阅读说明：本技术 集成磁流体散热芯片装置 (Integrated magnetic fluid heat dissipation chip device ) 是由 李尧 于 2021-09-03 设计创作，主要内容包括：本发明公开了一种集成磁流体散热芯片装置,其包括基板、安装于所述基板上的芯片、设于所述芯片上的密封的散热管,所述装置还包括填充在所述散热管内的磁流体、绕设于所述散热管上的电磁线圈,所述磁流体包括基液、悬于所述基液或沉淀于或浮于所述基液内的磁性微粒,以磁流体作为换热过程中的热量交换介质,磁流体在缠绕加磁电磁线圈的散热管中做上下往复运动,从贴近芯片的底端吸收热量变成高温磁流体,然后上下至顶端进行散热变成低温磁流体,散热后再下沉至底端吸收热量,如此循环往复,该芯片散热装置具有制造简单、体积小、集成度高、散热效率高、无噪音的特点。(The invention discloses an integrated magnetic fluid heat dissipation chip device, which comprises a substrate, a chip arranged on the substrate, and a sealed heat dissipation pipe arranged on the chip, the device also comprises a magnetic fluid filled in the radiating pipe and an electromagnetic coil wound on the radiating pipe, the magnetic fluid comprises a base fluid, magnetic particles suspended in the base fluid or precipitated or suspended in the base fluid, the magnetic fluid is used as a heat exchange medium in the heat exchange process, the magnetic fluid reciprocates up and down in a radiating pipe wound with a magnetizing electromagnetic coil and absorbs heat from the bottom end close to the chip to become high-temperature magnetic fluid, then radiating from top to bottom to become low-temperature magnetic fluid, sinking to bottom to absorb heat after radiating, repeating the steps, the chip heat dissipation device has the characteristics of simple manufacture, small volume, high integration level, high heat dissipation efficiency and no noise.)

1. The utility model provides an integrated magnetic current body heat dissipation chip device, its include the base plate, install in chip on the base plate, locate sealed cooling tube on the chip, its characterized in that: the device is still including filling magnetic current body in the cooling tube, around locating solenoid on the cooling tube, the magnetic current body include the base fluid, suspend in the base fluid or deposit in or float in magnetic particle in the base fluid, work as magnetic particle suspend in when in the base fluid, respectively around being equipped with solenoid on the lateral surface of the upper end periphery of cooling tube and lower tip, work as magnetic particle deposits in when in the base fluid, around being equipped with solenoid on the lateral surface of the upper end of cooling tube, work as magnetic particle float in when in the base fluid, around being equipped with solenoid on the lateral surface of the lower tip of cooling tube.

2. The integrated magnetic fluid heat sink chip device according to claim 1, wherein: the chip is connected with the lower end surface of the radiating pipe through a thermal interface coating.

3. The integrated magnetic fluid heat sink chip device according to claim 1, wherein: the radiating pipe is a cylinder or a cuboid.

4. The integrated magnetic fluid heat sink chip device according to claim 1, wherein: the radiating pipe is made of copper, aluminum alloy or AlSiC.

5. The integrated magnetic fluid heat sink chip device according to claim 1, wherein: the magnetic particles are one or a mixture of more of ferroferric oxide, iron nitride or iron boride.

6. The integrated magnetic fluid heat sink chip device according to claim 1, wherein: the base liquid is diester.

7. The integrated magnetic fluid heat sink chip device according to claim 1, wherein: the device also comprises a temperature sensor which is arranged on the side surface of the chip and is used for sensing the temperature of the chip.

8. The integrated magnetic fluid heat sink chip device according to claim 1, wherein: and the upper end part of the radiating pipe is provided with an air channel or a water channel for assisting in radiating.

9. The integrated magnetic fluid heat sink chip device according to claim 1, wherein: the number of turns of each electromagnetic coil is increased from the middle section to the end section of the radiating pipe.

Technical Field

The technology belongs to the field of chips, and particularly relates to an integrated magnetic fluid heat dissipation chip device.

Background

As high-reliability semiconductor power device products are developing toward miniaturization, high integration, high speed, high efficiency and high power, these semiconductor devices inevitably generate more heat than ever before, and if the heat dissipation problem of the semiconductor devices is not solved well, the high temperature will directly cause the performance of the semiconductor devices to be reduced. In order to stabilize the performance of a semiconductor device, the heat dissipation design of the semiconductor device becomes extremely important, otherwise the performance of the device cannot be improved or the device cannot work normally, and the temperature of the semiconductor device exceeds the allowable maximum temperature, thereby causing the device to be damaged.

The existing radiator is generally divided into an air-cooled radiating system, a water-cooled radiating system, a heat pipe radiating system and the like, but the adoption of a fan for radiating heat easily generates dust, consumes energy and generates noise; the water cooling heat dissipation is adopted, so that the structure is complex and heavy; the heat pipe is adopted for heat dissipation, the manufacturing process is complex and the cost is high; CN201710825338.4 discloses a self-circulation fluid device for heat dissipation of chip-scale systems, which utilizes the diffusion/shrinkage tube structure of the device to generate a net flow difference, so as to make the liquid flow in one direction, and although energy consumption can be reduced, its actual heat dissipation efficiency is low, the internal structure of the device is complex, the implementability is poor, and the cost is extremely high, and it is not suitable for mass production.

Disclosure of Invention

The invention aims to provide an integrated magnetic fluid heat dissipation chip device which is simple to manufacture, small in size, high in heat dissipation efficiency and free of noise.

In order to achieve the purpose, the invention adopts the technical scheme that: the utility model provides an integrated magnetic current body heat dissipation chip device, its includes the base plate, install in chip on the base plate, locate sealed cooling tube on the chip, the device is still including filling magnetic current body in the cooling tube, around locating solenoid on the cooling tube, the magnetic current body include base fluid, hang in base fluid or deposit in or float in magnetic particle in the base fluid works as magnetic particle hangs in when in the base fluid, around being equipped with solenoid respectively on the lateral surface of the upper end periphery of cooling tube and lower tip, works as magnetic particle deposits in when in the base fluid, around being equipped with solenoid on the lateral surface of the upper end of cooling tube, works as magnetic particle floats in when in the base fluid, around being equipped with solenoid on the lateral surface of the lower tip of cooling tube.

In another preferred mode, the chip is connected with the lower end surface of the radiating pipe through a thermal interface coating.

In another preferred mode, the radiating pipe is a cylinder or a cuboid.

In another preferred mode, the radiating pipe is made of copper, aluminum alloy or AlSiC.

In another preferred mode, the magnetic particles are a mixture of one or more of ferroferric oxide, iron nitride or iron boride.

In another preferred mode, the base liquid is a diester.

In another preferred mode, the device further comprises a temperature sensor arranged on the side surface of the chip and used for sensing the temperature of the chip.

In another preferred mode, the upper end of the radiating pipe is provided with an air channel or a water channel for assisting in radiating.

In another preferred mode, the number of turns of each electromagnetic coil increases from the middle section to the end section of the radiating pipe.

Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages: the chip heat dissipation device has the advantages of being simple to manufacture, small in size, high in integration level, high in heat dissipation efficiency and free of noise.

Drawings

Fig. 1 is a schematic structural diagram of an integrated magnetic fluid heat dissipation chip device in the first embodiment;

fig. 2 is a schematic view of the integrated magnetic fluid heat dissipation chip device according to the first embodiment when magnetic particles sink downward;

fig. 3 is a schematic diagram illustrating the magnetic particles in the integrated mhd heat dissipating chip device of the first embodiment moving upward to the top;

fig. 4 is a schematic structural diagram of an integrated magnetic fluid heat dissipation chip device according to a second embodiment;

fig. 5 is a schematic view of the integrated mhd heat dissipating chip device according to the second embodiment when magnetic particles move upward to the top;

fig. 6 is a schematic structural diagram of an integrated magnetic fluid heat dissipation chip device in the third embodiment;

fig. 7 is a schematic view of the integrated magnetic fluid heat dissipation chip device according to the third embodiment when the magnetic particles sink downward.

Detailed Description

The invention will be further described with reference to examples of embodiments shown in the drawings to which the invention is attached.

Example one

As shown in fig. 1 to 3, the integrated magnetic fluid 4 heat dissipating chip 2 device includes a substrate 1, a chip 2 mounted on the substrate 1, a sealed heat dissipating pipe 3 provided on the chip 2, a magnetic fluid 4 filled in the heat dissipating pipe 3, an electromagnetic coil 5 wound on the heat dissipating pipe 3, a temperature sensor 6 provided on a side surface of the chip 2 for sensing a temperature of the chip 2, and an air passage or a water passage 7 provided at an upper end portion of the heat dissipating pipe 3 for assisting heat dissipation.

The magnetic fluid 4 comprises a base liquid 42 and magnetic particles 41, the density of the magnetic particles 41 is equivalent to that of the base liquid 42, the magnetic particles 41 are suspended in the base liquid 42, electromagnetic coils are respectively wound on the outer side surfaces of the periphery of the upper end part and the lower end part of the radiating pipe 3, and the number of turns of each electromagnetic coil is increased from the middle section of the radiating pipe to the end part. The lower end faces of the chip 2 and the radiating pipe 3 are connected through the thermal interface coating 8, so that the connection part is in full contact, and the reduction of the heat conduction performance caused by overlarge gaps is avoided. The cooling tube 3 is cylinder or cuboid, and in this embodiment, the cooling tube 3 is confined cuboid, and the plane bottom fully contacts with 2 upper surfaces of chip, increases heat radiating area, improves the radiating efficiency. The radiating pipe 3 is made of materials with good thermal conductivity such as copper, aluminum alloy or AlSiC, and the magnetic fluid 4 is packaged in the radiating pipe 3. The magnetic particles 41 are one or a mixture of a plurality of nano particles with good thermal stability and high magnetization intensity, such as ferroferric oxide, iron nitride or iron boride. The base liquid 42 is a liquid having good heat dissipation properties and compatible with the magnetic fine particles 41, and includes: a diester. And acquiring the surface temperature of the chip in real time by using a temperature sensor. When the chip does not work, the temperature is lower than the preset temperature, the electromagnetic coil is not electrified, heat dissipation is not carried out through the magnetic fluid, and energy can be saved. When the chip starts to work and the real-time temperature is in different preset temperature intervals, the digital power supply regulates the speed of the movement of the magnetic fluid by regulating the current in the electromagnetic coil and the change speed of the electrifying time of the two coils. When the temperature of the chip is higher, the current can be increased to enable more magnetic particles to be concentrated at the heat source end or the cold source end, or the current change speed of the two coils can be accelerated, the flow of the magnetic fluid at the heat end and the cold end is accelerated, and the heat dissipation of the chip is accelerated. The upper end part of the radiating pipe can be additionally provided with a ventilation channel or a water flow channel, and when the magnetic fluid with large heat is adsorbed at the top end of the radiating pipe, the additionally arranged air flow or water flow can accelerate heat dissipation and take away a large amount of heat.

The magnetofluid is used as a heat exchange medium in the heat exchange process, the magnetofluid reciprocates up and down in a radiating pipe with the upper end and the lower end wound with electromagnetic coils, absorbs heat from the bottom end to become high-temperature magnetofluid, and then radiates at the top end to become low-temperature magnetofluid. The chip heat dissipation device has the characteristics of simple manufacture, small volume, high integration level, high heat dissipation efficiency and no noise.

Example two

As shown in fig. 1 to 3, the integrated magnetic fluid 4 heat dissipating chip 2 device includes a substrate 1, a chip 2 mounted on the substrate 1, a sealed heat dissipating pipe 3 provided on the chip 2, a magnetic fluid 4 filled in the heat dissipating pipe 3, an electromagnetic coil 5 wound on the heat dissipating pipe 3, a temperature sensor 6 provided on a side surface of the chip 2 for sensing a temperature of the chip 2, and an air passage or a water passage 7 provided at an upper end portion of the heat dissipating pipe 3 for assisting heat dissipation.

The magnetic fluid 4 comprises base liquid 42 and magnetic particles 41, the density of the magnetic particles 41 is greater than that of the base liquid 42 and is sunk in the base liquid 42, electromagnetic coils are wound on the outer side face of the upper end portion of the radiating pipe 3, the number of turns of the electromagnetic coils is increased progressively from the middle section of the radiating pipe to the end portion, and the lower end faces of the chip 2 and the radiating pipe 3 are connected through a thermal interface coating 8, so that the connecting portions are in full contact, and the reduction of the heat conduction performance caused by overlarge gaps is avoided. The cooling tube 3 is cylinder or cuboid, and in this embodiment, the cooling tube 3 is confined cuboid, and the plane bottom fully contacts with 2 upper surfaces of chip, increases heat radiating area, improves the radiating efficiency. The radiating pipe 3 is made of materials with good thermal conductivity such as copper, aluminum alloy or AlSiC, and the magnetic fluid 4 is packaged in the radiating pipe 3. The magnetic particles 41 are one or a mixture of a plurality of nano particles with good thermal stability and high magnetization intensity, such as ferroferric oxide, iron nitride or iron boride. The base liquid 42 is a liquid having good heat dissipation properties and compatible with the magnetic fine particles 41, and includes: a diester. And acquiring the surface temperature of the chip in real time by using a temperature sensor. When the chip does not work, the temperature is lower than the preset temperature, the electromagnetic coil is not electrified, heat dissipation is not carried out through the magnetic fluid, and energy can be saved. When the chip starts to work and the real-time temperature is in different preset temperature intervals, the digital power supply regulates the speed of the movement of the magnetic fluid by regulating the current in the electromagnetic coil and the change speed of the electrifying time of the two coils. When the temperature of the chip is higher, the current can be increased to enable more magnetic particles to be concentrated at the heat source end or the cold source end, or the current change speed of the two coils can be accelerated, the flow of the magnetic fluid at the heat end and the cold end is accelerated, and the heat dissipation of the chip is accelerated. The upper end part of the radiating pipe can be additionally provided with a ventilation channel or a water flow channel, and when the magnetic fluid with large heat is adsorbed at the top end of the radiating pipe, the additionally arranged air flow or water flow can accelerate heat dissipation and take away a large amount of heat.

The magnetic fluid is used as a heat exchange medium in the heat exchange process, the electromagnetic coils on the periphery of the upper end part of the radiating pipe enable the magnetic particles in the electromagnetic fluid to move upwards to drive the high-temperature magnetic fluid to move upwards to the top for heat dissipation, then the power supply is cut off, the magnetic particles move downwards under the action of gravity to drive the low-temperature magnetic fluid to move downwards to the bottom for absorbing the heat of the chip, and then the power supply is electrified again, so that the cycle is repeated. The chip heat dissipation device has the characteristics of simple manufacture, small volume, high integration level, high heat dissipation efficiency, low energy consumption and no noise.

EXAMPLE III

As shown in fig. 1 to 3, the integrated magnetic fluid 4 heat dissipating chip 2 device includes a substrate 1, a chip 2 mounted on the substrate 1, a sealed heat dissipating pipe 3 provided on the chip 2, a magnetic fluid 4 filled in the heat dissipating pipe 3, an electromagnetic coil 5 wound on the heat dissipating pipe 3, a temperature sensor 6 provided on a side surface of the chip 2 for sensing a temperature of the chip 2, and an air passage or a water passage 7 provided at an upper end portion of the heat dissipating pipe 3 for assisting heat dissipation.

The magnetic fluid 4 comprises base liquid 42 and magnetic particles 41, the density of the magnetic particles 41 is smaller than that of the base liquid 42, the magnetic particles float in the base liquid 42, electromagnetic coils are wound on the outer side face of the lower end portion of the radiating pipe 3, the number of turns of the electromagnetic coils is increased from the middle section of the radiating pipe to the end portion, and the chip 2 is connected with the lower end face of the radiating pipe 3 through a thermal interface coating 8, so that the connecting portion is in full contact, and the reduction of heat conduction performance caused by overlarge gaps is avoided. The cooling tube 3 is cylinder or cuboid, and in this embodiment, the cooling tube 3 is confined cuboid, and the plane bottom fully contacts with 2 upper surfaces of chip, increases heat radiating area, improves the radiating efficiency. The radiating pipe 3 is made of materials with good thermal conductivity such as copper, aluminum alloy or AlSiC, and the magnetic fluid 4 is packaged in the radiating pipe 3. The magnetic particles 41 are one or a mixture of a plurality of nano particles with good thermal stability and high magnetization intensity, such as ferroferric oxide, iron nitride or iron boride. The base liquid 42 is a liquid having good heat dissipation properties and compatible with the magnetic fine particles 41, and includes: a diester. And acquiring the surface temperature of the chip in real time by using a temperature sensor. When the chip does not work, the temperature is lower than the preset temperature, the electromagnetic coil is not electrified, heat dissipation is not carried out through the magnetic fluid, and energy can be saved. When the chip starts to work and the real-time temperature is in different preset temperature intervals, the digital power supply regulates the speed of the movement of the magnetic fluid by regulating the current in the electromagnetic coil and the change speed of the electrifying time of the two coils. When the temperature of the chip is higher, the current can be increased to enable more magnetic particles to be concentrated at the heat source end or the cold source end, or the current change speed of the two coils can be accelerated, the flow of the magnetic fluid at the heat end and the cold end is accelerated, and the heat dissipation of the chip is accelerated. The upper end part of the radiating pipe can be additionally provided with a ventilation channel or a water flow channel, and when the magnetic fluid with large heat is adsorbed at the top end of the radiating pipe, the additionally arranged air flow or water flow can accelerate heat dissipation and take away a large amount of heat.

The magnetic fluid is used as a heat exchange medium in the heat exchange process, the electromagnetic coils on the periphery of the lower end part of the radiating pipe enable the magnetic particles in the electromagnetic fluid to descend to drive the low-temperature magnetic fluid to descend to the bottom to absorb the heat of the chip, then the power supply is cut off, the magnetic particles ascend under the action of buoyancy to drive the high-temperature magnetic fluid to ascend to the top to dissipate the heat, then the power supply is electrified again, and the process is circulated. The chip heat dissipation device has the characteristics of simple manufacture, small volume, high integration level, high heat dissipation efficiency, low energy consumption and no noise.

The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.