Electronic package and manufacturing method and bearing structure thereof
阅读说明:本技术 电子封装件及其制法与承载结构 (Electronic package and manufacturing method and bearing structure thereof ) 是由 陈汉宏 林荣政 余国华 林长甫 于 2019-04-25 设计创作,主要内容包括:一种电子封装件及其制法与承载结构,包括:承载件,其具有至少一穿孔;电子元件,其设于该承载件上并电性连接该承载件;以及强化体,其设于该穿孔中并凸出该承载件,其中,该强化体未电性连接该承载件及该电子元件,以经由该强化体有效分散热应力,避免该电子元件与该承载件分离。(An electronic package, a method for fabricating the same and a carrier structure thereof, comprising: a carrier having at least one through hole; the electronic element is arranged on the bearing piece and is electrically connected with the bearing piece; and the strengthening body is arranged in the through hole and protrudes out of the bearing piece, wherein the strengthening body is not electrically connected with the bearing piece and the electronic element so as to effectively disperse thermal stress through the strengthening body and avoid the separation of the electronic element and the bearing piece.)
1. An electronic package, comprising:
a carrier having at least one through hole;
the electronic element is arranged on the bearing piece and is electrically connected with the bearing piece; and
the strengthening body is arranged in the through hole and protrudes out of the bearing piece, wherein the strengthening body is not electrically connected with the bearing piece and the electronic element.
2. The electronic package according to claim 1, wherein the carrier has a first surface and a second surface opposite to each other, the electronic component is disposed on the first surface of the carrier, and the stiffener protrudes from the first surface of the carrier.
3. The electronic package according to claim 2, further comprising a board block disposed on the second surface of the carrier, wherein the board block is connected to the stiffener but not electrically connected to the carrier and the electronic component.
4. The electronic package according to claim 1, wherein the carrier has a first surface and a second surface opposite to the first surface, the electronic component is disposed on the first surface of the carrier, and the stiffener protrudes from the second surface of the carrier.
5. The electronic package according to claim 4, further comprising a board block disposed on the first surface of the carrier, wherein the board block is connected to the stiffener but not electrically connected to the carrier and the electronic component.
6. The electronic package according to claim 1, wherein a wiring area and an open area adjacent to the wiring area are defined on the surface of the carrier, so that the electronic component is disposed in the wiring area, and the stiffener is disposed in the open area.
7. The electronic package according to claim 1, wherein the through hole is located at an edge of one of the surfaces of the carrier without being connected to the edge.
8. The electronic package of claim 1, wherein the through hole is a notch formed in a side surface of the carrier.
9. The electronic package according to claim 1, further comprising an insulator formed on the carrier to cover a portion of the stiffener protruding from the carrier.
10. The electronic package of claim 1, further comprising a heat sink disposed on the carrier.
11. The electronic package according to claim 1, further comprising a plurality of conductive elements formed on the carrier for electrically connecting the carrier.
12. A method of fabricating an electronic package, comprising:
providing a bearing part with at least one through hole;
arranging at least one electronic element on the bearing piece and electrically connecting the electronic element with the bearing piece; and
and forming a reinforcing body in the through hole and enabling the reinforcing body to protrude out of the bearing piece, wherein the reinforcing body is not electrically connected with the bearing piece and the electronic element.
13. The method of claim 12, wherein the carrier has a first surface and a second surface opposite to the first surface, the electronic component is disposed on the first surface of the carrier, and the stiffener protrudes from the first surface of the carrier.
14. The method of claim 13, further comprising disposing a plate on the second surface of the carrier, wherein the plate is connected to the stiffener but not electrically connected to the carrier and the electronic component.
15. The method of claim 12, wherein the carrier has a first surface and a second surface opposite to each other, the electronic component is disposed on the first surface of the carrier, and the stiffener protrudes from the second surface of the carrier.
16. The method of claim 15, further comprising disposing a plate on the first surface of the carrier, wherein the plate is connected to the stiffener but not electrically connected to the carrier and the electronic component.
17. The method of claim 12, wherein the carrier has a wiring region and an open region adjacent to the wiring region defined on a surface thereof, such that the electronic component is disposed in the wiring region and the stiffener is disposed in the open region.
18. The method of claim 12, wherein the through hole is located at an edge of one surface of the carrier without connecting to the edge.
19. The method of claim 12, wherein the through hole is a notch formed on a side surface of the carrier.
20. The method of claim 12, further comprising forming an insulator on the carrier to cover a portion of the stiffener protruding from the carrier.
21. The method of claim 12, further comprising disposing a heat sink on the carrier.
22. The method of claim 12, further comprising forming a plurality of conductive elements on the carrier to electrically connect the carrier.
23. A load bearing structure, comprising:
a carrier having at least one through hole; and
the strengthening body is arranged in the through hole and protrudes out of the bearing piece, wherein the strengthening body is not electrically connected with the bearing piece.
24. The structure of claim 23, further comprising a plate block disposed on the carrier and connected to the stiffener but not electrically connected to the carrier.
25. The carrier structure of claim 23 wherein the perforations are located at and not in communication with an edge of one of the surfaces of the carrier.
26. The load bearing structure of claim 23, wherein the through hole is a notch formed in a side of the load bearing member.
27. The load bearing structure of claim 23, further comprising an insulator formed on the carrier to cover the portion of the reinforcement protruding from the carrier.
28. The carrier structure of claim 23, further comprising a plurality of conductive elements formed on the carrier for electrically connecting the carrier.
Technical Field
The present invention relates to a package structure, and more particularly, to an electronic package, a method for fabricating the same, and a carrier structure.
Background
With the increasing demand for electronic products in terms of functions and processing speed, semiconductor chips used as core components of electronic products need to have higher density electronic components (electronic components) and electronic circuits (electronic circuits), so that the semiconductor chips generate a larger amount of heat energy during operation, and the encapsulant covering the semiconductor chips is a poor heat-transfer material with a thermal conductivity of only 0.8Wm-1k-1 (i.e., the dissipation efficiency of heat energy is not good), so that the generated heat energy cannot be effectively dissipated, which may cause damage to the semiconductor chips or cause product reliability problems.
Therefore, in order to dissipate Heat energy into the atmosphere rapidly, a Heat Sink (Heat Sink or Heat Spreader) is usually disposed in the semiconductor package structure, the Heat Sink is generally bonded to the back surface of the semiconductor chip through a Heat dissipation adhesive, such as a Thermal Interface Material (TIM), so as to dissipate the Heat generated by the semiconductor chip through the Heat dissipation adhesive and the Heat Sink, and in addition, it is usually better to expose the top surface of the Heat Sink to the encapsulant or directly to the atmosphere, so as to obtain better Heat dissipation effect.
Conventional TIM layers are low temperature melting, thermally conductive materials (e.g., solder materials) disposed between the back surface of a semiconductor chip and a heat sink.
As shown in fig. 1, a conventional method for manufacturing a semiconductor package 1 first mounts a semiconductor chip 11 on a package substrate 10 by flip-chip bonding (i.e., via conductive bumps 110 and an underfill 111) on an active surface 11a thereof, and then reflows a heat sink 13 on a non-active surface 11b of the semiconductor chip 11 via a TIM layer 12 (which includes a solder layer and a flux) on a top surface 130 thereof, and mounts support legs 131 of the heat sink 13 on the package substrate 10 via an adhesive layer 14. Then, a molding operation is performed to encapsulate the semiconductor chip 11 and the heat sink 13 with an encapsulant (not shown), and the top plate 130 of the heat sink 13 is exposed to the outside of the encapsulant and directly contacts the atmosphere. Then, the semiconductor package 1 is mounted on a circuit board 9 via a plurality of solder balls 15 with its package substrate 10.
In operation, the heat generated by the semiconductor chip 11 is conducted to the top plate 130 of the heat sink 13 through the non-active surface 11b and the TIM layer 12 to dissipate the heat to the outside of the semiconductor package 1.
However, in the conventional semiconductor package 1, the solder balls 15 are located in the wiring region of the package substrate 10, so that during thermal cycling (thermal cycle), stress is concentrated in the non-wiring region of the package substrate 10, causing warpage of the package substrate 10, resulting in separation of the semiconductor chip 11 from the package substrate 10, which may cause delamination (delaminating) problem, resulting in failure of the semiconductor chip 11 to be electrically connected to the circuit board 9 or failure of the semiconductor package 1 to pass reliability test, resulting in poor yield of the product.
In addition, when the size of the semiconductor package 1 increases, the weight also increases, so when the solder Ball 15 is reflowed and the solder Ball 15 is in a molten state, the solder Ball 15 cannot bear the weight of the component above the solder Ball 15, and the component is crushed and deformed (as shown by the dotted line in fig. 1), so that the adjacent solder balls 15 are easily bridged (Ball bridge) to cause an electrical short circuit.
Therefore, how to overcome the above problems of the prior art has become a problem to be overcome in the industry.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, the present invention provides an electronic package, a method for manufacturing the same, and a carrier structure, which prevent the electronic component from being separated from the carrier.
The electronic package of the present invention includes: a carrier having at least one through hole; the electronic element is arranged on the bearing piece and is electrically connected with the bearing piece; and the strengthening body is arranged in the through hole and protrudes out of the bearing piece, wherein the strengthening body is not electrically connected with the bearing piece and the electronic element.
The invention also provides a manufacturing method of the electronic packaging piece, which comprises the following steps: providing a bearing part with at least one through hole; and arranging the electronic element on the bearing piece, electrically connecting the electronic element with the bearing piece, forming a reinforcing body in the through hole, and protruding the reinforcing body out of the bearing piece, wherein the reinforcing body is not electrically connected with the bearing piece and the electronic element.
In an embodiment, the carrier has a first surface and a second surface opposite to the first surface, the electronic component is disposed on the first surface of the carrier, and the stiffener protrudes out of the first surface of the carrier. For example, the method further includes disposing a plate body on the second surface of the supporting member, wherein the plate body is connected to the reinforcing member but not electrically connected to the supporting member and the electronic component.
In an embodiment, the carrier has a first surface and a second surface opposite to the first surface, the electronic component is disposed on the first surface of the carrier, and the stiffener protrudes out of the second surface of the carrier. For example, the method further includes disposing a plate body on the first surface of the supporting member, wherein the plate body is connected to the reinforcing member but not electrically connected to the supporting member and the electronic component.
In the electronic package and the method for manufacturing the same, a wiring area and a void area adjacent to the wiring area are defined on the surface of the carrier, so that the electronic component is disposed in the wiring area, and the stiffener is disposed in the void area.
In an embodiment, the through hole is located at an edge of one surface of the carrier and is not connected to the edge.
In an embodiment of the electronic package and the method for fabricating the same, the through hole is a notch formed on a side surface of the carrier.
The electronic package and the method for manufacturing the same further include forming an insulator on the carrier to cover the portion of the stiffener protruding from the carrier.
In the electronic package and the method for manufacturing the same, a heat sink is disposed on the carrier.
The electronic package and the method for manufacturing the same further include forming a plurality of conductive elements electrically connected to the carrier on the carrier.
The present invention further provides a bearing structure, comprising: a carrier having at least one through hole; and the strengthening body is arranged in the through hole and protrudes out of the bearing piece, wherein the strengthening body is not electrically connected with the bearing piece.
The bearing structure further includes a plate block disposed on the bearing member and connected to the reinforcing member, wherein the plate block is not electrically connected to the bearing member.
In the above-mentioned carrying structure, the through hole is located at an edge of one of the surfaces of the carrying element and is not communicated with the edge.
In the above-mentioned bearing structure, the through hole is a notch formed on the side surface of the bearing member.
The supporting structure further includes an insulator formed on the supporting member to cover the portion of the reinforcing member protruding from the supporting member.
The carrier structure further includes a plurality of conductive elements formed on the carrier for electrically connecting the carrier.
In view of the above, in the electronic package, the manufacturing method thereof and the carrier structure of the invention, the design that the reinforcement body penetrates through the carrier is mainly used to effectively disperse the thermal stress, so compared with the prior art, the invention can prevent the electronic element from being separated from the carrier, and therefore, the electronic element can be effectively electrically connected to the circuit board or the electronic package can pass the reliability test.
In addition, when the size of the electronic packaging part is increased, the weight is increased, so that when the conductive elements are in a molten state, the reinforcing body or the plate body supports the downward pressure, the conductive elements can be pressed to a certain degree and then can be in a preset shape, the adjacent conductive elements can not be bridged, and the problem of electrical short circuit can be avoided.
Drawings
Fig. 1 is a schematic cross-sectional view of a conventional semiconductor package.
Fig. 2A to 2D are schematic cross-sectional views illustrating a method for manufacturing an electronic package according to a first embodiment of the invention.
Fig. 2A' is a partial top view of fig. 2A.
Fig. 3A to 3C are schematic cross-sectional views illustrating a method for manufacturing an electronic package according to a second embodiment of the invention.
Fig. 3A' is a partial top view of fig. 3A.
FIG. 3A "is a schematic cross-sectional view of FIG. 3A' taken along section line P-P.
Fig. 3B' is a partial top view of fig. 3B.
FIG. 3B 'is a schematic cross-sectional view of FIG. 3B' taken along section line P-P.
Fig. 3C' is a schematic cross-sectional view from another perspective of fig. 3C.
FIG. 4A is an enlarged cross-sectional view of a portion of the alternative embodiment of FIG. 3C.
Fig. 4B is a schematic cross-sectional view illustrating a method for manufacturing an electronic package according to another embodiment of the invention.
Description of the symbols
1 semiconductor package
10 packaging substrate
11 semiconductor chip
11a,21a action surface
11b,21b non-active surface
110,210 conductive bump
111,22 primer
12 TIM layer
13,2a,4a heat sink
130 topsheet
131,27,47 support foot
14 adhesive layer
15 solder ball
2,3,4 electronic package
20 load bearing member
20a first surface
20b second surface
20c side surface
200,300 perforations
201,202 wiring layer
21 electronic component
23,33,43 reinforcement
23a,33b ends
24,34,44 plate body
25 insulator
26 bonding layer
28,48 heat sink
280 heat-conducting interface layer
29, 29' conductive element
4b integrally formed structure
9 Circuit Board
A wiring region
Open area B
Length of L
And H height.
Detailed Description
The following description of the embodiments of the present invention is provided by way of specific examples, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein.
It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for understanding and reading the contents disclosed in the specification, and are not used for limiting the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, ratio relationship changes or size adjustments should still fall within the scope of the technical contents disclosed in the present invention without affecting the efficacy and the achievable purpose of the present invention. In addition, the terms "above", "first", "second" and "a" as used in the present specification are for the sake of clarity only, and are not intended to limit the scope of the present invention, and changes or modifications of the relative relationship may be made without substantial technical changes.
Fig. 2A to 2D are schematic cross-sectional views illustrating a method for manufacturing an electronic package according to a first embodiment of the invention.
As shown in fig. 2A and 2A', a
In the present embodiment, the
In addition, the
Moreover, the through
As shown in fig. 2B, a plurality of reinforcing
In this embodiment, the reinforcing
In addition, the
As shown in fig. 2C, an insulator 25 is formed on the
In the embodiment, the insulator 25 is made of a plastic material to fix the reinforcing
In addition, a bonding layer 26 such as an adhesive may be formed on the
As shown in fig. 2D, a
In the present embodiment, the plurality of supporting
In addition, a plurality of
In addition, the
In addition, in order to improve the adhesion strength between the TIM and the
Therefore, the electronic package 2 formed by the manufacturing method of the present invention is mainly disposed in the open area B of the
In addition, when the size of the electronic package 2 is increased, the weight is increased, so when the
Fig. 3A to 3C are schematic cross-sectional views illustrating a method for manufacturing an
As shown in fig. 3A and 3A ″, a
In the present embodiment, as shown in fig. 3A', the through
In addition, the view of fig. 3A is seen from the direction of the side surface 20c of the
As shown in fig. 3B, 3B' and 3B ″, a plurality of
In the present embodiment, the view of fig. 3B is seen from the direction of the side surface 20c of the
As shown in fig. 3C, a
In the present embodiment, a plurality of
In addition, it should be understood that an insulator 25 may be formed to cover the end 33b of the reinforcing
Therefore, the
In addition, when the size of the
As shown in fig. 4B, the
The invention further provides an
The reinforcing
In one embodiment, the
In one embodiment, the
In one embodiment, the
In one embodiment, the through
In one embodiment, the electronic package 2 further includes at least one insulator 25 formed on the
In an embodiment, the
In one embodiment, the
The present invention further provides a bearing structure, comprising: the structure comprises a bearing
In one embodiment, the supporting structure further includes at least one
In one embodiment, the through
In one embodiment, the supporting structure further includes at least one insulator 25 formed on the supporting
In one embodiment, the supporting structure further includes a plurality of
In summary, the electronic package, the manufacturing method thereof and the carrier structure of the invention disperse stress through the design of the stiffener, so that the invention can prevent the electronic component from separating from the carrier, and the electronic component can be effectively electrically connected to the circuit board or the electronic package can pass reliability test.
In addition, when the size of the electronic packaging part is increased, the weight is increased, so that when the conductive elements are in a molten state, the reinforcing body or the plate body supports the downward pressure, the conductive elements can be pressed to a certain degree and then can be in a preset shape, the adjacent conductive elements can not be bridged, and the problem of electrical short circuit can be avoided.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify the above-described embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of the invention should be determined from the following claims.
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