阅读说明：本技术 一种可分区调控流量的散热结构及其制备方法 (Heat dissipation structure capable of regulating and controlling flow in areas and preparation method thereof ) 是由 王玮 杨宇驰 杜建宇 于 2021-07-13 设计创作，主要内容包括：本发明涉及一种可分区调控流量的散热结构,其通过调整入液管路与入液口的连接关系以及出液管路与出液口的连接关系,以及通过调整散热结构内不同区域的嵌入式微流道及歧管通道的结构特征和并行度来调整流阻,可以极大程度的减少调控流量所需要的压力调控结构数目。本发明的散热结构通过调节压力调控结构的压强数值,可以动态调控散热结构内不同区域的散热性能,相较于传统的单阀门流道结构,可以提升泵功的利用率,提升散热系统的能耗比。本发明针对散热结构内散热性能要求高的区域设计了小尺寸、高并行度、小流阻的歧管通道结构,在强化冷却性能的同时,较小流阻使得压降调控更为有效,增加了调制比例。另外,本发明还涉及所述散热结构的制备方法。(The invention relates to a heat radiation structure capable of regulating and controlling flow in a partition mode, which can regulate and control flow resistance by regulating the connection relation between a liquid inlet pipeline and a liquid inlet and the connection relation between a liquid outlet pipeline and a liquid outlet and regulating the structural characteristics and parallelism of embedded micro-channels and manifold channels in different areas in the heat radiation structure, and can greatly reduce the number of pressure regulation and control structures required by regulating and controlling flow. The heat dissipation structure can dynamically regulate and control the heat dissipation performance of different areas in the heat dissipation structure by regulating the pressure value of the pressure regulation and control structure, and can improve the utilization rate of pump power and the energy consumption ratio of a heat dissipation system compared with the traditional single-valve flow passage structure. The manifold channel structure with small size, high parallelism and small flow resistance is designed for the area with high heat dissipation performance requirement in the heat dissipation structure, the cooling performance is enhanced, the pressure drop regulation is more effective due to the small flow resistance, and the modulation proportion is increased. In addition, the invention also relates to a preparation method of the heat dissipation structure.)

1. The utility model provides a but heat radiation structure of subregion regulation and control flow which characterized in that includes:

the cover plate structure comprises a first heat dissipation unit array, and the back of each first heat dissipation unit is provided with an embedded micro-channel;

the bottom plate structure comprises second heat dissipation unit arrays, the top of each second heat dissipation unit is provided with a manifold channel, a liquid inlet and a liquid outlet, and a first heat dissipation unit in the first heat dissipation unit array is in one-to-one correspondence with a second heat dissipation unit in the second heat dissipation unit array and is in fluid communication with the embedded micro-channel through the manifold channel;

the liquid inlet pipeline is communicated with a plurality of liquid inlets in parallel, and each liquid inlet can be connected with only one liquid inlet pipeline;

each liquid outlet pipeline is communicated with a plurality of liquid outlets in parallel, and each liquid outlet can be connected with only one liquid outlet pipeline; and

and a pressure regulating structure is arranged at the inlet of each liquid inlet pipeline and/or the outlet of each liquid outlet pipeline.

2. The heat dissipation structure according to claim 1, wherein the first and second arrays of heat dissipation cells are each an m x n array, where m and n are each independently a positive integer of 2 or more.

3. The heat dissipation structure of claim 2, wherein all of the liquid inlets in one or more rows of the second heat dissipation unit array are connected in parallel to the same liquid inlet pipeline; all liquid outlets in one or more rows in the second radiating unit array are communicated with the same liquid outlet pipeline in parallel.

4. The heat dissipation structure according to claim 2, wherein a power distribution pattern in a heat dissipation region of a heat source is unknown, and the embedded micro flow channel of each of the first heat dissipation units and the manifold channel of each of the second heat dissipation units are respectively of the same structure.

5. The heat dissipating structure of claim 2, wherein the heat generating power density of the heat source decreases gradually from the center to the edge, and the width of the embedded microchannel of the first heat dissipating unit located at the center of the first heat dissipating unit array is smallest; the width of the manifold channel structure of the second heat dissipation unit positioned in the center of the second heat dissipation unit array is the minimum; the width of the manifold channel of the second radiating unit positioned at the four corners of the second radiating unit array is the largest.

6. The heat dissipation structure of claim 1 or 2, wherein the cover plate structure is formed integrally or assembled by a plurality of first heat dissipation units; the bottom plate structure can be integrally formed or assembled and combined by a plurality of second heat dissipation units.

7. The method for producing the heat dissipating structure of any one of claims 1 to 6, comprising:

preparing a cover plate structure comprising a first heat dissipation unit array, and enabling each first heat dissipation unit to be provided with an embedded micro-channel;

preparing a bottom plate structure comprising a second heat dissipation unit array, wherein each second heat dissipation unit is provided with a manifold channel, a liquid inlet and a liquid outlet;

bonding and sealing the cover plate structure and the bottom plate structure, so that the first heat dissipation units in the first heat dissipation unit array are in one-to-one correspondence with the second heat dissipation units in the second heat dissipation unit array and are in fluid communication with the embedded micro-channels through the manifold channels;

arranging a plurality of liquid inlet pipelines, wherein each liquid inlet pipeline is communicated with a plurality of liquid inlet ports in parallel, and each liquid inlet port can be only connected with one liquid inlet pipeline;

a plurality of liquid outlet pipelines are arranged, so that each liquid outlet pipeline is communicated with a plurality of liquid outlets in parallel, and each liquid outlet can be connected with only one liquid outlet pipeline; and

and a pressure regulating structure is arranged at the inlet of each liquid inlet pipeline and/or the outlet of each liquid outlet pipeline.

8. The method of claim 7, wherein the cover plate structure is integrally formed, and the entire substrate is processed by photolithography, etching, milling, etching or a combination thereof, so as to obtain the cover plate structure including the first array of heat dissipation units; or, the cover plate structure is an assembly combination of a plurality of the first heat dissipation units, the plurality of substrates are respectively processed through a photoetching process, an etching process, a milling cutter processing process, an etching process or a combination thereof, so as to obtain a plurality of first heat dissipation units provided with the embedded micro flow channels, and then the plurality of first heat dissipation units are spliced to form the first heat dissipation unit array, so as to obtain the cover plate structure.

9. The method of claim 8, wherein the base plate structure is integrally formed, and the entire substrate is processed by photolithography, etching, milling, drilling, etching or a combination thereof, thereby obtaining the base plate structure including the second heat dissipation unit array.

10. The method as claimed in claim 8, wherein the bottom plate structure is an assembly of a plurality of the second heat dissipation units, the plurality of substrates are processed by photolithography, etching, milling, etching or a combination thereof to obtain a plurality of second heat dissipation units having manifold channels, liquid inlets and liquid outlets, and then the plurality of second heat dissipation units are assembled to form the second heat dissipation unit array, thereby obtaining the bottom plate structure.

Technical Field

The invention relates to the field of chip heat dissipation, in particular to a heat dissipation structure capable of regulating and controlling flow in a partitioned mode and a preparation method thereof.

Background

Liquid cooling is a technique for cooling a high-heat-generating power module in an electronic device by using the property of liquid, is used for a chip module with large thermal design power consumption, and is mainly used for cooling a high-power chip. Because the liquid has a larger specific heat capacity than the gas, and the liquid and the solid surface generally have a larger convective heat transfer coefficient when moving relatively, the liquid cooling can realize smaller thermal resistance between the junction temperature of the transistor and the ambient temperature.

In the design and test process of the liquid cooling radiator, the heat source is often a simulation heat source with uniform heating or a heating model containing a small number of hot spots. However, in an actual electronic chip, different functional partitions, different operating regions and different clock/power consumption distributions cause the power density to exhibit extremely strong non-uniformity, thereby generating severe local overheating phenomena and hot spots, and particularly, the hot spot phenomena become more and more obvious with the development of three-dimensional integration and core-grain integration (chip integration) modes.

In traditional liquid cooling radiator, only adopt a valve to control the flow of cooling working medium generally, therefore the cooling mode is comparatively single, when the heating power of certain region increases in the heat radiating area, in order to guarantee that chip surface highest temperature does not exceed the restriction, need promote this regional heat-sinking capability. Since the flow rate of the whole radiator is controlled by only one valve, in order to improve the heat radiation performance of the area, the flow rate in the whole area needs to be increased, which leads to serious waste of pump work.

Or, in the conventional liquid-cooled radiator, a plurality of groups of fluid passages are also arranged to control the flow of each region respectively, that is, each group of fluid passages respectively adopt an independent valve and a driving pump to control the flow of the cooling working medium of each region, so as to achieve the purpose of regulating and controlling the heat dissipation performance by regions. This approach, while not causing a waste of pump work, increases the complexity of the system. Especially, in the case of large-scale Chiplet integration, if there are n × n control regions, n needs to be set²A liquid inlet and n²A liquid outlet and is provided with n²The individual control valves add significant complexity to the system, making the method difficult to use in embedded microfluidic heat dissipation structures.

Therefore, it is necessary to develop a heat dissipation structure with low system complexity and capable of regulating and controlling flow in a partitioned manner.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provide a heat dissipation structure capable of regulating and controlling flow in a partitioned mode.

The invention also aims to provide a preparation method of the heat dissipation structure.

In order to achieve the above object, the present invention provides the following technical solutions.

A heat dissipation structure capable of regulating and controlling flow in a partitioned mode comprises:

the cover plate structure comprises a first heat dissipation unit array, and the back of each first heat dissipation unit is provided with an embedded micro-channel;

the bottom plate structure comprises second heat dissipation unit arrays, the top of each second heat dissipation unit is provided with a manifold channel, a liquid inlet and a liquid outlet, and a first heat dissipation unit in the first heat dissipation unit array is in one-to-one correspondence with a second heat dissipation unit in the second heat dissipation unit array and is in fluid communication with the embedded micro-channel through the manifold channel;

the liquid inlet pipeline is communicated with a plurality of liquid inlets in parallel, and each liquid inlet can be connected with only one liquid inlet pipeline;

each liquid outlet pipeline is communicated with a plurality of liquid outlets in parallel, and each liquid outlet can be connected with only one liquid outlet pipeline; and

and a pressure regulating structure is arranged at the inlet of each liquid inlet pipeline and/or the outlet of each liquid outlet pipeline.

The preparation method of the heat dissipation structure comprises the following steps:

preparing a cover plate structure comprising a first heat dissipation unit array, and enabling each first heat dissipation unit to be provided with an embedded micro-channel;

preparing a bottom plate structure comprising a second heat dissipation unit array, wherein each second heat dissipation unit is provided with a manifold channel, a liquid inlet and a liquid outlet;

bonding and sealing the cover plate structure and the bottom plate structure, so that the first heat dissipation units in the first heat dissipation unit array are in one-to-one correspondence with the second heat dissipation units in the second heat dissipation unit array and are in fluid communication with the embedded micro-channels through the manifold channels;

arranging a plurality of liquid inlet pipelines, wherein each liquid inlet pipeline is communicated with a plurality of liquid inlet ports in parallel, and each liquid inlet port can be only connected with one liquid inlet pipeline;

a plurality of liquid outlet pipelines are arranged, so that each liquid outlet pipeline is communicated with a plurality of liquid outlets in parallel, and each liquid outlet can be connected with only one liquid outlet pipeline; and

and a pressure regulating structure is arranged at the inlet of each liquid inlet pipeline and/or the outlet of each liquid outlet pipeline.

Compared with the prior art, the invention achieves the following technical effects:

1. the invention adjusts the flow resistance by adjusting the connection relation between the liquid inlet pipeline and the liquid inlet and the connection relation between the liquid outlet pipeline and the liquid outlet, and adjusting the structural characteristics and the parallelism of the embedded micro-channel and the manifold channel in different areas in the heat dissipation structure, and can greatly reduce the number of pressure regulation structures required by regulating and controlling the flow. For example, for a heat dissipation structure having an m × n first heat dissipation unit array, the number of pressure regulation structures can be reduced from m × n required for respectively controlling the flow of each region by a conventional method to m + n or less, so that the complexity of the system is reduced on the premise of ensuring the regulation effectiveness, the reliability of the system is improved, and the regulation cost is reduced.

2. The heat dissipation structure can dynamically regulate and control the heat dissipation performance of different areas in the heat dissipation structure by regulating the pressure value of the pressure regulation and control structure, and can improve the utilization rate of pump power and the energy consumption ratio of a heat dissipation system compared with the traditional single-valve flow passage structure.

3. The manifold channel structure with small size, high parallelism and small flow resistance is designed for the area with high heat dissipation performance requirement in the heat dissipation structure, the cooling performance is enhanced, the pressure drop regulation is more effective due to the small flow resistance, and the modulation proportion is increased.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:

fig. 1 is a schematic view of a cover plate structure provided in embodiment 1 of the present invention.

Fig. 2 is a schematic view of a bottom plate structure provided in embodiment 1 of the present invention.

Fig. 3 is a schematic view of a heat dissipation structure provided in embodiment 1 of the present invention.

Fig. 4 is a schematic view of a cover plate structure provided in embodiment 2 of the present invention.

Fig. 5 is a schematic diagram of a bottom plate structure provided in embodiment 2 of the present invention.

Fig. 6 is a schematic view of a heat dissipation structure provided in embodiment 2 of the present invention.

FIG. 7 is a schematic view of the cooling liquid passage of the present invention.

Description of the reference numerals

100 is a cover plate structure, 101 is a first heat dissipation unit, 102 is an embedded micro channel, 200 is a base plate structure, 201 is a second heat dissipation unit, 202 is a manifold channel, 203 is a liquid inlet, 204 is a liquid outlet, 205 is an inflow channel in the manifold channel, 206 is an outflow channel in the manifold channel, 300 is a liquid inlet pipe, 400 is a liquid outlet pipe, 500 is a valve, and 600 is a heat dissipation structure.

Detailed Description

Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.

Various structural schematics according to embodiments of the present disclosure are shown in the figures. The figures are not drawn to scale, wherein certain details are exaggerated and possibly omitted for clarity of presentation. The shapes of various regions, layers, and relative sizes and positional relationships therebetween shown in the drawings are merely exemplary, and deviations may occur in practice due to manufacturing tolerances or technical limitations, and a person skilled in the art may additionally design regions/layers having different shapes, sizes, relative positions, as actually required.

In the context of the present disclosure, when a layer/element is referred to as being "on" another layer/element, it can be directly on the other layer/element or intervening layers/elements may be present. In addition, if a layer/element is "on" another layer/element in one orientation, then that layer/element may be "under" the other layer/element when the orientation is reversed.

Because the system complexity of the existing heat dissipation structure capable of regulating and controlling the flow in a partitioning mode is high, the invention provides an improved heat dissipation structure which is structurally as follows.

A heat dissipation structure capable of regulating and controlling flow in a partitioned mode comprises:

the cover plate structure comprises a first heat dissipation unit array, and the back of each first heat dissipation unit is provided with an embedded micro-channel;

the bottom plate structure comprises second heat dissipation unit arrays, the top of each second heat dissipation unit is provided with a manifold channel, a liquid inlet and a liquid outlet, and a first heat dissipation unit in the first heat dissipation unit array is in one-to-one correspondence with a second heat dissipation unit in the second heat dissipation unit array and is in fluid communication with the embedded micro-channel through the manifold channel;

the liquid inlet pipeline is communicated with a plurality of liquid inlets in parallel, and each liquid inlet can be connected with only one liquid inlet pipeline;

each liquid outlet pipeline is communicated with a plurality of liquid outlets in parallel, and each liquid outlet can be connected with only one liquid outlet pipeline; and

and a pressure regulating structure is arranged at the inlet of each liquid inlet pipeline and/or the outlet of each liquid outlet pipeline.

The heat radiation structure adjusts the flow resistance by adjusting the connection relation between the liquid inlet pipeline and the liquid inlet and the connection relation between the liquid outlet pipeline and the liquid outlet, and adjusting the structural characteristics and the parallelism of the embedded micro-channels and the manifold channels in different areas in the heat radiation structure, thereby greatly reducing the number of pressure regulation structures required by flow regulation. For example, for a heat dissipation structure having an m × n (m > n) first heat dissipation unit array, the number of pressure regulation structures can be reduced from m × n required for controlling the flow rate of each region by a conventional method to m + n or less, so that the complexity of the system is reduced on the premise of ensuring the regulation effectiveness, the reliability of the system is improved, and the regulation cost is reduced.

The cover plate structure can be integrally formed or assembled and combined by a plurality of first heat dissipation units. The cover plate structure may be a high thermal conductivity material such as silicon, diamond, a metal (e.g., copper), combinations thereof, or the like. In a specific embodiment, the cover plate structure is an assembly combination of a plurality of the first heat dissipation units, wherein the first heat dissipation units are silicon-based chips with embedded micro channels on the back.

The first heat dissipation cell array is an m x n array, wherein m and n are each independently a positive integer greater than 2. The back of each first heat dissipation unit is provided with a plurality of embedded micro-channels which are arranged in parallel and are not communicated with each other. The factors needing to be considered for selecting the parameters of the embedded micro-channel such as length, width, height, spacing and the like comprise that the fluid resistance is increased if the length is too long, and the fluid resistance is seriously increased if the width is too narrow; when the height is too small, the heat cannot be sufficiently dissipated through the flow channel; when the height of the flow channel is too high, the heat exchange efficiency is influenced due to the reduction of the fin efficiency, so that the heat dissipation is not facilitated. In order to achieve the optimal heat dissipation performance, simulation optimization can be performed on all parameters to select appropriate parameters.

In order to realize the partition regulation of the flow of the cooling liquid, the heat dissipation area of the heat source needs to be divided into a plurality of sub-areas, and the first heat dissipation unit array is designed according to the sub-areas. The shape and size of the first heat dissipation unit may be divided according to the power distribution of the heat source, and the acceptable system complexity. Typically, the first heat dissipating unit has an area of between 3mm by 3mm and 10mm by 10 mm. Generally, the smaller the area of the first heat dissipating unit, the better the controllability of the flow rate of the cooling liquid, the better the heat dissipating performance, but the more complicated the flow path structure.

In the first heat dissipation unit array, the embedded micro flow channels of the respective first heat dissipation units may be the same or different in size and distribution. The embedded micro-channels of the first heat dissipation units are independent and do not influence each other.

The bottom plate structure of the invention can be integrally formed or assembled and combined by a plurality of second heat dissipation units. The back plane structure may be silicon, diamond, glass, metal (e.g., copper), combinations thereof, or the like.

The second heat dissipation cell array is an m x n array, wherein m and n are each independently a positive integer greater than 2. Each second heat dissipation unit is provided with a manifold channel, a liquid inlet and a liquid outlet. The manifold channel comprises an inflow channel and an outflow channel, wherein the inflow channel comprises a total inflow channel and a plurality of branch inflow channels, and the total inflow channel is communicated with the liquid inlet; the outflow channel comprises a total outflow channel and a plurality of branch outflow channels, and the total outflow channel is communicated with the liquid outlet. The inflow channel and the outflow channel are both in a comb-tooth shape, wherein each branch inflow channel and each branch outflow channel are arranged in parallel. One end of each branch inflow channel is communicated with the total inflow channel, and the other end of each branch inflow channel is closed; one end of each branch outflow channel is communicated with the total outflow channel, and the other end is closed. The inflow channels and the outflow channels are arranged in an interdigital manner and are not communicated with each other. The direction of fluid flow in each of the divided inlet channels or each of the divided outlet channels is at a perpendicular or near perpendicular angle to the direction of fluid flow in the embedded microchannels.

Because the first heat dissipation units in the first heat dissipation unit array and the second heat dissipation units in the second heat dissipation unit array are in one-to-one correspondence fluid communication with the embedded micro channels through the manifold channels, the areas of the second heat dissipation units can be designed according to the areas of the first heat dissipation units. In the second heat dissipation unit array, the manifold channels of the respective second heat dissipation units may be the same or different in size and distribution. The manifold channels of the second heat dissipation units are independent of each other and do not affect each other.

The present invention is described in the following two cases with respect to the design of the embedded micro flow channel of the first heat dissipation unit and the manifold channel of the second heat dissipation unit.

If the Power Map in the heat dissipation area of the heat source is unknown, the embedded micro-channel of each first heat dissipation unit and the manifold channel of each second heat dissipation unit can be respectively designed into the same structure, and the structure of the channels can be designed by combining Thermal Design Power (TDP), Thermal resistance values (including but not limited to internal Thermal resistance, external Thermal resistance, interface Thermal resistance and the like), pumping parameters (pressure intensity, flow rate and the like) and the like, so that the micro-channel structure capable of meeting the cooling requirement is obtained. For the multi-core processor, since the heat dissipation requirements of the respective regions are the same, the respective first heat dissipation units can be designed into the same embedded micro-channels. In one specific embodiment, the first heat dissipation cell array is a 3 x 3 array, and the embedded micro channels in each cell are independent from each other and have the same structural characteristics, as shown in fig. 1; meanwhile, the second heat dissipation unit array is correspondingly a 3 × 3 array, and the manifold channels in each unit are independent from each other and have the same structural characteristics, as shown in fig. 2.

If the power distribution map in the heat dissipation area of the heat source is known, the heat dissipation area of the heat source needs to be divided into a plurality of sub-areas according to the power distribution map, and the first heat dissipation unit array and the embedded micro-channel structure therein need to be designed according to the sub-areas. For example, for a heat source structure with a heat generation power density gradually decreasing from the center to the edge, in order to obtain higher temperature uniformity, it is necessary to increase the heat dissipation performance of the central region of the heat dissipation structure, and in addition, the heat dissipation performance of the corner regions can be decreased. In a specific embodiment, the first heat dissipation unit array is a 3 × 3 array, in which the width of the embedded micro channels of the first heat dissipation unit located in the center of the array is the smallest, and the parallelism is the highest (i.e., the number of micro channels per unit area is the largest, and the distribution density is the highest), so as to increase the convective heat transfer coefficient and enhance the local cooling capability, as shown in fig. 4; meanwhile, the second heat dissipation unit array is correspondingly 3 × 3 array, wherein the width of the manifold channel of the second heat dissipation unit at the center of the array is the smallest, and the number of the manifold channels is the largest, so that the first heat dissipation unit at the center of the array has the smallest flow resistance, the largest flow and the strongest cooling capacity, as shown in fig. 5. In this embodiment, since the cooling capacity of the heat dissipating units at four corners of the array is the lowest, the second heat dissipating units located at four corners of the second heat dissipating unit array have the largest structural features of the manifold channels and the smallest number, so that the flow rate is the smallest and the heat dissipating performance is the worst, as shown in fig. 5.

In the present invention, the base plate structure may be bonded under the cover plate structure through a silicon-silicon direct bonding process, an anodic bonding process, a eutectic bonding process, or an adhesive process, thereby achieving fluid communication between the manifold channel of each second heat dissipation unit and the embedded micro channel of one first heat dissipation unit, respectively. When the cover plate structure and the bottom plate structure are combined together through a eutectic bonding process or an adhesion process, a sealing layer is arranged between the cover plate structure and the bottom plate structure, and the sealing layer is an adhesive layer or a metal layer; preferably, the adhesive layer comprises a thermosetting material or a thermoplastic material; preferably, the thermosetting material is epoxy resin or polyurethane, and the thermoplastic material is polyvinyl acetate or polyvinyl acetal; preferably, the metal layer includes one or more metal materials selected from Cu, Sn, Pb, In, Au, Ag, and Sb.

The material of the liquid inlet pipe and the liquid outlet pipe is not particularly limited as long as the flow of the cooling liquid can be realized.

In order to reduce the system complexity of the heat dissipation structure, each liquid inlet pipeline can be communicated with a plurality of liquid inlets in parallel, and each liquid outlet pipeline can be communicated with a plurality of liquid outlets in parallel. For example, all the liquid inlets in one or more rows in the second heat dissipation unit array can be connected in parallel to the same liquid inlet pipeline; all liquid outlets in one or more columns of the second heat dissipation unit array may be connected in parallel to the same liquid outlet pipeline, as shown in fig. 3 and 6.

The pressure regulating structure is arranged at the inlet of the liquid inlet pipeline and/or the outlet of the liquid outlet pipeline. In a specific embodiment, the first heat dissipating unit array and the second heat dissipating unit array are both m × n (m > n) arrays, where m and n are each independently a positive integer of 2 or more, and the number of pressure regulating structures is n or m + n. And controlling the pressure regulating structure according to the heating state of the heat source. For example, when the power of the heat source area corresponding to a certain unit of the first heat dissipation unit array is increased, the pressure of the pressure regulation structure at the inlet end of the unit may be increased, and/or the pressure of the pressure regulation structure at the outlet end of the unit may be decreased, so as to increase the flow rate of the unit and improve the heat dissipation capability thereof.

In practical cases, the number of interconnected flow paths and pressure regulating structures can be designed in combination with the varying requirements of the heat source power.

The heat dissipation structure can dynamically regulate and control the heat dissipation performance of different areas by regulating the pressure value of the pressure regulation and control structure, and can improve the utilization rate of pump power and the energy consumption ratio of a heat dissipation system compared with the traditional single-valve flow passage structure.

The flow of the cooling fluid in the embedded microchannels and the manifold channels is as shown in fig. 7, the cooling fluid flows in from the liquid inlet of the second heat dissipation unit, flows in the inflow channel of the manifold channel as shown by the solid arrows, and because the inflow channel is closed at the end far away from the liquid inlet, the cooling fluid flows into the embedded microchannels of the first heat dissipation unit as shown by the dotted arrows, exchanges heat with the heat source, flows along the outflow channel of the manifold channel as shown by the hollow arrows, and because the outflow channel is closed at the end far away from the liquid outlet, the cooling fluid finally flows out from the liquid outlet, and the whole fluid cooling process is completed.

The invention also provides a preparation method of the heat dissipation structure, which comprises the following steps.

Firstly, a cover plate structure comprising a first heat dissipation unit array is prepared, and each first heat dissipation unit is provided with an embedded micro-channel.

The embedded micro flow channel may be formed according to the design of the embedded micro flow channel for the first heat dissipation unit as described above.

In a specific embodiment, the cover plate structure is integrally formed, and the entire substrate is processed through a photolithography process, an etching process, a milling process, an etching process, or a combination thereof, so as to obtain the cover plate structure including the first heat dissipation unit array. The substrate may be a high thermal conductivity material such as silicon, diamond, metal (e.g., copper), and the like.

In another specific embodiment, the cover plate structure is an assembly combination of a plurality of the first heat dissipation units, the plurality of substrates are respectively processed through a photolithography process, an etching process, a milling process, an etching process, or a combination thereof, so as to obtain a plurality of first heat dissipation units provided with the embedded micro channels, and then the plurality of first heat dissipation units are spliced to form the first heat dissipation unit array, so as to obtain the cover plate structure. The substrate may be a high thermal conductivity material such as silicon, diamond, metal (e.g., copper), and the like. Preferably, the substrate may be a substrate of a heat source chip. The substrate has an area between 3mm and 10 mm.

And preparing a bottom plate structure comprising a second heat dissipation unit array at the same time, before or after the cover plate structure is prepared, so that each second heat dissipation unit is provided with a manifold channel, a liquid inlet and a liquid outlet.

The manifold channel may be formed according to the design of the manifold channel for the second heat dissipation unit as described above.

In a specific embodiment, the base plate structure is integrally formed, and the entire substrate is processed through a photolithography process, an etching process, a milling process, a drilling process, an etching process, or a combination thereof, so as to obtain the base plate structure including the second heat dissipation unit array. The substrate may be silicon, diamond, glass, metal (e.g., copper), etc.

In another specific embodiment, the bottom plate structure is an assembly combination of a plurality of the second heat dissipation units, the plurality of substrates are respectively processed through a photolithography process, an etching process, a milling process, an etching process, or a combination thereof, so as to obtain a plurality of second heat dissipation units provided with manifold channels, liquid inlets, and liquid outlets, and then the plurality of second heat dissipation units are spliced to form the second heat dissipation unit array, so as to obtain the bottom plate structure. The substrate may be silicon, diamond, glass, metal (e.g., copper), etc.

And then, bonding and sealing the cover plate structure and the bottom plate structure, so that the first heat dissipation units in the first heat dissipation unit array are in one-to-one correspondence with the second heat dissipation units in the second heat dissipation unit array and are in fluid communication with the embedded micro-channels through the manifold channels.

The base plate structure may be bonded under the cover plate structure by a silicon-silicon direct bonding process, an anodic bonding process, a eutectic bonding process, or an adhesive process. After bonding and sealing, the manifold channel of each second heat dissipation unit is respectively communicated with the fluid of the embedded micro-channel of one first heat dissipation unit.

And then arranging a plurality of liquid inlet pipelines, wherein each liquid inlet pipeline is communicated with a plurality of liquid inlet ports in parallel, and each liquid inlet port can be only connected with one liquid inlet pipeline.

Then, a plurality of liquid outlet pipelines are arranged, so that each liquid outlet pipeline is communicated with a plurality of liquid outlets in parallel, and each liquid outlet can be connected with only one liquid outlet pipeline.

In a specific embodiment, the liquid inlet and outlet pipes are realized by means of a packaging fixture.

And finally, installing a pressure regulating structure at the inlet of each liquid inlet pipeline and/or the outlet of each liquid outlet pipeline.

The pressure regulating structure can be a control valve such as an electromagnetic valve.

The invention will be further described with reference to specific embodiments and drawings, but the invention is not limited thereto.

Example 1

Firstly, a heat dissipation area of a heat source is divided into 3 × 3 sub-areas, and a first heat dissipation unit array is designed according to the sub-areas, wherein the area of the first heat dissipation unit 101 is 5mm × 5mm, and the embedded micro channels 102 in each first heat dissipation unit 101 are mutually independent and have the same structural characteristics. Then, an embedded micro flow channel 102 is formed on the copper plate by using a milling process, thereby obtaining a cover plate structure 100, as shown in fig. 1.

And forming a second heat dissipation unit array on the copper plate by using a milling process and a drilling process, thereby obtaining a bottom plate structure 200, as shown in fig. 2, wherein the second heat dissipation unit 201 comprises a manifold channel 202, a liquid inlet 203 and a liquid outlet 204, and the manifold channels 202 in each second heat dissipation unit 201 are independent from each other and have the same structural characteristics.

The cover plate structure 100 and the base plate structure 200 are bonded face to face using a eutectic bonding process to achieve sealing of the flow channel structure (such that the flow direction of each fluid flowing into the channel or each fluid flowing out of the channel is perpendicular or nearly perpendicular to the flow direction of the fluid in the embedded micro flow channel).

After bonding, all the liquid inlets 203 of each row in the second heat dissipation unit array are communicated in parallel on the same liquid inlet pipeline 300; meanwhile, all the liquid outlets 204 of each row are connected in parallel to the same liquid outlet pipe 400. Then, valves 500 are additionally installed at the inlet of each liquid inlet pipeline 300 and the outlet of each liquid outlet pipeline, so as to obtain the heat dissipation structure 600.

Example 2

The procedure is as in example 1, except that:

1) the structure characteristics of the embedded micro channels 102 of the first heat dissipation unit 101 located at the center of the first heat dissipation unit array are minimized so as to improve the convective heat transfer coefficient and enhance the local cooling capability, and the obtained cover plate structure 100 is shown in fig. 4;

2) the structural characteristics (i.e. the width) of the manifold channel 202 of the second heat dissipation unit 201 positioned at the center of the second heat dissipation unit array is minimized, and the number of the manifold channels is maximized; the manifold channel structure characteristics of the second heat dissipation units located at the four corners of the second heat dissipation unit array are maximized, the number of manifold channels is minimized, and the resulting bottom plate structure 200 is shown in fig. 5;

3) after bonding, connecting 6 liquid inlets of the first row and the third row in the second heat dissipation unit array in parallel on the same liquid inlet pipeline 300, and connecting 3 liquid inlets of the second row in parallel on the other liquid inlet pipeline 300; meanwhile, 6 liquid outlets of the first row and the third row are connected in parallel to the same liquid outlet pipe 400, and 3 liquid outlets of the second row are connected in parallel to another liquid outlet pipe 400, and the obtained heat dissipation structure 600 is as shown in fig. 6.

Compared to the 6 valves of example 1, example 2 uses only 4 valves, which reduces the flexibility of regulation, but the system complexity is reduced accordingly.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.