阅读说明：本技术 一种惯性测量仪封装结构 (Inertia measuring instrument packaging structure ) 是由 朱伟琪 于 2020-06-30 设计创作，主要内容包括：本发明涉及半导体技术领域,尤其涉及一种惯性测量仪封装结构,其中,包括：一底板；一围堰,设置在底板上,并于底板上方形成空腔；一引线框,设置于空腔的底部,引线框设置有焊盘；至少一颗裸晶,设置于空腔内；复数根金线,用以分别对应连接引线框的焊盘及裸晶的焊盘；一金属盖,覆盖并固定于围堰的顶部,用以遮蔽空腔；一防护膜,粘贴于金属盖的内侧顶部,用以防护空腔内的引线框、裸晶以及复数根金线。有益效果：通过金属盖覆盖围堰的顶部,以保护裸晶,避免现有技术中环氧树脂模压对裸晶产生的应力,有效提升惯性测量仪的产品性能,降低产品成本,缩短生产周期。(The invention relates to the technical field of semiconductors, in particular to an inertia measuring instrument packaging structure, which comprises: a base plate; the cofferdam is arranged on the bottom plate, and a cavity is formed above the bottom plate; the lead frame is arranged at the bottom of the cavity and provided with a bonding pad; at least one bare crystal arranged in the cavity; a plurality of gold wires for connecting the bonding pads of the lead frame and the die correspondingly; the metal cover covers and is fixed at the top of the cofferdam to shield the cavity; and the protective film is adhered to the top of the inner side of the metal cover and used for protecting the lead frame, the bare chip and the plurality of gold wires in the cavity. Has the advantages that: the top of the cofferdam is covered by the metal cover to protect the bare crystals, so that the stress of epoxy resin mould pressing on the bare crystals in the prior art is avoided, the product performance of the inertia measuring instrument is effectively improved, the product cost is reduced, and the production period is shortened.)

1. An inertial measurement instrument package, comprising:

a base plate;

the cofferdam is arranged on the bottom plate, and a cavity is formed above the bottom plate;

the lead frame is arranged at the bottom of the cavity and provided with a bonding pad;

at least one bare crystal arranged in the cavity;

a plurality of gold wires for respectively and correspondingly connecting the bonding pads of the lead frame and the die;

the metal cover covers and is fixed at the top of the cofferdam and used for shielding the cavity;

and the protective film is adhered to the top of the inner side of the metal cover and used for protecting the lead frame, the bare chip and the gold wires in the cavity.

2. The inertial measurement instrument package of claim 1, wherein the metal cover is secured to the top of the cofferdam such that the cavity is sealed.

3. The inertial measurement instrument package of claim 2, wherein the metal cover is provided with a vent hole for releasing heat within the cavity.

4. The inertia gauge package of claim 2, further comprising a glue coating applied to each of the gold wires for preventing damage to the gold wires.

5. The inertial measurement instrument package of claim 4, wherein the glue coating is a silicone.

6. The inertial meter package of claim 1, wherein the dam comprises a first step facing into the cavity, the lead frame being disposed on the first step.

7. The inertial measurement instrument package of claim 6, wherein a second step is further provided on the first step, the top of the second step being secured to the metal cover.

8. The inertial measurement instrument package of claim 6, wherein the metal lid is secured to the second step top by a solder paste.

9. The inertial measurement instrument package structure of claim 1, wherein when the number of the dies is greater than one, the dies are bonded by bonding gold wires.

10. The inertial measurement instrument package of claim 9, wherein when the number of dice is greater than one, the bonded dice are stacked in the cavity with the thicker die below and the thinner die above.

Technical Field

The invention relates to the technical field of semiconductors, in particular to an inertia measuring instrument packaging structure.

Background

With the development of technology, electronic products gradually enter people's lives, and bare chips in the electronic products are the determining factors for determining the performance of the products, for example, an inertial measurement instrument needs to be packaged in the production process.

Disclosure of Invention

To address the above-mentioned problems in the prior art, an inertial measurement instrument package structure is provided.

The specific technical scheme is as follows:

the invention provides an inertia measuring instrument packaging structure, which comprises:

a base plate;

the cofferdam is arranged on the bottom plate, and a cavity is formed above the bottom plate;

the lead frame is arranged at the bottom of the cavity and provided with a bonding pad;

at least one bare crystal arranged in the cavity;

a plurality of gold wires for respectively and correspondingly connecting the bonding pads of the lead frame and the die;

the metal cover covers and is fixed at the top of the cofferdam and used for shielding the cavity;

and the protective film is adhered to the top of the inner side of the metal cover and used for protecting the lead frame, the bare chip and the gold wires in the cavity.

Preferably, the metal cover is fixed to the top of the cofferdam so that the cavity is sealed.

Preferably, the metal cover is provided with a ventilation through hole for releasing heat in the cavity.

Preferably, the gold wire protective sleeve further comprises a glue coating which is coated on each gold wire and used for preventing the gold wires from being damaged.

Preferably, the glue coating is silica gel.

Preferably, the cofferdam includes a first step facing into the cavity, and the lead frame is disposed on the first step.

Preferably, a second step is further arranged on the first step, and the top of the second step is fixed with the metal cover.

Preferably, the metal cover is fixed on the top of the second step by solder paste.

Preferably, when the number of the bare crystals is more than one, the bare crystals are bound by a binding gold wire.

Preferably, when the number of the bare chips is more than one, the bonded bare chips are stacked in the cavity, the thicker bare chip is located below the cavity, and the thinner bare chip is located above the cavity.

The technical scheme has the following advantages or beneficial effects: the top of the cofferdam is covered by the metal cover to protect the bare crystals, so that the stress of epoxy resin mould pressing on the bare crystals in the prior art is avoided, the product performance of the inertia measuring instrument is effectively improved, the product cost is reduced, and the production period is shortened.

Drawings

Embodiments of the present invention will now be described more fully hereinafter with reference to the accompanying drawings. The drawings are, however, to be regarded as illustrative and explanatory only and are not restrictive of the scope of the invention.

FIG. 1 is a schematic structural diagram of an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a cavity according to an embodiment of the invention.

The above reference numerals denote descriptions:

a base plate 1; cofferdam 2; a first step 20; a second step 21; a lead frame 3; a bare crystal 4; a gold wire 5; 50, glue coating; a metal cover 6; a protective film 7; a ventilation through hole 8; and binding a gold wire 9.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.

The invention is further described with reference to the following drawings and specific examples, which are not intended to be limiting.

The invention provides an inertia measuring instrument packaging structure, which comprises:

a base plate 1;

the cofferdam 2 is arranged on the bottom plate 1, and a cavity is formed above the bottom plate 1;

the lead frame 3 is arranged at the bottom of the cavity, and the lead frame 3 is provided with a bonding pad;

at least one bare chip 4 arranged in the cavity;

a plurality of gold wires 5 for connecting the bonding pads of the lead frame 3 and the die 4, respectively;

a metal cover 6 covering and fixed on the top of the cofferdam 2 for shielding the cavity;

and the protective film 7 is adhered to the top of the metal cover 6 and used for protecting the lead frame 3, the bare chip 4 and the gold wires 5 in the cavity.

Referring to fig. 1 and 2, the bottom plate 1 is rectangular, the cofferdam 2 is disposed on the bottom plate 1, and the cofferdam 2 surrounds the periphery of the bottom plate 1, so that a cavity is formed above the bottom plate 1, and the bare chips 4 can be accommodated in the cavity. In this embodiment, the tube housing formed by fixing the cofferdam 2 and the bottom plate 1 is used to replace the substrate for carrying the bare chip 4 in the prior art.

Further, after the plurality of gold wires 5 are respectively and correspondingly connected with the bonding pad of the lead frame 3 and the bonding pad of the bare chip 4, the metal cover 6 is used for replacing epoxy resin mould pressing in the prior art to cover the bare chip 4, so that stress on the bare chip 4 caused by the epoxy resin mould pressing in the prior art is avoided, the effect of protecting the bare chip 4 is achieved, the product performance of the inertia measuring instrument is effectively improved, the product cost is reduced, and the production period is shortened.

Further, in the embodiment, a protective film 7 is further adhered to the top of the inner side of the metal cover 6 for preventing water and pollution and protectingLead frame in cavity3Bare crystal4And a plurality of gold threads5, and the protective film 7 can be adhered to the periphery of the inner side of the metal cover 6, so that the waterproof effect of the highest-grade IP68 can be achieved.

In a preferred embodiment, a metal cover 6 is secured to the top of weir 4 so that the cavity is sealed.

Specifically, by fixing the metal cover 6 and the top of the cofferdam 4, the bare chip 4 in the above technical scheme is protected in the sealed cavity formed by the metal cover 6 and the cofferdam 4 without damage.

In the embodiment, the metal cover 6 is fixed to the top of the second step 21, compared with the prior art that only about 90% of epoxy resin can be cured in the molding and curing process, a high-temperature process is required to make the epoxy resin react and be completely cured subsequently, and the complete curing time is 4-6 hours, obviously, the metal cover 6 is used for replacing the epoxy resin, so that the production period is effectively shortened.

In a preferred embodiment, a glue coating 50 is further included, applied to each gold wire 5, for preventing damage to the gold wires 5.

Specifically, each gold wire 5 is coated with the glue paint 50, thereby playing a role of protecting the gold wire 5.

In a preferred embodiment, the glue coating 50 is a silicone.

Specifically, the glue coating 50 may be a silica gel, where the silica gel refers to a highly active adsorption material, belongs to an amorphous substance, does not react with any substance except strong alkali and hydrofluoric acid, is insoluble in water and any solvent, is non-toxic and odorless, and has the advantages of high adsorption performance, good thermal stability, stable chemical properties, high mechanical strength, and the like, and thus, the gold wires 5 in the glue coating can be better protected from being damaged.

In a preferred embodiment, shown in fig. 1, the dam 2 comprises a first step 20 facing into the cavity, the lead frame 3 being arranged on the first step 20.

In a preferred embodiment, a second step 21 is further disposed on the first step 20, and the top of the second step 21 is fixed to the metal cover 6.

Specifically, the cofferdam 2 further includes a second step 21, the second step 21 is disposed on the first step 20, and the metal cover 6 can be fixed to the top of the second step 21, so that the metal cover 6 and the cofferdam 2 form a cavity capable of accommodating the bare die 4.

In a preferred embodiment, the metal lid 6 is fixed to the top of the second step 21 by soldering with a solder paste (not shown).

Specifically, in the present embodiment, the metal cap 6 is soldered to the top of the second step 21 by using solder paste (not shown), and a reflow oven (not shown) can be provided to perform the soldering operation, and the time for soldering the metal cap 6 to the top of the second step 21 through the reflow oven (not shown) can be less than 10 minutes, compared with the conventional technology, the epoxy resin can be cured by only about 90% in the molding and curing process, and a high temperature process is required to fully cure the epoxy resin, and the fully curing time is 4-6 hours.

In a preferred embodiment, the metal cover 6 is provided with a venting through hole 8 for releasing heat from the cavity.

Specifically, as shown in fig. 1, in the above technical solution, since the metal cover 6 and the top of the second step 21 are welded to generate heat after the reflow furnace operation, the metal cover 6 is provided with a ventilation through hole 8, so that the heat in the cavity is released, and the heat is prevented from remaining in the cavity to cause structural deformation and generate stress. In addition, it should be noted that the ventilation through hole 8 in this embodiment is shielded by the protective film 7 in the above technical solution, so as to prevent external water and/or impurities from permeating into the cavity through the ventilation through hole 8Lead frame3Bare crystal4And a plurality of gold threads5, damage.

In a preferred embodiment, when the number of the dies 4 is greater than one, the dies 4 are bonded by the bonding gold wire 9.

In a preferred embodiment, when the number of die 4 is greater than one, the bonded die 4 are stacked in the cavity with the thicker die 4 below and the thinner die 4 above.

In the above embodiment, stacking a plurality of bonded dies 4 in the cavity can reduce the size of the packaged inertia measurement instrument. On this basis, further, thicker bare chip 4 is located the below, and thinner bare chip 4 is located the top, and the gold thread of connecting lead frame 3 can be drawn by the bare chip that is located the top for the bare chip 4 position that need connect lead frame 3 that is located on first step 20 is raised, thereby avoids connecting the gold thread 5 between lead frame 3 and the bare chip 4 that is located the top and is bent too big radian, thereby avoids gold thread 5 to be damaged.

The technical scheme has the following advantages or beneficial effects: the top of the cofferdam is covered by the metal cover to protect the bare crystals, so that the stress of epoxy resin mould pressing on the bare crystals in the prior art is avoided, the product performance of the inertia measuring instrument is effectively improved, the product cost is reduced, and the production period is shortened.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.