阅读说明：本技术 一种改善双面液冷散热器均温性的结构 (Structure for improving temperature uniformity of double-sided liquid cooling radiator ) 是由 夏波涛 曾茂进 韩豪雷 方杰 于 2021-03-15 设计创作，主要内容包括：本发明涉及一种改善双面液冷散热器均温性的结构,该方案包括IGBT模块、上散热器、疏密翅片、下散热器及水嘴；所述IGBT模块位于上散热器和下散热器之间；所述疏密翅片设于IGBT模块的上下两侧面或其中一侧面,通过所述水嘴通入冷却液与疏密翅片进行热交换实现IGBT模块的散热；所述疏密翅片的翅片密度与IGBT模块的发热量呈正比；当IGBT模块上侧面发热量高时,上侧面的疏密翅片的翅片密度高于下侧面的翅片密度,本方案通过将疏密翅片的翅片与IGBT模块的发热量挂钩呈正比设置,使得每个IGBT模块的散热效果能够更好地得到平均,保证其均温性,从而起到更好地换热效果。(The invention relates to a structure for improving the temperature uniformity of a double-sided liquid cooling radiator, which comprises an IGBT module, an upper radiator, density fins, a lower radiator and a water nozzle; the IGBT module is positioned between the upper radiator and the lower radiator; the density fins are arranged on the upper side surface and the lower side surface of the IGBT module or one side surface of the IGBT module, and cooling liquid is introduced through the water nozzle to exchange heat with the density fins so as to realize heat dissipation of the IGBT module; the fin density of the density fins is in direct proportion to the heat productivity of the IGBT module; when the side calorific capacity was high on the IGBT module, the fin density of the density fin of going up the side was higher than the fin density of downside, and this scheme is the direct ratio setting through the fin with density fin and the calorific capacity couple of IGBT module for the radiating effect of every IGBT module can obtain more evenly, guarantees its temperature uniformity nature, thereby plays the effect of changing heat better.)

1. A structure for improving the temperature uniformity of a double-sided liquid cooling radiator is characterized by comprising an IGBT module, an upper radiator, density fins, a lower radiator and a water nozzle; the IGBT module is positioned between the upper radiator and the lower radiator; the density fins are arranged on the upper side surface and the lower side surface of the IGBT module or one side surface of the IGBT module, and cooling liquid is introduced through the water nozzle to exchange heat with the density fins so as to realize heat dissipation of the IGBT module; the fin density of the density fins is in direct proportion to the heat productivity of the IGBT module; when the heat generation of the upper side of the IGBT module is high, the fin density of the density fins of the upper side is higher than that of the lower side.

2. The structure for improving the temperature uniformity of a double-sided liquid cooling radiator according to claim 1, wherein when the power consumptions of the IGBT modules are different, the density fins are arranged along the length direction of the IGBT modules, and the density degrees of the fins are in a direct proportion relation with the power consumptions of the IGBT modules; when the power consumption of the IGBT modules is the same, the density of the fins gradually becomes denser from the water inlet to the water outlet of the water nozzle.

3. The structure of claim 2, wherein the density fins comprise a plurality of fin portions, and each fin portion corresponds to an IGBT module.

4. The structure of claim 1, wherein the upper heat sink includes an upper heat sink main body and an upper heat sink cover plate disposed below the upper heat sink main body, the lower heat sink includes a lower heat sink main body and a lower heat sink cover plate disposed above the lower heat sink main body, and the IGBT module is disposed between the upper heat sink cover plate and the lower heat sink cover plate.

5. The structure for improving the temperature uniformity of a double-sided liquid cooling radiator as claimed in claim 4, wherein the upper radiator body and the lower radiator body are both provided with heat exchange grooves, the heat exchange grooves are both communicated with the water nozzle, and the density fins are located in the heat exchange grooves.

6. The structure for improving the temperature uniformity of a double-sided liquid-cooled radiator of claim 5, wherein the density fins are located in the heat exchange grooves of the upper radiator main body, and the heat exchange grooves of the lower radiator main body are internally provided with the equal-density fins.

7. The structure for improving the temperature uniformity of a double-sided liquid-cooled radiator of claim 4, wherein the IGBT module is welded and fixed with the upper radiator cover plate or the lower radiator cover plate, and a side surface, which is not welded, of the IGBT module is provided with heat-conducting silicone grease or heat-conducting paste.

8. The structure for improving the temperature uniformity of a double-sided liquid-cooled radiator as claimed in claim 4, wherein the upper radiator cover plate and the lower radiator cover plate are both provided with anti-creeping grooves, and the anti-creeping grooves are both arranged towards one side of the IGBT module.

9. The structure for improving the temperature uniformity of a double-sided liquid-cooled radiator as claimed in claim 6, wherein the density fins are fixed to the upper radiator cover plate by brazing, and the equal-density fins are fixed to the lower radiator cover plate by brazing.

10. The structure for improving the temperature uniformity of a double-sided liquid-cooled radiator as claimed in claim 4, wherein the upper radiator cover plate is provided with a male head communicated with the water nozzle, and the lower radiator cover plate is provided with a female head communicated with the male head in a matching manner through a sealing ring.

Technical Field

The invention relates to an IGBT radiator, in particular to a structure for improving the temperature uniformity of a double-sided liquid cooling radiator.

Background

An Insulated Gate Bipolar Transistor (IGBT) module is a modular semiconductor product formed by bridging and packaging an IGBT (insulated Gate Bipolar transistor chip) and a field-programmable Gate diode (FWD) through a specific circuit; the packaged IGBT module is directly applied to equipment such as a frequency converter, a UPS (uninterrupted power supply) and the like.

The IGBT module has the characteristics of energy conservation, convenience in installation and maintenance, stable heat dissipation and the like; the IGBT is a core device for energy conversion and transmission, is used as a new strategic industry of China, and is widely applied in the fields of rail transit, smart power grids, aerospace, electric vehicles, new energy equipment and the like.

The IGBT is a high-power semiconductor device, the power loss is large, the heating phenomenon is serious, the IGBT chip is used as a main heating source, the position of the IGBT chip in a module can also influence the heat dissipation effect of a heat radiator, the liquid cooling heat radiator for the existing new energy automobile usually dissipates heat of the IGBT arranged in the middle of the module at the chip position, most of fin structures in the heat radiator are consistent, and the heat dissipation effect and the temperature uniformity are poor. When the IGBT chip is not positioned in the middle of the module, the upper surface and the lower surface of the module have different heat productivity, and the radiator cannot achieve good temperature uniformity.

In summary, a structure capable of significantly improving a double-sided heat dissipation structure of an IGBT heat sink is urgently needed.

Disclosure of Invention

The invention aims to provide a structure for improving the temperature uniformity of a double-sided liquid cooling radiator, aiming at the problems in the prior art.

In order to realize the purpose of the invention, the invention adopts the following technical scheme: a structure for improving the temperature uniformity of a double-sided liquid cooling radiator comprises an IGBT module, an upper radiator, density fins, a lower radiator and a water nozzle; the IGBT module is positioned between the upper radiator and the lower radiator; the density fins are arranged on the upper side surface and the lower side surface of the IGBT module or one side surface of the IGBT module, and cooling liquid is introduced through the water nozzle to exchange heat with the density fins so as to realize heat dissipation of the IGBT module; the fin density of the density fins is in direct proportion to the heat productivity of the IGBT module; when the heat generation of the upper side of the IGBT module is high, the fin density of the density fins of the upper side is higher than that of the lower side.

The working principle and the beneficial effects are as follows: 1. when the IGBT chip in the IGBT module is not positioned in the middle of the module, the heat productivity of the upper surface and the lower surface of the module is different, so that the density degree of fins, namely the heat exchange area, is adjusted according to the different heat productivity by adopting density fins, so that the heat exchange quantity is balanced, and the heat dissipation of the upper surface and the lower surface of the IGBT is more uniform;

2. the density fins on the side with low heat productivity of the opposite IGBT modules are kept unchanged, the uniformity of the temperature of the radiator is guaranteed, and meanwhile, the flow resistance cannot rise sharply, so that the influence on the flowing efficiency of the cooling liquid is reduced.

Furthermore, when the power consumptions of the IGBT modules are different, the density fins are arranged along the length direction of the IGBT modules, and the density degree of the fins is in direct proportion to the power consumption of the IGBT modules; when the power consumption of the IGBT modules is the same, the density of the fins gradually becomes denser from the water inlet to the water outlet of the water nozzle. This setting can adapt to the IGBT module of different models better, and especially the IGBT module consumption is higher, and calorific capacity is just higher, consequently sets up more encrypted fin, can improve the heat exchange capacity to can balance with the IGBT module heat dissipation capacity that the consumption is low, reduce different IGBT module temperature difference, guarantee the temperature uniformity nature. Therefore, when the IGBT chip part of the single IGBT module is combined in the middle, the temperature uniformity of the radiator can be better ensured by combining the scheme.

Further, the density fin comprises a plurality of fin parts, and each fin part corresponds to one IGBT module. According to the arrangement, the fin part area in the radiating fin is arranged, so that independent processing can be performed more conveniently, and the fin part area can be distinguished more conveniently.

Further, the upper radiator comprises an upper radiator main body and an upper radiator cover plate arranged below the upper radiator main body, the lower radiator comprises a lower radiator main body and a lower radiator cover plate arranged above the lower radiator main body, and the IGBT module is positioned between the upper radiator cover plate and the lower radiator cover plate. This setting is guaranteeing under the radiating circumstances of IGBT module, provides a simple structure's structure, is showing and has reduced assembly cost.

Further, all be equipped with the heat exchange groove on last radiator main part and the lower radiator main part, just the heat exchange groove all communicates with the water injection well choke, density fin is located the heat exchange groove. This setting, through letting in the coolant liquid in the water injection well choke, the coolant liquid carries out the heat exchange with density fin in the heat exchange tank, combines above-mentioned scheme, and the IGBT module is kept apart between two radiator cover boards, can prevent effectively that the IGBT module from intaking, guarantees that it has safe and reliable's operational environment, and density fin can be in the coolant liquid is steeped completely, need not to consider the waterproof design of IGBT module, is showing the effective heat exchange area who has improved density fin, has improved the radiating efficiency.

Furthermore, the density fins are positioned in the heat exchange groove of the upper radiator main body, and the equal-density fins are arranged in the heat exchange groove of the lower radiator main body. This setting, when the IGBT module consumption is the same, can make the higher one side of IGBT module surface temperature effectively dispel the heat to the bulk temperature of radiator reaches evenly, and the isopycnic fin of radiator is compared and all adopts density fin from top to bottom in addition, and the change of fluid flow area can not be too big, and the velocity of flow is relatively stable, thereby guarantees that the flow resistance can not sharply rise.

Furthermore, the IGBT module is welded and fixed with the upper radiator cover plate or the lower radiator cover plate, and one side surface, which is not welded, of the IGBT module is provided with heat-conducting silicone grease or heat-conducting paste. This setting is guaranteeing under this structure detachable condition, is showing the heat exchange efficiency who improves between IGBT module and last radiator cover board and the lower radiator cover board, because the life of brazing comparison heat conduction silicone grease is longer and heat conduction efficiency is better.

Furthermore, all be equipped with anti-creep electric groove on last radiator cover board and the lower radiator cover board, and anti-creep electric groove all sets up towards IGBT module one side. This setting, the anticreep electric recess can prevent that the electrified metal position of IGBT and insulating material from producing the phenomenon that the electric arc climbed along the crust, protects IGBT's insulating layer, can guarantee IGBT module's normal operating better.

Furthermore, the density fins and the upper radiator cover plate are fixed through brazing, and the equal-density fins and the lower radiator cover plate are fixed through brazing. This setting can reduce the heat transfer loss between density fin and the isopycnic fin and two radiator shroud better, compares and has now through modes such as silicone grease and heat conduction pad, and life is longer, and heat transfer efficiency is higher.

Furthermore, a male head communicated with the water nozzle is arranged on the upper radiator cover plate, and a female head communicated with the male head through a sealing ring in a matched mode is arranged on the lower radiator cover plate. This setting provides a simple to operate and the connected mode that sealing performance is good, can make things convenient for the connection between two upper and lower radiator cover plates well, improves sealing performance.

Drawings

FIG. 1 is an exploded view of the present invention;

FIG. 2 is a schematic structural view of an upper heat sink;

FIG. 3 is a schematic view of the structure of the lower heat sink;

FIG. 4 is a schematic view of the internal structure of the present invention;

FIG. 5 is a schematic diagram of one embodiment of the present invention;

fig. 6 is a surface temperature rise diagram of an IGBT power consumption 720w heat sink adopting this scheme.

In the figure, 1, an upper radiator cover plate; 2. an upper heat sink body; 3. density fins; 4. a lower heat sink cover plate; 5. a lower heat sink body; 6. an equal density fin; 7. pressing a plate; 8. a bolt; 9. a fin portion; 10. a heat exchange tank; 11. an anti-creep groove; 12. a male head; 13. a seal ring; 14. a female head; 15. a water nozzle; 16. An IGBT module.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, the above terms should not be construed as limiting the present invention.

As shown in fig. 1-3, the structure for improving the temperature uniformity of the double-sided liquid cooling radiator comprises an upper radiator, density fins 3, a lower radiator, a water nozzle 15 and a pressing plate 7, wherein the upper radiator comprises an upper radiator cover plate 1 and an upper radiator main body 2, the density fins 3 are arranged in the upper radiator cover plate 1 and the upper radiator main body 2, the lower radiator comprises a lower radiator cover plate 4 and a lower radiator main body 5, the lower radiator cover plate 4 and the lower radiator main body 5 are internally provided with equal-density fins 6, and the upper radiator and the lower radiator are arranged by bolts 8 through threaded holes of the pressing plate 7. The upper surface and the lower surface of the IGBT module 16 are respectively contacted with the upper radiator and the lower radiator, the cooling liquid enters the radiators from the water nozzle 15, double-sided heat dissipation is carried out on the IGBT module 16, the flow of the cooling liquid entering the radiators is lengthened, the water inlet temperature is increased, the density of the heat dissipation fins of the radiators is sequentially increased, the side with the higher surface temperature of the IGBT module 16 can effectively dissipate heat, the overall temperature of the radiators is uniform, and meanwhile, the equal-density fins of the lower radiator can ensure that the flow resistance of the radiators cannot rapidly increase. Wherein the pressure plate 7 can ensure the strength of the liquid cooling radiator.

When the heat generation of the upper side of the IGBT module 16 is high, the fin density of the density fins 3 on the upper side is higher than that on the lower side; when the power consumptions of the IGBT modules 16 are different, the density fins 3 are arranged along the length direction of the IGBT modules 16, and the density degree of the fins is in direct proportion to the power consumption of the IGBT modules 16; when the power consumption of the IGBT module 16 is the same, the density of the density fins 3 gradually becomes denser from the water inlet to the water outlet of the water nozzle 15. This setting to the IGBT module 16 of different models, can adapt to better, especially the IGBT module 16 consumption is higher, and calorific capacity is just higher, consequently sets up more encrypted fin, can improve the heat exchange capacity to 16 heat dissipation capacity with the low-power consumption can be balanced, reduce different IGBT module 16 temperature differences, guarantee the temperature uniformity nature. Therefore, when the IGBT chip part of the single IGBT module 16 is combined in the middle, the temperature uniformity of the radiator can be better ensured by combining the scheme.

Specifically, the density fin 3 includes a plurality of fin portions 9, and each fin portion 9 corresponds to one IGBT module 16. This setting, the fin portion 9 subregion setting among the radiating fin can be processed alone with man-hour conveniently more, also more conveniently distinguishes.

Specifically, the upper radiator includes an upper radiator main body 2 and an upper radiator cover plate 1 disposed below the upper radiator main body 2, the lower radiator includes a lower radiator main body 5 and a lower radiator cover plate 4 disposed above the lower radiator main body 5, and the IGBT module 16 is located between the upper radiator cover plate 1 and the lower radiator cover plate 4. This setting is guaranteeing under the radiating circumstances of IGBT module 16, provides a simple structure's structure, is showing and has reduced assembly cost.

Specifically, heat exchange grooves 10 are formed in the upper radiator main body 2 and the lower radiator main body 5, the heat exchange grooves 10 are communicated with the water nozzle 15, and the density fins 3 are located in the heat exchange grooves 10. This setting, through let in the coolant liquid in water injection well choke 15, the coolant liquid carries out the heat exchange with density fin 3 in heat exchange tank 10, combine above-mentioned scheme, IGBT module 16 keeps apart between two radiator cover boards, can prevent effectively that IGBT module 16 from intaking, guarantees that it has safe and reliable's operational environment, density fin 3 can be in the coolant liquid is steeped completely, need not to consider IGBT module 16's waterproof design, is showing the effective heat exchange area who has improved density fin 3, has improved the radiating efficiency.

Preferably, the IGBT module 16 is welded and fixed to the upper heat sink cover plate 1 or the lower heat sink cover plate 4, and a side surface of the IGBT module 16 not welded is provided with a heat conductive silicone grease or a heat conductive paste. This setting is guaranteeing under this structure detachable condition, is showing the heat exchange efficiency who improves between IGBT module 16 and last radiator cover 1 and the lower radiator cover 4, because the life of heat conduction silicone grease is longer and heat conduction efficiency is better than brazing.

Preferably, the upper radiator cover plate 1 and the lower radiator cover plate 4 are both provided with anti-creeping grooves 11, and the anti-creeping grooves 11 are both arranged towards one side of the IGBT module 16. With this arrangement, the normal operation of the IGBT module 16 can be better ensured. Preferably, the depth of the groove is 1-3mm, and the width is 2-5mm

Preferably, the density fins 3 and the upper radiator cover 1 are fixed by brazing, and the equal density fins and the lower radiator cover 4 are fixed by brazing. This setting can reduce the heat transfer loss between density fin 3 and the isopycnic fin and two radiator shroud better, compares and has now through modes such as silicone grease and heat conduction pad, and life is longer, and heat transfer efficiency is higher.

Referring to fig. 4, preferably, the upper radiator cover 1 is provided with a male head 12 communicated with a water nozzle 15, and the lower radiator cover 4 is provided with a female head 14 communicated with the male head 12 through a sealing ring 13. This setting provides a simple to operate and the connected mode that sealing performance is good, can make things convenient for the connection between two upper and lower radiator cover plates well, improves sealing performance.

In the present embodiment, referring to fig. 5, a total of three IGBT modules 16, namely, IGBT1, IGBT2, and IGBT3, are provided along the water inlet direction, according to the heat transfer manner:

Q＝hs△t；

wherein Q- - -heat transfer, W; h- - -Heat transfer coefficient, W/(m)²K); s- -heat transfer area, m²(ii) a Δ t- -temperature difference, K.

Then Q of IGBT1₁＝h·s₁·△t₁＝h·s₁·(t₁-t₀)；

Q of IGBT2₂＝h·s₂·△t₂＝h·s₂·(t₂-t₁’)；

Q of IGBT3₃＝h·s₃·△t₃＝h·s₃·(t₃-t₂’)。

As the temperature of the fluid is gradually increased in the heat transfer process, the temperature difference is gradually reduced, namely, delta t1> delta t2> delta t 3.

The temperature difference is small, and in order to ensure the temperature uniformity of the radiator, the heat transfer quantity is required to be equal, namely Q1-Q2-Q3, so when delta t1> delta t2> delta t3, s1 < s2 < s 3.

In order to realize the effect that the heat transfer area s1 is more than s2 is more than s3, the heat transfer area is increased and the temperature uniformity is improved by sequentially increasing the fin density of the radiator.

Referring to fig. 6, it can be seen that when the fin density scheme is adopted, the temperature of the radiator is higher as the flow of the cooling liquid entering the radiator is longer, and when the scheme is adopted, the temperature of the radiator is always within a certain range, and the temperature uniformity is obviously better.

The present invention is not described in detail in the prior art, and therefore, the present invention is not described in detail.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

Although terms such as the upper radiator cover plate 1, the upper radiator body 2, the density fins 3, the lower radiator cover plate 4, the lower radiator body 5, the equal density fins 6, the pressure plate 7, the bolts 8, the fin portions 9, the heat exchange grooves 10, the anti-creeping grooves 11, the male heads 12, the seal rings 13, the female heads 14, the water nozzles 15, the IGBT modules 16, and the like are used more herein, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed as being without limitation to any additional limitations that may be imposed by the spirit of the present invention.

The present invention is not limited to the above-mentioned preferred embodiments, and any other products in various forms can be obtained by anyone in the light of the present invention, but any changes in the shape or structure thereof, which have the same or similar technical solutions as those of the present application, fall within the protection scope of the present invention.