducting substrate are respectively formed hot face and lead with huyashi-chuuka (cold chinese-style noodles) and in the first side heat-conducting substrate and the second side Temperature difference is generated between hot substrate.

4. flip-over type cooling wafer as described in claim 1, which is characterized in that the first side heat-conducting substrate and the second side are led Hot substrate is ceramic substrate, aluminium sheet, magnesium plate, aluminium alloy plate or magnesium alloy plate.

5. a kind of encapsulating structure comprising flip-over type cooling wafer according to any one of claims 1 to 4, it is characterised in that It include: a pedestal the flip-over type cooling wafer is arranged, which from bottom to top sequentially has one first plane and one With first interplanar have segment difference the second plane, first plane enabled the flip-over type cooling wafer is arranged this second The lower edge of the prominent side of the upper limb of plane and second side heat-conducting substrate parallel or below the protrusion side of second side heat-conducting substrate, in A circuit board is set in second plane, and through conducting resinl or through the power connector on the upside of the solder bond circuit board be somebody's turn to do Positive terminal and the negative terminal of prominent side lower edge are electrically connected with constituting.

6. encapsulating structure as claimed in claim 5, which is characterized in that the power connector is via the direction among the circuit board Positive terminal and negative terminal on the lower edge position for extending to the protrusion side, with the protrusion side are electrically connected；On the circuit board AC signal route extend via unilateral or two sides direction and be coupled to the high-temperature components.

7. encapsulating structure as claimed in claim 5, which is characterized in that the power connector is via the circuit board one or both sides Direction extend to the lower edge position of the protrusion side, on the protrusion side positive terminal and negative terminal be electrically connected；The electricity AC signal route on the plate of road extends via the direction among the circuit board and is coupled to the high-temperature components.

8. encapsulating structure as claimed in claim 5, which is characterized in that the power connector via the circuit board side direction Positive terminal and negative terminal on the lower edge position for extending to the protrusion side, with the protrusion side are electrically connected；On the circuit board Direction of the AC signal route via the circuit board with respect to the power connector other side extend and be coupled to the high-temperature components.

9. encapsulating structure as claimed in claim 5, which is characterized in that be to supply the flip-over type refrigeration with one in first plane The platform of chip setting, to increase or decrease the height of the flip-over type cooling wafer, to enable its upper limb of the second plane and be somebody's turn to do The lower edge of the prominent side of second side heat-conducting substrate is parallel or below the protrusion side of second side heat-conducting substrate.

10. encapsulating structure as claimed in claim 9, which is characterized in that the platform system be the groove being set on the pedestal or Projection seat.

11. a kind of encapsulating structure comprising flip-over type cooling wafer according to any one of claims 1 to 4, feature exist In including: a pedestal the flip-over type cooling wafer is arranged, in being across multiple conducting pins on the pedestal, which is connect The upper limb of foot and the lower edge of the prominent side of second side heat-conducting substrate are parallel or below the protrusion side of second side heat-conducting substrate.

12. encapsulating structure as claimed in claim 11, which is characterized in that a metal is respectively set on the upside of the conducting pin Conducting gasket extends and contacts to the downside of the positive terminal or the negative terminal to constitute and be electrically connected.

13. encapsulating structure as claimed in claim 11, which is characterized in that be brilliant for the flip-over type refrigeration with one on the pedestal The platform of piece setting, to increase or decrease the height of the flip-over type cooling wafer, with enable the conducting pin upper limb and this The lower edge of the prominent side of two side heat-conducting substrates is parallel or below the protrusion side of second side heat-conducting substrate.

14. encapsulating structure as claimed in claim 11, which is characterized in that the platform system be the groove being set on the pedestal or Projection seat.

Technical field

It is espespecially a kind of anti-through feed-in present invention is directed to a kind of flip-over type cooling wafer and comprising its encapsulating structure To the biggish second side heat-conducting substrate of power utilization area as huyashi-chuuka (cold chinese-style noodles), to multiply the flip-over type cooling wafer for carrying more hot parts And the encapsulating structure comprising it.

Background technique

Thermoelectric cooling module (Thermoelectric Cooler, TEC) is called thermoelectric cooling mould group (Thermoelectric Cooling Module), cooling wafer, peltier effect refrigerator (Peltier Cooler), Peltier monomer (Peltier Cell) or heat pump (Heat Pump), be it is a kind of carry out thermoelectricity transfer through Peltier effect (Peltier Effect), make to cause The substrate of cold both sides of wafers generates the electronic component of huyashi-chuuka (cold chinese-style noodles) and hot face respectively.So-called Peltier effect refers to when direct current circulates When crossing the galvanic couple of two kinds of semiconductor materials composition, one end heat absorption, the phenomenon that the heat release of one end.

The main material of cooling wafer is the thermoelectric semiconductor (such as bismuth telluride (Bi of N-type and p-type₂Te₃, BiTe), by N-type And P-type semiconductor is penetrated and is connected in series, and is clipped in two ceramic substrates (aluminium nitride (AlN), aluminium oxide (Al₂O₃), silicon carbide (SiC), beryllium oxide (BeO) etc.) between.Short circuit phenomenon of the insulation effect of ceramic substrate to prevent N-type and P-type semiconductor. When impressed current source, when current loop flows through N-type and P-type semiconductor, N-type and P-type semiconductor electronics (electron) and electric hole (hole) positive and negative anodes that can flow to impressed current source respectively cause heat can be from the substrate (electrons and holes of cooling wafer side Separate side) substrate (the close side of electrons and holes) of the other side is passed to, generate huyashi-chuuka (cold chinese-style noodles) and hot face respectively whereby.Refrigeration Or the rate of heating and refrigeration, heating, by by current direction and size determine.

Summary of the invention

The purpose of the present invention is to provide a kind of flip-over type cooling wafer and comprising its encapsulating structure, upside-down mounting refrigeration is utilized The mode of chip carries electronic component using the heat-conducting plate of large area, increases settable number of parts, and part is allowed to operate phase again Same temperature, and the space that routing is accounted for is saved, the volume of packaging body can be reduced, and apply the encapsulation in narrow space Body.On the other hand, the gold thread of power supply and AC signal can be separated through upside-down mounting cooling wafer, keep high-frequency signal complete whereby Property.

In order to achieve the above objectives, the invention discloses a kind of flip-over type cooling wafers, it is characterised in that including；

One first side heat-conducting substrate；

One second side heat-conducting substrate, second side heat-conducting substrate area are greater than the first side heat-conducting substrate, and towards one or two Side direction, which extends, forms prominent side with the opposite first side heat-conducting substrate；And

One Peltier effect layer is set between the first side heat-conducting substrate and second side heat-conducting substrate, the Peltier The positive terminal and negative terminal of effect layer are set on the protrusion side of one or two side directions；

Wherein, the positive terminal of the Peltier effect layer and negative terminal feed-in reverse electrical source, to enable first side thermally conductive Substrate and second side heat-conducting substrate it is cold and hot converse, it is high to multiply load using the biggish second side heat-conducting substrate of area as huyashi-chuuka (cold chinese-style noodles) Warm element allows all high-temperature components on the huyashi-chuuka (cold chinese-style noodles) to maintain identical operation temperature, and lesser first side of area is thermally conductive Substrate contacts heat extraction as hot face and radiator.

Wherein, the direction of the positive terminal and negative terminal on the protrusion side downward, and with the electricity on the upside of circuit board Source Port is directed through conducting resinl adhesion or welding electrically combines.

Wherein, which has multiple P-type semiconductor crystal grain and N-type semiconductor crystal grain, and in first side That multiple P-type semiconductor is connected is brilliant towards having on the side of the Peltier effect layer for heat-conducting substrate and second side heat-conducting substrate The circuit layer of grain and the N-type semiconductor crystal grain is to enable the first side heat-conducting substrate and second side heat-conducting substrate be respectively formed hot face Temperature difference is generated with huyashi-chuuka (cold chinese-style noodles) and between the first side heat-conducting substrate and second side heat-conducting substrate.

Wherein, the first side heat-conducting substrate and second side heat-conducting substrate are ceramic substrate, aluminium sheet, magnesium plate, aluminium alloy plate Or magnesium alloy plate.

A kind of encapsulating structure comprising flip-over type cooling wafer as described above, characterized by comprising: one to be arranged The pedestal of the flip-over type cooling wafer, the pedestal from bottom to top sequentially have with one first plane and one with first interplanar Have the second plane of segment difference, the upper limb which enables second plane the flip-over type cooling wafer is arranged and this The lower edge of the prominent side of two side heat-conducting substrates is arranged parallel or below the protrusion side of second side heat-conducting substrate in second plane One circuit board, through conducting resinl or through the power connector and the protrusion side lower edge on the upside of the solder bond circuit board this just Extreme son and the negative terminal are electrically connected with constituting.

Wherein, which extends to the lower edge position of the protrusion side via the direction among the circuit board, with this Positive terminal and negative terminal on prominent side are electrically connected；AC signal route on the circuit board is via unilateral or two sides Direction extend and be coupled to the high-temperature components.

Wherein, which extends to the lower edge position of the protrusion side via the direction of the circuit board one or both sides Set, on the protrusion side positive terminal and negative terminal be electrically connected；AC signal route on the circuit board is via the electricity Direction among the plate of road extends and is coupled to the high-temperature components.

Wherein, which extends to the lower edge position of the protrusion side via the direction of the circuit board side, with this Positive terminal and negative terminal on prominent side are electrically connected；AC signal route on the circuit board is opposite via the circuit board The direction of the power connector other side extends and is coupled to the high-temperature components.

It wherein, is the platform being arranged with one for the flip-over type cooling wafer in first plane, to increase or decrease The height of the flip-over type cooling wafer, to enable its upper limb of the second plane parallel with the prominent lower edge of side of second side heat-conducting substrate Or the protrusion side lower than second side heat-conducting substrate.

Wherein, which is the groove being set on the pedestal or projection seat.

A kind of encapsulating structure comprising flip-over type cooling wafer as described above, characterized by comprising: one to be arranged The pedestal of the flip-over type cooling wafer, in be on the pedestal across multiple conducting pins, the upper limb of the conducting pin and this second The lower edge of the prominent side of side heat-conducting substrate is parallel or below the protrusion side of second side heat-conducting substrate.

Wherein, be respectively set on the upside of the conducting pin metal conduction gasket extend and contact to the positive terminal or The downside of the negative terminal is electrically connected with constituting.

It wherein, is the platform being arranged with one for the flip-over type cooling wafer on the pedestal, to increase or decrease this The height of dress formula cooling wafer, to enable the upper limb of the conducting pin and the prominent lower edge of side of second side heat-conducting substrate parallel or low In the protrusion side of second side heat-conducting substrate.

Wherein, which is the groove being set on the pedestal or projection seat.

Therefore system of the present invention has the advantage that effect compared with known techniques:

1. present invention increase in the way of inversion cooling wafer can be used to carry the area of electronic component, can be used to increase The space of die bond, meanwhile, it can be applicable to the packaging body of narrow space.

2. cooling wafer allows the relative area of huyashi-chuuka (cold chinese-style noodles) on cooling wafer larger in the way of reverse operating in the present invention, can With fast and stable coldface temperature so that the high-temperature electronic part being carried on operates under isoperibol.

3. the present invention, which is not necessary to routing, to save the space that routing is accounted in conjunction with circuit board, packaging body can be reduced Volume, while being avoided between cooling wafer high current or high voltage operation and high-frequency signal mutually through separation direct current and AC signal Mutually interfere.

Detailed description of the invention

Fig. 1, the appearance diagram of flip-over type cooling wafer first embodiment of the present invention.

Fig. 2, first embodiment of the invention are applied to the appearance diagram on a wherein encapsulating structure.

Fig. 3, first embodiment of the invention are applied to the side schematic view on a wherein encapsulating structure.

Fig. 4, first embodiment of the invention are applied to the appearance diagram on another encapsulating structure.

Fig. 5, first embodiment of the invention are applied to the side schematic view on another encapsulating structure.

Fig. 6, first embodiment of the invention are applied to the appearance diagram on another encapsulating structure.

Fig. 7, first embodiment of the invention are applied to the side schematic view on another encapsulating structure.

Fig. 8, the appearance diagram of flip-over type cooling wafer second embodiment of the present invention.

Fig. 9, second embodiment of the invention are applied to the appearance diagram on a wherein encapsulating structure.

Figure 10, second embodiment of the invention are applied to the side schematic view on a wherein encapsulating structure.

Figure 11, second embodiment of the invention are applied to the appearance diagram on another encapsulating structure.

Figure 12, second embodiment of the invention are applied to the side schematic view on another encapsulating structure.

Specific embodiment

The detailed description of the related present invention and technology contents, now just cooperation schema is described as follows.Schema in the present invention is only It is that embodiment example and its ratio may not be drawn to scale, the schemas such as this example and ratio are not to limit asking for this case Range is sought, is chatted in advance herein bright.

Referring to Fig. 1, be the appearance diagram of first embodiment of the invention, as shown in the figure:

The present embodiment provides a kind of flip-over type cooling wafer 100, which includes that one first side is thermally conductive Substrate 10A, second side heat-conducting substrate 20A and a Peltier effect layer 30A.Wherein the Peltier effect layer 30A system is arranged Between first side heat-conducting substrate 10A and second side heat-conducting substrate 20A.

In this present embodiment, which is greater than first side heat-conducting substrate 10A, and towards one Side direction, which extends, forms prominent side 22A with opposite first side heat-conducting substrate 10A.The positive terminal of Peltier effect layer 30A 31A and negative terminal 32A system are set on the 22A of the protrusion side.Wherein, the positive terminal and cathode of Peltier effect layer 30A Terminal feed-in reverse electrical source, first side heat-conducting substrate 10A's and second side heat-conducting substrate 20A is cold and hot converse to enable, and utilizes The biggish second side heat-conducting substrate 20A of area multiplies as huyashi-chuuka (cold chinese-style noodles) carries high-temperature components N.

The Peltier effect layer 30A system has multiple P-type semiconductor crystal grain and N-type semiconductor crystal grain, and in this That this is connected is more towards having on the side of Peltier effect layer 30A by side heat-conducting substrate 10A and second side heat-conducting substrate 20A Circuit layer 11A, 21A of a P-type semiconductor crystal grain and the N-type semiconductor crystal grain with enable the first side heat-conducting substrate 10A and this Between two side heat-conducting substrate 20A, because electric hole and electronics flow to the first side from second side and are respectively formed huyashi-chuuka (cold chinese-style noodles) and hot face, and enable this Temperature difference is generated between side heat-conducting substrate 10A and second side heat-conducting substrate 20A.Wherein, P-type semiconductor crystal grain and N-type half It is to be connected in series between semiconductor die, forms current-series and hot-fluid parallel connection to reach thermoelectric-cooled effect.

The first side heat-conducting substrate 10A and second side heat-conducting substrate 20A be in preferred embodiment for non-conductor but High thermal conductivity material (such as: heat dissipation ceramic substrate (Al₂O₃, AlN, SiC, BeO etc.), or the metal substrate (aluminium handled through anode Plate, magnesium plate, aluminium alloy plate and/or magnesium alloy plate etc.)).It is simultaneous simultaneously in order to avoid there is a situation where short circuits between semiconductor grain Thermally conductive effect is cared for, first side heat-conducting substrate 10A and second side heat-conducting substrate 20A should select the material of insulation, high thermal conductivity, base This, aluminium sheet, magnesium plate, aluminium alloy plate and/or magnesium alloy plate surface should preferably carry out anodized, make shape on its surface At insulation film.In addition to the above embodiments, the first side heat-conducting substrate 10A and second side heat-conducting substrate 20A can also use pottery Ceramic material or select conductive heat-conducting substrate but be arranged between heat-conducting substrate and circuit layer 11A, 21A heat-conducting effect compared with Good insulating layer, is not limited in the present invention.The circuit layer 11A, 21A can be independent substrate, be provided with electricity Road gold thread or the inner surface for being formed directly into first side heat-conducting substrate 10A and second side heat-conducting substrate 20A, Yu Benfa It is not limited in bright.Circuit layer 11A, 21A shown in schema are only schematic diagram, and circuit layout thereon is not in schema Disclosed in, it chats in advance herein bright.

Positive terminal 31A and negative terminal 32A direction of the flip-over type cooling wafer 100 when being inverted, on the 22A of the protrusion side The direction of lower section, and conducting resinl adhesion or weldering are directed through with the power connector 41A on the upside of circuit board 40A (as shown in Figure 2) Connect electrical combination.In this present embodiment, positive terminal 31A and negative terminal 32A system are to be set to below the 22A of the protrusion side And the conductive principal column extended downward by protrusion side 22A；Other than the above embodiments, in section Example, the positive terminal Sub- 31A and negative terminal 32A can also be this power port of electrode slice, the metal gasket area on circuit board or other classes, this portion Divide end to see demand when product design and set, is not limited in the present invention.

Please refer to figs. 2 and 3 together, the appearance signal being applied on a wherein encapsulating structure for first embodiment of the invention Figure and side schematic view, as shown in the figure:

It is below the embodiment for disclosing the present invention and being applied to a wherein encapsulating structure, the present embodiment system includes: a pedestal 50A, the flip-over type cooling wafer 100 is arranged.Pedestal 50A from bottom to top sequentially has one first plane 51A, Yi Jiyi With the second plane 52A of segment difference between first plane 51A.The first plane 51A is to be arranged the flip-over type cooling wafer 100 with enable the upper limb of second plane 52A substantially with the lower edge of the prominent side 22A of second side heat-conducting substrate 20A parallel or below The protrusion side 22A of second side heat-conducting substrate 20A, in circuit board 40A is arranged on second plane 52A, through conducting resinl or thoroughly It crosses the positive terminal 31A of the power connector 41A and the protrusion side 22A lower edge on the upside of solder bond circuit board 40A and is somebody's turn to do Negative terminal 32A is electrically connected with constituting.

It wherein, is the platform 53A being arranged with one for the flip-over type cooling wafer 100 on pedestal 50A；In the present embodiment In, platform 53A system is plane.In another preferred embodiment, platform 53A system can be groove or projection seat, to reduce Or the high flip-over type cooling wafer 100 of frame, it is not limited in the present invention.

In this present embodiment, the protrusion side 22A system of the flip-over type cooling wafer 100 turns to the direction in left side, circuit board 40A On DC line (power connector 41A) system the lower edge position of protrusion side 22A is extended to by the direction in left side, with prominent side Positive terminal 31A and negative terminal 32A on 22A are electrically connected.Under framework as above, AC signal route 42A can be with Extend and be electrically connected to the circuit board on high-temperature components N or flip-over type cooling wafer 100 via intermediate or right side direction, DC line is avoided to influence the integrality of high-frequency signal whereby.Similarly, the protrusion side 22A of the flip-over type cooling wafer 100 also may be used To turn to the direction on right side, and the DC line on circuit board 40A is enabled to extend to the protrusion side by the direction on the right side of circuit board 40A The lower edge position of 22A, is not limited in the present invention.Above-mentioned AC signal route 42A can be single-ended mode (Single Ended) or difference modes (Differential), do not limited in the present invention.

Referring to Figure 4 together and Fig. 5, the appearance diagram being applied to for first embodiment of the invention on another encapsulating structure And side schematic view, as shown in the figure:

It is below the embodiment for disclosing the present invention and being applied to a wherein encapsulating structure, the present embodiment system includes: a pedestal 80A, the flip-over type cooling wafer 100 is arranged.Pedestal 80A from bottom to top sequentially has one first plane 81A, Yi Jiyi With the second plane 82A of segment difference between first plane 81A, the first plane 81A system is to be arranged flip-over type cooling wafer 100 with enable the upper limb of second plane 82A substantially with the lower edge of the prominent side 22A of second side heat-conducting substrate 20A parallel or below The protrusion side 22A of second side heat-conducting substrate 20A, in a circuit board 70A is arranged on second plane 82A, through conducting resinl or Positive terminal 31A through power connector 71A and the protrusion side 22A lower edge on the upside of solder bond circuit board 70A and Negative terminal 32A is electrically connected with constituting.

It wherein, is the platform 83A being arranged with one for the flip-over type cooling wafer 100 on pedestal 80A；In the present embodiment In, platform 83A system is plane.In another preferred embodiment, platform 83A system can be groove or projection seat, to reduce Or the high flip-over type cooling wafer 100 of frame, it is not limited in the present invention.Only, if the design of pedestal and mechanism is proper, this is flat Platform 83A can also omit setting and be plane.

In this present embodiment, the protrusion side 22A system of the flip-over type cooling wafer 100 turns to the direction of rear side, circuit board 70A On DC line (power connector 71A) system the lower edge position of protrusion side 22A is extended to by the direction among circuit board 70A It sets, is electrically connected with the positive terminal 31A and negative terminal 32A protruded on the 22A of side.Under framework as above, AC signal Route 72A can extend via the direction in left side or right side and be electrically connected to high-temperature components N or flip-over type cooling wafer 100 On circuit board, avoid whereby DC line influence high-frequency signal integrality.Above-mentioned AC signal route 72A can be single End mode (Single Ended) or difference modes (Differential), are not limited in the present invention.

Referring to Figure 6 together and Fig. 7, the appearance diagram being applied to for first embodiment of the invention on another encapsulating structure And side schematic view, as shown in the figure:

It is below the embodiment for disclosing the present invention and being applied to a wherein encapsulating structure, the present embodiment system includes: a pedestal 60A, the flip-over type cooling wafer 100 is arranged, in being across multiple conducting pin 61A on pedestal 60A.In Practical Operation On, pedestal 60A can design the position of conducting pin 61A when die sinking, and the size of the flip-over type cooling wafer 100 is cooperated to advise Pedestal 60A structure is improved in lattice, principal column height or ornaments position, reaches optimal configuration.

The upper limb of conducting pin 61A substantially with the lower edge of the prominent side 22A of second side heat-conducting substrate 20A parallel or below The protrusion side 22A of second side heat-conducting substrate 20A.In a preferred embodiment, it can distinguish in the upside of conducting pin 61A A metal conduction gasket 62A is arranged to extend and contact to the downside of positive terminal 31A or negative terminal 32A to constitute electrical property Connection；It is fixed including positive terminal 31A and only in setting metal conduction gasket 62A and negative pole end on negative terminal 32A Sub- 32A is fixed and only in setting metal conduction gasket 62A and positive terminal 31A and negative terminal 32A on positive terminal 31A The case where being respectively provided with metal conduction gasket 62A.The metal conduction gasket 62A system is to fill up the conducting pin 61A and the anode Clearance between terminal 31A (or the negative terminal 32A).

On the other hand ought wherein one conducting pin 61A correspond to wherein one end period of the day from 11 p.m. to 1 a.m (such as: it is positive terminal 31A), another Side terminal (such as: the problem of negative terminal 32A) considering impedance matching or frequency response can not necessarily correspond to another The position of one conducting pin, at this point it is possible to extend through metal conduction gasket 62A and contact to the downside of another terminal.

The demand of impedance matching or structural symmetry is contemplated in above-mentioned mode, can also be in multiple conducting pin 61A On be respectively provided with metal conduction gasket 62A and be connected to positive terminal 31A and negative terminal 32A；Similarly, as conducting pin 61A Height and the height of positive terminal 31A and negative terminal 32A to it is corresponding when can also omit metal conduction gasket 62A, Yu Ben It is not limited in invention.

It is that can increase by one to cause for the flip-over type on pedestal 60A in the case that conducting pin 61A can not adjust height The platform 63A that cold chip 100 is arranged, to increase or decrease the height of the flip-over type cooling wafer 100, to enable the conducting pin Lower edge of the upper limb of 61A substantially with the prominent side 22A of second side heat-conducting substrate 20A is parallel or below second side heat-conducting substrate The protrusion side 22A of 20A.Platform 63A system can be the projection seat being set on pedestal 60A or groove, refuse in the present invention With limitation.

Other than the present embodiment, conducting pin can also be it is horizontally disposed, prolong via across the upward side wall of pedestal The space and positive terminal 31A or negative terminal 32A for extending to inside are electrically connected, and the variation of the embodiments such as this belongs to this hair The bright range to be protected.

It is the appearance diagram and side schematic view of second embodiment of the invention also referring to Fig. 8, Fig. 9, Figure 10, It is as shown in the figure:

The present embodiment system provides a kind of flip-over type cooling wafer 200, which includes that one first side is led Hot substrate 10B, second side heat-conducting substrate 20B and a Peltier effect layer 30B.Wherein Peltier effect layer 30B system sets It is placed between first side heat-conducting substrate 10B and second side heat-conducting substrate 20B.

The Peltier effect layer 30B system has multiple P-type semiconductor crystal grain and N-type semiconductor crystal grain, and in this That this is connected is more towards having on the side of Peltier effect layer 30B by side heat-conducting substrate 10B and second side heat-conducting substrate 20B Circuit layer 11B, 21B of a P-type semiconductor crystal grain and the N-type semiconductor crystal grain with enable the first side heat-conducting substrate 10B and this Between two side heat-conducting substrate 20B, because electric hole and electronics flow to the first side from second side and are respectively formed huyashi-chuuka (cold chinese-style noodles) and hot face, and enable this Temperature difference is generated between side heat-conducting substrate 10B and second side heat-conducting substrate 20B.Wherein, P-type semiconductor crystal grain and N-type half It is to be connected in series between semiconductor die, forms current-series and hot-fluid parallel connection to reach thermoelectric-cooled effect.

In this present embodiment, which is greater than first side heat-conducting substrate 10B, and towards two Side direction, which extends, forms prominent side 22B, 23B with the two sides of opposite first side heat-conducting substrate 10B.Peltier effect layer 30B Positive terminal 31B and negative terminal 32B system be respectively arranged at protrusion side 22B, 23B of the two sides second side heat-conducting substrate 20B On.Wherein, the positive terminal 31B of Peltier effect layer 30B and negative terminal 32B feed-in reverse electrical source, to enable first side Heat-conducting substrate 10B's and second side heat-conducting substrate 20B is cold and hot converse, utilizes the biggish second side heat-conducting substrate 20B of area Multiply as huyashi-chuuka (cold chinese-style noodles) and carries high-temperature components N.

Positive terminal 31B and negative terminal of the flip-over type cooling wafer 200 when being inverted, on two sides prominent side 22B, 23B The direction of 32B downward, and conducting resinl adhesion or welding electricity are directed through with the power connector 41B on the upside of circuit board 40B Property combine.In this present embodiment, positive terminal 31B and negative terminal 32B system are to be respectively arranged at the protrusion side 22B, 23B Lower section and the conductive principal column extended downward by the protrusion side 22B, 23B；Other than the above embodiments, in section Example, Positive terminal 31B and negative terminal 32B can also for electrode slice, the metal gasket area on circuit board 40B or other classes this Power port, this part end is seen demand when product design and is set, and is not limited in the present invention.

Please continue to refer to Fig. 9 and Figure 10, as shown in the figure:

It is below the embodiment for disclosing the present invention and being applied to a wherein encapsulating structure, the present embodiment system includes: a pedestal 50B, the flip-over type cooling wafer 200 is arranged.Pedestal 50B include one first plane 51B and be set to this first The two sides plane 51B and the second plane 52B between first plane 51B with segment difference, 200 system of flip-over type cooling wafer setting In on first plane 51B with enable the upper limb of two sides second plane 52B substantially with second side two sides heat-conducting substrate 20B it is prominent The lower edge of side 22B, 23B parallel or below second side heat-conducting substrate 20B protrusion side 22B, 23B, on second plane 52B One circuit board 40B is set, through conducting resinl or through on the upside of solder bond circuit board 40B power connector 41B and this is prominent The positive terminal 31B and negative terminal 32B of side 22B, 23B lower edge are electrically connected out with constituting.

In this present embodiment, protrusion side 22B, 23B of the flip-over type cooling wafer 200 is prominent by two side directions, circuit DC line (power connector 41B) system on plate 40B by the direction of two sides in circuit board 40B extend to protrusion side 22B, Positive terminal 31B and negative terminal 32B on the lower edge position of 23B, with prominent side 22B, 23B are electrically connected.In frame as above Under structure, AC signal route 42B can extend and be electrically connected to high-temperature components N or flip-over type refrigeration via intermediate direction Circuit board on chip 200 avoids DC line from influencing the integrality of high-frequency signal whereby.Above-mentioned AC signal route 42B It can be single-ended mode (Single Ended) or difference modes (Differential), not limited in the present invention.

It wherein, is the platform 53B being arranged with one for the flip-over type cooling wafer 200 on pedestal 50B；In the present embodiment In, platform 53B system is plane.In another preferred embodiment, platform 53B can also be groove or projection seat, to reduce Or the high flip-over type cooling wafer 200 of frame, it is not limited in the present invention.

Also referring to Figure 11 and Figure 12, the appearance signal being applied on another encapsulating structure for second embodiment of the invention Figure and side schematic view, as shown in the figure:

It is below the embodiment for disclosing the present invention and being applied to a wherein encapsulating structure, the present embodiment system includes: a pedestal 60B, the flip-over type cooling wafer 200 is arranged, in being across multiple conducting pin 61B, the conducting pin on pedestal 60B Lower edge of the upper limb of 61B substantially with second side two sides heat-conducting substrate 20B prominent side 22B, 23B is led parallel or below the second side Protrusion side 22B, 23B of hot substrate 20B.

In a preferred embodiment, a metal conduction gasket 62B can be respectively set on the upside of conducting pin 61B and prolong It stretches and contacts to the downside of positive terminal 31B or negative terminal 32B to constitute and be electrically connected.

It, can be individually for the position adjustment of two sides positive terminal 31B and negative terminal 32B in a preferred embodiment Not Dao Tong pin 61B height；It is that can increase by one on pedestal 60B in the case that conducting pin 61B can not adjust height For the platform 63B of the flip-over type cooling wafer 200 setting, to increase or decrease the height of the flip-over type cooling wafer 200, with Enable lower edge of the upper limb of conducting pin 61B substantially with second side heat-conducting substrate 20B prominent side 22B, 23B parallel or below this Protrusion side 22B, 23B of the thermally conductive base 20B of second side.Platform 63B system can be the projection seat or recessed being set on pedestal 60B Slot is not limited in the present invention.

Other than the present embodiment, conducting pin can also be it is horizontally disposed, prolong via across the upward side wall of pedestal The space and positive terminal 31B or negative terminal 32B for extending to inside are electrically connected, and the variation of the embodiments such as this belongs to this hair The bright range to be protected.

In conclusion the encapsulating structure of the invention increase in the way of inversion cooling wafer can be used to carry electronic component Area, can be used to increase the space of die bond, meanwhile, can be applicable to the packaging body of narrow space.In addition, refrigeration is brilliant in the present invention Piece allows the relative area of huyashi-chuuka (cold chinese-style noodles) on cooling wafer larger in the way of reverse operating, can be with fast and stable coldface temperature to hold The high-temperature electronic part being loaded in operates under isoperibol.In addition, the present invention, which is not necessary to routing, to be saved in conjunction with circuit board The space that routing is accounted for is gone to, the volume of packaging body can be reduced, while avoiding cooling wafer through separation direct current and AC signal It is interfered with each other between high current or high voltage operation and high-frequency signal.

The above has been described in detail, a preferred embodiment only described above, only of the invention, when It cannot limit the range of implementation of the invention with this, i.e., all equivalent changes and modifications made according to scope of the present invention patent, all Should still it belong in the patent covering scope of the present invention.