阅读说明：本技术 光元件搭载用封装件、电子装置以及电子模块 (Package for mounting optical element, electronic device, and electronic module ) 是由 北川明彦 木村贵司 于 2020-02-20 设计创作，主要内容包括：提供一种能够实现高散热性的光元件搭载用封装件、电子装置以及电子模块。光元件搭载用封装件具备：光学部件,反射光；以及基体,具有包含搭载光元件的第一搭载部以及搭载光学部件的第二搭载部的凹部。而且,光学部件具有反射面和反射面上的透射膜,透射膜的表面相对于反射面倾斜。电子装置在上述的光元件搭载用封装件搭载有光元件而构成。电子模块在上述的模块用基板搭载有电子装置而构成。(Provided are a package for mounting an optical element, an electronic device, and an electronic module, which can realize high heat dissipation. The package for mounting an optical element includes: an optical component that reflects light; and a base body having a recess including a first mounting portion for mounting the optical element and a second mounting portion for mounting the optical component. The optical member has a reflection surface and a transmission film on the reflection surface, and a surface of the transmission film is inclined with respect to the reflection surface. The electronic device is configured by mounting an optical element on the optical element mounting package. The electronic module is configured by mounting an electronic device on the module substrate.)

1. An optical element mounting package includes:

an optical component that reflects light; and

a base body having a recess including a first mounting portion for mounting an optical element and a second mounting portion for mounting the optical component,

the optical member has a reflection surface and a transmission film on the reflection surface, a surface of the transmission film being inclined with respect to the reflection surface.

2. The optical element mounting package according to claim 1, wherein,

the optical component is a flat-plate mirror,

the second mounting portion includes a recessed portion for positioning one edge portion of the flat mirror.

3. The optical element mounting package according to claim 1 or claim 2,

the transmissive film is thicker at a portion closer to the first mounting portion than at a portion farther from the first mounting portion.

4. The optical element mounting package according to any one of claims 1 to 3,

the optical member has a substrate having the reflecting surface on one surface,

the base material is thicker at a portion closer to the first mounting portion than at a portion farther from the first mounting portion.

5. The optical element mounting package according to any one of claims 1 to 4,

the optical component includes a portion bonded to the second mounting portion and a non-bonded portion on a rear surface thereof.

6. An electronic device is provided with:

the package for mounting an optical element according to any one of claims 1 to 5; and

and an optical element mounted on the first mounting portion.

7. An electronic module is provided with:

the electronic device of claim 6; and

and a module substrate on which the electronic device is mounted.

Technical Field

The invention relates to a package for mounting an optical element, an electronic device, and an electronic module.

Background

Conventionally, there is a TO (Transistor Outline) -Can type semiconductor laser on which a laser chip is mounted (see, for example, japanese patent application laid-open No. 2004-.

Disclosure of Invention

Means for solving the problems

The package for mounting an optical element according to the present disclosure includes:

an optical component that reflects light; and

a base body having a recess including a first mounting portion for mounting an optical element and a second mounting portion for mounting the optical component,

the optical member has a reflection surface and a transmission film on the reflection surface, a surface of the transmission film being inclined with respect to the reflection surface.

An electronic device according to the present disclosure is configured to include: the package for mounting an optical element; and an optical element mounted on the first mounting portion.

An electronic module according to the present disclosure includes: the electronic device and the module substrate on which the electronic device is mounted.

Drawings

Fig. 1 is an exploded perspective view showing an electronic device according to embodiment 1 of the present disclosure.

Fig. 2 is a vertical cross-sectional view showing an electronic device according to embodiment 1.

Fig. 3 is an enlarged view of a portion of the optical member of fig. 2.

Fig. 4A is an explanatory view of a first example, showing a method of mounting an optical component.

Fig. 4B illustrates a method of mounting an optical component, and is an explanatory view of a second example.

Fig. 5A is a light path diagram of a reflection surface having a transmission film.

Fig. 5B is an enlarged view of a portion of fig. 5A.

Fig. 5C is a light path diagram of the reflection surface of the comparative example without the transmission film.

Fig. 6A is a graph showing a relationship between parameters of the optical member and the light beam characteristics, and a relationship between the inclination angle of the transmissive film and the light beam characteristics.

Fig. 6B is a graph showing a relationship between parameters of the optical member and the light beam characteristics, and a relationship between the reflection surface angle and the light beam characteristics.

Fig. 6C is a graph showing the relationship between the parameter of the optical member and the light beam characteristic, and the relationship between the refractive index of the transmissive film and the light beam characteristic.

Fig. 7A is a diagram showing modification 1 of the optical member having a different mode of the transmissive film.

Fig. 7B is a diagram showing modification 2 of the optical member having a different mode of the transmissive film.

Fig. 7C is a diagram showing modification 3 of the optical member having a different mode of the transmissive film.

Fig. 7D is a diagram showing a modification 4 of the optical member having a different mode of the transmissive film.

Fig. 8 is a diagram showing a modification 5 of the optical member having a different base material type.

Fig. 9a1 is an explanatory diagram illustrating a bonding method 1 of an optical member.

Fig. 9a2 is an explanatory diagram illustrating a bonding method 1 of an optical member.

Fig. 9B1 is an explanatory diagram illustrating the bonding method 2 of the optical member.

Fig. 9B2 is an explanatory diagram illustrating the bonding method 2 of the optical member.

Fig. 9C1 is an explanatory diagram illustrating the bonding method 3 of the optical member.

Fig. 9C2 is an explanatory diagram illustrating the bonding method 3 of the optical member.

Fig. 10a1 is an explanatory diagram illustrating a bonding method 4 of an optical member.

Fig. 10a2 is an explanatory diagram illustrating a bonding method 4 of an optical member.

Fig. 10B1 is an explanatory diagram illustrating the bonding method 5 of the optical member.

Fig. 10B2 is an explanatory diagram illustrating the bonding method 5 of the optical member.

Fig. 10C1 is an explanatory diagram illustrating the bonding method 6 of the optical member.

Fig. 10C2 is an explanatory diagram illustrating the bonding method 6 of the optical member.

Fig. 11 is an exploded perspective view showing an electronic device according to embodiment 2 of the present disclosure.

Fig. 12 is a longitudinal sectional view showing a module device according to an embodiment of the present disclosure.

Detailed Description

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings.

(embodiment mode 1)

Fig. 1 is an exploded perspective view showing an electronic device according to embodiment 1 of the present disclosure. Fig. 2 is a vertical cross-sectional view showing an electronic device according to embodiment 1. Fig. 3 is an enlarged view of a portion of the optical member of fig. 2. Hereinafter, the respective directions will be described with the first main surface Su side of the substrate 2 as the upper side and the second main surface Sb side as the lower side, but the respective directions in the description do not necessarily coincide with the directions when the electronic device 10 is used.

The electronic device 10 according to embodiment 1 includes: a substrate 2 having a first main surface Su, a second main surface Sb, and a recess 3 opening to the first main surface Su; an optical element 11 and an optical member 8 mounted in the recess 3; the lid 9 closes the opening of the recess 3. The lid 9 is made of a material (glass or resin) that transmits light, and is bonded to the first main surface Su of the substrate 2 via a bonding material. The structure in which the cover 9, the optical element 11, and the auxiliary holder 12 are removed from the electronic device 10 corresponds to an optical element mounting package.

The base body 2 has: an upper base part 2A mainly comprising an insulating material and a lower base part 2B comprising a metal. The upper base 2A is provided with a through hole 3a penetrating in the vertical direction. The base lower portion 2B is provided with a concave hole 3B communicating with the through hole 3 a. The upper base 2A and the lower base 2B are joined together, and at the time of joining, the concave hole 3B communicates with the through hole 3a to form a concave portion 3 opened upward.

The basic shape portion of the base upper portion 2A includes a ceramic material such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body, for example. The above-described portion can be produced, for example, by forming a ceramic green sheet, which is a ceramic material before sintering, into a predetermined shape by punching, die processing, or the like and sintering the ceramic green sheet. The upper substrate 2A further includes electrodes D1 to D4 (fig. 1 and 2) disposed on the first main surface Su and wiring conductors passing therethrough. These conductors can be formed by applying or filling a conductor paste to predetermined positions of the ceramic green sheets before sintering, and sintering the conductor paste together with the ceramic green sheets. Further, the corner portions of the side surfaces of the upper base 2A may not be cut.

The base lower portion 2B is made of a metal material having high thermal conductivity, such as copper or aluminum, and can be formed by press forming, for example. The concave hole 3B of the base lower portion 2B includes a first mounting portion 4 on which the optical element 11 is mounted via the sub-mount 12 and a second mounting portion 5 on which the optical component 8 is mounted. The first mounting portion 4 is, for example, a flat surface extending in the horizontal direction. The term "planar" is a concept including a strict plane and a plane that is regarded as a plane when small irregularities are ignored. The second mounting portion 5 is a planar surface inclined with respect to the horizontal direction. The second mounting portion 5 is inclined in a direction upward as it is farther from the first mounting portion 4. The second mounting portion 5 may have a groove portion 5a lower than the first mounting portion 4. The second mounting portion 5 has a recessed portion 5b (fig. 2) for positioning one end portion of the optical component 8. The lower base 2B may also contain the same ceramic material as the upper base 2A. When the base lower portion 2B contains a ceramic material, it can be formed by die processing or the like. When the upper base portion 2A and the lower base portion 2B are made of the same sintered body, they may be integrally formed.

The optical element 11 is, for example, a laser diode (semiconductor laser). The light element 11 may be a light-emitting element having directivity. The optical element 11 is bonded to the upper surface of the auxiliary holder 12 via a bonding material, and the auxiliary holder 12 is bonded to the upper surface of the first mounting portion 4 via a bonding material. The light emitting direction of the optical element 11 is a direction (for example, a horizontal direction) along the upper surface of the first mounting portion 4 or the upper surface of the auxiliary holder 12 and faces the second mounting portion 5. The optical element 11 is electrically connected to the electrodes D3 and D4 in the recess 3 of the upper base portion 2A via bonding wires W1 and W2 and a wiring conductor of the auxiliary holder 12. The electrodes inside the recess 3 are connected to the electrodes D1 and D2 outside the recess 3 via wiring conductors, and the optical element 11 is driven by inputting power via the electrodes D1 and D2.

The optical member 8 is a flat mirror, and reflects light incident from the optical element 11 upward. The reflected light is emitted upward of the electronic device 10 through the lid 9. As shown in fig. 3, the optical member 8 includes a flat plate-like base material 8a, a reflective film 8b formed on one surface of the base material 8a, and a transmissive film 8c formed on the reflective film 8 b. The substrate 8a contains, for example, glass, metal such as Al, Ag, Si, or an organic material. When the substrate 8a contains metal, the reflective film 8b may be omitted, and in the above case, one surface of the substrate 8a functions as a reflective surface. The reflective surface may be planar in shape. The surface of the reflective film 8b functions as a reflective surface. The reflective film 8b is a metal film of Ag, Al, Au, Pt, Cr or the like, and is formed by a thin film manufacturing technique such as vapor deposition, sputtering, plating or the like. The transmission film 8c contains SiO, SiO₂、Al₂O₃、TiO、Ta₂O₅Dielectric multilayer film, MgF₂And a silicon acrylic coating. The transmissive film (protective film) 8c protects the reflective surface. The transmissive film 8c has uniform refractive index and uniform transparency independent of position. The transmissive film 8c has a thickness angle such that the surface S1 (fig. 3) is inclined with respect to the reflective surface S2 (fig. 3).

Fig. 4A and 4B are an explanatory view showing a first example of a method of mounting an optical component and an explanatory view showing a second example.

When the optical component 8 is mounted on the second mounting portion 5, one edge portion of the optical component 8 is positioned by abutting against the recessed portion 5b of the second mounting portion 5. Then, in the positioned state, the optical component 8 is joined to the second mounting portion 5. The optical member 8 is joined to the second mounting portion 5 via a solder such as SnAgCu or AuSu, a metal nanoparticle sintered material containing Ag, Cu, or the like as a main component, and a joining material such as an inorganic adhesive containing alumina, zirconia, or the like as a main component. As shown in fig. 4A, the optical component 8 may be mounted on the second mounting portion 5 with the second main surface Sb of the substrate 2 disposed horizontally. In the above mounting, the optical component 8 is disposed on the second mounting portion 5 in a state of being inclined with respect to the horizontal plane, and one edge portion is brought into contact with the recessed corner portion 5b by gravity, whereby the optical component 8 is positioned. Further, by curing the bonding material, the optical component 8 can be mounted with high positional accuracy. Alternatively, as shown in fig. 4B, the optical component 8 may be mounted with the second mounting portion 5 disposed horizontally on the base 2. In the case of the above mounting, the bonding material is cured in a state where the optical component 8 and the second mounting portion 5 are horizontal. By the above mounting method, the optical component 8 can be mounted with high accuracy of the tilt angle.

Fig. 5A to 5C are optical path diagrams of a reflection surface having a transmissive film, enlarged views thereof, and optical path diagrams of a reflection surface of a comparative example without a transmissive film.

As shown in fig. 5A and 5B, light incident to the transmissive film 8c and light traveling outward from the transmissive film 8c are refracted at the surface of the transmissive film 8 c. Further, the transmission film 8c has a thickness, and light that has passed through the transmission film 8c and has been reflected by the reflection surface is emitted from a position different from the incident position. Further, the angle of light traveling outward from the transmissive film 8C due to the thickness angle of the transmissive film 8C is closer to the vertical angle than the angle in the case where the incident light is totally reflected on the surface of the transmissive film 8C, as shown in fig. 5C. By the above-described operation, the configuration of fig. 5A and 5B can reduce the beam spread angle as compared with the configuration of the optical member 8R of fig. 5C in which total reflection is performed on the reflection surface. The change in the light beam characteristics is obtained by the action of the transmissive film 8c, and the characteristics such as the diffusion angle and the inclination of the light beam can be variously changed by changing the thickness angle, the inclination angle, the refractive index, and the like of the transmissive film 8 c.

Fig. 6A to 6C are diagrams showing a relationship between predetermined parameters of the optical member and the light beam characteristics, and are a graph showing a relationship between an inclination angle of the transmissive film and the light beam characteristics, a graph showing a relationship between a reflection surface angle and the light beam characteristics, and a graph showing a relationship between a refractive index of the transmissive film and the light beam characteristics, respectively. The beam tilt represents the vertical direction as 0 °. The value of fig. 6A is calculated under the fixed condition that the reflection surface angle is 45 ° and the refractive index of the transmissive film 8c is 1.5. The value of fig. 6B is calculated under the fixed condition that the inclination angle of the transmissive film 8c is 10 ° and the refractive index of the transmissive film 8c is 1.5. The value of fig. 6C is calculated under the fixed conditions that the angle of the reflection surface is 40 ° and the inclination angle of the transmission film 8C is 10 °. The angle of the reflecting surface represents the horizontal direction as 0 °. The inclination angle of the transmissive film 8c is an angle of the surface of the transmissive film 8c with respect to the reflective surface, and an inclination that decreases the thickness of the transmissive film 8c as the distance from the first mounting portion 4 increases is represented as a positive value. The refractive index of the transmissive film 8c can be changed depending on the material of the transmissive film 8 c. For example, the refractive index can be 1.4 to 1.8 by an optical glass material having different components, and the refractive index can be 1.5 to 1.9 by a resin material having different components.

As shown in fig. 6A to 6C, the inclination angle of the reflection surface of the optical member 8, the inclination angle of the transmissive film 8C, and the refractive index of the transmissive film 8C can be appropriately changed. By selecting these parameters, even if the beam characteristics of the optical element 11 are the same, the beam characteristics (emission angle and beam spread) of the light emitted from the electronic device 10 can be appropriately adjusted.

In embodiment 1, by selecting the inclination angle and the refractive index of the transmissive film 8c, the inclination angle of the reflective surface of the optical member 8 is set to an angle smaller than 45 ° and the reflected light of the optical member 8 is set to an angle close to the vertical direction, as compared with the case where the transmissive film 8c is not provided. By adopting the above configuration, as compared with a configuration in which the transmission film 8c having a thickness angle is not present, the height dimension of the electronic device 10 can be reduced by an amount corresponding to a small inclination angle of the reflection surface of the optical member 8, and emission of a light beam at a desired angle can be realized.

In embodiment 1, the inclination angle and the refractive index of the transmissive film 8c are selected so that the beam spread angle of the outgoing light from the electronic device 10 is smaller than the beam spread angle of the outgoing light from the optical element 11. With the above configuration, even when the beam spread angle of the optical element 11 is larger than a required beam spread angle, the transmission film 8c is selected to meet the required beam spread angle. On the other hand, the light beam spread angle of the light emitted from the electronic device 10 may be set larger than the light beam spread angle of the light emitted from the optical element 11 by selecting the inclination angle and the refractive index of the transmissive film 8 c. With the above configuration, even when the beam spread angle of the optical element 11 is smaller than the required beam spread angle, the transmission film 8c can be selected to meet the required beam spread angle.

Fig. 7A to 7D show modifications 1 to 4 of optical members having different types of transmissive films, respectively.

The optical member 8 as a flat mirror may have a transmissive film 8C formed on the entire reflective surface as shown in fig. 7A and 7B, for example, or may have a transmissive film 8C formed by removing edge portions E1 and E2 of the reflective surface as shown in fig. 7C and 7D. Further, as shown in fig. 7A and 7C, the thinnest part of the transmissive film 8C may have a substantially zero thickness, or as shown in fig. 7B and 7D, the thinnest part of the transmissive film 8C may have a thickness.

The transmission film 8c having a thickness angle can be manufactured by performing a film forming process by disposing the reflection surface obliquely with respect to the generation source of the molding material with respect to the state of being directed forward in a vacuum film forming apparatus such as vapor deposition or sputtering. By the above-mentioned manufacturing method, a thickness angle is formed in which the film is thicker as it approaches the generation source of the molding material and the film is thinner as it approaches the generation source of the molding material.

Alternatively, the transmissive film 8c having a thickness angle can be manufactured by arranging a plurality of substrates 8a having the reflective film 8b in an inclined state and performing a coating process by a sprayer. Here, the plurality of substrates 8a are arranged on the jig so as to fill the gap so that the coating liquid does not pass from the reflection surface to the surface at the deep position or fall off. The coating liquid sprayed to the reflecting surface is accumulated in a large amount in the deep part of the reflecting surface arranged on the jig with the gap filled. The large amount of the accumulated coating liquid is diffused to the entire reflection surface by surface tension, and the transmission film 8c is formed to be thinner as it approaches the nebulizer and thicker as it is farther from the depth of the nebulizer.

The transmissive film 8c avoiding the edge portion can be formed by masking the transmissive film 8c by a vacuum deposition apparatus or a sprayer when forming the transmissive film.

In embodiment 1, the optical member 8 is a flat mirror as shown in fig. 7A to 7D, and has a structure in which the thickness of the transmission film 8c is increased as it approaches the first mounting portion 4. According to the above configuration, the base material 8a warps in the vicinity of the first mounting portion 4 due to the stress when the transmissive film 8c is cured. The internal warp refers to a warp in the direction in which the transmissive film 8c side of the base material 8a contracts and the back surface extends. The internal warpage of the substrate 8a is caused by the stress of the transmissive film 8c generated during film formation, and the thicker the transmissive film 8c is, the larger the internal warpage is generated, and therefore the thicker the transmissive film 8c is. By the internal warpage of the base material 8a, the reflection angle of the emitted light can be further increased (made nearly vertical) on the side close to the optical element 11, and the return light of the light reflected from the side of the optical member 8 close to the optical element 11 toward the optical element 11 can be reduced. By reducing the return light, the reliability and lifetime of the optical element 11 can be improved.

Fig. 8 shows a modification 5 of the optical member having a different base material type.

As shown in fig. 8, the base material 8a of the optical component 8 may be thicker on the side closer to the first mounting portion 4. According to the above configuration, when heat from the optical element 11 is transferred to the optical member 8, the deformation of the optical member 8 due to heat can be reduced by making the base material 8a, which is positioned on the side where the heat is easily transferred, thick. Therefore, the distortion of the optical member 8 due to the heat generation of the optical element 11 can be reduced, and the deviation of the optical path of the light emitted from the electronic device 10 due to the heat generation can be suppressed. In fig. 8, the transmissive film 8c close to the first mounting portion 4 is configured to be thin, but the transmissive film 8c may be inclined in the opposite direction to the above configuration, and in this case, the effect of suppressing the displacement of the optical path due to heat generation is also obtained in the same manner.

Fig. 9a1 to 10C2 are explanatory views showing bonding methods 1 to 6 of optical members. Fig. 9a1 to 9C1 and 10a1 to 10C1 are rear views of the optical component 8 after bonding. Fig. 9a2 to 9C2 and fig. 10a2 to 10C2 are vertical sectional views of the optical component 8 and the second mounting portion 5.

As shown in bonding method 1, the entire rear surface of optical component 8 may be bonded to second mounting portion 5 via bonding material F. When solder such as SnAg is used as the bonding material, the bonding material F spreads to the entire rear surface of the optical component 8 due to surface tension when the bonding material is melted, and the entire rear surface is bonded to the second mounting portion 5.

When bonding is performed using a metal nanoparticle sintered material or an inorganic adhesive material, as in bonding methods 2 to 6, the bonding material F may be applied and cured only on a part of the back surface of the optical component 8, and the optical component 8 may be bonded to the second mounting portion 5. The local bonding position may be a rear center, a corner portion, a vertical side portion extending in the front-rear direction, a horizontal side portion extending in the left-right direction, or any combination thereof of the optical member 8. By providing the partial bonding, the stress applied from the bonding material F to the optical component 8 is relaxed, and the contact area between the base material 8a and the second mounting portion 5 is reduced, whereby the heat transfer to the base material 8a via the second mounting portion 5 can be reduced, and the thermal deformation of the optical component 8 can be suppressed. Therefore, displacement of the optical path of the outgoing light due to heat generation of the optical element 11 can be suppressed.

As described above, according to the electronic device 10 and the package for mounting an optical element in accordance with embodiment 1, a surface-mount type system is realized by a configuration in which the optical element 11 and the optical component 8 are mounted in the recess 3, and high heat dissipation can be obtained even when the electronic device is small in size. Further, by reflecting the light from the optical element 11 by the optical member 8, the light can be emitted upward. Further, by using the optical member 8 in which the surface of the transmission film 8c is inclined with respect to the reflection surface, even if the light beam characteristics of the optical element 11 are fixed, the requirements regarding the inclination angle and the diffusion angle of the light beam can be easily met by selecting the optical member 8.

Further, according to the electronic device 10 and the package for mounting an optical element according to embodiment 1, the optical component 8 is a flat mirror, and the second mounting portion 5 is provided with the recessed portion 5b for positioning one end portion of the optical component 8. Therefore, the mounting accuracy of the optical component 8 can be improved and the mounting process can be simplified.

Further, according to the electronic device 10 and the package for mounting an optical element of embodiment 1, the portion of the transmissive film 8c of the optical component 8 closer to the first mounting portion 4 is thicker than the portion farther from the first mounting portion 4. Therefore, the spread angle of the light beam can be reduced. Further, if the optical member 8 is a flat mirror, the base material 8a can be warped in the direction approaching the first mounting portion 4 by the stress of the transmissive film 8c, so that the return light to the optical element 11 can be reduced, and the reliability of the optical element 11 can be improved and the life of the optical element 11 can be prolonged.

Further, according to the electronic device 10 and the package for mounting an optical element according to embodiment 1, the optical member 8 is a flat mirror, and a portion of the base material 8a close to the first mounting portion 4 is thicker than a portion far from the first mounting portion 4. Therefore, when the heat diffused from the optical element 11 is transferred to the optical member 8, the heat capacity of the optical member 8 can be increased when the heat is transferred more. Therefore, the amount of deformation of the optical component 8 due to heat generation of the optical element 11 can be reduced, and further, displacement of the optical path of the emitted light due to heat generation can be suppressed.

Further, according to the electronic device 10 and the package for mounting an optical element according to embodiment 1, the back surface of the optical component 8 includes a portion to be bonded to the second mounting portion 5 and a non-bonded portion. Therefore, stress applied from the base 2 (base lower portion 2B) to the optical component 8 and heat transferred from the base 2 (base lower portion 2B) to the optical component 8 can be reduced. Therefore, stability and reliability of light emitted from the electronic device 10 can be improved.

(embodiment mode 2)

Fig. 11 is an exploded perspective view showing an electronic device according to embodiment 2 of the present disclosure. In embodiment 2, the same components as those in embodiment 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

The electronic device 10E according to embodiment 2 includes: a base body 2E having a recess 3; an optical element 11 and an optical member 8E mounted in the recess 3; and a lid 9 closing the opening of the recess 3. The structure in which the cover 9, the optical element 11, and the auxiliary holder 12 are removed from the electronic device 10E corresponds to an optical element mounting package.

The base 2E mainly contains an insulating material. The basic shape portion of the base 2E contains a ceramic material in the same manner as the base upper portion 2A of embodiment 1. Electrodes are formed on the upper surface of the concave portion 3, the second main surface Sb, the periphery of the opening of the concave portion 3 of the first main surface Su, and the like in the basic shape portion, and wiring conductors for electrically connecting the electrodes are formed inside the basic shape portion. The recess 3 includes a first mounting portion 4E having a horizontal planar shape and a second mounting portion 5E having a horizontal planar shape. In the first mounting portion 4E, the optical element 11 is mounted via the auxiliary holder 12, as in embodiment 1. The second mounting portion 5E is mounted with a block-shaped optical component 8E. The optical member 8E has a horizontal bottom surface and a reflection surface inclined with respect to the bottom surface, and the same transmission film 8c as in embodiment 1 is formed on the reflection surface.

As described above, in the electronic device 10E and the optical element mounting package according to embodiment 2, the configuration in which the optical element 11 and the optical component 8E are mounted in the recess 3 can realize a display surface mounting type system, and can obtain high heat dissipation even when the electronic device is small in size. Further, the light from the optical element 11 is reflected by the optical member 8, and the light can be emitted upward. Further, by using the optical member 8E in which the surface of the transmission film 8c and the reflection surface are inclined, even if the light beam characteristics of the optical element 11 are fixed, the requirements regarding the inclination angle and the spread angle of the light beam can be easily met by selecting the optical member 8.

In the electronic device 10E and the package for mounting an optical element according to embodiment 2, a mounting portion having the same shape as the second mounting portion 5 according to embodiment 1 may be used instead of the second mounting portion 5E, and the optical member 8 according to embodiment 1 may be used instead of the optical member 8E according to embodiment 2. The above-described use can also provide the effects obtained by the embodiment described in embodiment 1.

In the electronic device 10E and the package for mounting an optical element according to embodiment 2, a substrate in which the upper portion and the lower portion of the substrate are made of different materials and the lower portion includes a metal material may be used instead of the substrate 2E, as in the upper substrate portion 2A and the lower substrate portion 2B according to embodiment 1. By adopting the above, the heat dissipation of the optical element 11 can be further improved.

< electronic Module >

Fig. 12 is a vertical cross-sectional view illustrating a module device according to an embodiment of the present disclosure.

The electronic module 100 according to the embodiment of the present disclosure is configured by mounting the electronic device 10 on the module substrate 110. The module substrate 110 may be mounted with other electronic devices, electronic components, electric components, and the like, in addition to the electronic device 10. The module substrate 110 is provided with electrode pads 111, 112, and the electronic device 10 is bonded to the electrode pads 111 via a bonding material 113 such as solder. The electrodes D1 and D2 of the electronic device 10 may be connected to the electrode pads 112 of the module substrate 110 via bonding wires W11 and W12, and signals may be output from the module substrate 110 to the electronic device 10 via these electrodes.

Alternatively, the electronic module 100 according to the embodiment of the present disclosure may be configured such that the electronic device 10E according to embodiment 2 is mounted on the module substrate 110. In the case of the above configuration, the electrode provided on the second main surface Sb of the electronic device 10E and the electrode pad 111 of the module substrate 110 may be bonded via a bonding material such as solder, and a signal may be transmitted to the electronic device 10E via these members.

As described above, according to the electronic module 100 of the present embodiment, the electronic device 10 can emit light having a desired beam characteristic in a small component space.

The embodiments of the present disclosure have been described above. However, the above embodiments are merely examples. The present embodiment is described in all aspects as an example, and the present invention is not limited to this. The present disclosure can also be applied to embodiments in which combination, change, substitution, addition, omission, and the like are appropriately performed, as long as they are not contradictory. Further, it is understood that numerous modifications not illustrated can be devised without departing from the scope of the invention.

Industrial applicability

The present disclosure can be used for an optical element mounting package, an electronic device, and an electronic module.