阅读说明：本技术 散热装置、电子器件和应用 (Heat sink, electronic device and application ) 是由 陈俊凯 王郑 李志恒 于 2021-07-09 设计创作，主要内容包括：本发明提供一种散热装置、电子器件和应用,上述散热装置包括上盖板和下盖板；上盖板与下盖板配合围成进液微流道、散热腔和出液微流道,进液微流道设置有进液口,出液微流道设置有出液口,散热腔与进液微流道和出液微流道连通,散热腔内设置有多根间隔设置的散热柱,上盖板在对应散热腔的位置设置有散热接触区,散热柱在散热接触区与上盖板接触。上述散热装置中散热腔设计的散热柱,可以增大换热面积,增大冷却液的流体雷诺数,提高紊流效果,有效降低散热装置本身热阻,提高散热能力。进一步地,上述散热装置层数较少,可以通过增加单层厚度来增加其硬度,也就可以降低散热装置变形的几率,还可以缩短加工时长,实现产品质量可控。(The invention provides a heat dissipating double-fuselage, electronic device and application, the above-mentioned heat dissipating double-fuselage includes upper cover plate and lower cover plate; the upper cover plate and the lower cover plate are matched to enclose a liquid inlet micro-channel, a heat dissipation cavity and a liquid outlet micro-channel, the liquid inlet micro-channel is provided with a liquid inlet, the liquid outlet micro-channel is provided with a liquid outlet, the heat dissipation cavity is communicated with the liquid inlet micro-channel and the liquid outlet micro-channel, a plurality of heat dissipation columns arranged at intervals are arranged in the heat dissipation cavity, the upper cover plate is provided with a heat dissipation contact area at the position corresponding to the heat dissipation cavity, and the heat dissipation columns are in contact with the upper cover plate at the heat dissipation contact area. The heat dissipation column with the heat dissipation cavity in the heat dissipation device can increase the heat exchange area, increase the fluid Reynolds number of the cooling liquid, improve the turbulence effect, effectively reduce the thermal resistance of the heat dissipation device and improve the heat dissipation capacity. Furthermore, the number of layers of the heat dissipation device is small, the hardness of the heat dissipation device can be increased by increasing the thickness of a single layer, the deformation probability of the heat dissipation device can be reduced, the processing time can be shortened, and the controllable product quality is realized.)

1. A heat dissipation device is characterized by comprising an upper cover plate and a lower cover plate;

the upper cover plate and the lower cover plate are matched to enclose a liquid inlet micro-channel, a heat dissipation cavity and a liquid outlet micro-channel, the liquid inlet micro-channel is provided with a liquid inlet, the liquid outlet micro-channel is provided with a liquid outlet, the heat dissipation cavity is communicated with the liquid inlet micro-channel and the liquid outlet micro-channel, a plurality of heat dissipation columns which are arranged at intervals are arranged in the heat dissipation cavity, the upper cover plate is provided with a heat dissipation contact area at a position corresponding to the heat dissipation cavity, and the heat dissipation columns are in contact with the upper cover plate at the heat dissipation contact area;

the coolant liquid can by the inlet flows in, warp the inlet miniflow channel gets into the heat dissipation chamber, and the heat dissipation intracavity with the heat dissipation post carries out the heat exchange, later via go out the liquid miniflow channel and the liquid outlet flows out.

2. The heat dissipating device according to claim 1, wherein the upper cover plate and the lower cover plate are provided with a flow channel groove and a heat exchanging groove, the flow channel groove on the upper cover plate and the flow channel groove on the lower cover plate cooperate to form the inlet micro channel and the outlet micro channel, and the heat exchanging groove on the upper cover plate and the heat exchanging groove on the lower cover plate cooperate to form the heat dissipating chamber.

3. The heat sink of claim 1 wherein the inlet microchannel narrows from its inlet end towards the heat sink chamber.

4. The heat dissipating device of claim 1, wherein there are a plurality of the fluid outlet microchannels, and the plurality of fluid outlet microchannels are connected to different positions of the heat dissipating chamber.

5. The heat dissipating device of claim 4, wherein there is one inlet microchannel, two outlet microchannels, and the outlet microchannels are disposed on both sides of the inlet microchannel.

6. The heat dissipating device of claim 1, wherein the distance between the centers of any two adjacent heat dissipating studs is 0.4mm to 0.8 mm.

7. The heat sink of claim 1, wherein the heat-dissipating stud has a radial dimension of 0.2mm to 0.6 mm.

8. The heat dissipating device of any one of claims 1 to 7, wherein the heat dissipating stud, the upper cover plate and the lower cover plate are made of copper or aluminum independently.

9. An electronic device comprising a functional component and the heat dissipating device according to any one of claims 1 to 8, the heat generating region of the functional component being in contact with the heat dissipating contact region of the heat dissipating device.

10. Use of the heat sink according to any one of claims 1 to 8 in the manufacture of a heat sink for an electronic device.

Technical Field

The invention relates to the technical field of heat dissipation of electronic devices, in particular to a heat dissipation device, an electronic device and application.

Background

Because the integration level of the electronic device is continuously improved, the internal power density of the electronic device is continuously broken through, the heat productivity of the electronic device is larger and larger, and the service life of the electronic device is seriously influenced. The failure probability of the electronic device is increased sharply along with the increase of the working temperature, and the working life of the electronic device is reduced to half of the service life of the previous working temperature every time the working environment temperature of the electronic device is increased by 10 ℃, so that the reliability of the electronic device can be ensured only when the electronic device works in a lower-temperature environment. The increasing heat generation of electronic devices has become a bottleneck limiting the electronic devices to further increase the integration level and improve the performance along moore's law. Therefore, it is necessary to design an efficient heat dissipation means to take out the heat accumulated inside the electronic device and dissipate the heat to the external environment, so as to control the internal operating temperature of the system within the limit of ensuring safe, reliable and high-performance operation. Failure to control the operating temperature of an electronic device within an acceptable range can cause a number of potential problems if the heat dissipation management system is improperly designed, with the most immediate consequences of poor operation, reduced reliability, and even premature failure of the electronic device.

The traditional micro-channel radiator has small volume and high radiating power and is widely applied to high-power laser chips. Because of the small size and the complex internal channel structure, the microchannel heat sink usually has a multi-layer (more than two layers) structure, for example, five-layer structure, the top layer and the bottom layer are used as sealing plates, the middle three layers are used for processing channels, and finally the five layers are combined into a whole to form a microchannel heat sink. However, due to the complex multi-layer structure and the inconsistent bonding force between layers during processing, water leakage, internal through holes and other defects may be caused, which affects the yield and heat dissipation performance of electronic products. In addition, when the multi-layer board is combined and processed, the pretreatment is relatively complex, the processing time is relatively long, and the waste of labor and time is caused. Meanwhile, when the multi-layer structure of the micro-channel radiator is combined, the thermal resistance of an interlayer interface is large, and the heat dissipation performance is influenced. The interlayer dislocation condition will affect the heat dissipation performance of the radiator. The multilayer patterns are combined into a whole, and the probability of dislocation among layers is high. Each layer of the multi-layer micro-channel is relatively thin, has insufficient hardness and is easy to deform in processing.

Disclosure of Invention

Accordingly, in order to simplify the heat dissipation device, reduce the thermal resistance of the interface between layers, and reduce the deformation probability of the heat sink, it is necessary to provide a heat dissipation device, an electronic device, and an application.

The invention provides a heat dissipation device, which comprises an upper cover plate and a lower cover plate;

the upper cover plate and the lower cover plate are matched to enclose a liquid inlet micro-channel, a heat dissipation cavity and a liquid outlet micro-channel, the liquid inlet micro-channel is provided with a liquid inlet, the liquid outlet micro-channel is provided with a liquid outlet, the heat dissipation cavity is communicated with the liquid inlet micro-channel and the liquid outlet micro-channel, a plurality of heat dissipation columns which are arranged at intervals are arranged in the heat dissipation cavity, the upper cover plate is provided with a heat dissipation contact area at a position corresponding to the heat dissipation cavity, and the heat dissipation columns are in contact with the upper cover plate at the heat dissipation contact area;

the coolant liquid can by the inlet flows in, warp the inlet miniflow channel gets into the heat dissipation chamber, and the heat dissipation intracavity with the heat dissipation post carries out the heat exchange, later via go out the liquid miniflow channel and the liquid outlet flows out.

In one embodiment, the upper cover plate and the lower cover plate are both provided with a runner groove and a heat exchange groove, the runner groove on the upper cover plate and the runner groove on the lower cover plate are matched to form the liquid inlet micro-channel and the liquid outlet micro-channel, and the heat exchange groove on the upper cover plate and the heat exchange groove on the lower cover plate are matched to form the heat dissipation cavity.

In one embodiment, the liquid inlet micro-channel is gradually narrowed from the inlet end to the heat dissipation cavity.

In one embodiment, the liquid outlet micro-channels are provided with a plurality of liquid outlet micro-channels, and the plurality of liquid outlet micro-channels are communicated with different positions of the heat dissipation cavity.

In one embodiment, there is one liquid inlet micro-channel, there are two liquid outlet micro-channels, and the liquid outlet micro-channels are disposed on two sides of the liquid inlet micro-channel.

In one embodiment, the distance between the centers of any two adjacent heat dissipation columns is 0.4 mm-0.8 mm.

In one embodiment, the radial dimension of the heat dissipation column is 0.2 mm-0.6 mm.

In one embodiment, the heat-dissipating stud, the upper cover plate and the lower cover plate are made of copper or aluminum.

Further, the present invention also provides an electronic device comprising a functional component and the heat dissipation device as described above, wherein the heat generation region of the functional component is in contact with the heat dissipation contact region of the heat dissipation device.

Furthermore, the invention provides the application of the heat dissipation device in manufacturing the heat sink of the electronic device.

The heat dissipation column designed in the heat dissipation cavity in the heat dissipation device can increase the heat exchange area and improve the heat dissipation capacity; in addition, the heat dissipation column can further increase the fluid Reynolds number of the cooling liquid, improve the turbulent flow effect and further improve the heat dissipation performance. Meanwhile, the structure avoids a large amount of interface thermal resistance formed by the interface between the layers of the multi-layer heat dissipation device, effectively reduces the thermal resistance of the heat dissipation device, further improves the heat dissipation performance, shortens the processing time and realizes the controllable product quality. Furthermore, the heat dissipation device has fewer layers, and the rigidity of the heat dissipation device can be increased by increasing the thickness of a single layer, so that the deformation probability of the heat dissipation device can be reduced.

Drawings

Fig. 1 is a schematic view of a heat dissipation device according to an embodiment of the invention;

FIG. 2 is a bottom view of the heat sink of FIG. 1;

FIG. 3 is a top view of the heat dissipation device shown in FIG. 1;

fig. 4 is a cross-sectional view of the heat dissipation device shown in fig. 1 along a section of fig. 3A-a'.

The reference numerals are explained below:

10: heat dissipating device, 1011: upper cover plate, 1012: lower cover plate, 1021: liquid inlet, 1022: liquid inlet micro flow channel, 1031: outlet port, 1032: liquid outlet micro-flow channel, 1041: heat-dissipating post, 1042: a heat dissipation contact area.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the invention, "a plurality" means at least two, e.g., two, three, etc., unless explicitly specified otherwise. In the description of the present invention, "a plurality" means at least one, e.g., one, two, etc., unless specifically limited otherwise.

The words "preferably," "more preferably," and the like in this disclosure mean embodiments of the invention that may, in some instances, provide certain benefits. However, other embodiments may be preferred, under the same or other circumstances. Furthermore, the recitation of one or more preferred embodiments does not imply that other embodiments are not useful, nor is it intended to exclude other embodiments from the scope of the invention.

When a range of values is disclosed herein, the range is considered to be continuous and includes both the minimum and maximum values of the range, as well as each value between such minimum and maximum values. Further, when a range refers to an integer, each integer between the minimum and maximum values of the range is included. Further, when multiple range-describing features or characteristics are provided, the ranges may be combined. In other words, unless otherwise indicated, all ranges disclosed herein are to be understood to encompass any and all subranges subsumed therein.

It should be noted that in the description of the present invention, for the terms of orientation, there are terms such as "central", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicating the orientation and positional relationship based on the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific scope of the present invention.

In describing positional relationships, unless otherwise specified, when an element such as a layer, film or substrate is referred to as being "on" another layer, it can be directly on the other layer or intervening layers may also be present. Further, when a layer is referred to as being "under" another layer, it can be directly under, or one or more intervening layers may also be present. It will also be understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.

Where the terms "comprising," "having," and "including" are used herein, it is intended to cover a non-exclusive inclusion, as another element may be added, unless an explicit limitation is used, such as "only," "consisting of … …," etc.

Unless mentioned to the contrary, terms in the singular may include the plural and are not to be construed as being one in number.

Further, the drawings are not drawn to a 1:1 scale, and the relative sizes of the elements in the drawings are drawn only by way of example to facilitate understanding of the invention, but are not necessarily drawn to true scale, and the scale in the drawings does not constitute a limitation of the invention. It will be understood that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1 and 2, the present invention provides a heat dissipating device 10, which includes an upper cover plate 1011 and a lower cover plate 1012;

the upper cover plate 1011 and the lower cover plate 1012 are matched to enclose a liquid inlet micro channel 1022, a heat dissipation cavity and a liquid outlet micro channel 1032, the liquid inlet micro channel 1022 is provided with a liquid inlet 1021, the liquid outlet micro channel 1032 is provided with a liquid outlet 1031, the heat dissipation cavity is communicated with the liquid inlet micro channel 1022 and the liquid outlet micro channel 1032, a plurality of heat dissipation columns 1041 arranged at intervals are arranged in the heat dissipation cavity, the upper cover plate 1011 is provided with a heat dissipation contact area 1042 at a position corresponding to the heat dissipation cavity, and the heat dissipation columns 1041 are in contact with the upper cover plate 1011 at the heat dissipation contact area 1042;

the cooling liquid can flow in from the liquid inlet 1021, enter the heat dissipation cavity through the liquid inlet micro-channel 1022, and exchange heat with the heat dissipation column 1041 in the heat dissipation cavity, and then flow out through the liquid outlet micro-channel 1032 and the liquid outlet 1031.

Fig. 3 is a top view and fig. 4 is a schematic cross-sectional view, which are provided to facilitate better understanding of the heat dissipation device 10 provided by the present invention.

In a specific example, the upper cover plate 1011 and the lower cover plate 1012 are both provided with flow channel grooves and heat exchange grooves, the flow channel grooves on the upper cover plate 1011 and the flow channel grooves on the lower cover plate 1012 cooperate to form a liquid inlet micro channel 1022 and a liquid outlet micro channel 1032, and the heat exchange grooves on the upper cover plate 1011 and the heat exchange grooves on the lower cover plate 1012 cooperate to form a heat dissipation chamber.

It is understood that the heat sink contact region 1042 is located above the heat sink cavity.

In one specific example, the inlet microchannel 1022 narrows from its inlet end toward the heat dissipation chamber.

In one specific example, the outlet microchannels 1032 are provided in a plurality, and the plurality of outlet microchannels 1032 communicate with different positions of the heat dissipation chamber.

In one specific example, there are one inlet microchannel 1022, two outlet microchannels 1032, and the outlet microchannels 1032 are disposed on both sides of the inlet microchannel 1022.

It can be understood that the cooling liquid enters the heat dissipation device 10 through the liquid inlet 1021, flows to the heat dissipation cavity, and after heat exchange with the heat dissipation column in the heat dissipation cavity, the cooling liquid diffuses to both sides along the liquid outlet micro-channel 1032, and flows to the liquid outlet 1031 through the liquid outlet micro-channel 1032 at both sides, and the flow process of the cooling liquid is completed.

In one particular example, the heat-dissipating stud 1041 is a cylindrical or polygonal prism.

Preferably, the heat dissipation column 1041 is a cylinder, and the contact area with the cooling liquid is larger than that of the polygonal prism, so that a good heat exchange effect can be achieved.

In a specific example, the distance between the centers of any two adjacent heat dissipation studs 1041 is 0.4mm to 0.8mm, and preferably, the distance between the centers is 0.5mm to 7 mm.

Further, the radial dimension of the heat dissipation column 1041 is 0.2mm to 0.6mm, and preferably, the radial dimension is 0.3mm to 0.5 mm.

It will be appreciated that the radial dimension is the diameter for a cylindrical heat-dissipating stud and the diameter is the inscribed circle diameter for a polygonal prism.

When the heat dissipation pillars 1041 are cylinders and the diameters of the heat dissipation pillars are the same, the smaller the distance between the centers of the heat dissipation pillars 1041 is, the higher the heat dissipation performance of the heat dissipation device 10 is, but if the distance between the heat dissipation pillars 1041 in the heat dissipation device 10 is too small, the greater the density of the heat dissipation pillars 1041 formed in the heat dissipation cavity will increase the pressure loss of the heat dissipation device 10.

Further, the height of the heat dissipation column 1041 is 0.6mm to 1.2mm, preferably, the height of the heat dissipation column 1041 is 0.8mm to 1mm, and the height of the heat dissipation column 1041 is specifically 0.9 mm.

In one specific example, the material of the heat dissipation pillar, the upper cover plate and the lower cover plate is independently selected from copper or aluminum.

It can be understood that the heat dissipation column, the upper cover plate and the lower cover plate are designed integrally, that is, the heat dissipation plate, the upper cover plate and the lower cover plate are made of the same material.

In a specific example, the total thickness of the upper and lower cover plates 1011 and 1012 is 1mm to 2 mm.

Preferably, the total thickness of the upper and lower cover plates 1011 and 1012 is 1.2mm to 1.8mm, and particularly 1.5mm, it can be understood that the thickness of the upper and lower cover plates 1011 and 1012 is 0.75 mm.

The ratio of the length to the width of the upper cover plate 1011 to the lower cover plate 1012 is (20mm to 30mm): 8mm to 15 mm.

It will be appreciated that the heat dissipation contact region 1042 of the upper cover 1011 is spaced from the edge of the upper cover 1011.

Preferably, any edge of the heat dissipation contact region 1042 is at a distance of 0.5mm to 0.8mm from the edge of the upper cover plate 1011 nearest thereto, and particularly, the above distance may be, but not limited to, 0.5mm, 0.6mm, 0.7mm, or 0.8 mm.

In a specific example, the cooling liquid is selected from at least one of water, ethylene glycol, and a fluorinated liquid.

Preferably, the cooling liquid is water.

The heat dissipation column 1041 designed in the heat dissipation cavity of the heat dissipation device 10 can increase the heat exchange area and improve the heat dissipation capability; in addition, the heat dissipation column 1041 can further increase the fluid reynolds number of the cooling liquid, thereby improving the turbulent flow effect and improving the heat dissipation performance. Meanwhile, the structure avoids a large amount of interface thermal resistance formed by the interlayer interfaces of the multi-layer heat dissipation device, effectively reduces the thermal resistance of the heat dissipation device 10, further improves the heat dissipation performance, shortens the processing time and realizes controllable product quality. Furthermore, the number of layers of the heat dissipation device 10 is small, and the hardness of the heat dissipation device 10 can be increased by increasing the thickness of a single layer, so that the probability of deformation of the heat dissipation device 10 can be reduced.

Further, the present invention also provides an electronic device, which comprises a functional component and a heat dissipation device 10, wherein the heat generating region of the functional component is in contact with the heat dissipation contact region 1042 of the heat dissipation device.

It is understood that the heat generating region of the functional component may be, but is not limited to, a laser bar.

Similarly, the way of contacting the heat generating region of the functional component with the heat dissipating contact region 1042 of the heat dissipating device 10 can be, but is not limited to, welding.

Specifically, the cooling liquid enters the heat dissipation device 10 through the liquid inlet 1021 and the liquid inlet micro channels 1012 formed by the upper cover plate 1011 and the lower cover plate 1012, and enters the heat dissipation chamber to perform heat exchange, so that the cooling liquid after heat exchange is from the plurality of liquid outlet micro channels 1032 to the liquid outlet 1031, and the heat exchange flow process of the cooling liquid in the heat dissipation device 10 is completed.

The heating area of the functional component is fixed at the position of the heat dissipation contact area 1042 in the upper cover plate 1011, after the functional component works to generate heat, the heat is transferred to the heat dissipation column 1041 through the heat dissipation contact area 1042 on the upper cover plate 1011 to exchange heat with the cooling liquid, and the heat of the heat dissipation column 1041 is taken away by the cooling liquid after the heat exchange.

The heat dissipation device 10 provided by the invention only needs to design one liquid inlet micro channel 1022, so that liquid can reach the heat dissipation cavity without resistance, and unnecessary pressure loss can be effectively avoided. After the heat is exchanged by the cooling liquid in the heat dissipation cavity, the heat reaches the liquid outlet, and only two liquid outlet micro channels 1032 are designed to surround the liquid inlet micro channel 1022 by avoiding mounting hole positions, so that the pressure loss caused by the resistance of the cooling liquid in the flowing process can be avoided.

Further, the heat dissipation cavity in the heat dissipation device 10 is a main heat exchange area, and a large number of heat dissipation columns 1041 are designed here, so that the heat exchange area can be effectively increased, and the heat dissipation capability is improved; the heat dissipation columns 1041 are staggered with each other, so that the Reynolds number of the fluid is increased, the turbulent flow effect is improved, and the heat dissipation performance is improved.

Further, the present invention provides the application of the heat dissipation device 10 in the manufacture of a heat sink for electronic devices.

Specific examples are provided below to further illustrate the heat dissipation device of the present invention in detail.

Example 1

This embodiment provides a heat dissipating device, comprising an upper cover plate and a lower cover plate, wherein the upper cover plate, the lower cover plate and heat dissipating pillars are all made of copper material, the thermal conductivity is 380w/(mk), the length of the upper cover plate and the lower cover plate is 26.5mm, the width of the upper cover plate and the lower cover plate is 11.5mm, the thickness of the cover plate region formed by the upper cover plate and the lower cover plate is 1.5mm, the width of the heat dissipating contact region is 4.08mm, the length of the heat dissipating contact region is 9.9mm, the distance between the heat dissipating contact region and the longer side edge of the upper cover plate is 0.8mm, the distance between the heat dissipating contact region and the shorter side edge of the upper cover plate is 0.5mm, the height of the heat dissipating pillars is 0.9mm, the distance between the heat dissipating pillars and the adjacent heat dissipating pillars disposed parallel to the longer edge of the upper cover plate is 0.55mm, the distance between the heat dissipating pillars and the adjacent heat dissipating pillars disposed non-parallel to any edge of the upper cover plate is 0.6mm, the heat dissipating pillars are alternately disposed in the heat dissipating cavity, the cooling liquid is water, the pumping flow of the cooling liquid is 0.3L/min, and the heat dissipation column is a cylinder with the diameter of 0.4 mm.

Example 2

This embodiment provides a heat dissipating device, comprising an upper cover plate and a lower cover plate, wherein the upper cover plate, the lower cover plate and heat dissipating pillars are all made of copper material, the thermal conductivity is 380w/(mk), the length of the upper cover plate and the lower cover plate is 26.5mm, the width of the upper cover plate and the lower cover plate is 11.5mm, the thickness of the cover plate region formed by the upper cover plate and the lower cover plate is 1.5mm, the width of the heat dissipating contact region is 4.08mm, the length of the heat dissipating contact region is 9.9mm, the distance between the heat dissipating contact region and the longer side edge of the upper cover plate is 0.8mm, the distance between the heat dissipating contact region and the shorter side edge of the upper cover plate is 0.5mm, the height of the heat dissipating pillars is 0.9mm, the distance between the heat dissipating pillars and the adjacent heat dissipating pillars disposed parallel to the longer edge of the upper cover plate and the adjacent heat dissipating pillars disposed non-parallel to any edge of the upper cover plate is 0.5mm, the heat dissipating pillars are alternately disposed in the heat dissipating chamber, the cooling liquid is water, the pumping flow of the cooling liquid is 0.3L/min, and the heat dissipation column is a cylinder with the diameter of 0.4 mm.

Example 3

This embodiment provides a heat dissipating device, comprising an upper cover plate and a lower cover plate, wherein the upper cover plate, the lower cover plate and heat dissipating pillars are all made of copper material, the thermal conductivity is 380w/(mk), the length of the upper cover plate and the lower cover plate is 26.5mm, the width of the upper cover plate and the lower cover plate is 11.5mm, the thickness of the cover plate region formed by the upper cover plate and the lower cover plate is 1.5mm, the width of the heat dissipating contact region is 4.08mm, the length of the heat dissipating contact region is 9.9mm, the distance between the heat dissipating contact region and the longer side edge of the upper cover plate is 0.8mm, the distance between the heat dissipating contact region and the shorter side edge of the upper cover plate is 0.5mm, the height of the heat dissipating pillars is 0.9mm, the distance between the heat dissipating pillars and the adjacent heat dissipating pillars disposed parallel to the longer edge of the upper cover plate is 0.55mm, the distance between the heat dissipating pillars and the adjacent heat dissipating pillars disposed non-parallel to any edge of the upper cover plate is 0.7mm, the heat dissipating pillars are alternately disposed in the heat dissipating cavity, the cooling liquid is water, the pumping flow of the cooling liquid is 0.3L/min, and the heat dissipation column is a cylinder with the diameter of 0.4 mm.

Example 4

This embodiment provides a heat dissipating device, comprising an upper cover plate and a lower cover plate, wherein the upper cover plate, the lower cover plate and heat dissipating pillars are all made of copper material, the thermal conductivity is 380w/(mk), the length of the upper cover plate and the lower cover plate is 26.5mm, the width of the upper cover plate and the lower cover plate is 11.5mm, the thickness of the cover plate region formed by the upper cover plate and the lower cover plate is 1.5mm, the width of the heat dissipating contact region is 4.08mm, the length of the heat dissipating contact region is 9.9mm, the distance from the heat dissipating contact region to the edge of the longer side of the upper cover plate is 0.8mm, the distance from the edge of the shorter side of the upper cover plate is 0.5mm, the height of the heat dissipating pillars is 0.9mm, the inter-pillar distance between the heat dissipating pillar and the adjacent heat dissipating pillar disposed parallel to the longer edge of the upper cover plate is 0.5mm, the inter-pillar distance between the heat dissipating pillar and the adjacent heat dissipating pillar disposed non-parallel to any edge of the upper cover plate is 0.6mm, the heat dissipating pillar is disposed alternately in the heat dissipating cavity, the cooling liquid is water, the pumping flow of the cooling liquid is 0.3L/min, and the heat dissipation column is a cylinder with the diameter of 0.4 mm.

Example 5

This embodiment provides a heat dissipating device, comprising an upper cover plate and a lower cover plate, wherein the upper cover plate, the lower cover plate and heat dissipating pillars are all made of copper material, the thermal conductivity is 380w/(mk), the length of the upper cover plate and the lower cover plate is 26.5mm, the width of the upper cover plate and the lower cover plate is 11.5mm, the thickness of the cover plate region formed by the upper cover plate and the lower cover plate is 1.5mm, the width of the heat dissipating contact region is 4.08mm, the length of the heat dissipating contact region is 9.9mm, the distance between the heat dissipating contact region and the longer side edge of the upper cover plate is 0.8mm, the distance between the heat dissipating contact region and the shorter side edge of the upper cover plate is 0.5mm, the height of the heat dissipating pillars is 0.9mm, the distance between the heat dissipating pillars and the adjacent heat dissipating pillars disposed parallel to the longer edge of the upper cover plate is 0.6mm, the distance between the heat dissipating pillars and the adjacent heat dissipating pillars disposed non-parallel to any edge of the upper cover plate is 0.6mm, the heat dissipating pillars are alternately disposed in the heat dissipating chamber, the cooling liquid is water, the pumping flow of the cooling liquid is 0.3L/min, and the heat dissipation column is a cylinder with the diameter of 0.4 mm.

Example 6

This embodiment provides a heat dissipating device, comprising an upper cover plate and a lower cover plate, wherein the upper cover plate, the lower cover plate and heat dissipating pillars are all made of copper material, the thermal conductivity is 380w/(mk), the length of the upper cover plate and the lower cover plate is 26.5mm, the width of the upper cover plate and the lower cover plate is 11.5mm, the thickness of the cover plate region formed by the upper cover plate and the lower cover plate is 1.5mm, the width of the heat dissipating contact region is 4.08mm, the length of the heat dissipating contact region is 9.9mm, the distance between the heat dissipating contact region and the longer side edge of the upper cover plate is 0.8mm, the distance between the heat dissipating contact region and the shorter side edge of the upper cover plate is 0.5mm, the height of the heat dissipating pillars is 0.9mm, the distance between the heat dissipating pillars and the adjacent heat dissipating pillars disposed parallel to the longer edge of the upper cover plate is 0.55mm, the distance between the heat dissipating pillars and the adjacent heat dissipating pillars disposed non-parallel to any edge of the upper cover plate is 0.6mm, the heat dissipating pillars are alternately disposed in the heat dissipating cavity, the cooling liquid is water, the pumping flow of the cooling liquid is 0.3L/min, and the heat dissipation column is a cylinder with the diameter of 0.3 mm.

Example 7

This embodiment provides a heat dissipating device, comprising an upper cover plate and a lower cover plate, wherein the upper cover plate, the lower cover plate and heat dissipating pillars are all made of copper material, the thermal conductivity is 380w/(mk), the length of the upper cover plate and the lower cover plate is 26.5mm, the width of the upper cover plate and the lower cover plate is 11.5mm, the thickness of the cover plate region formed by the upper cover plate and the lower cover plate is 1.5mm, the width of the heat dissipating contact region is 4.08mm, the length of the heat dissipating contact region is 9.9mm, the distance between the heat dissipating contact region and the longer side edge of the upper cover plate is 0.8mm, the distance between the heat dissipating contact region and the shorter side edge of the upper cover plate is 0.5mm, the height of the heat dissipating pillars is 0.9mm, the distance between the heat dissipating pillars and the adjacent heat dissipating pillars disposed parallel to the longer edge of the upper cover plate is 0.55mm, the distance between the heat dissipating pillars and the adjacent heat dissipating pillars disposed non-parallel to any edge of the upper cover plate is 0.6mm, the heat dissipating pillars are alternately disposed in the heat dissipating cavity, the cooling liquid is water, the pumping flow of the cooling liquid is 0.3L/min, and the heat dissipation column is a cylinder with the diameter of 0.5 mm.

Comparative example 1

This comparative example provides a copper radiator of five-layer structure, and this radiator includes from top to bottom be first layer to fifth layer in proper order, does not have the heat dissipation post structure, and the three-layer is the heat transfer layer in the middle of first layer and the fifth layer for the apron layer, and the feed liquor microchannel is ten total, and the coolant liquid flows into the second floor through the third layer in proper order after getting into from the feed liquor channel on fourth layer by the inlet, flows out by the second layer again and reachs the liquid outlet, accomplishes the heat dissipation.

Simulation and result analysis

Simulation software flotherm XT was used to simulate a five-layer structure micro-channel radiator and the micro-channel heat dissipation device of the invention designed with a two-layer structure, the overall peripheral dimensions were consistent, the simulated heat source heating methods were consistent, and both the simulated heat sources and the micro-channel heat dissipation device of the invention had the heating power consumption of 80W, and the heat dissipation simulation results of the heat dissipation devices of the above examples 1 to 7 and comparative example 1 are shown in table 1 below.

TABLE 1

	Temperature rise Δ T (. degree. C.)	Pressure loss (KPa)
			Example 1	17.5	45
Example 2	15.9	51
			Example 3	19.2	41
Example 4	17.2	50
			Example 5	18.3	39
Example 6	19.4	33
			Example 7	16.2	58
Comparative example 1	20.5	45

When the radiator structure is made of copper and a five-layer microchannel radiator is used, the temperature rise of the surface of the heat source is 20.5 ℃, and the pressure loss is 45KPa, while the heat radiator adopting the embodiment 1 of the invention has the temperature rise of the surface of the heat source of 17.5 ℃ and the temperature drop of 3 ℃ on the same scale under the condition of the same pressure loss; when the radiator structure is made of aluminum and a five-layer microchannel radiator is used, the surface temperature rise of the heat source is 24.3 ℃ and the pressure loss is 45KPa, but by adopting the radiator of the embodiment 1, the surface temperature rise of the heat source is 20.6 ℃ and the year-on-year reduction is 3.7 ℃ under the condition of the same pressure loss, and the radiating performance is greatly improved by the radiator.

The invention also further explores the relationship between the diameter of the heat dissipation columns and the distance between the heat dissipation columns and the temperature rise and the pressure loss of the heat dissipation device, under the condition that the distance between the heat dissipation columns arranged in a staggered mode is not changed, the temperature rise of the diameter of the heat dissipation columns is obviously reduced, but the pressure loss is obviously increased, the temperature rise of the distance between the heat dissipation columns is obviously increased, but the pressure loss is obviously reduced, so that the diameter of the heat dissipation columns is matched with the distance between the columns to achieve the ideal heat source surface temperature rise and pressure loss.

The double-layer heat dissipation device and the five-layer micro-channel heat dissipation device are adopted, and under the condition that the pressure loss is the same as that of the five-layer micro-channel heat dissipation device, the heat dissipation performance is optimized on the premise that the pressure loss is not increased by the double-layer structure. Further proves that the heat dissipation device 10 with the heat dissipation cavity containing the heat dissipation column 1041 provided by the invention can effectively increase the heat exchange area and improve the heat dissipation capability; in addition, the reynolds number of the fluid of the cooling liquid can be further increased by controlling the diameter and the distance between the heat dissipation columns 1041, so that the turbulence effect is improved, and the heat dissipation performance is improved. Meanwhile, the double-layer heat dissipation device 10 avoids a large amount of interface thermal resistance formed by the interface between the layers of the multi-layer heat dissipation device, so that the thermal resistance of the heat dissipation device is effectively reduced, the heat dissipation performance is further improved, meanwhile, the number of layers of the heat dissipation device is small, the hardness of the heat dissipation device can be increased by increasing the thickness of a single layer, and the probability of deformation of the heat dissipation device can be effectively reduced. The heat dissipation device 10 provided by the invention has a simple structure, can shorten the processing time and realize the controllable product quality.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, so as to understand the technical solutions of the present invention specifically and in detail, but not to be understood as the limitation of the protection scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. It should be understood that the technical solutions provided by the present invention and obtained by logical analysis, reasoning or limited experiments by those skilled in the art are all within the scope of the appended claims. Therefore, the protection scope of the patent of the present invention shall be subject to the content of the appended claims, and the description and the attached drawings can be used for explaining the content of the claims.