阅读说明：本技术 一种立式功率端子双面散热功率模块 (Vertical power terminal double-sided heat dissipation power module ) 是由 孙静 姚礼军 言锦春 于 2021-08-16 设计创作，主要内容包括：本发明公开了一种立式功率端子双面散热功率模块,包括功率模块本体,所述功率模块本体包括相对设置的第一绝缘基板、第二绝缘基板及设置在两绝缘基板之间的若干芯片及导电连接块,所述芯片的下表面通过连接层与所述第一绝缘基板连接,芯片的上表面通过连接层与导电连接块连接并通过金属导线与所述第一绝缘基板电性连接,所述导电连接块的上表面通过连接层与所述第二绝缘基板连接；所述第一绝缘基板上设置有功率端子和控制端子,所述功率端子与第一绝缘基板连接的焊脚处开设有圆弧孔,功率端子远离圆弧孔的一端朝第一绝缘基板一侧弯折并垂直于第一绝缘基板使之成为立式功率端子,第一绝缘基板和第二绝缘基板之间通过环氧塑封体注塑加工。(The invention discloses a vertical power terminal double-sided heat dissipation power module which comprises a power module body, wherein the power module body comprises a first insulating substrate, a second insulating substrate, a plurality of chips and a conductive connecting block, wherein the first insulating substrate and the second insulating substrate are oppositely arranged, the plurality of chips and the conductive connecting block are arranged between the two insulating substrates, the lower surfaces of the chips are connected with the first insulating substrate through a connecting layer, the upper surfaces of the chips are connected with the conductive connecting block through the connecting layer and are electrically connected with the first insulating substrate through metal wires, and the upper surfaces of the conductive connecting blocks are connected with the second insulating substrate through the connecting layer; the power terminal and the control terminal are arranged on the first insulating substrate, the arc hole is formed in the welding leg position where the power terminal is connected with the first insulating substrate, one end, far away from the arc hole, of the power terminal bends towards one side of the first insulating substrate and is perpendicular to the first insulating substrate to enable the first insulating substrate to be a vertical power terminal, and the first insulating substrate and the second insulating substrate are subjected to injection molding through an epoxy plastic package body.)

1. The utility model provides a vertical power terminal double-sided heat dissipation power module, includes the power module body, its characterized in that: the power module body comprises a first insulating substrate, a second insulating substrate, a plurality of chips and a conductive connecting block, wherein the first insulating substrate and the second insulating substrate are arranged oppositely, the plurality of chips and the conductive connecting block are arranged between the two insulating substrates, the lower surfaces of the chips are connected with the first insulating substrate through a connecting layer, the upper surfaces of the chips are connected with the conductive connecting block through the connecting layer and are electrically connected with the first insulating substrate through bonding or welding metal wires so as to realize the electrical control connection of the power module body, and the upper surfaces of the conductive connecting blocks are connected with the second insulating substrate through the connecting layer; the novel bar cutting machine is characterized in that a power terminal and a control terminal are arranged on the first insulating substrate, the power terminal and the control terminal are complete lead frames before finished bar cutting, arc holes are formed in welding feet where the power terminal and the first insulating substrate are connected, one end, away from the arc holes, of the power terminal bends towards one side of the first insulating substrate and is perpendicular to the first insulating substrate to enable the first insulating substrate to be a vertical power terminal, and relative gaps between the first insulating substrate and the second insulating substrate are processed through injection molding of epoxy plastic packaging bodies to achieve electrical isolation.

2. The vertical power terminal double-sided heat dissipation power module of claim 1, wherein: the first insulating substrate and the second insulating substrate are both double-sided metal layer-coated insulating substrates, the opposite surfaces of the first insulating substrate and the second insulating substrate are grooved planar metal layers, the middle layer is an insulating layer made of aluminum oxide or silicon nitride, one side of the first insulating substrate, which deviates from the second insulating substrate, is a flat metal layer used for being connected with a heat dissipation system to dissipate heat, and the flat metal layer is flush with the outer surface of the epoxy plastic package body and exposed out of the epoxy plastic package body.

3. The vertical power terminal double-sided heat dissipation power module according to claim 1 or 2, characterized in that: the connecting layer is a silver paste sintering or tin soldering connecting layer, silver paste adopted by silver paste sintering is a micron-sized silver paste material, a nanometer-sized silver paste material or a mixture of the micron-sized silver paste material and the nanometer-sized silver paste material, and the silver paste material is in a silver film or silver paste form; the tin soldering welding adopts one of Sn-containing welding materials such as SnPb, SnAg, SnAgCu and PbSnAg, and the highest welding temperature is controlled to be 100-400 ℃.

4. The vertical power terminal double-sided heat dissipation power module of claim 3, wherein: the conductive connecting block is made of AlSiC, AlC, Cu or Cu-Mo, and the surface of the conductive connecting block is plated with one of nickel, gold and silver materials or an alloy material thereof.

5. The vertical power terminal double-sided heat dissipation power module of claim 3, wherein: the metal wire is in a linear or strip structure, is bonded or connected between the chip and the first insulating substrate in an ultrasonic mode or in a welding mode, and is made of one of pure aluminum, pure copper and pure gold materials or alloy materials of the pure aluminum, the pure copper and the pure gold materials.

6. The vertical power terminal double-sided heat dissipation power module of claim 3, wherein: the chip is an IGBT or SiC chip, one of gold and silver materials or an alloy material thereof is electroplated on the surface of the chip, and a temperature sensor and a current sensor are integrated on the chip.

Technical Field

The invention relates to the field of power electronics, in particular to a vertical power terminal double-sided heat dissipation power module.

Background

With the increasing miniaturization requirement of new energy automobile industry on power modules, the module heat dissipation condition is more and more severe. The planar horizontal double-sided heat dissipation module is limited in installation mode because the power terminal is parallel to the module heat dissipation insulating substrate. In the existing double-sided heat dissipation power module in the market, most of the insulating substrates are in parallel with the same shape and size, but the modules with the same shape and size are easily limited in an internal layout mode and a module later-stage installation mode, so that the invention of the vertical type power terminal double-sided heat dissipation power module supplements and enriches the internal layout mode and the module installation mode of the power module, and increases the installation adaptability of the double-sided heat dissipation power module.

Disclosure of Invention

The invention aims to solve the technical problem of providing a vertical power terminal double-sided heat dissipation power module which can improve the heat dissipation capacity of the module, enrich the module installation mode and effectively improve the module installation adaptability, aiming at the defects in the prior art.

The invention aims to solve the technical scheme that the vertical power terminal double-sided heat dissipation power module comprises a power module body, wherein the power module body comprises a first insulating substrate, a second insulating substrate, a plurality of chips and a conductive connecting block, the first insulating substrate and the second insulating substrate are oppositely arranged, the chips and the conductive connecting block are arranged between the two insulating substrates, the lower surfaces of the chips are connected with the first insulating substrate through a connecting layer, the upper surfaces of the chips are connected with the conductive connecting block through the connecting layer and are electrically connected with the first insulating substrate through bonding or welding metal wires so as to realize the electrical control connection of the power module body, and the upper surfaces of the conductive connecting blocks are connected with the second insulating substrate through the connecting layer; the novel bar cutting machine is characterized in that a power terminal and a control terminal are arranged on the first insulating substrate, the power terminal and the control terminal are complete lead frames before finished bar cutting, arc holes are formed in welding feet where the power terminal and the first insulating substrate are connected, one end, away from the arc holes, of the power terminal bends towards one side of the first insulating substrate and is perpendicular to the first insulating substrate to enable the first insulating substrate to be a vertical power terminal, and relative gaps between the first insulating substrate and the second insulating substrate are processed through injection molding of epoxy plastic packaging bodies to achieve electrical isolation.

Furthermore, the first insulating substrate and the second insulating substrate are both double-sided metal layer-coated insulating substrates, the opposite surfaces of the first insulating substrate and the second insulating substrate are grooved planar metal layers, the middle layer is an insulating layer made of aluminum oxide or silicon nitride, one sides of the first insulating substrate and the second insulating substrate, which are deviated from each other, are flat metal layers used for being connected with a heat dissipation system to dissipate heat, and the flat metal layers are flush with the outer surface of the epoxy plastic package body and exposed out of the epoxy plastic package body.

Further, the connecting layer is a silver paste sintering or tin soldering welding connecting layer, silver paste adopted by silver paste sintering is a micron-sized silver paste material, a nanometer-sized silver paste material or a mixture of the micron-sized silver paste material and the nanometer-sized silver paste material, and the silver paste material is in a silver film or silver paste form; the tin soldering welding adopts one of Sn-containing welding materials such as SnPb, SnAg, SnAgCu and PbSnAg, and the highest welding temperature is controlled to be 100-400 ℃.

Furthermore, the conductive connecting block is made of AlSiC, AlC, Cu or Cu-Mo, and the surface of the conductive connecting block is plated with one of nickel, gold and silver materials or an alloy material thereof.

Furthermore, the metal wire is in a linear or ribbon structure, the metal wire is bonded by ultrasonic or connected between the chip and the first insulating substrate by welding, and the metal wire is made of one of pure aluminum, pure copper and pure gold materials or alloy materials thereof.

Furthermore, the chip is an IGBT or SiC chip, one of gold and silver materials or alloy materials thereof is electroplated on the surface of the chip, and a temperature sensor and a current sensor are integrated on the chip.

The invention has the beneficial technical effects that: according to the invention, by using the vertical power terminal double-sided heat dissipation power module, the internal layout mode of the module and the external installation mode of the module are more abundant, the installation adaptability is larger, both sides of the module can be directly cooled by water, the heat dissipation capability of the module is improved, the long-time working reliability of the module is improved, the power circulation capability of the module is improved, the current grade is further improved on the premise of the volume of the existing module, and the module integration level is improved.

Drawings

FIG. 1 is a side cross-sectional schematic view of the present invention;

FIG. 2 is a schematic front cross-sectional view of the present invention;

FIG. 3 is a schematic view of a lead frame according to the present invention;

fig. 4 is a circuit diagram of the power module body according to the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood by those skilled in the art, the present invention is further described with reference to the accompanying drawings and examples.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "left", "right", "inside", "outside", "lateral", "vertical", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description of the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, and thus, should not be construed as limiting the present invention.

As shown in fig. 1-4, the vertical power terminal double-sided heat dissipation power module of the present invention includes a power module body, the power module body includes a first insulating substrate 1, a second insulating substrate 2, a plurality of chips 3 and a conductive connection block 4, the first insulating substrate 1 and the second insulating substrate are disposed opposite to each other, the lower surface of the chip 3 is connected to the first insulating substrate 1 through a connection layer 5, the upper surface of the chip 3 is connected to the conductive connection block 4 through the connection layer 5 and is electrically connected to the first insulating substrate 1 through a bonding or welding metal wire 6 to realize electrical control connection of the power module body, and the upper surface of the conductive connection block 4 is connected to the second insulating substrate 2 through the connection layer 5; the first insulating substrate 1 is provided with a power terminal 7 and a control terminal 8, the power terminal 7 and the control terminal 8 are complete lead frames before the finished product is subjected to rib cutting, and the surface of the complete lead frames is plated with one of materials such as gold and silver or alloy materials thereof.

Referring to fig. 1-2, arc holes 10 are formed in the solder joints where the power terminals 7 are connected with the first insulating substrate 1, and one ends of the power terminals 7, which are far away from the arc holes 10, are bent towards one side of the first insulating substrate 1 and are perpendicular to the first insulating substrate to enable the first insulating substrate to be vertical power terminals. The relative gap of 2 between the first insulating substrate 1 and the second insulating substrate is processed through injection molding of the epoxy plastic package body 9 so as to realize electrical isolation, the epoxy plastic package body adopts a high-temperature and high-pressure condition, and the gap between the two insulating substrates of the whole power module is filled with epoxy materials so as to realize electrical isolation. The power terminal 7 comprises a welding leg provided with an arc hole, a first bending edge which is inclined towards the second insulating substrate and enables one end of the power terminal, which extends out of the epoxy plastic package body 9, to be located at the middle position of the epoxy plastic package body, a connecting edge which extends transversely and a vertical terminal edge which is perpendicular to the connecting edge.

Referring to fig. 1, the first insulating substrate 1 and the second insulating substrate 2 are both double-sided metal layer-coated insulating substrates, the shapes of the insulating substrates can be changed according to actual requirements, the first insulating substrate 1 and the second insulating substrate 2 can be the same in shape or different in shape, the opposite surfaces of the first insulating substrate 1 and the second insulating substrate 2 are groove-provided planar metal layers 11, and gold, silver and the like are plated on the surface of the groove-provided planar metal layers 11 locally, so that silver paste sintering or welding or aluminum wire bonding can be facilitated to be used as conductive layers; the middle layer 12 is an insulating layer made of materials such as aluminum oxide or silicon nitride, a flat metal layer 13 for connecting with a heat dissipation system to dissipate heat is arranged on one side of the first insulating substrate 1 and the second insulating substrate 2 which are away from each other, and the flat metal layer 13 is flush with the outer surface of the epoxy plastic package body 9 and is exposed out of the epoxy plastic package body.

Referring to fig. 1, the connection layer 5 is a silver paste sintering or soldering connection layer, the silver paste used in the silver paste sintering is a micro-scale silver paste material, a nano-scale silver paste material or a mixture of the micro-scale silver paste material and the nano-scale silver paste material, the silver paste material is in a silver film or silver paste form, the silver paste can be sintered at a low temperature and a high pressure, and the melting temperature can reach 700 ℃ or even higher after the sintering is completed. The tin soldering welding adopts one of Sn-containing welding materials such as SnPb, SnAg, SnAgCu and PbSnAg, and the highest welding temperature is controlled to be 100-400 ℃. The conductive connecting block is made of AlSiC, AlC, Cu or Cu-Mo, and one of materials such as nickel, gold, silver and the like or alloy materials thereof is plated on the surface of the conductive connecting block so that the conductive connecting block can be used for welding.

The metal wire 6 is in a linear or ribbon structure, the metal wire 6 is bonded or connected between the chip 3 and the first insulating substrate 1 through ultrasonic or welding, and the metal wire 6 is made of one of pure aluminum, pure copper and pure gold materials or alloy materials thereof. The chip 3 is a chip such as IGBT or SiC, one of materials such as gold and silver or alloy materials thereof is electroplated on the surface of the chip 3, and a temperature sensor and a current sensor are integrated on the chip 3. Fig. 2 is an overall internal layout of the module. It should be noted that, in practical applications, the number of chips included in the power module may be other numbers according to practical needs, and the invention is not limited thereto.

As shown in fig. 2-3, the power terminal 7 and the control terminal 8 of the module are connected with the conductive layer of the insulating substrate in a shape of a part, and the welding feet are processed by arc holes, so that the welding effect can be better confirmed. The conductive connecting block part of the module can be designed into different shapes according to actual requirements, so that the applicability of the conductive connecting block is higher, the connection and conduction effects can be achieved, and different chip layouts can be met. In the embodiment shown in fig. 3, the lead frame of the module is designed with a special sharp corner at the head of the connecting terminal portion of the lead frame of the module on the premise of ensuring the satisfaction of electrical clearance, thermal resistance and the like, so that the sharp corner forming process can be simplified. The double-sided cooling packaging technology can obviously reduce the junction temperature of the chip, and is a packaging structure with wide development prospect.

The specific embodiments described herein are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.