阅读说明：本技术 一种用于igbt的两相流冷却装置 (Two-phase flow cooling device for IGBT ) 是由 李萍 于 2020-11-20 设计创作，主要内容包括：本发明涉及一种用于IGBT的两相流冷却装置,包括换热冷板模块、混流管、储液缓冲罐、散热器和动力泵,换热冷板模块、混流管、储液缓冲罐和散热器依次环状连接形成冷却循环流道,动力泵接入冷却循环流道；换热冷板模块包括一个中空的壳体,壳体的两端接入冷却循环流道,壳体的一侧面为换热面板,换热面板的外侧面焊接IGBT,内侧面上设有换热翅片,在换热翅片上设有强化沸腾层。与现有技术相比,本发明具有实现小流量冷媒的高效散热,降低冷却装置对动力泵的功率要求和整体密闭性要求,提高工作稳定性等优点。(The invention relates to a two-phase flow cooling device for an IGBT (insulated gate bipolar transistor), which comprises a heat exchange cold plate module, a mixed flow pipe, a liquid storage buffer tank, a radiator and a power pump, wherein the heat exchange cold plate module, the mixed flow pipe, the liquid storage buffer tank and the radiator are sequentially connected in an annular manner to form a cooling circulation flow channel, and the power pump is connected into the cooling circulation flow channel; the heat exchange cold plate module comprises a hollow shell, the two ends of the shell are connected into a cooling circulation flow channel, one side face of the shell is a heat exchange panel, the outer side face of the heat exchange panel is welded with an IGBT (insulated gate bipolar translator), the inner side face of the heat exchange panel is provided with heat exchange fins, and reinforced boiling layers are arranged on the heat exchange fins. Compared with the prior art, the invention has the advantages of realizing the high-efficiency heat dissipation of the low-flow refrigerant, reducing the power requirement and the integral tightness requirement of the cooling device on the power pump, improving the working stability and the like.)

1. The two-phase flow cooling device for the IGBT is characterized by comprising a heat exchange cold plate module (1), a mixed flow pipe (4), a liquid storage buffer tank (5), a radiator (7) and a power pump (8), wherein the heat exchange cold plate module (1), the mixed flow pipe (4), the liquid storage buffer tank (5) and the radiator (7) are sequentially connected in an annular mode to form a cooling circulation flow channel, and the power pump (8) is connected into the cooling circulation flow channel; the heat exchange cold plate module (1) comprises a hollow shell (103), two ends of the shell (103) are connected into a cooling circulation flow channel, one side face of the shell (103) is a heat exchange panel (104), the outer side face of the heat exchange panel (104) is welded with an IGBT (2), heat exchange fins (101) are arranged on the inner side face, and reinforced boiling layers (102) are arranged on the heat exchange fins (101).

2. The two-phase flow cooling device for the IGBT according to claim 1, wherein the enhanced boiling layer (102) is a micro-nano porous layer.

3. The two-phase flow cooling device for the IGBT as claimed in claim 1, wherein a spoiler, a micro-channel or a spiral coil is arranged in the mixed flow pipe (4).

4. The two-phase flow cooling device for the IGBT as claimed in claim 3, wherein a spoiler is arranged in the flow mixing pipe (4), and the ratio of the axial length of the spoiler per 360 degrees of torsion to the inner diameter of the flow mixing pipe (4) is 4-6.

5. The two-phase flow cooling device for the IGBT according to claim 1, wherein the liquid storage buffer tank (5) comprises a liquid storage chamber (501) and a buffer chamber (503), the liquid storage chamber (501) and the buffer chamber (503) are isolated by an elastic membrane (502), and two ends of the liquid storage chamber (501) are connected into a cooling circulation flow channel.

6. A two-phase flow cooling device for IGBT according to claim 5 characterized in that said buffer chamber (503) is provided with air holes (504).

7. The two-phase flow cooling device for IGBT according to claim 5, characterized in that said elastic membrane (502) is PVC elastic membrane, silicone rubber elastic membrane, butyl rubber elastic membrane or EPDM elastic membrane.

8. The two-phase flow cooling device for the IGBT according to claim 1, wherein the device comprises a plurality of heat exchange cold plate modules (1), the plurality of heat exchange cold plate modules (1) are arranged side by side, and two ends of the plurality of heat exchange cold plate modules (1) are connected into a cooling circulation flow channel through a bus bar (9) together.

9. A two-phase flow cooling device for IGBTs according to claim 1, wherein said heat sink (7) is provided with a fan set (6).

10. The two-phase flow cooling device for the IGBT as claimed in claim 1, wherein the liquid refrigerant in the cooling circulation channel is an electron fluorinated liquid.

Technical Field

The invention relates to the field of IGBT heat dissipation, in particular to a two-phase flow cooling device for an IGBT.

Background

The current market mainly adopts forced air cooling and indirect liquid cooling technologies for the high-power IGBT chip heat dissipation mode.

The main air cooling mode is forced convection heat exchange of a fan and a radiating fin. The main disadvantages are: the heat dissipation efficiency is poor, and temperature control is unstable, receives the influence of space environment and temperature greatly, and the whole volume that occupies of forced air cooling device is big moreover, and the system is airtight, and is big to system's electronic components life-span influence.

The indirect liquid cooling technology is to cool the IGBT chip by a liquid cooling plate, stick the IGBT chip on the liquid cooling plate by heat conducting paste, heat conducting glue and the like, and then connect the liquid cooling plate into an external radiator for circulating heat dissipation. The main disadvantages are: the temperature of the control chip needs large flow of the refrigerant, so that the flow resistance of the whole system is large, the pressure is large, the requirement on the power of a system pump is high, the requirement on the tightness of the system is high, the fault is easy to occur, and the working stability is poor; meanwhile, the cooling liquid is generally water or glycol water solution, and has the risks of scaling, corrosion and the like for a long time.

Disclosure of Invention

The invention aims to overcome the defects in the prior art and provide a two-phase flow cooling device for an IGBT (insulated gate bipolar transistor), so that the efficient heat dissipation of a low-flow refrigerant is realized, the power requirement and the integral tightness requirement of the cooling device on a power pump are reduced, and the working stability is improved.

The purpose of the invention can be realized by the following technical scheme:

a two-phase flow cooling device for an IGBT comprises a heat exchange cold plate module, a mixed flow pipe, a liquid storage buffer tank, a radiator and a power pump, wherein the heat exchange cold plate module, the mixed flow pipe, the liquid storage buffer tank and the radiator are sequentially connected in an annular mode to form a cooling circulation flow channel, and the power pump is connected into the cooling circulation flow channel; the heat exchange cold plate module comprises a hollow shell, two ends of the shell are connected into a cooling circulation flow channel, one side face of the shell is a heat exchange panel, the outer side face of the heat exchange panel is welded with an IGBT (insulated gate bipolar translator), the inner side face of the heat exchange panel is provided with heat exchange fins, and reinforced boiling layers are arranged on the heat exchange fins.

Furthermore, the enhanced boiling layer is a micro-nano porous layer which is arranged in a laminated manner.

Furthermore, a turbulence strip, a micro-channel or a spiral coil is arranged in the flow mixing pipe.

Furthermore, the mixed flow pipe is internally provided with a turbulence strip, and the ratio of the axial length of each 360-degree torsion of the turbulence strip to the inner diameter of the mixed flow pipe is 4-6.

Further, the stock solution buffer tank include stock solution room and buffer chamber, keep apart through the elastic membrane between stock solution room and the buffer chamber, the both ends of stock solution room insert the cooling cycle runner.

Furthermore, the buffer chamber is provided with an air hole.

Further, the elastic membrane is a PVC elastic membrane, a silicon rubber elastic membrane, a butyl rubber elastic membrane or an EPDM elastic membrane.

Further, including a plurality of heat transfer cold drawing modules, a plurality of heat transfer cold drawing modules set up side by side, and the both ends of a plurality of heat transfer cold drawing modules are jointly passed through the busbar and are inserted the refrigeration cycle runner.

Furthermore, a fan set is arranged on the radiator.

Furthermore, the liquid refrigerant in the cooling circulation flow channel is electron fluorinated liquid.

Compared with the prior art, the invention has the following advantages:

1. the invention adds heat exchange fins with strengthened boiling layers in the traditional heat exchange cold plate, and adds a mixed flow tube and a liquid storage buffer tank in a cooling circulation flow passage. In the heat dissipation circulation process of the refrigerant, the evaporation core number of the refrigerant can be increased due to the enhanced boiling layer, and part of the refrigerant can be directly evaporated in the heat exchange cold plate to improve the heat dissipation efficiency; then leading the gas-liquid mixed refrigerant into the mixed flow pipe for fully mixing again to form single-phase liquid which enters the liquid storage buffer tank; the liquid storage buffer tank is used for adjusting pressure change caused by refrigerant phase change. Therefore, the invention realizes the high-efficiency heat dissipation of the low-flow refrigerant, can obviously reduce the power requirement on the power pump and the tightness requirement on the circulating flow channel, reduces the whole volume, improves the working stability and saves energy.

2. According to the invention, the IGBT and the heat exchange cold plate module are welded, so that the mutual thermal resistance is reduced, and the heat exchange efficiency is enhanced.

3. The mixed flow pipe is internally provided with a turbulent flow strip, a micro-channel or a spiral coil pipe, so that the gas-liquid mixing efficiency is improved.

4. Be equipped with the gas pocket on the surge chamber, can adjust the surge chamber atmospheric pressure better through external air pump device to improve the effect of stock solution buffer tank buffering and release.

5. The invention can arrange a plurality of heat exchange cold plate modules to be connected side by side, and is easy to assemble and adjust through the structure of the bus bar.

6. The liquid refrigerant in the invention adopts the electronic fluorinated liquid, has strong inertia, can not corrode a system, and improves the reliability.

Drawings

Fig. 1 is a schematic structural diagram of the first embodiment.

Fig. 2 is a schematic sectional view of the heat exchange cold plate module in fig. 1 in the direction of a.

FIG. 3 is a schematic structural view of a liquid storage buffer tank.

Fig. 4 is a schematic structural diagram of a heat exchange cold plate module according to a second embodiment.

Reference numerals: the heat exchange device comprises a 1-heat exchange cold plate module, 101-heat exchange fins, 102-enhanced boiling layers, 103-shells, 104-heat exchange panels, 2-IGBTs, 3-temperature sensors, 4-mixed flow pipes, 5-liquid storage buffer tanks, 501-liquid storage chambers, 502-elastic membranes, 503-buffer chambers, 504-air holes, 6-fan sets, 7-radiators, 8-power pumps and 9-busbars.

Detailed Description

The invention is described in detail below with reference to the figures and specific embodiments. The present embodiment is implemented on the premise of the technical solution of the present invention, and a detailed implementation manner and a specific operation process are given, but the scope of the present invention is not limited to the following embodiments.

Example one

As shown in fig. 1, the present embodiment provides a two-phase flow cooling device for IGBTs for a charging pile. The two-phase flow cooling device comprises a heat exchange cold plate module 1, a mixed flow pipe 4, a liquid storage buffer tank 5, a radiator 7 and a power pump 8. The heat exchange cold plate module 1, the mixed flow pipe 4, the liquid storage buffer tank 5 and the radiator 7 are sequentially connected in an annular mode to form a cooling circulation flow channel, and the power pump 8 is connected into the cooling circulation flow channel and specifically arranged between the heat exchange cold plate module 1 and the radiator 7. The IGBTs 2 are welded to the hot plate module 1.

The cooling cycle process of this example is: a liquid refrigerant with a certain supercooling degree is transmitted into the heat exchange cold plate module 1 through the power pump 8, partial vaporization is carried out in the heat exchange cold plate module 1, and a vapor-liquid mixture is discharged from the heat exchange cold plate module 1 and enters the vapor-liquid mixed flow pipe 4; gas refrigerant and liquid refrigerant are fully mixed in the mixed flow pipe 4 to form single-phase liquid which enters the liquid storage buffer tank 5; and finally, the liquid refrigerant enters the radiator 7 to be cooled and then enters the pump to complete the whole circulation.

As shown in fig. 2, the heat exchange cold plate module 1 includes a hollow housing 103, and both ends of the housing 103 are connected to the cooling circulation flow channel. The top surface of the shell 103 is a heat exchange panel 104, the outer side surface of the heat exchange panel 104 is welded with an IGBT2, the inner side surface is provided with heat exchange fins 101, and the heat exchange fins 101 are provided with reinforced boiling layers 102. The heat exchange panel 104 is made of pure copper, and the heat exchange fins 101 are processed by a wire cutting method. The thickness of heat exchange fins 101 is 2mm, the height of fins is 10mm, and the interval of fins is 2 mm. The heat exchange fins 101 effectively increase the surface area of the heat exchange panel 104, and the enhanced boiling layer 102 increases the number of vaporization cores, which is beneficial to directly vaporizing part of the refrigerant in the heat exchange cold plate module 1 to improve the heat dissipation efficiency. The enhanced boiling layer 102 is a micro-nano porous layer (a porous structure of micron or nano level), and a sintered copper powder layer, an adhered copper network layer, a grown nanowire layer, or the like may be used. The copper mesh is divided into three layers of 200 meshes, 200 meshes and 100 meshes from inside to outside in sequence, and vacuum pressure diffusion welding is adopted. The specific welding method is to arrange the copper mesh in the heat exchange fin 101, press the copper mesh by a meshing die under the pressure of 5MPa, and weld the copper mesh in a vacuum pressure diffusion welding furnace for 24 hours at the welding temperature of 800 ℃.

The IGBT2 and the heat exchange panel 104 are soldered by low-temperature solder paste, so that the thermal resistance between the IGBT2 and the heat exchange panel 104 is reduced.

The mixed flow pipe 4 is used for further and fully mixing the cooling liquid mixed by vapor and liquid of the high-efficiency heat exchange plate and changing the two-phase flow in the pipeline into single-phase flow. For sufficient mixing, at least one of a flow disturbing strip, a micro-channel or a spiral coil is arranged in the flow mixing pipe 4, and the flow disturbing strip is preferred in the embodiment. The torsion degree of the spoiler strips is represented by a full pitch H, namely the ratio of the axial length of each 360-degree torsion of the spoiler strips to the inner diameter Di of the circular pipe, namely the torsion rate YY is H/Di, and the torsion rate Y is generally designed to be 4-6, preferably 5.

As shown in fig. 3, the liquid storage buffer tank 5 is a container for storing liquid and a device for balancing system pressure, and can better adjust pressure variation caused by refrigerant phase change. The liquid storage buffer tank 5 comprises a liquid storage chamber 501 and a buffer chamber 503, the liquid storage chamber 501 and the buffer chamber 503 are isolated by an elastic membrane 502, and two ends of the liquid storage chamber 501 are connected to a cooling circulation flow channel. The buffer chamber 503 is provided with an air hole 504. The connection of the air vent 504 with an air pump is not shown. The specific function is that the pressure in the two-phase flow circulation flow channel is increased, the air pump air extraction buffer chamber 503 is reduced, and the liquid storage chamber 501 is increased to reduce the system pressure. On the contrary, the pressure in the two-phase flow circulation flow path decreases, the pumping buffer chamber 503 becomes large, and the liquid storage chamber 501 becomes small, increasing the system pressure. The elastic membrane 502 has super elasticity, and can satisfy small pressure difference and large deformation, and a PVC elastic membrane 502, a silicone rubber elastic membrane 502, a butyl rubber elastic membrane 502 or an EPDM elastic membrane 502 can be adopted, and the EPDM elastic membrane 502 is selected in this embodiment.

The specific working process of the liquid storage buffer tank 5 is that when the IGBT2 is not in operation, the system is filled with cooling liquid, and in order to keep the elastic membrane 502 from deforming, the buffer chamber 503 needs to be pressurized at a pressure of 50 KPa; when the system is operated, the two-phase flow is formed in the flow passage, and the gas occupies the volume of the space in the system, so that the pressure in the entire flow passage increases, the elastic membrane 502 starts to bulge toward the buffer chamber 503 to compress the space of the buffer chamber 503, the pressure in the buffer chamber 503 increases, and the pressure in the buffer chamber 503 is maintained to be constant by exhausting the air to maintain the pressure balance. As the IGBT2 is powered more, the refrigerant vaporizes more, the buffer chamber 503 is compressed more, and the more air is drawn out of the buffer chamber 503. When the IGBT2 is operated or the power is reduced, the refrigerant vaporization is reduced, the elastic membrane 502 is deformed again, and the buffer chamber 503 needs to be inflated to maintain the pressure balance of the whole system.

The radiator 7 is also provided with a fan set 6, and the fan set 6 and the radiator 7 finally release the heat of the IGBT2 to the atmosphere.

In this embodiment, the power pump 8 is specifically a magnetic pump; the fan is an axial flow fan; the radiator 7 is an air-cooled surface air cooler.

Temperature sensor 3 can also be equipped with between IGBT2 and heat transfer cold plate module 1 for connect the rotational speed of fan group 6 regulation fan, when temperature sensor 3 gathered the temperature and surpassed and set for the threshold value, through the rotational speed of PWM regulation control fan, improve the rotational speed of fan, with the temperature of reduction system, satisfy IGBT 2's heat dissipation demand.

The liquid refrigerant in the embodiment adopts the electronic fluorinated liquid, has strong inertia, cannot corrode a system, and improves the reliability.

Example two

As shown in fig. 4, the present embodiment is different from the first embodiment in that: have a plurality of heat transfer cold plate module 1 that set up side by side, the both ends of a plurality of heat transfer cold plate module 1 are passed through busbar 9 jointly and are connected into the cooling cycle runner, preferred four in this embodiment.

The foregoing detailed description of the preferred embodiments of the invention has been presented. It should be understood that numerous modifications and variations could be devised by those skilled in the art in light of the present teachings without departing from the inventive concepts. Therefore, the technical solutions available to those skilled in the art through logic analysis, reasoning and limited experiments based on the prior art according to the concept of the present invention should be within the scope of protection defined by the claims.