阅读说明：本技术 一种新型陶瓷封装结构 (Novel ceramic packaging structure ) 是由 王莹 于 2020-07-31 设计创作，主要内容包括：本发明公开了一种新型陶瓷封装结构,涉及陶瓷封装技术领域,包括包括陶瓷管壳,且陶瓷管壳的顶部焊接有芯片,所述陶瓷管壳的顶部焊接有盖板,且芯片位于盖板内；所述陶瓷管壳的顶部呈平面设置,且芯片焊接在陶瓷管壳的平面上,所述陶瓷管壳和盖板均为方形设置；本发明陶瓷壳体顶部平面化,去掉了现有技术陶瓷陶瓷的深腔,可通过钎焊或者平行缝焊等多种封装形式进行封装,这样可以简化陶瓷壳体的结构,大幅降低成本,同时增加陶瓷壳体密封后的可靠性。(The invention discloses a novel ceramic packaging structure, which relates to the technical field of ceramic packaging and comprises a ceramic tube shell, wherein a chip is welded at the top of the ceramic tube shell, a cover plate is welded at the top of the ceramic tube shell, and the chip is positioned in the cover plate; the top of the ceramic tube shell is arranged in a plane, the chip is welded on the plane of the ceramic tube shell, and the ceramic tube shell and the cover plate are both arranged in a square shape; the top of the ceramic shell is planarized, a deep cavity of ceramic in the prior art is removed, and the ceramic shell can be packaged in various packaging forms such as brazing or parallel seam welding, so that the structure of the ceramic shell can be simplified, the cost is greatly reduced, and the reliability of the sealed ceramic shell is improved.)

1. The novel ceramic packaging structure comprises a ceramic tube shell (100), a chip (200) is welded on the top of the ceramic tube shell (100), a cover plate (300) is welded on the top of the ceramic tube shell (100), and the chip (200) is located in the cover plate (300);

the method is characterized in that: the top of the ceramic tube shell (100) is arranged in a plane, and the chip (200) is welded on the plane of the ceramic tube shell (100).

2. The novel ceramic package structure of claim 1, wherein: the ceramic tube shell (100) and the cover plate (300) are both arranged in a square shape.

Technical Field

The invention relates to the technical field of ceramic packaging, in particular to a novel ceramic packaging structure.

Background

The ceramic shell package is a common electronic component package form, generally, ceramic is used as a substrate, a cavity with a certain depth is arranged in the middle, a chip or other electronic components are fixed in a ceramic cavity base, electronic interconnection is realized through a connecting wire and the like, and then a cover plate (metal or other materials) and a base are sealed through various package forms, so that the package is realized.

However, the ceramic tube with the cavity is generally high in manufacturing cost, and the peripheral wall of the cavity is relatively weak, which is liable to bring adverse effects on air tightness and even reliability, and therefore, improvement is required.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides a novel ceramic packaging structure, which solves the problems mentioned in the background technology.

In order to achieve the purpose, the invention is realized by the following technical scheme: a novel ceramic packaging structure comprises a ceramic tube shell, wherein a chip is welded at the top of the ceramic tube shell, a cover plate is welded at the top of the ceramic tube shell, and the chip is positioned in the cover plate;

the top of the ceramic tube shell is arranged in a plane, and the chip is welded on the plane of the ceramic tube shell.

The novel ceramic package structure as described above, wherein the ceramic package and the cover plate are preferably arranged in a square shape.

Compared with the prior art, the invention has the following beneficial effects: the ceramic shell top is flat, has removed the ceramic's of prior art deep chamber, and multiple packaging forms such as accessible brazing or parallel seam welding encapsulate, can simplify ceramic shell's structure like this, reduce cost by a wide margin, increase the reliability after ceramic shell seals simultaneously.

Drawings

FIG. 1 is a perspective view of a top view of the present invention;

FIG. 2 is a perspective view of a top view of the ceramic shell of the present invention;

fig. 3 is a perspective view of the cover plate of the present invention from a bottom view.

In the figure: 100. a ceramic housing; 200. a chip; 300. and (7) a cover plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a novel ceramic packaging structure comprises a ceramic tube shell 100, wherein a chip 200 is welded at the top of the ceramic tube shell 100, a cover plate 300 is welded at the top of the ceramic tube shell 100, the chip (200) is positioned in the cover plate 300, and the ceramic tube shell 100 and the cover plate 300 are both arranged in a square shape;

the top of the ceramic package 100 is disposed in a plane, and the chip 200 is soldered to the plane of the ceramic package 100.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.