Chip, chip packaging method and electronic equipment

文档序号：1129623 发布日期：2020-10-02 浏览：9次中文

阅读说明：本技术 一种芯片及芯片封装方法、电子设备 (Chip, chip packaging method and electronic equipment ) 是由王超宏于 2020-08-06 设计创作，主要内容包括：本发明提供一种芯片及芯片封装方法、电子设备,该芯片包括芯片本体、引线框架和树脂支架,引线框架固定于树脂支架的一个端部上,且所述支架围设在引线框架上,引线框架和树脂支架围成容纳腔体。芯片本体位于容纳腔体内,引线框架包括相互绝缘设置的第一金属板区和第二金属板区,芯片本体设置在第一金属板区上,芯片本体与第二金属板区电连接,即通过树脂支架和引线框架实现了对芯片本体的封装。树脂材料的成本较低,同时通过树脂形成树脂支架的工艺方法较为简单,提高了生产效率,有助于降低生产成本,因而有效的降低了芯片的成本,解决了现有芯片采用陶瓷基板的封装方式,导致芯片封装的成本较高的问题。(The invention provides a chip, a chip packaging method and electronic equipment. The chip body is located and holds the cavity, and the lead frame is distinguished including the first metal sheet district and the second metal sheet that mutual insulation set up, and the chip body sets up on first metal sheet district, and the chip body is connected with second metal sheet district electricity, has realized the encapsulation to the chip body through resin support and lead frame promptly. The resin material has low cost, and meanwhile, the process method for forming the resin support through the resin is simple, so that the production efficiency is improved, the production cost is reduced, the cost of the chip is effectively reduced, and the problem of high chip packaging cost caused by the adoption of a ceramic substrate packaging mode of the conventional chip is solved.)

1. A chip is characterized by comprising a chip body, a lead frame and a resin support, wherein the lead frame is fixed on one end part of the resin support, the resin support is arranged on the lead frame in a surrounding manner, the resin support and the lead frame jointly form an accommodating cavity, and a first opening communicated with the accommodating cavity is formed in the other end part, opposite to the lead frame, of the resin support;

the chip body is located hold the cavity in, the lead frame includes first metal sheet district and second metal sheet district, first metal sheet district with the interval insulating setting of second metal sheet, the chip body sets up on the first metal sheet district, the chip body with second metal sheet district electricity is connected.

2. The chip of claim 1, wherein the resin frame includes a first frame portion disposed around a peripheral sidewall of the lead frame and a second frame portion located above the lead frame, the second frame portion forming a sidewall of the receiving cavity.

3. The chip of claim 2, wherein the first and second frame portions are integrally formed on the lead frame by die pressing.

4. The chip of claim 2, wherein the first frame portion is formed on the lead frame by hot pressing with a mold, and the second frame portion is formed separately from the first frame portion and the lead frame.

5. The chip of claim 4, further comprising an adhesive layer by which the second leg portion is disposed on the lead frame.

6. The chip according to any one of claims 1 to 5, further comprising an optical device, wherein at least two opposite sides of the resin holder have a stepped structure, the optical device is disposed on the stepped structure, and the optical device is located on a light emitting path of the chip body.

7. The chip of claim 6, wherein the step structure or the step structure and the adjacent resin support form a second opening, the optical device covers the second opening, the step structure has a vent hole thereon, and the receiving cavity communicates with an external environment through the vent hole.

8. The chip of claim 7, wherein the optical device comprises at least a collimating mirror, a diffractive optical element, or a diffuser.

9. The chip of claim 8, wherein the optical device comprises a collimating lens and a diffractive optical element, the collimating lens is located above the chip body, the diffractive optical element is located above the collimating lens, and light emitted from the chip body passes through the collimating lens and the diffractive optical element in sequence and then is emitted.

10. The chip of claim 8, wherein the optical device comprises a collimating lens and a diffusing sheet, the collimating lens is located above the chip body, the diffusing sheet is located above the collimating lens, and light emitted from the chip body passes through the collimating lens and the diffusing sheet in sequence and then exits.

11. The chip of claim 6, further comprising a photodiode, wherein the photodiode is located in the receiving cavity, wherein the lead frame further comprises a third metal plate region and a fourth metal plate region, and wherein the first metal plate region, the second metal plate region, the third metal plate region and the fourth metal plate region are insulated from each other;

the photodiode is arranged on the third metal plate area, the cathode of the photodiode is electrically contacted with the third metal plate area, the anode of the photodiode is electrically connected with the fourth metal plate area, and the photodiode is used for detecting an optical power signal sent by the chip body and outputting the optical power signal as a feedback signal.

12. The chip of claim 11, wherein the chip body is a laser light emitting chip or an infrared light emitting chip;

the lead frame further comprises a fifth metal plate area, and the first metal plate area, the second metal plate area, the third metal plate area, the fourth metal plate area and the fifth metal plate area are arranged in an insulated mode;

the negative pole of chip body with first metal sheet district electrical contact, the positive pole of chip body respectively through metal lead with second metal sheet district with fifth metal sheet district electricity is connected.

13. The chip of claim 12, wherein the chip body comprises a plurality of light emitting units, the first metal plate region has a cathode pad thereon, cathodes of the plurality of light emitting units are in electrical contact with the cathode pad, and anodes of the plurality of light emitting units are electrically connected to the second metal plate region and the fifth metal plate region through the metal leads, respectively.

14. The chip of claim 13, wherein adjacent two of the first, second, third, fourth, and fifth sheet metal regions have an insulating gap therebetween;

the resin holder further includes a filling portion filled in the insulating gap.

15. The chip of claim 14, wherein lateral cross-sectional shapes of outer sidewalls of the first, second, third, fourth, and fifth plate regions at ends thereof distal from the chip body are saw-toothed.

16. The chip of claim 15, wherein the saw-tooth shape is composed of a plurality of saw-teeth, and the saw-tooth shape comprises at least: one or more of square, triangle, fan and trapezoid.

17. The chip according to any one of claims 1 to 5, wherein the chip body emits light having a wavelength of 780nm to 3000 nm;

the molding material of the resin support includes a black thermosetting resin.

18. The chip of any one of claims 1 to 5, wherein the material of the resin support comprises at least one of silica, carbon black, epoxy resin, hardener, and catalyst.

19. A method of chip packaging, the method comprising:

providing a lead frame and a chip body, wherein the lead frame comprises a first metal plate area and a second metal plate area, and the first metal plate area and the second metal plate area are arranged in an insulating mode;

forming a resin support on the lead frame, wherein the lead frame is fixed on one end part of the resin support, the resin support is arranged on the lead frame in a surrounding manner, the resin support and the lead frame jointly form an accommodating cavity in a surrounding manner, and a first opening communicated with the accommodating cavity is formed in the other end part of the resin support opposite to the lead frame;

disposing the chip body on the first metal plate region;

and electrically connecting the chip body with the second metal plate region.

20. The chip packaging method according to claim 19, wherein the resin frame includes a first frame portion and a second frame portion, and wherein the forming the resin frame on the lead frame includes:

providing a first die, wherein the first die comprises an upper die and a lower die which are opposite, the upper die and the lower die enclose a cavity for accommodating the lead frame, one end of the upper die facing the lower die is provided with a flat part and a groove part which surrounds the periphery of the flat part, and one end surface of the lower die facing the upper die is a flat surface;

the lead frame is positioned in the cavity, the lead frame is clamped between the flat part and the flat surface, and the groove part is positioned on the periphery of the lead frame;

injecting resin into the first mold and molding, wherein the resin positioned on the peripheral side wall of the lead frame forms the first bracket part, and the resin positioned in the groove part forms the second bracket part; and (6) demolding.

21. The chip packaging method according to claim 19, wherein the resin frame includes a first frame portion and a second frame portion, and wherein the forming the resin frame on the lead frame includes:

providing a first die, wherein the first die comprises an upper die and a lower die which are opposite, the upper die and the lower die enclose a cavity for accommodating the lead frame, and the end faces of one ends, opposite to each other, of the upper die and the lower die are flat faces;

positioning the lead frame in the cavity, clamping the lead frame between the flat surfaces, injecting resin into the first mold and molding, forming the first support part by the resin positioned on the peripheral side wall of the lead frame, and demolding;

providing a second mold, wherein a groove is formed in the position, corresponding to the periphery of the lead frame, of the second mold, resin is injected into the second mold and is molded, and the second support part is formed by demolding;

disposing the second leg portion on the lead frame.

22. The method of claim 21, wherein the disposing the second leg portion on the lead frame comprises:

and bonding the second bracket part on the lead frame.

23. The method of any of claims 19-22, wherein the forming a resin support on the lead frame further comprises: forming a stepped structure on at least opposite sides of the resin support;

after the chip body is electrically connected with the lead frame, the method further comprises the following steps:

providing an optical device;

disposing the optical device on the stair step structure.

24. The method of claim 23, wherein the forming a stepped structure on at least two opposing sides of the resin support further comprises: and an exhaust hole is formed on the stepped structure, and the accommodating cavity is communicated with an external environment through the exhaust hole.

25. The chip packaging method according to claim 23, wherein the lead frame further comprises a third metal plate region and a fourth metal plate region, and the first metal plate region, the second metal plate region, the third metal plate region and the fourth metal plate region are arranged to be insulated from each other;

after forming the resin support on the lead frame, and enclosing the accommodating cavity with the first opening by the lead frame and the resin support, the method further comprises the following steps:

providing a photodiode;

disposing the photodiode on the third metal plate region with a cathode of the photodiode in electrical contact with the third metal plate region;

electrically connecting the photodiode to the fourth metal plate region.

26. The chip packaging method according to claim 25, wherein the chip body is a laser light emitting chip or an infrared light emitting chip, the lead frame further comprises a fifth metal plate region, and the first metal plate region, the second metal plate region, the third metal plate region, the fourth metal plate region and the fifth metal plate region are arranged to be insulated from each other;

the disposing the chip body on the first metal plate region includes: electrically contacting the cathode of the chip body with the first metal plate region;

after the chip body is electrically connected with the second metal plate region, the method further comprises the following steps: and electrically connecting the anode of the chip body with the fifth metal plate area through a metal lead.

27. The chip packaging method according to claim 26, further comprising, after the providing the lead frame and the chip body:

providing an insulating gap between two adjacent metal plate areas of the first metal plate area, the second metal plate area, the third metal plate area, the fourth metal plate area and the fifth metal plate area;

and leading the first metal plate area, the second metal plate area, the third metal plate area, the fourth metal plate area and the fifth metal plate area to be far away from the transverse cross section of the outer side wall at one end of the chip body to be in a zigzag shape.

28. A chip obtained by the chip packaging method according to any one of claims 19 to 27.

29. An electronic device comprising a chip according to any one of claims 1 to 18 or a chip according to claim 28.

Technical Field

The present disclosure relates to the field of semiconductor technologies, and in particular, to a chip, a chip packaging method, and an electronic device.

Background

The 3D imaging can record the distance information between the shooting target object and the camera, and the three-dimensional coordinate information of the shooting target object is obtained through modeling of the static or dynamic three-dimensional coordinate information of the shooting target object. Therefore, 3D imaging has great application potential in physical recognition, motion recognition, scene recognition and the like. Among them, as a technical branch of 3D imaging, the active vision system is an imaging technique that measures depth of field by actively projecting to an observation object using an independent artificial light source, such as structured light 3D and TOF. Due to the advancement of the system technology, the system has been widely applied to terminal equipment.

At present, an active visual system mostly needs an active Laser light source to emit Laser light with a specific wavelength, wherein a Vertical-Cavity Surface-Emitting Laser (VCSEL, also called as Vertical resonant Cavity Surface-Emitting Laser) is a semiconductor light Emitting device, and has the advantages of small volume, fast reaction speed and high energy efficiency, and is suitable for the active visual system. At present, the packaging mode of VCSEL mainly realizes the encapsulation through ceramic substrate, forms ceramic substrate packaging body through ceramic material promptly, has the cavity that is used for holding the chip in ceramic substrate, and the chip setting is in this cavity, because ceramic substrate is the insulator, need drill usually in ceramic substrate bottom to realize being connected of the pin on chip and the ceramic substrate outer bottom, and then through pin and other device turn-on connections.

However, the packaging method using the ceramic substrate has a high cost due to the high cost of the ceramic itself and the complex molding process of the ceramic substrate package, which results in a high cost of the VCSEL chip package.

Disclosure of Invention

The invention provides a chip, a chip packaging method and electronic equipment, and aims to solve the problem that the packaging cost is high due to the fact that the existing chip is packaged in a ceramic substrate packaging mode.

The chip comprises a chip body, a lead frame and a resin support, wherein the lead frame is fixed on one end part of the resin support, the resin support is arranged on the lead frame in a surrounding manner, the resin support and the lead frame jointly form an accommodating cavity, and a first opening communicated with the accommodating cavity is formed in the other end part, opposite to the lead frame, of the resin support;

In a possible embodiment, the resin holder includes a first holder portion disposed to surround the peripheral side wall of the lead frame, and a second holder portion located above the lead frame, the second holder portion forming the side wall of the accommodating cavity.

In a possible embodiment, the first and second frame portions are integrally formed on the lead frame by means of die hot pressing.

In one possible embodiment, the first frame portion is formed on the lead frame by hot pressing with a mold, and the second frame portion is formed separately from the first frame portion and the lead frame.

In a possible embodiment, the lead frame further comprises an adhesive layer, the first support portion is formed on the lead frame by means of hot pressing through a die, and the second support portion is arranged on the lead frame through the adhesive layer.

In one possible embodiment, the chip further comprises an optical device, wherein at least two opposite sides of the resin support are provided with a step structure, the optical device is arranged on the step structure, and the optical device is positioned on the light emitting optical path of the chip body.

In one possible embodiment, the step structure or the step structure and the adjacent resin holder form a second opening, the optical device covers the second opening, the step structure has a vent hole thereon, and the accommodation cavity communicates with an external environment through the vent hole.

In a possible embodiment, the optical means comprise at least a collimating mirror, a diffractive optical element or a diffuser.

In a possible implementation manner, the optical device includes a collimating lens and a diffractive optical element, the collimating lens is located above the chip body, the diffractive optical element is located above the collimating lens, and light emitted by the chip body sequentially passes through the collimating lens and the diffractive optical element and then is emitted.

In a possible embodiment, the optical device includes a collimating lens and a diffusion sheet, the collimating lens is located above the chip body, the diffusion sheet is located above the collimating lens, and light emitted from the chip body passes through the collimating lens and the diffusion sheet in sequence and then is emitted.

In a possible embodiment, the lead frame further includes a photodiode, the photodiode is located in the accommodating cavity, the lead frame further includes a third metal plate region and a fourth metal plate region, and the first metal plate region, the second metal plate region, the third metal plate region and the fourth metal plate region are arranged in an insulated manner;

In one possible embodiment, the chip body is a laser light emitting chip or an infrared light emitting chip;

In a possible embodiment, the chip body includes a plurality of light emitting units, the first metal plate region has a cathode pad thereon, a plurality of cathodes of the light emitting units are in electrical contact with the cathode pad, and a plurality of anodes of the light emitting units are electrically connected to the second metal plate region and the fifth metal plate region through the metal leads, respectively.

In a possible embodiment, two adjacent metal plate regions of the first metal plate region, the second metal plate region, the third metal plate region, the fourth metal plate region and the fifth metal plate region have an insulating gap therebetween;

the resin holder further includes a filling portion filled in the insulating gap.

In a possible embodiment, the lateral cross-sectional shape of the outer sidewall of the end of the first metal plate region, the second metal plate region, the third metal plate region, the fourth metal plate region and the fifth metal plate region away from the chip body is a zigzag.

In a possible embodiment, the saw-tooth shape is composed of a plurality of saw-teeth, the shape of the saw-teeth at least comprising: one or more of square, triangle, fan and trapezoid.

In one possible embodiment, the wavelength of the emitted light of the chip body is 780nm-3000 nm;

the molding material of the resin support includes a black thermosetting resin.

In one possible embodiment, the material of the resin support includes at least one of silica, carbon black, epoxy resin, hardener, and catalyst.

A second aspect of the present invention provides a chip packaging method, including:

disposing the chip body on the first metal plate region;

and electrically connecting the chip body with the second metal plate region.

In one possible embodiment, the resin holder includes a first holder portion and a second holder portion, and the forming of the resin holder on the lead frame includes:

the lead frame is positioned in the cavity, the lead frame is clamped between the flat part and the flat surface, and the groove part is positioned on the periphery of the lead frame;

In one possible embodiment, the resin holder includes a first holder portion and a second holder portion, and the forming of the resin holder on the lead frame includes:

providing a first die, wherein the first die comprises an upper die and a lower die which are opposite, the upper die and the lower die enclose a cavity for accommodating the lead frame, and the end faces of one ends, opposite to each other, of the upper die and the lower die are flat faces;

disposing the second leg portion on the lead frame.

In one possible embodiment, the disposing the second bracket portion on the lead frame includes:

and bonding the second bracket part on the lead frame.

In one possible embodiment, the forming of the resin support on the lead frame further includes: forming a stepped structure on at least opposite sides of the resin support;

after the chip body is electrically connected with the lead frame, the method further comprises the following steps:

providing an optical device;

disposing the optical device on the stair step structure.

In one possible embodiment, the forming of the stepped structure on at least opposite sides of the resin support further includes: and an exhaust hole is formed on the stepped structure, and the accommodating cavity is communicated with an external environment through the exhaust hole.

In a possible embodiment, the lead frame further comprises a third metal plate region and a fourth metal plate region, and the first metal plate region, the second metal plate region, the third metal plate region and the fourth metal plate region are arranged to be insulated from each other;

providing a photodiode;

disposing the photodiode on the third metal plate region with a cathode of the photodiode in electrical contact with the third metal plate region;

electrically connecting the photodiode to the fourth metal plate region.

In a possible embodiment, the chip body is a laser light emitting chip or an infrared light emitting chip, the lead frame further includes a fifth metal plate area, and the first metal plate area, the second metal plate area, the third metal plate area, the fourth metal plate area and the fifth metal plate area are arranged in an insulated manner;

the disposing the chip body on the first metal plate region includes: electrically contacting the cathode of the chip body with the first metal plate region;

In a possible embodiment, after providing the lead frame and the chip body, the method further includes:

A third aspect of the present invention provides a chip obtained by any one of the chip packaging methods described above.

A fourth aspect of the invention provides an electronic device comprising any of the chips described above.

The invention provides a chip, a chip packaging method and electronic equipment. Compared with ceramic packaging, the resin material is low in cost, meanwhile, the process method for forming the resin support through resin is simple, production efficiency can be improved, and cost reduction is further facilitated, so that the cost of the chip is effectively reduced, and the problem that the cost of chip packaging is high due to the fact that the existing chip adopts a ceramic substrate packaging mode is solved. In addition, compared with ceramic, the metal lead frame can better dissipate heat of the chip body, and can directly carry out circuit connection without drilling, thereby reducing parasitic inductance in the circuit and further improving the performance of the chip.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a schematic top view of a chip according to an embodiment of the present invention;

FIG. 2 is a schematic cross-sectional view taken along line A-A of FIG. 1;

fig. 3 is a schematic front view of a lead frame used in a chip according to an embodiment of the present invention;

FIG. 4 is a schematic cross-sectional view taken along line A-A of FIG. 3;

FIG. 5 is a schematic cross-sectional view taken along line B-B of FIG. 3;

fig. 6 is a schematic diagram of a back side structure of a lead frame used in a chip according to an embodiment of the present invention;

fig. 7 is a schematic diagram of a back side structure of another lead frame used for a chip according to an embodiment of the present invention;

fig. 8 is a schematic front view of a molded lead frame and a molded resin frame for a chip according to an embodiment of the present invention;

FIG. 9 is a schematic cross-sectional view taken along line A-A of FIG. 8;

FIG. 10 is a schematic cross-sectional view taken along line B-B of FIG. 8;

fig. 11 is a schematic diagram of a back structure of a molded lead frame and a molded resin frame for a chip according to a first embodiment of the present invention;

fig. 12 is a flowchart illustrating a packaging method adopted by a chip according to an embodiment of the present invention;

FIG. 13 is a schematic view of a chip according to a second embodiment of the present invention along line A-A;

fig. 14 is a schematic front view of a molded first frame portion of a resin frame and a lead frame for a chip according to a second embodiment of the present invention;

FIG. 15 is a schematic cross-sectional view taken along line A-A of FIG. 14;

FIG. 16 is a schematic cross-sectional view taken along line B-B of FIG. 14;

fig. 17 is a schematic front view of a second frame portion of a resin frame used for a chip according to a second embodiment of the present invention;

fig. 18 is a schematic back side view of a second frame portion of a resin frame used for a chip according to a second embodiment of the present invention;

FIG. 19 is a schematic cross-sectional view taken along line A-A of FIG. 17;

FIG. 20 is a schematic cross-sectional view taken along line B-B of FIG. 17;

fig. 21 is a schematic cross-sectional view taken along line a-a of a lead frame and a resin frame used for a chip according to a second embodiment of the present invention after molding;

fig. 22 is a schematic cross-sectional view taken along line B-B of a lead frame and a resin frame used for a chip according to a second embodiment of the present invention.

Description of reference numerals:

10-a chip; 11-a chip body; 12-a lead frame; 121-a first metal plate region; 122-a second metal plate region; 123-a third metal plate region; 124-a fourth metal plate region; 125-fifth panel zone; 126-insulation gap; 127-saw teeth; 13-a resin scaffold; 131-a first frame portion; 132-a second leg portion; 133-a filling section; 134-step structure; 135-air vent; 136 — a first opening; 137-a second opening; 14-a containment cavity; 20-an adhesive layer; 30-an optical device; 40-photodiode, 50-metal lead.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The technical solution of the present invention will be described in detail below with specific examples. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.

In a first aspect of the embodiments of the present application, a chip is provided, specifically, the chip may be a laser chip, such as a VCSEL chip, or any other chip capable of emitting light.

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