Electrical attachment structure and forming method thereof
阅读说明:本技术 电性贴附结构及其形成方法 (Electrical attachment structure and forming method thereof ) 是由 陈立宜 于 2019-10-23 设计创作,主要内容包括:本发明公开了一种电性贴附结构,其包含基板、接触垫组,以及微型元件以及电极组的组合。接触垫组位于基板之上,其中接触垫组包含至少一个接触垫,并且至少一个接触垫是导电的。组合位于接触垫组之上,电极组的相对两侧分别与微型元件以及接触垫组相接触。接触垫组与电极组间的接触周边在基板上的垂直投影较该微型元件的外周边在基板上的垂直投影长,其中接触周边在基板上的垂直投影被外周边在基板上的垂直投影所包围。此电性贴附结构及其形成方法提供以帮助电极组与接触垫组之间的液体层抓住电极组并将电极组贴附到接触垫组。(The invention discloses an electrical property attaching structure, which comprises a substrate, a contact pad group, a micro element and an electrode group combination. The contact pad set is located on the substrate, wherein the contact pad set comprises at least one contact pad, and the at least one contact pad is conductive. The assembly is located on the contact pad set, and two opposite sides of the electrode set are respectively contacted with the micro-device and the contact pad set. The perpendicular projection of the contact periphery of the contact pad group and the electrode group on the substrate is longer than that of the outer periphery of the micro-component on the substrate, wherein the perpendicular projection of the contact periphery on the substrate is surrounded by the perpendicular projection of the outer periphery on the substrate. The electrical attachment structure and the method of forming the same provide for assisting the liquid layer between the electrode assembly and the contact pad assembly to grip the electrode assembly and attach the electrode assembly to the contact pad assembly.)
1. An electrical attachment structure, comprising:
a substrate;
a set of contact pads located over the substrate, wherein the set of contact pads comprises at least one contact pad, wherein the contact pad is electrically conductive; and
the combination of a micro-component and an electrode set is located on the contact pad set, the electrode set comprises at least one electrode, two opposite sides of the electrode set are respectively in contact with the micro-component and the contact pad set, a perpendicular projection of a contact periphery between the contact pad set and the electrode set on the substrate is longer than a perpendicular projection of an outer periphery of the micro-component on the substrate, and the perpendicular projection of the contact periphery on the substrate is surrounded by the perpendicular projection of the outer periphery on the substrate.
2. The electrical attachment structure of claim 1 further comprising: and the adhesion layer is arranged between the contact pad group and the substrate.
3. The electrical connection structure of claim 1, wherein one of the set of contact pads and the set of electrodes comprises one of copper, tin, titanium, and indium.
4. The electrical attachment structure of claim 1 wherein the lateral length of the micro-device is less than or equal to 100 microns.
5. A method of forming an electrical attachment structure, comprising:
forming a set of contact pads on a substrate, wherein the set of contact pads includes at least one contact pad, and the at least one contact pad is electrically conductive;
placing a combination of a micro-component and an electrode set on the contact pad set such that opposite sides of the electrode set are in contact with the micro-component and the contact pad set, respectively, the electrode set comprising at least one electrode, a perpendicular projection of a contact perimeter between the contact pad set and the electrode set on the substrate being longer than a perpendicular projection of an outer perimeter of the micro-component on the substrate, and the perpendicular projection of the contact perimeter on the substrate being surrounded by the perpendicular projection of the outer perimeter of the micro-component on the substrate;
forming a liquid layer between the set of electrodes and the set of contact pads such that the microelements are captured by capillary forces generated by the liquid layer; and
evaporating the liquid layer such that the electrode assembly is attached to and electrically connected with the contact pad set.
6. The method of claim 5, wherein forming the liquid layer comprises:
reducing the temperature of the set of contact pads in an environment containing vapor to condense at least a portion of the vapor to form the liquid layer.
7. The method of claim 5, wherein forming the liquid layer comprises:
spraying a vapor on the substrate such that at least a portion of the vapor condenses to form the liquid layer.
8. The method of claim 7, wherein the vapor has a water vapor pressure higher than ambient water vapor pressure.
9. The method of claim 7, wherein the vapor comprises nitrogen and water.
10. The method of claim 5, further comprising forming an adhesive layer on the substrate prior to forming the set of contact pads.
11. The method of claim 5, wherein the liquid layer comprises water.
12. The method of claim 6, wherein said liquid layer is formed at a dew point temperature.
13. The method of claim 5, wherein evaporating the liquid layer comprises:
after the liquid layer is evaporated, the temperature of the contact pad set is raised so that the electrode set is adhesively fixed to the contact pad set.
14. The method of claim 5, wherein at least one of the set of contact pads and the set of electrodes comprises an adhesive material, and further comprising:
after evaporating the liquid layer, raising the temperature of the set of contact pads above the melting point of the bonding material.
15. The method of claim 5, wherein at least one of the set of contact pads and the set of electrodes comprises an adhesive material, and further comprising:
after evaporating the liquid layer, raising the temperature of the set of contact pads to below the melting point of the bonding material and above the boiling point of the liquid layer.
16. The method of claim 5, further comprising:
after evaporating the liquid layer, raising the temperature of the set of contact pads above the eutectic point of the set of contact pads and the set of electrodes.
17. The method of claim 5, wherein the thickness of the liquid layer between the set of electrodes and the set of contact pads is less than the thickness of the microelements when the microelements are gripped by the capillary force.
18. The method of claim 5, wherein one of the set of contact pads and the set of electrodes comprises one of copper, tin, titanium, and indium.
19. The method of claim 5, wherein the microelements have a lateral length of less than or equal to 100 microns.
Technical Field
The present invention relates to an electrical attachment structure, and more particularly, to an electrical attachment structure and a method for forming the same.
Background
Conventional techniques for transferring components include transferring from a transfer chip to a receiving substrate by die bonding. One such embodiment is "direct bonding", which involves one bonding step from the transfer chip to the array of elements of the receiving substrate, followed by removal of the transfer chip. Another such embodiment is "indirect bonding", which involves two bonding/peeling steps. In indirect bonding, the transfer head may pick up an array of elements from a donor substrate, bond the array of elements to a receiving substrate, and then remove the transfer head.
One of the important issues that may affect the transfer quality is the moment the component is in contact with the receiving chip.
Disclosure of Invention
The present invention is directed to overcoming the drawbacks of the prior art and providing an electrical attachment structure and a method for forming the same, which enables a micro device to be better held in place for subsequent bonding.
According to some embodiments of the present invention, an electrical attachment structure is provided. The electrical property attaching structure comprises a substrate, a contact pad group, and a combination of a micro element and an electrode group. The contact pad set is located on the substrate, wherein the contact pad set comprises at least one contact pad, and at least one contact pad is conductive. The combination of the micro-element and the electrode group is positioned on the contact pad group, the electrode group comprises at least one electrode, and two opposite sides of the electrode group are respectively contacted with the micro-element and the contact pad group. The perpendicular projection of the contact periphery of the contact pad group and the electrode group on the substrate is longer than the perpendicular projection of the outer periphery of the micro-component on the substrate, wherein the perpendicular projection of the contact periphery on the substrate is surrounded by the perpendicular projection of the outer periphery on the substrate.
According to an embodiment of the present invention, the electrical attachment structure further includes an adhesive layer between the contact pad set and the substrate.
According to an embodiment of the present invention, one of the contact pad set and the electrode set includes one of copper, tin, titanium, and indium.
According to an embodiment of the present invention, the lateral length of the micro-device is less than or equal to 100 μm.
According to some embodiments of the present invention, a method of forming an electrical attachment structure is provided. The method comprises the following steps: forming a set of contact pads on a substrate, wherein the set of contact pads includes at least one contact pad, and the at least one contact pad is electrically conductive; placing a combination of a micro-component and an electrode group on the contact pad group, so that two opposite sides of the electrode group are respectively contacted with the micro-component and the contact pad group, wherein the electrode group comprises at least one electrode, the vertical projection of the contact periphery between the contact pad group and the electrode group on the substrate is longer than that of the outer periphery of the micro-component on the substrate, and the vertical projection of the contact periphery on the substrate is surrounded by that of the outer periphery of the micro-component on the substrate; forming a liquid layer between the electrode assembly and the contact pad assembly such that the micro-device is captured by capillary forces generated by the liquid layer; and evaporating the liquid layer so that the electrode group is attached to the contact pad group and electrically connected with the contact pad group.
According to an embodiment of the present invention, forming a liquid layer comprises: the temperature of the set of contact pads is reduced in an environment containing vapor to condense at least a portion of the vapor to form a liquid layer.
According to an embodiment of the present invention, forming a liquid layer comprises: a vapor is sprayed on the substrate such that at least a portion of the vapor condenses to form a liquid layer.
According to one embodiment of the present invention, the water vapor pressure of the vapor is higher than the ambient water vapor pressure.
According to an embodiment of the invention, the vapor comprises nitrogen and water.
According to an embodiment of the invention, an adhesive layer is formed on the substrate before the contact pad set is formed.
According to an embodiment of the invention, the liquid layer comprises water.
According to an embodiment of the invention, the liquid layer is formed at a temperature of the dew point.
According to one embodiment of the present invention, the evaporated liquid layer comprises: after the liquid layer is evaporated, the temperature of the contact pad set is raised so that the electrode set is adhesively secured to the contact pad set.
According to an embodiment of the present invention, at least one of the set of contact pads and the set of electrodes comprises a bonding material, and after evaporating the liquid layer, the temperature of the set of contact pads is raised to above the melting point of the bonding material.
According to an embodiment of the present invention, at least one of the set of contact pads and the set of electrodes comprises a bonding material, and after evaporating the liquid layer, the temperature of the set of contact pads is raised to below the melting point of the bonding material and above the boiling point of the liquid layer.
According to an embodiment of the invention, after evaporating the liquid layer, the temperature of the set of contact pads is raised above the eutectic point of the set of contact pads and the set of electrodes.
According to one embodiment of the present invention, the thickness of the liquid layer between the electrode set and the contact pad set is less than the thickness of the micro-device when the micro-device is held by capillary force.
According to an embodiment of the present invention, one of the contact pad set and the electrode set includes one of copper, tin, titanium, and indium.
According to an embodiment of the present invention, the lateral length of the micro-device is less than or equal to 100 μm.
Compared with the prior art, the invention has obvious advantages and beneficial effects. By means of the technical scheme, the electric attaching structure and the forming method thereof help the liquid layer between the electrode group and the contact pad group to grasp the electrode group and attach the electrode group to the contact pad group. The electrical attachment structure is just capable of making the contact perimeter larger than the original contact perimeter to enhance the capillary force generated by the liquid layer for grasping the electrodes.
The foregoing is merely illustrative of the problems to be solved, solutions to problems, and effects produced by the present invention, and the details of which are set forth in the following description and related drawings.
Drawings
In order to make the aforementioned and other objects, features, advantages and embodiments of the invention more comprehensible, the following description is given:
FIG. 1 is a schematic cross-sectional view of an electrical attachment structure according to some embodiments of the present invention;
FIG. 1B is a perspective view of an electrical attachment structure according to some embodiments of the present invention;
FIG. 1C is a schematic bottom view of the top contact surface of a contact pad set according to some embodiments of the invention;
FIG. 1D is a schematic bottom view of the bottom contact surface of an electrode assembly according to some embodiments of the inventions;
FIG. 1E is a schematic bottom view of a set of contact pads and an electrode set when the electrode set is close to or in contact with the set of contact pads, according to some embodiments of the invention;
FIG. 1F is a schematic view of a contact perimeter according to some embodiments of the present invention;
FIG. 1G is a schematic view of an original contact perimeter in accordance with some embodiments of the present invention;
FIG. 1H is a schematic perspective view of a liquid layer in contact with an electrode set and a contact pad set according to some embodiments of the present invention;
FIG. 2 is a schematic bottom view of a set of contact pads and an electrode set when the electrode set is close to or in contact with the set of contact pads according to some embodiments of the invention;
FIG. 3A is a schematic bottom view of a set of contact pads and an electrode set when the electrode set is close to or in contact with the set of contact pads according to some embodiments of the invention;
FIG. 3B is a schematic bottom view of a set of contact pads and an electrode set when the electrode set is close to or in contact with the set of contact pads according to some embodiments of the invention;
FIG. 4 is a schematic top view of a set of contact pads and an electrode set when the electrode set is near or in contact with the set of contact pads according to some embodiments of the invention;
FIG. 5A is a schematic cross-sectional view of one type of contact pad set and electrode set in accordance with some embodiments of the invention;
FIG. 5B is a schematic cross-sectional view of one type of contact pad set and electrode set in accordance with some embodiments of the invention;
FIG. 5C is a schematic cross-sectional view of one type of contact pad set and electrode set in accordance with some embodiments of the invention;
FIG. 6A is a schematic cross-sectional view of an electrical attachment structure according to some embodiments of the present invention;
FIG. 6B is a schematic bottom view of the contact pad set and the electrode set when the electrode set is close to or in contact with the contact pad set according to some embodiments of the invention;
FIG. 7 is a schematic bottom view of a set of contact pads and an electrode set when the electrode set is near or in contact with the set of contact pads according to some embodiments of the invention;
FIG. 8 is a flow chart of a method of forming an electrical attachment structure according to some embodiments of the present invention;
FIG. 9A is a cross-sectional view of an intermediate stage of a method of forming an electrical attachment structure according to some embodiments of the present invention;
FIG. 9B is a cross-sectional view of an intermediate stage of a method of forming an electrical attachment structure according to some embodiments of the present invention;
FIG. 9C is a cross-sectional view of an intermediate stage of a method of forming an electrical attachment structure according to some embodiments of the present invention; and
FIG. 9D is a cross-sectional view of an intermediate stage of a method of forming an electrical attachment structure according to some embodiments of the present invention.
[ description of main symbols ]
100A, 100E: electrical property attaching structure
110: substrate
120A、120A’、120A”、120A”’、120B、120C、120D、120D’、120E、
120F: contact pad set
120A-1, 120A' -1: contact pad
120A-tcs: top contact surface
130A、130A’、130A”、130A”’、130B、130C、130D、130D’、130E、
130F: electrode group
130A-1, 130A' -1: electrode for electrochemical cell
130A-bcs: bottom contact surface
140: micro-element
150: liquid layer
152: meniscus of liquid
200: method of producing a composite material
L: lateral length
OP: outer periphery of
CP, CP1, CP2, CP3, CP 4: contact perimeter
PCP (primary phenol treatment): original contact periphery
SP: concave part
T: thickness of
HP: hollow part
210-240: operation of
Detailed Description
While the spirit of the invention will be described in detail and with reference to the drawings, those skilled in the art will understand that various changes and modifications can be made without departing from the spirit and scope of the invention as taught herein.
In various embodiments, reference is made to the accompanying drawings. However, certain embodiments may be practiced without one or more of these specific details, or in combination with other known methods and configurations. In the following description, for purposes of explanation, numerous implementation details, such as implementation configurations, dimensions, and processes, are set forth in order to provide a thorough understanding of the embodiments described herein. In other instances, well-known and conventional semiconductor processing and fabrication techniques have not been described in particular detail in order to not unnecessarily obscure the present invention. Reference throughout this specification to "one embodiment," "an embodiment," etc., means that a particular feature, structure, configuration, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment," "in an embodiment," and the like, in various places throughout this specification are not necessarily all referring to the same embodiment of the invention. Furthermore, the particular features, structures, configurations, or characteristics may be combined in any suitable manner in one or more embodiments.
The terms "above," "to," "over," "in," "between," and "over" as used herein may refer to the relative position of one layer with respect to another layer. One layer "on" or "over" or bonded to another layer, may be directly in contact with the other layer, or may have one or more intervening layers. One layer "between" layers may be directly in contact with the layers, or may have one or more intervening layers.
Referring to fig. 1A to 1E, fig. 1A is a cross-sectional view of an
Fig. 1F is a schematic diagram of the contact periphery CP according to some embodiments of the invention, fig. 1G is a schematic diagram of the original contact periphery PCP according to some embodiments of the invention, and fig. 1H is a perspective schematic diagram of the liquid layer 150 respectively contacting the
Perspective (three-dimensional view) views illustrating the above embodiment are shown in fig. 1B and 1H. In some embodiments, the electrode set 130A and the contact pad set 120A may be brought into proximity with each other and into contact with the liquid layer 150 therebetween such that the combination of the electrode set 130A and the
It is noted that the contact perimeter CP and the original contact perimeter PCP can be interpreted as a single contact perimeter (or a plurality of separate contact perimeters, as will be mentioned later in some embodiments) when the electrode set 130A is in contact with the contact pad set 120A. When the liquid layer 150 is interposed between and in contact with the electrode set 130A and the contact pad set 120A, they may also be interpreted as a single contact perimeter (or multiple contact perimeters). In this case, the contact perimeter CP (and the original contact perimeter PCP) is considered to have a perimeter with a thickness T (as shown in FIG. 1H) measured from the bottom contact surfaces 130A-bcs of the electrode set 130A through the perimeter of the liquid layer 150 to the
Referring to fig. 2-3B, fig. 2 is a schematic bottom view of the contact pad set 120A ' and the electrode set 130A ' (not explicitly shown, since it overlaps and is behind the contact pad set 120A ' in fig. 2) when the electrode set 130A ' is close to or in contact with the contact pad set 120A ' according to some embodiments of the invention. Fig. 3A is a schematic bottom view of the contact pad set 120A "and the electrode set 130A" (not explicitly shown because it overlaps and is behind the contact pad set 120A "in fig. 3A) when the electrode set 130A" is near or in contact with the contact pad set 120A "in accordance with some embodiments of the invention. Fig. 3B is a schematic bottom view of the contact pad set 120A ' "and the electrode set 130A '" (not explicitly shown because it overlaps and is behind the contact pad set 120A ' "in fig. 3B) when the electrode set 130A '" is near or in contact with the contact pad set 120A ' ", according to some embodiments of the invention. The contact pad set 120A ' "includes a plurality of
The embodiment shown in fig. 3A may be considered a modification of the embodiment shown in fig. 2. The contact pad set 120A "and the electrode set 130A" of the embodiment shown in fig. 3A have a plurality of separated hollow portions HP. In the embodiment shown in fig. 3B, the plurality of
Fig. 4 is a schematic bottom view of the contact pad set 120B and the electrode set 130B when the electrode set 130B is close to or in contact with the contact pad set 120B according to some embodiments of the invention. In these embodiments, the
Referring to fig. 5A to 5C, fig. 5A to 5C are schematic cross-sectional views of three different types of contact pad sets and electrode sets according to some embodiments of the invention. In these embodiments, the perpendicular projection of the at least one contact perimeter CP on the
Referring to fig. 6A, 6B, and 7, fig. 6A is a cross-sectional view of an
Fig. 8 is a flowchart of a method 200 of forming an
The method 200 continues with operation 230 in which a liquid layer 150 is formed between the
The method 200 continues with operation 240 in which the liquid layer 150 is evaporated such that the
In summary, an electrical attachment structure and a method for forming the same are provided to help a liquid layer between an electrode assembly and a contact pad assembly to hold the electrode assembly and attach the electrode assembly to the contact pad assembly. The electrical attachment structure, as described in the specification, allows the contact perimeter to be larger than the original contact perimeter to enhance the capillary force generated by the liquid layer for grasping the electrodes.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
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