阅读说明：本技术 功率模块 (Power module ) 是由 山本悠 井上道信 林山晋也 于 2020-03-13 设计创作，主要内容包括：本发明提供一种可靠性较高的功率模块。功率模块具备：壳体,具有在外表面露出的外部端子；基板,设于所述壳体内；半导体元件,搭载于所述基板；引线,连接于所述半导体元件；金属板端子,设于所述壳体内,并将所述外部端子连接于所述半导体元件的电极；以及凝胶材料,设于所述壳体内,并覆盖所述金属板端子的一部分、所述基板、所述半导体元件以及所述引线。所述金属板端子具有：第一部分,配置于所述引线与所述壳体的顶板之间且是所述凝胶材料的内部；第二部分,相对于所述第一部分弯曲,并连接于所述半导体元件的所述电极；以及第三部分,从所述第一部分的端部朝向所述基板延伸。(The invention provides a power module with high reliability. The power module includes: a housing having an external terminal exposed on an outer surface; the substrate is arranged in the shell; a semiconductor element mounted on the substrate; a lead connected to the semiconductor element; a metal plate terminal provided in the case and connecting the external terminal to an electrode of the semiconductor element; and a gel material provided in the case and covering a part of the metal plate terminal, the substrate, the semiconductor element, and the lead. The metal plate terminal has: a first portion disposed between the lead and a top plate of the case and inside the gel material; a second portion which is bent with respect to the first portion and connected to the electrode of the semiconductor element; and a third portion extending from an end of the first portion toward the substrate.)

1. A power module is provided with:

a housing having an external terminal exposed on an outer surface;

the substrate is arranged in the shell;

a semiconductor element mounted on the substrate;

a lead connected to the semiconductor element;

a metal plate terminal provided in the case and connecting the external terminal to an electrode of the semiconductor element; and

a gel material provided in the case and covering a part of the metal plate terminal, the substrate, the semiconductor element, and the lead,

the metal plate terminal has:

a first portion disposed between the lead and a top plate of the case and inside the gel material;

a second portion which is bent with respect to the first portion and connected to the electrode of the semiconductor element; and

a third portion extending from an end of the first portion toward the substrate.

2. A power module is provided with:

a housing having an external terminal exposed on an outer surface;

the substrate is arranged in the shell;

a semiconductor element mounted on the substrate;

a lead connected to the semiconductor element;

a metal plate terminal provided in the case and connecting the external terminal to an electrode of the semiconductor element;

a low stiffness plate; and

a gel material provided in the case and covering a part of the metal plate terminal, the low rigidity plate, the substrate, the semiconductor element, and the lead,

the metal plate terminal has:

a first portion disposed between the lead and a top plate of the case and inside the gel material; and

a second portion bent with respect to the first portion and connected to an electrode of the semiconductor element,

the low rigidity plate has a rigidity lower than that of the first portion, the low rigidity plate is attached to the first portion, and an end portion of the low rigidity plate protrudes from an end portion of the first portion.

3. The power module as set forth in claim 2,

the low rigidity plate is made of a resin material.

4. A power module is provided with:

a housing having an external terminal exposed on an outer surface;

the substrate is arranged in the shell;

a semiconductor element mounted on the substrate;

a lead connected to the semiconductor element;

a metal plate terminal provided in the case and connecting the external terminal to an electrode of the semiconductor element;

the partition plate is arranged in the shell; and

a gel material provided in the case and covering a part of the metal plate terminal, the partition plate, the substrate, the semiconductor element, and the lead,

the metal plate terminal has:

a first portion disposed between the lead and a top plate of the case and inside the gel material; and

a second portion bent with respect to the first portion and connected to an electrode of the semiconductor element,

a space between the first portion and the substrate is partitioned from the periphery by a portion of the case, the metal plate terminal, and the partition plate.

5. The power module as set forth in claim 4,

a portion of the divider panel is attached to the first portion.

6. The power module as set forth in claim 4,

a portion of the divider panel is attached to the second portion.

7. The power module of any one of claims 4 to 6,

the partition plate is made of a resin material.

Technical Field

Background

Conventionally, as a power module for controlling a current, there has been developed a power module in which a substrate is fixed in a case, a power semiconductor element is mounted on the substrate, an electrode of the power semiconductor element is led out to the outside of the case by using a metal plate terminal, and the case is filled with a gel material. Such a power module is required to have high reliability against a heat load generated when the power module is repeatedly turned on and off.

Disclosure of Invention

Technical problem to be solved by the invention

Drawings

Fig. 1 is a perspective view showing a power module according to a first embodiment.

Fig. 2 is a perspective cross-sectional view showing a power module according to a first embodiment.

Fig. 3 is a sectional view showing a power module according to a first embodiment.

Fig. 4 (a) is a sectional view showing a room temperature state of the power module of the comparative example, fig. 4 (b) is a sectional view showing a high temperature state of the power module of the comparative example, and fig. 4 (c) is a sectional view showing a high temperature state of the power module of the first embodiment.

Fig. 5 is a perspective view showing a power module according to a second embodiment.

Fig. 6 is a perspective cross-sectional view showing a power module according to a second embodiment.

Fig. 7 (a) is a cross-sectional view showing a room temperature state of the power module according to the second embodiment, and fig. 7 (b) is a cross-sectional view showing a high temperature state of the power module according to the second embodiment.

Fig. 8 is an exploded perspective view showing a power module according to a third embodiment.

Fig. 9 is a perspective cross-sectional view showing a power module according to a third embodiment.

Fig. 10 is a cross-sectional view showing an operation of the power module according to the third embodiment.

Fig. 11 is an exploded perspective view showing a power module according to a fourth embodiment.

Fig. 12 is a perspective cross-sectional view showing a power module according to a fourth embodiment.

Fig. 13 (a) is a perspective view showing a power module assumed in the first test example, fig. 13 (b) is a view showing an analysis model of a gel material, and fig. 13 (c) is a view showing a strain distribution of the gel material.

Fig. 14 is a graph in which the height of the flat portion of the metal plate terminal is plotted on the horizontal axis, and the maximum value of the strain of the gel material is plotted on the vertical axis, thereby showing the influence of the height of the flat portion on the amount of strain of the gel material.

Fig. 15 (a) is a diagram showing an analysis model of a gel material in a case where no partition plate is provided, fig. 15 (b) is a diagram showing an analysis model of a gel material in a case where a partition plate is provided, and fig. 15 (c) is a graph showing the influence of the presence or absence of a partition plate on the amount of strain of a gel material by taking the presence or absence of a partition plate on the horizontal axis and the maximum value of the amount of strain of the gel material on the vertical axis.

Description of the reference numerals

1. 2, 3, 4: power module

10: shell body

11: base plate

12: side plate

13: top board

14: external terminal

15: through hole

16: bolt

20: substrate

21: semiconductor device with a plurality of semiconductor chips

22: electrode for electrochemical cell

23: lead wire

30: metal plate terminal

31-37: plane part

33a, 36a, 37 a: end part

40: gel material

40a, 40 b: in part

41: air layer

51: low rigidity plate

51 a: end part

61: partition board

62: horizontal part

63. 64: vertical part

65: space(s)

66: partition board

67. 68, 69: vertical part

101: power module

Embodiments relate to a power module.