阅读说明：本技术 半导体装置及半导体装置的制造方法 (Semiconductor device and method for manufacturing semiconductor device ) 是由 清水康贵 于 2021-03-12 设计创作，主要内容包括：涉及半导体装置及其制造方法。目的是提供可削减在对将半导体元件围绕的壳体进行成型时使用的模具的制造所耗费的时间和制造成本的技术。半导体装置(100)具有：基座板(2)；冷却板(1)；绝缘基板(3)；半导体元件(6)；壳体(7)；引线框(8),其与壳体(7)一体地形成并且在引线框的一个端部形成的端子(8a)凸出至壳体(7)外；以及封装材料(10)。壳体(7)具有：一对第1壳体部件(7a、7b),以彼此相对的方式配置；以及一对第2壳体部件(7c、7d),以与一对第1壳体部件(7a、7b)交叉并且彼此相对的方式配置。一对第1壳体部件(7a、7b)与一对第2壳体部件(7c、7d)通过彼此的两个端部连结而形成壳体(7)。(To a semiconductor device and a method of manufacturing the same. Provided is a technology which can reduce the time and manufacturing cost required for manufacturing a mold used for molding a case surrounding a semiconductor element. A semiconductor device (100) comprises: a base plate (2); a cooling plate (1); an insulating substrate (3); a semiconductor element (6); a housing (7); a lead frame (8) that is formed integrally with the housing (7) and a terminal (8a) formed at one end of the lead frame protrudes out of the housing (7); and an encapsulating material (10). The housing (7) has: a pair of first case members (7a, 7b) disposed so as to face each other; and a pair of 2 nd case members (7c, 7d) arranged so as to intersect the pair of 1 st case members (7a, 7b) and face each other. The pair of first case members (7a, 7b) and the pair of second case members (7c, 7d) are connected at both ends thereof to form a case (7).)

1. A semiconductor device, comprising:

a base plate;

a cooling plate fixed to a lower surface of the base plate;

an insulating substrate fixed to a region of an upper surface of the base plate except for a peripheral portion;

a semiconductor element mounted on an upper surface of the insulating substrate;

a case fixed to a peripheral edge portion of an upper surface of the base plate and surrounding the semiconductor element;

a lead frame which is formed integrally with the housing and has a terminal formed at one end portion; and

an encapsulating material filled in the case to cover the semiconductor element,

the housing has:

a pair of 1 st case members disposed in a manner opposing each other; and

a pair of 2 nd case members disposed so as to intersect the pair of 1 st case members and face each other,

the pair of 1 st case members and the pair of 2 nd case members are coupled at both ends thereof to form the case.

2. The semiconductor device according to claim 1,

a recess recessed in the horizontal direction is formed at both end portions of each of the 1 st case members,

convex portions protruding in the horizontal direction and fitted into the concave portions are formed at both end portions of each of the 2 nd case member,

the concave portion and the convex portion are fitted in a horizontal direction.

3. The semiconductor device according to claim 1,

bottom surfaces of the pair of 1 st case members and the pair of 2 nd case members are fixed to a peripheral edge portion of an upper surface of the base plate.

4. The semiconductor device according to claim 1,

the lead frame is a plurality of DLB frames, the DLBs are direct wire bonds,

the plurality of DLB frames are integrally formed with the pair of 1 st case members and the pair of 2 nd case members, respectively.

5. The semiconductor device according to claim 1,

a coupling surface that couples the pair of 1 st case members and the pair of 2 nd case members is formed at an angle of 90 ° <180 ° with respect to the upper surface of the base plate.

6. The semiconductor device according to claim 5,

each of the 2 nd case members has a screw fastening hole for fixing the 2 nd case member to the base plate,

the joining surface that forms an angle of 90 ° <180 ° with respect to the upper surface of the base plate is formed in each of the 2 nd case members.

7. The semiconductor device according to claim 2,

the convex portion of each 2 nd case member has a trapezoidal shape in which the length of the side on the leading end side is longer than the length of the side on the trailing end side in plan view.

8. The semiconductor device according to claim 1,

the pair of 1 st case members have the same shape, and the pair of 2 nd case members have the same shape.

9. The semiconductor device according to claim 1,

each of the 2 nd case members has an asymmetrical shape with respect to the center of each of the 2 nd case members in a plan view.

10. The semiconductor device according to claim 2,

the concave portion of each 1 st case member and the convex portion of each 2 nd case member are fixed by an adhesive.

11. A method for manufacturing a semiconductor device, which manufactures the semiconductor device according to any one of claims 1 to 10,

the method for manufacturing the semiconductor device comprises the following steps:

(a) arranging the lead frame on a die, wherein the lead frame is provided with a connecting rod part for being fixed on the die;

(b) injecting resin into the mold, molding the 1 st case member or the 2 nd case member, and performing insert molding of the lead frame with respect to the case member; and

(c) and cutting the connecting rod part after the insert molding.

Technical Field

The present invention relates to a semiconductor device having a case surrounding a semiconductor element and a method for manufacturing the same.

Background

The semiconductor device has a case that surrounds a semiconductor element. Since the housing is of an integral type structure, a large amount of time and manufacturing cost are required for manufacturing a mold used when molding the housing.

For example, patent document 1 discloses a container having a pair of flat plates disposed in parallel and facing each other, and a cylindrical portion formed by combining at least two side plates between the pair of flat plates.

Each side plate has: a groove part continuously or intermittently formed on the inner wall along a pair of end edge parts forming the opening part of the cylindrical part; and an engaging portion formed along the other two end edges of each side plate, for engaging the side plates with each other in a state of being combined as a cylindrical portion. Each flat plate has a fitting portion that is fitted into each groove portion of each side plate disposed adjacent to each flat plate. The flat plates are fixed in the axial direction of the cylindrical portion by fitting the fitting portions to the groove portions. This makes it possible to easily and inexpensively produce a container having a new shape.

Patent document 1: japanese laid-open patent publication No. 2005-150170

Terminals for connection to external wiring need to be provided in a case surrounding the semiconductor element. However, in the technique described in patent document 1, since each side plate is formed by heating and bending a synthetic resin plate, it is not possible to provide a terminal on the synthetic resin plate before the heating and bending. Therefore, the technique described in patent document 1 cannot solve the problems of time and manufacturing cost required for manufacturing the mold.

Disclosure of Invention

Accordingly, an object of the present invention is to provide a technique capable of reducing the time and manufacturing cost required for manufacturing a mold used for molding a case surrounding a semiconductor element.

The semiconductor device according to the present invention includes: a base plate; a cooling plate fixed to a lower surface of the base plate; an insulating substrate fixed to a region of an upper surface of the base plate except for a peripheral portion; a semiconductor element mounted on an upper surface of the insulating substrate; a case fixed to a peripheral edge portion of an upper surface of the base plate and surrounding the semiconductor element; a lead frame which is formed integrally with the housing and has a terminal formed at one end portion; and a sealing material filled in the case and covering the semiconductor element, the case having: a pair of 1 st case members disposed in a manner opposing each other; and a pair of 2 nd case members disposed so as to intersect the pair of 1 st case members and face each other, wherein the pair of 1 st case members and the pair of 2 nd case members are coupled at both ends thereof to form the case.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, it is possible to reduce the time and manufacturing cost required for manufacturing a mold used for molding a case surrounding a semiconductor element.

Drawings

Fig. 1 is a plan view of a semiconductor device according to embodiment 1.

Fig. 2 is a sectional view taken along line a-a of fig. 1.

Fig. 3 is an exploded perspective view of a housing of the semiconductor device.

Fig. 4 is a perspective view of a housing of the semiconductor device.

Fig. 5 is a perspective view showing an example of a connection portion between the 1 st case member and the 2 nd case member.

Fig. 6 is a perspective view showing another example of the coupling portion between the 1 st case member and the 2 nd case member.

Fig. 7 is a plan view showing an example of the 2 nd case member.

Fig. 8 is a plan view showing another example of the 2 nd case member.

Fig. 9 is a perspective view showing a method of manufacturing the 1 st housing member.

Fig. 10 is a plan view showing a method of manufacturing the 1 st housing member.

Fig. 11 is a plan view showing a method of manufacturing the 1 st housing member.

Fig. 12 is a cross-sectional view showing a state before the 1 st and 2 nd case members of the semiconductor device according to embodiment 2 are coupled to each other.

Fig. 13 is a cross-sectional view showing a state in which the 1 st case member and the 2 nd case member of the semiconductor device according to embodiment 2 are coupled to each other.

Fig. 14 is a sectional view of the semiconductor device according to embodiment 3.

Fig. 15 is a plan view showing a state in which the integrated housing is deformed.

Detailed Description

< embodiment 1>

Embodiment 1 will be described below with reference to the drawings. Fig. 1 is a plan view of a semiconductor device 100 according to embodiment 1. Fig. 2 is a sectional view taken along line a-a of fig. 1.

As shown in fig. 1 and 2, the semiconductor device 100 includes a base plate 2, a cooling plate 1, an insulating substrate 3, a semiconductor element 6, a case 7, a lead frame 8, a sealing material 10, and a cover 11.

The base plate 2 is formed of metal into a rectangular shape, for example. The cooling plate 1 is formed of, for example, metal into a rectangular shape and fixed to the lower surface of the base plate 2. Since the plan view profile of the cooling plate 1 is formed larger than the plan view profile of the base plate 2, the outer peripheral portion of the cooling plate 1 protrudes outward from the base plate 2.

The insulating substrate 3 is fixed to the region of the upper surface of the base plate 2 except for the peripheral edge portion. The insulating substrate 3 has an insulating layer 4 and a circuit pattern 5 formed on an upper surface of the insulating layer 4. The circuit pattern 5 is formed of a metal such as copper, for example.

The semiconductor element 6 is mounted on the upper surface of the circuit pattern 5. In fig. 2, two semiconductor elements 6 are mounted, but the number of semiconductor elements 6 is not limited to two.

The case 7 is fixed to a peripheral portion of the upper surface of the base plate 2 by an adhesive, and is fixed to the base plate 2 and the cooling plate 1 by four bolts 12. The case 7 surrounds the insulating substrate 3 and the semiconductor element 6. Here, the case 7 is not an integral type but is divided into 4 portions, and is formed by connecting both ends in the longitudinal direction of the pair of 1 st case members 7a and 7b and both ends in the longitudinal direction of the pair of 2 nd case members 7c and 7 d. Details of the housing 7 will be described later.

The lead frame 8 has a terminal 8a formed at one end. The lead frame 8 is integrally formed with the housing 7 by insert molding. The other end of the lead frame 8 is connected to the semiconductor element 6 via a wire 9.

The sealing material 10 is filled in the case 7 to cover the insulating substrate 3 and the semiconductor element 6. The encapsulating material 10 is a thermosetting resin, such as an epoxy resin. The cover 11 is fitted into the inner peripheral side of the case 7 so as to cover the upper surface of the sealing material 10. The cover 11 is, for example, a resin plate or a metal plate.

Next, the details of the housing 7 will be described. Fig. 3 is an exploded oblique view of the housing 7. Fig. 4 is an oblique view of the housing 7.

As shown in fig. 1, 3 and 4, the housing 7 has a pair of 1 st housing members 7a, 7b and a pair of 2 nd housing members 7c, 7 d. The pair of first case members 7a and 7b are formed in the same shape so as to extend in the X direction, and are arranged so as to face each other in the Y direction. That is, the pair of first casing members 7a and 7b are a pair of wall portions facing in the Y direction.

The pair of 2 nd case members 7c and 7d are formed in the same shape so as to extend in the Y direction, and are arranged so as to face each other in the X direction. That is, the pair of 2 nd case members 7c, 7d are a pair of wall portions facing in the X direction. As shown in fig. 1 and 2, bottom surfaces of the pair of 1 st case members 7a, 7b and the pair of 2 nd case members 7c, 7d are fixed to a peripheral edge portion of the upper surface of the base plate 2.

Next, the connection between the pair of 1 st case members 7a and 7b and the pair of 2 nd case members 7c and 7d will be described. Fig. 5 is a perspective view showing an example of a connection portion between the 1 st casing member 7a and the 2 nd casing member 7 c. Fig. 6 is a perspective view showing another example of the connection portion between the 1 st casing member 7a and the 2 nd casing member 7 c. Since the pair of 1 st case members 7a and 7b have the same shape and the pair of 2 nd case members 7c and 7d have the same shape, only the connection between the 1 st case member 7a and the 2 nd case member 7c will be described here.

As shown in fig. 3 to 5, recessed portions 15 recessed in the horizontal direction are formed at both ends in the longitudinal direction of the 1 st case member 7 a. At both ends in the longitudinal direction of the 2 nd case member 7c, projections 14 are formed which project in the horizontal direction and which fit into the recesses 15. The convex portion 14 of the 2 nd case member 7c has a trapezoidal shape in which the length of the side on the leading end side is longer than the length of the side on the trailing end side in plan view. The recess 15 of the 1 st case member 7a has a trapezoidal shape in which the length of the side on the leading end side is shorter than the length of the side on the trailing end side in plan view.

The recess 15 of the 1 st casing member 7a and the projection 14 of the 2 nd casing member 7c are fitted in the horizontal direction, whereby the 1 st casing member 7a and the 2 nd casing member 7c are coupled. This enables the 1 st case member 7a and the 2 nd case member 7c to be positioned in the horizontal direction, and the case 7 can be easily assembled.

As shown in fig. 6, the concave portion 15 of the 1 st case member 7a and the convex portion 14 of the 2 nd case member 7c may be further fixed by an adhesive 16. This makes the connection between the 1 st casing member 7a and the 2 nd casing member 7c stronger.

Next, the shape of the 2 nd case members 7c and 7d will be described with reference to fig. 7 and 8. Fig. 7 is a plan view showing an example of the 2 nd case member 7 c. Fig. 8 is a plan view showing another example of the 2 nd case member 7 c. Since the 2 nd case members 7c and 7d have the same shape, only the shape of the 2 nd case member 7c will be described here.

As shown in fig. 7, the 2 nd case member 7c has an asymmetrical shape with respect to the center of the 2 nd case member 7c in a plan view. Specifically, the lengths l1, l2 of the 2 nd case member 7c from the center to the convex portion 14 are different. Alternatively, as shown in fig. 8, the lengths l1 and l2 from the center to the convex portion 14 are the same, but a convex portion 14a having a size larger than that of the convex portion 14 is formed at one end of the 2 nd case member 7 c.

Since the 2 nd case member 7c has the shape as shown in fig. 7 or 8, an assembly error can be suppressed when the case 7 is assembled, and thus the yield of the case 7 is improved.

Next, a method for manufacturing the 1 st case member 7b forming a part of the case 7 will be described. Fig. 9 is a perspective view showing a method of manufacturing the 1 st case member 7 b. Fig. 10 and 11 are plan views showing a method of manufacturing the 1 st case member 7 b. Note that the 1 st case member 7a and the 2 nd case members 7c and 7d are manufactured by the same method as the 1 st case member 7b, and therefore, the description thereof is omitted.

First, the lead frame 8 is set in a mold, and the lead frame 8 has the connection rod portion 8b for fixing to the mold. Next, if resin is injected into the mold, the 1 st case member 7b is molded, and the lead frame 8 is insert-molded with respect to the 1 st case member 7b, the 1 st case member 7b shown in fig. 9 is obtained. As shown in fig. 10, if the connecting rod portion 8b is cut after the insert molding, the 1 st case member 7b shown in fig. 11 is obtained. The 1 st housing part 7b shown in fig. 11 is used for assembly of the housing 7.

As described above, the semiconductor device 100 according to embodiment 1 includes: a base plate 2; a cooling plate 1 fixed to the lower surface of the base plate 2; an insulating substrate 3 fixed to a region other than a peripheral portion of the upper surface of the base plate 2; a semiconductor element 6 mounted on the upper surface of the insulating substrate 3; a case 7 fixed to a peripheral edge portion of the upper surface of the base plate 2 so as to surround the semiconductor element 6; a lead frame 8 formed integrally with the housing 7 and having a terminal 8a formed at one end portion; and a sealing material 10 filled in the case 7 and covering the semiconductor element 6, the case 7 having: a pair of 1 st case members 7a, 7b arranged so as to face each other; and a pair of 2 nd case members 7c and 7d arranged so as to intersect the pair of 1 st case members 7a and 7b and face each other, and the pair of 1 st case members 7a and 7b and the pair of 2 nd case members 7c and 7d are connected at both ends thereof to form the case 7.

Therefore, the case 7 can be divided into the pair of 1 st case members 7a and 7b and the pair of 2 nd case members 7c and 7d, and the shapes of the members can be simplified. This can reduce the time and manufacturing cost required for manufacturing the mold used for molding the case 7 surrounding the semiconductor element 6. In addition, the yield of the case 7 can be improved by simplifying the shape of the components.

Further, by dividing the case 7, stress applied to the case 7 when the base plate 2 is attached to the cooling plate 1 can be relaxed as compared with the case of the integrated case, and therefore reliability of the semiconductor device 100 is improved.

Further, as shown in fig. 15, in the case of the integrated housing 27, since the housing 27 is shrunk and deformed at the time of manufacturing the housing 27, there is a problem that the fitting property with the cover 11 fitted to the inner peripheral side of the housing 27 and the positioning of the terminal 8a become difficult. However, the semiconductor device 100 according to embodiment 1 can solve such a problem. Fig. 15 is a plan view showing a state in which the integrated housing 27 is deformed.

Further, recessed portions 15 recessed in the horizontal direction are formed at both end portions of the 1 st casing members 7a, 7b, and protruding portions 14 protruding in the horizontal direction and fitted into the recessed portions 15 are formed at both end portions of the 2 nd casing members 7c, 7d, and the recessed portions 15 and the protruding portions 14 are fitted in the horizontal direction. When the semiconductor device 100 operates, the base plate 2 deforms in the vertical direction, and the case 7 follows the deformation in the vertical direction. This can relax the stress applied to the case 7, as compared with the case of the integrated case, thereby improving the reliability of the semiconductor device 100.

Further, since the bottom surfaces of the pair of 1 st case members 7a, 7b and the pair of 2 nd case members 7c, 7d are fixed to the peripheral edge portion of the upper surface of the base plate 2, the stress applied to the case 7 can be further relaxed. This further improves the reliability of the semiconductor device 100.

Further, since the convex portions 14 of the respective 2 nd case members 7c and 7d have a trapezoidal shape in which the length of the side on the front end side is longer than the length of the side on the rear end side in plan view, the 1 st case members 7a and 7b and the respective 2 nd case members 7c and 7d can be positioned, and the case 7 can be easily assembled.

Further, since the concave portions 15 of the 1 st case members 7a and 7b and the convex portions 14 of the 2 nd case members 7c and 7d are fixed by the adhesive 16, the 1 st case members 7a and 7b and the 2 nd case members 7c and 7d are more firmly coupled. This can suppress leakage of the sealing material 10, and therefore, the yield of the case 7 is improved.

Further, since the pair of 1 st case members 7a and 7b have the same shape and the pair of 2 nd case members 7c and 7d have the same shape, the number of types of case members forming the case 7 is reduced, and the time required for manufacturing the case 7 can be reduced.

Further, since the respective 2 nd case members 7c and 7d have asymmetric shapes with respect to the centers of the respective 2 nd case members 7c and 7d in plan view, assembly errors can be suppressed when the case 7 is assembled, and therefore, the yield of the case 7 is improved.

The method for manufacturing the semiconductor device 100 includes the steps of: a step (a) of providing a lead frame 8 in a mold, the lead frame 8 having a connecting rod portion 8b for fixing to the mold; a step (b) of injecting resin into the mold, molding the 1 st case members 7a, 7b or the 2 nd case members 7c, 7d, and insert-molding the lead frame 8 into the case members; and a step (c) of cutting the connecting rod portion 8b after the insert molding.

Therefore, the terminals 8a can be prevented from being washed away by the resin when the 1 st case members 7a and 7b and the 2 nd case members 7c and 7d are molded, and thus the yield of the case 7 is improved.

< embodiment 2>

Next, a semiconductor device 100 according to embodiment 2 will be described. Fig. 12 is a sectional view showing a state before the 1 st casing member 7a and the 2 nd casing member 7c are coupled. Fig. 13 is a sectional view showing a state in which the 1 st casing member 7a and the 2 nd casing member 7c are coupled. In embodiment 2, the same components as those described in embodiment 1 are denoted by the same reference numerals, and description thereof is omitted.

As shown in fig. 12 and 13, embodiment 2 differs from embodiment 1 in the structure of the coupling portion between the 1 st casing member 7a and the 2 nd casing member 7 c. The end surfaces, i.e., the coupling surfaces, of both ends of the 1 st case member 7a in the longitudinal direction are inclined surfaces. The connection surfaces, which are the surfaces of the 1 st case member 7a and 7b at both ends in the longitudinal direction of the 2 nd case member 7c, are inclined surfaces. In a state where the coupling surface of the 1 st case member 7a is coupled to the coupling surface of the 2 nd case member 7c, the 1 st case member 7a and the 2 nd case member 7c are coupled to each other by fastening the bolt 12 to the screw fastening hole 13 of the 2 nd case member 7c and the through hole 2a of the base plate 2.

The coupling surface forming the coupling of the 1 st casing member 7a and the 2 nd casing member 7c is at an angle of 90 ° <180 ° with respect to the upper surface of the base plate 2. Specifically, the coupling surface of the 2 nd casing member 7c is at an angle of 90 ° <180 ° with respect to the upper surface of the base plate 2, and the coupling surface of the 1 st casing member 7a is at an angle of 90 ° >0 with respect to the upper surface of the base plate 2. Alternatively, the coupling surface of the 1 st case member 7a is at an angle of 90 ° <180 ° with respect to the upper surface of the base plate 2, and the coupling surface of the 2 nd case member 7c is at an angle of 90 ° >0 with respect to the upper surface of the base plate 2.

This enables horizontal positioning of the 1 st casing member 7a and the 2 nd casing member 7 c. Further, the shape in the vertical direction of the connecting surface of the 1 st casing member 7a and the 2 nd casing member 7c allows the 1 st casing member 7a or the 2 nd casing member 7c to move with a degree of freedom in the vertical direction.

Further, as shown in fig. 13, when the coupling surface of the 2 nd casing member 7c having the screw fastening hole 13 is at an angle of 90 ° <180 ° with respect to the upper surface of the base plate 2, it is possible to suppress the 1 st casing member 7a, which is not fixed by screw fastening, from excessively moving in the vertical direction.

As described above, in the semiconductor device 100 according to embodiment 2, the connection surfaces that connect the pair of first case members 7a and 7b and the pair of second case members 7c and 7d are formed at an angle of 90 ° <180 ° with respect to the upper surface of the base plate 2. Therefore, the 1 st case members 7a and 7b and the 2 nd case members 7c and 7d can be positioned in the horizontal direction. Further, since the 1 st case member 7a or 7b or the 2 nd case member 7c or 7d can be moved with a degree of freedom in the vertical direction, the assembling property of the case 7 is improved.

The 2 nd case members 7c and 7d have screw fastening holes 13 for fixing the 2 nd case members 7c and 7d to the base plate 2, and coupling surfaces that form an angle of 90 ° <180 ° with respect to the upper surface of the base plate 2 are formed in the 2 nd case members 7c and 7 d.

Therefore, the 1 st case members 7a, 7b and the 2 nd case members 7c, 7d can be positioned in the vertical direction. Further, since the 1 st case members 7a and 7b without the screw fastening hole 13 can be freely moved in the vertical direction, the base plate 2 is deformed in the vertical direction when the semiconductor device 100 is operated, and the case 7 follows the deformation in the vertical direction. This can alleviate stress applied to the housing 7, and can suppress excessive vertical movement of the 1 st housing members 7a and 7b, which are not fixed by screw fastening, as compared with the case of the integrated housing.

< embodiment 3>

Next, a semiconductor device 100 according to embodiment 3 will be described. Fig. 14 is a sectional view of a semiconductor device 100 according to embodiment 3. In embodiment 3, the same components as those described in embodiment 1 are denoted by the same reference numerals, and description thereof is omitted.

As shown in fig. 14, in embodiment 3, the Lead frame 8 is a plurality of DLB (Direct Lead Bonding) frames integrally formed with the pair of 1 st case members 7a, 7b and the pair of 2 nd case members 7c, 7d, respectively. In fig. 14, illustration of the cooling plate 1, the sealing material 10, and the cover 11 is omitted.

In embodiment 3, unlike the case where the semiconductor element 6 is wired by the lead 9 as in embodiments 1 and 2, it is necessary to bond the DLB frame formed of a highly rigid copper or aluminum plate to the semiconductor element 6. Therefore, high accuracy is required for positioning in the vertical direction with respect to the warping of the base plate 2. However, by dividing the housing 7 so as to be movable in the vertical direction, the housing 7 can easily follow the warpage of the base plate 2.

As described above, in the semiconductor device 100 according to embodiment 3, the lead frame 8 is a plurality of DLB frames, and the DLB frames are integrally formed with the pair of first case members 7a and 7b and the pair of second case members 7c and 7d, respectively.

Therefore, the case 7 can follow the warpage of the base plate 2, and therefore, the yield of the semiconductor device 100 is improved, and the degree of freedom in designing the semiconductor device 100 is also improved.

Further, the respective embodiments can be freely combined, or can be appropriately modified or omitted.

Description of the reference numerals

1 cooling plate, 2 base plate, 3 insulating substrate, 6 semiconductor element, 7 casing, 7a, 7b 1 st casing component, 7c, 7d 2 nd casing component, 8 lead frame, 8a terminal, 8b connecting rod part, 10 packaging material, 14 convex part, 15 concave part, 16 adhesive, 100 semiconductor device.